CN105870297A - LED light source and packaging method thereof - Google Patents
LED light source and packaging method thereof Download PDFInfo
- Publication number
- CN105870297A CN105870297A CN201610364880.XA CN201610364880A CN105870297A CN 105870297 A CN105870297 A CN 105870297A CN 201610364880 A CN201610364880 A CN 201610364880A CN 105870297 A CN105870297 A CN 105870297A
- Authority
- CN
- China
- Prior art keywords
- light source
- led light
- rubber layer
- conductive rubber
- base board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 239000013078 crystal Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 239000000084 colloidal system Substances 0.000 claims abstract description 9
- 239000007787 solid Substances 0.000 claims abstract 3
- 239000003292 glue Substances 0.000 claims description 34
- 238000012856 packing Methods 0.000 claims description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 12
- 239000006071 cream Substances 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 5
- 238000007711 solidification Methods 0.000 claims description 5
- 230000008023 solidification Effects 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 39
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000004020 luminiscence type Methods 0.000 description 4
- 238000007788 roughening Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920004933 Terylene® Polymers 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a flexible and 360-degree glowing LED light source. The LED light source comprises a flexible substrate, LED chips, first electrical conductive colloid layers and second electrical conductive colloid layers, the flexible substrate is provided with a solid crystal zone, the first electrical conductive colloid layers are arranged on the surface of the solid crystal zone, the LED chips are flipped on the first electrical conductive colloid layers, and the second electrical conductive colloid layers are arranged on the surface of the flexible substrate and coat the LED chips. The invention further provides a packaging method of the LED light source. The LED light source and the packaging method thereof have the advantages that the LED chips are flipped on the flexible substrate through the first electrical conductive colloid layers, the second electrical conductive colloid layers are arranged on the flexible substrate and coat the LED chips, the LED light source can glow by 360 degrees, and the light source is flexible.
Description
Technical field
The present invention relates to field of light fittings, specifically a kind of LED light source and method for packing thereof.
Background technology
Existing LED lamp major part uses aluminium base or the ceramic substrate of hard, and at aluminium base or pottery
Mount LED lamp bead on substrate, then be installed on aluminium alloy or hard plastics.This technique limits lamp
The spatial modelling of tool and lighting angle, it is difficult to accomplish that full luminous intensity distribution illuminates.And LED filament lamp, it is by one group of LED
Chip package forms filament on the transparent substrate, and then multiple filaments connect the luminescence forming similar tengsten lamp
Effect.Owing to this filament is usually vertical bar shaped structure, need by hand that the two ends of filament are electric with driving respectively
The electrode wires welding that source is extended is to realize electrical connection, and the production efficiency of its assembling process is relatively low, and is unfavorable for
Automated production.
The patent of invention of Application No. 201410471362.9 discloses the encapsulation knot of a kind of flip LED chips
Structure, this encapsulating structure includes: substrate；It is fixed on the flip LED chips on described substrate；It is coated in described
Transparent sealing on flip LED chips；It is coated in the fluorescent glue in substrate and transparent sealing.This invention is passed through
Flip LED chips and the electrode engagement on substrate, increase by one layer between flip LED chips and fluorescent glue
Transparent sealing, makes fluorescent glue away from assembling the LED chip surface of high temperature, thus improves LED chip
External quantum efficiency also can improve the service life of LED chip.This technical scheme equally exists the space of light fixture
Moulding and the limited problem of lighting angle.
Summary of the invention
The technical problem to be solved is: provide a kind of flexible, 360 degree of luminous LED light
Source and method for packing thereof.
In order to solve above-mentioned technical problem, the technical solution used in the present invention is: a kind of LED, including soft
Property substrate, LED chip, the first conductive rubber layer and the second conductive rubber layer, described flexible base board is provided with
Crystal bonding area, described first conductive rubber layer is arranged at surface, crystal bonding area, and described LED chip upside-down mounting is led in first
On electricity colloid layer, described second conductive rubber layer is arranged at flexible base board surface and envelopes LED chip.
Another technical scheme that the present invention provides is: the method for packing of a kind of LED light source, comprises the steps:
Step 1, on flexible substrates mark off crystal bonding area and on crystal bonding area coat conductive rubber layer；
Step 2, on conductive rubber layer flip LED chips；
Step 3, at the fluorescent glue of positive and negative coated on both sides solid-state of flexible base board, described fluorescent glue envelopes
LED chip；
Step 4, fluorescent glue curing molding.
The beneficial effects of the present invention is: LED chip by the first conductive rubber layer upside-down mounting on flexible base board,
Second conductive rubber layer is arranged on flexible substrates and envelope LED chip so that LED light source can 360
Degree is luminous and light source is flexible；It is solid-state during the second conductive rubber layer coating, operates more convenient, after coating
Solidify.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED light source of the embodiment of the present invention 1.
Label declaration:
1, flexible base board；2, LED chip；3, the first conductive rubber layer；4, the second conducting resinl
Body layer.
Detailed description of the invention
By describing the technology contents of the present invention in detail, being realized purpose and effect, below in conjunction with embodiment also
Accompanying drawing is coordinated to be explained.
The design of most critical of the present invention is: flip LED chips on flexible substrates, in LED flip chip
Outer coating conductive rubber layer, and conductive rubber layer is arranged on the positive and negative two sides of flexible base board so that LED light
Source can 360 degree luminous and light source is flexible.
Refer to Fig. 1, a kind of LED, including flexible base board 1, LED chip the 2, first conductive rubber
Layer 3 and the second conductive rubber layer 4, described flexible base board is provided with crystal bonding area, and described first conductive rubber layer sets
Be placed in surface, crystal bonding area, described LED chip upside-down mounting on the first conductive rubber layer, described second conductive rubber
Layer is arranged at flexible base board surface and envelopes LED chip.
Knowable to foregoing description, the beneficial effects of the present invention is: LED chip passes through the first conductive rubber layer
Upside-down mounting is on flexible base board, and the second conductive rubber layer arranges on flexible substrates and envelopes LED chip, makes
LED light source can 360 degree luminescences and light source flexible.
Further, described first conductive rubber layer is tin cream or elargol.
Seen from the above description, before tin cream or elargol coating, first crystal bonding area is carried out roughening treatment, make die bond
Surface, district becomes uneven, then the crystal bonding area surface-coated tin cream after roughening treatment or elargol, thus
Form the first conductive rubber layer.LED chip upside-down mounting is pressed on the first conductive rubber layer and completes die bond, wherein,
The electrode layer of LED chip is bonded in the first conductive rubber layer.
Further, described second conductive rubber layer is fluorescent glue.
Preferably, the material of flexible base board is polyimide plastic, polyether-ether-ketone or electrically conducting transparent terylene, its
Lighter weight, thinner thickness and flexible.
Further, described flexible base board is provided with circuit.
Another technical scheme that the present invention provides is: the method for packing of a kind of LED light source, comprises the steps:
Step 1, on flexible substrates mark off crystal bonding area and on crystal bonding area coat conductive rubber layer；
Step 2, on conductive rubber layer flip LED chips；
Step 3, at the fluorescent glue of positive and negative coated on both sides solid-state of flexible base board, described fluorescent glue envelopes
LED chip；
Step 4, fluorescent glue curing molding.
Compared with the LED filament light source that 360 degree luminous, product of the present invention can arbitrarily change shape, at sky
Between moulding and install the advantage of its uniqueness；Compared with flexible light band, product of the present invention can be by this
Method for packing, it is achieved 360 degree luminous.
Further, described conductive rubber layer is tin cream or elargol.
Further, the component of described fluorescent glue includes fluorescent material and molding glue.Fluorescent material and molding glue are mixed
After conjunction, carry out vacuum defoamation, obtain fluorescent glue.
Further, described solidification specifically includes: the flexible base board of the fluorescent glue being coated with solid-state is placed in glimmering
Toast under the solidification temperature of optical cement.
Further, after fluorescent glue solidified forming, flexible base board is split, i.e. can get 360 degree of luminescences
Flexible LED light source.
Refer to Fig. 1, embodiments of the invention are: a kind of LED, including flexible base board 1, LED core
Sheet the 2, first conductive rubber layer 3 and the second conductive rubber layer 4, described flexible base board is provided with crystal bonding area, institute
State the first conductive rubber layer and be arranged at surface, crystal bonding area, described LED chip upside-down mounting on the first conductive rubber layer,
Described second conductive rubber layer is arranged at flexible base board surface and envelopes LED chip.Described first conducting resinl
Body layer is tin cream or elargol.Before tin cream or elargol coating, first crystal bonding area is carried out roughening treatment, make crystal bonding area
Surface becomes uneven, then the crystal bonding area surface-coated tin cream after roughening treatment or elargol, thus shape
Become the first conductive rubber layer.Described second conductive rubber layer is fluorescent glue.
Embodiment 2
The method for packing of a kind of LED light source, comprises the steps:
Step 1, mark off crystal bonding area and on crystal bonding area, coat tin cream or elargol on flexible substrates；
Step 2, on tin cream flip LED chips, wherein, LED chip can one side on flexible substrates
Arrange, it is also possible to two-sided setting；
Step 3, fluorescent material and molding glue are mixed after, carry out vacuum defoamation, obtain the fluorescent glue of solid-state,
The fluorescent glue of the positive and negative coated on both sides solid-state of flexible base board, described fluorescent glue envelopes LED chip；
Step 4, be coated with fluorescent glue after flexible base board be placed under the solidification temperature of fluorescent glue and toast,
After fluorescent glue solidified forming, flexible base board is split, i.e. can get 360 degree of luminous flexible LED light sources.
In sum, the LED light source of present invention offer and having the beneficial effects that of method for packing thereof: LED core
Sheet is by tin cream or elargol upside-down mounting on flexible base board, and fluorescent adhesive layer is arranged on the two sides of flexible base board and is coated with
Live LED chip so that LED light source can 360 degree luminescences and light source flexible；It is solid-state during fluorescent glue coating,
Operate more convenient, solidify after coating.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every profit
The equivalents made by description of the invention and accompanying drawing content, or directly or indirectly it is used in relevant technology
Field, is the most in like manner included in the scope of patent protection of the present invention.
Claims (9)
1. a LED light source, it is characterised in that: include flexible base board, LED chip, the first conducting resinl
Body layer and the second conductive rubber layer, described flexible base board is provided with crystal bonding area, and described first conductive rubber layer sets
Be placed in surface, crystal bonding area, described LED chip upside-down mounting on the first conductive rubber layer, described second conductive rubber
Layer is arranged at flexible base board surface and envelopes LED chip.
LED light source the most according to claim 1, it is characterised in that: described first conductive rubber layer
For tin cream or elargol.
LED light source the most according to claim 1, it is characterised in that: described second conductive rubber layer
For fluorescent glue.
LED light source the most according to claim 1, it is characterised in that: described flexible base board is provided with
Circuit.
5. the method for packing of a LED light source, it is characterised in that: comprise the steps:
Step 1, on flexible substrates mark off crystal bonding area and on crystal bonding area coat conductive rubber layer；
Step 2, on conductive rubber layer flip LED chips；
Step 3, at the fluorescent glue of positive and negative coated on both sides solid-state of flexible base board, described fluorescent glue envelopes
LED chip；
Step 4, fluorescent glue curing molding.
The method for packing of LED light source the most according to claim 5, it is characterised in that: described conduction
Colloid layer is tin cream or elargol.
The method for packing of LED light source the most according to claim 5, it is characterised in that: described fluorescence
The component of glue includes fluorescent material and molding glue.
The method for packing of LED light source the most according to claim 5, it is characterised in that: fluorescent glue is solid
After chemical conversion shape, flexible base board is split, i.e. can get 360 degree of luminous flexible LED light sources.
The method for packing of LED light source the most according to claim 5, it is characterised in that: described solidification
Specifically include: the flexible base board of the fluorescent glue being coated with solid-state is placed under the solidification temperature of fluorescent glue and dries
Roasting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610364880.XA CN105870297A (en) | 2016-05-27 | 2016-05-27 | LED light source and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610364880.XA CN105870297A (en) | 2016-05-27 | 2016-05-27 | LED light source and packaging method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105870297A true CN105870297A (en) | 2016-08-17 |
Family
ID=56642500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610364880.XA Pending CN105870297A (en) | 2016-05-27 | 2016-05-27 | LED light source and packaging method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105870297A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106704856A (en) * | 2016-11-21 | 2017-05-24 | 浙江亿米光电科技有限公司 | Lamp bulb with V-shaped LED flexible lamp filament and process for manufacturing V-shaped lamp filament |
| CN106783827A (en) * | 2017-02-11 | 2017-05-31 | 何坚鹏 | A kind of FPC plates illuminating source packaging structure and its production method |
| CN107093659A (en) * | 2016-09-30 | 2017-08-25 | 深圳市玲涛光电科技有限公司 | Flexible surface light source and its manufacture method and electronic equipment |
| CN108155280A (en) * | 2017-12-15 | 2018-06-12 | 广东昭信照明科技有限公司 | A kind of LED filament and its manufacturing method |
| CN109742068A (en) * | 2018-12-28 | 2019-05-10 | 苏州工业园区客临和鑫电器有限公司 | A kind of full-color RGB flexibility filament and its packaging method |
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| US20050051792A1 (en) * | 2003-09-09 | 2005-03-10 | Citizen Electronics Co., Ltd. | Semiconductor package |
| CN101784838A (en) * | 2007-08-16 | 2010-07-21 | 皇家飞利浦电子股份有限公司 | Backlight including side-emitting semiconductor light emitting devices |
| CN102544260A (en) * | 2011-12-31 | 2012-07-04 | 深圳市瑞丰光电子股份有限公司 | Method for coating fluorescent glue on surface of LED (light-emitting diode) flip chip |
| CN103545437A (en) * | 2013-10-11 | 2014-01-29 | 杭州恒诚光电科技有限公司 | Bendable LED (light emitting diode) luminous element |
| CN103928577A (en) * | 2014-04-02 | 2014-07-16 | 陕西光电科技有限公司 | Plate type LED packaging method and LED packaged with method |
| CN104022193A (en) * | 2014-06-18 | 2014-09-03 | 厦门多彩光电子科技有限公司 | Method and device for packaging border-free LED |
| CN205657085U (en) * | 2016-05-27 | 2016-10-19 | 福建鸿博光电科技有限公司 | LED light source |
-
2016
- 2016-05-27 CN CN201610364880.XA patent/CN105870297A/en active Pending
Patent Citations (7)
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| US20050051792A1 (en) * | 2003-09-09 | 2005-03-10 | Citizen Electronics Co., Ltd. | Semiconductor package |
| CN101784838A (en) * | 2007-08-16 | 2010-07-21 | 皇家飞利浦电子股份有限公司 | Backlight including side-emitting semiconductor light emitting devices |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107093659A (en) * | 2016-09-30 | 2017-08-25 | 深圳市玲涛光电科技有限公司 | Flexible surface light source and its manufacture method and electronic equipment |
| CN106704856A (en) * | 2016-11-21 | 2017-05-24 | 浙江亿米光电科技有限公司 | Lamp bulb with V-shaped LED flexible lamp filament and process for manufacturing V-shaped lamp filament |
| CN106783827A (en) * | 2017-02-11 | 2017-05-31 | 何坚鹏 | A kind of FPC plates illuminating source packaging structure and its production method |
| CN108155280A (en) * | 2017-12-15 | 2018-06-12 | 广东昭信照明科技有限公司 | A kind of LED filament and its manufacturing method |
| CN109742068A (en) * | 2018-12-28 | 2019-05-10 | 苏州工业园区客临和鑫电器有限公司 | A kind of full-color RGB flexibility filament and its packaging method |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160817 |
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| RJ01 | Rejection of invention patent application after publication |