CN207602620U - A kind of stent for LED encapsulation - Google Patents
A kind of stent for LED encapsulation Download PDFInfo
- Publication number
- CN207602620U CN207602620U CN201721905383.2U CN201721905383U CN207602620U CN 207602620 U CN207602620 U CN 207602620U CN 201721905383 U CN201721905383 U CN 201721905383U CN 207602620 U CN207602620 U CN 207602620U
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- Prior art keywords
- reflective
- stent
- encapsulation
- heat
- pedestal
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Abstract
The utility model discloses a kind of stents for LED encapsulation,Including pedestal,The pedestal plan vertical is connected with reflective stent,The reflective internal stent is equipped with reflective groove,The reflective groove inner wall is coated with aluminium foil layer,And the aluminium foil layer is uniformly distributed,The reflective groove bottom center is connected with encapsulation slot,And the encapsulation slot is located at the reflective frame bottom,The encapsulation trench bottom is connected with heat-conducting metal block,And the heat-conducting metal block extends vertically through the pedestal,The heat-conducting metal block both sides are equipped with electrode metal column,And the electrode metal column is vertically connected on the reflective trench bottom,The electrode metal top end is provided with horizontal strap,The strap inner sleeve is equipped with LED chip,This kind is used for the stent of LED encapsulation,It is simple in structure,It is reliable and stable,Encapsulation is secured,Leakproofness is preferable,Reflection efficiency is high,Heat dissipation effect is good,It can effectively prevent excessive glue phenomenon,Improve light extraction efficiency,It is with a wide range of applications.
Description
Technical field
The utility model is related to LED encapsulation technologies field, specially a kind of stents for LED encapsulation.
Background technology
LED encapsulates the encapsulation for referring to luminescence chip, has relatively big difference compared to integrated antenna package, the encapsulation of LED not only will
Wick can be protected by asking, but also will can light transmission, so the encapsulation of LED has encapsulating material special requirement, in LED illumination
Market since the lamps and lanterns of high brightness, specular removal, low cost are main force's products of future market demand, promotes to encapsulate enterprise indirectly
The separation of selection thermoelectricity, package support ultra-thin, light emitting angle is big more and more.
The utility model of existing Patent No. CN204204906U provides a kind of stent for LED encapsulation, including pedestal
With high reflectance stent, the pedestal is equipped with electrical interconnection, and the inner wall of the high reflectance stent is reflective surface, the base
Seat and high reflectance stent are integrally formed, which is formed by being integrally formed, and the manufacture craft is simple, at low cost,
And there is no any pads, can improve the reliability of whole lamp bead after LED encapsulation in this way, while the LED support uses
The characteristics of metal material of high reflectance is made, and reflection efficiency is high so the stent has, good heat dissipation effect, but the reality
Not ideal enough with novel structure, encapsulation is not secured enough, and leakproofness is poor, easily accumulates dust, and cleaning is relatively difficult, influences
The light-out effect of LED chip, heat dissipation effect is general, reduces working life, excessive glue also easily occurs in encapsulation process
Phenomenon influences the effect of encapsulation, can not much meet requirement of the current people to the product in this way.
So how to design a kind of stent for LED encapsulation, becoming us will currently solve the problems, such as.
Invention content
The purpose of this utility model is to provide a kind of stent for LED encapsulation, to solve to carry in above-mentioned background technology
The problem of going out.
To achieve the above object, the utility model provides following technical solution：A kind of stent for LED encapsulation, including
Pedestal, the pedestal plan vertical are connected with reflective stent, and the reflective internal stent is equipped with reflective groove, the reflective groove inner wall
Coated with aluminium foil layer, and the aluminium foil layer is uniformly distributed, and the reflective groove bottom center is connected with encapsulation slot, and the encapsulation slot
Positioned at the reflective frame bottom, the encapsulation trench bottom is connected with heat-conducting metal block, and the heat-conducting metal block extends vertically through
The pedestal, the heat-conducting metal block both sides are equipped with electrode metal column, and the electrode metal column be vertically connected on it is described anti-
Light trench bottom, the electrode metal top end are provided with horizontal strap, and the strap inner sleeve is equipped with LED core
Piece, the LED chip bottom is located at the encapsulation slot inner cavity, and the LED chip is connect with electrode metal column by routing, institute
Stating LED chip top encapsulation has cured fluorescent glue, and the fluorescent glue bottom is glued at the top of the strap, described glimmering
Horizontal transparent panel is equipped with above optical cement, and the reflective groove top is connected on the outside of the transparent panel.
Further, the pedestal is set as integrated formed structure, and the pedestal is with reflective stent with reflective stent
Ceramic material.
Further, groove of the reflective groove for bowl shape, and the smooth setting of reflective groove inner surface.
Further, the encapsulation trench bottom and outside, and the heat-conducting metal are wrapped at the top of the heat-conducting metal block
Block is metal copper billet.
Further, the electrode metal column is embedded in the pedestal and reflective internal stent with heat-conducting metal block.
Further, the encapsulation slot inner cavity is located on the inside of the strap, and the strap top surface is equal
It is even to be coated with the aluminium foil layer.
Further, the transparent panel outer ledge is sealedly connected on the reflective groove inner wall, and the transparent panel top
Portion and the smooth setting of bottom surface.
Compared with prior art, the beneficial effects of the utility model are：This kind is used for the stent of LED encapsulation, simple in structure,
Reliable and stable, encapsulation is secured, and leakproofness is preferable, and reflection efficiency is high, and heat dissipation effect is good, can effectively prevent excessive glue phenomenon, carry
High light extraction efficiency, by being coated with aluminium foil layer in reflective groove inner wall, can increase the reflection efficiency on surface, reduce cost, have
The light sent out using LED chip is imitated, light extraction efficiency is improved, by being provided with heat-conducting metal block, heat can be effectively conducted, carried
High heat dissipation effect, effectively reduces the operating temperature of LED chip, improves working life, by being provided with strap and envelope
Tankage can stablize fixed LED chip, effectively prevent that excessive glue occurs, improve the stability and fastness of encapsulation, pass through setting
There is transparent panel, improve sealing effect, can prevent dust from entering, be convenient to clean, ensure that good light-out effect, so should
Stent of the kind for LED encapsulation has wide application market.
Description of the drawings
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is the overlooking the structure diagram of the utility model；
Fig. 3 is the base bottom structure diagram of the utility model；
Figure label：1st, pedestal；2nd, reflective stent；3rd, reflective groove；4th, aluminium foil layer；5th, slot is encapsulated；6th, heat-conducting metal block；7、
Electrode metal column；8th, strap；9th, LED chip；10th, fluorescent glue；11st, transparent panel.
Specific embodiment
The utility model is further described With reference to embodiment, wherein, being given for example only property of attached drawing
Illustrate, expression is only schematic diagram rather than pictorial diagram, it is impossible to the limitation to this patent is interpreted as, in order to which this reality is better described
With novel specific embodiment, the certain components of attached drawing have omission, zoom in or out, and do not represent the size of actual product,
It will be understood by those skilled in the art that the omitting of some known structures and their instructions in the attached drawings are understandable, based on this reality
With the specific embodiment in novel, the institute that those of ordinary skill in the art are obtained without making creative work
There are other specific embodiments, shall fall within the protection scope of the present invention.
- Fig. 3 is please referred to Fig.1, the utility model provides a kind of technical solution：A kind of stent for LED encapsulation, including base
Seat 1,1 plan vertical of pedestal is connected with reflective stent 2, and the reflective stent 2 is internally provided with reflective groove 3, the reflective groove 3
Inner wall is coated with aluminium foil layer 4, and the aluminium foil layer 4 is uniformly distributed, and 3 bottom center of reflective groove is connected with encapsulation slot 5, and institute
It states encapsulation slot 5 and is located at reflective 2 bottom of stent, 5 bottom of the encapsulation slot is connected with heat-conducting metal block 6, and heat conduction gold
Belong to block 6 and extend vertically through the pedestal 1,6 both sides of heat-conducting metal block are equipped with electrode metal column 7, and the electrode metal column 7
3 bottom of reflective groove is vertically connected on, 7 top of electrode metal column is provided with horizontal strap 8, the geometrical clamp
8 inner sleeve of plate is equipped with LED chip 9, and 9 bottom of LED chip is located at 5 inner cavity of the encapsulation slot, and the LED chip 9 and electricity
Pole metal column 7 is connected by routing, and 9 top encapsulation of LED chip has cured fluorescent glue 10, and 10 bottom of the fluorescent glue
8 top of strap is glued to, 10 top of fluorescent glue is equipped with horizontal transparent panel 11, and 11 outside of the transparent panel
3 top of reflective groove is connected to, the above forms the basic structure of the utility model.
More specifically, the pedestal 1 is set as integrated formed structure, and the pedestal 1 and reflective stent with reflective stent 2
2 be ceramic material, by being provided with the pedestal 1 and reflective stent 2 so that stable structure is reliable, can quickly absorb with
Dissipate the operating temperature of the LED chip 9, groove of the reflective groove 3 for bowl shape, and 3 inner surface light of the reflective groove
Sliding setting by being provided with the reflective groove 3, can increase the reflection efficiency on surface, by being coated in 3 inner wall of reflective groove
There is aluminium foil layer 4, convenient material drawing reduces cost, can efficiently use the light that LED chip is sent out, and improves light extraction efficiency, described to lead
6 top of thermometal block is wrapped in encapsulation 5 bottom of slot and outside, and the heat-conducting metal block 6 is metal copper billet, passes through setting
There is the heat-conducting metal block 6, heat can be effectively conducted, improve heat dissipation effect, effectively reduce the operating temperature of LED chip 9,
Working life is improved, the electrode metal column 7 is embedded in heat-conducting metal block 6 inside the pedestal 1 and reflective stent 2,
By the structure design of the electrode metal column 7 and heat-conducting metal block 6, packaging effects are improved, are connected convenient for routing, are ensured electrical
It connects more stable, improves radiating efficiency, 8 inside of strap is located at 5 inner cavity of the encapsulation slot, and the geometrical clamp
8 top surface of plate is uniformly coated with the aluminium foil layer 4, by being provided with the strap 8 and encapsulation slot 5, can stablize solid
The fixed LED chip 9 effectively prevent that excessive glue occurs, improves the stability and fastness of encapsulation, 11 outer side edges of transparent panel
Edge is sealedly connected on 3 inner wall of reflective groove, and the smooth setting in 11 top and bottom surface of the transparent panel, passes through setting
There is the transparent panel 11, improve sealing effect, can prevent dust from entering, be convenient to clean, ensure that good light-out effect.
Operation principle：This kind is used for the stent of LED encapsulation, when in use, passes through pedestal 1 and the one of reflective stent 2 first
Forming structure so that stable structure is reliable, is used convenient for encapsulation, then by being coated with aluminium foil layer 4 in 3 inner wall of reflective groove,
The reflection efficiency on 3 surface of reflective groove can be increased, the light that LED chip 9 is sent out is efficiently used, light extraction efficiency is improved, in LED core
When piece 9 works, by heat-conducting metal block 6, heat can be effectively conducted, the operating temperature of LED chip 9 is effectively reduced, improves
Working life when carrying out LED encapsulation, LED chip 9 is fixed in encapsulation slot 5, is fixed by strap 8, Ran Houtong
10 cure package of fluorescent glue is crossed, excessive glue can be prevented by 8 plate of geometrical clamp, improve the stability and fastness of encapsulation,
By being connected with transparent panel 11 in 3 end sealing of reflective groove, sealing effect is improved, can be dust-proof, it is convenient to clean, ensures good
Light-out effect, by electrode metal column 7 and heat-conducting metal block 6 be embedded in pedestal 1 with inside reflective stent 2, convenient for beating
Line connects, and ensures that electric connection is more stable, is conducted convenient for heat, improve radiating efficiency.
While there has been shown and described that specific embodiment of the present utility model, for those of ordinary skill in the art
For, it is possible to understand that in the case of the principle that does not depart from the utility model and spirit, can to these specific embodiments into
The a variety of change, modification, replacement and modification of row, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (7)
1. a kind of stent for LED encapsulation, including pedestal（1）, it is characterised in that：The pedestal（1）Plan vertical is connected with
Reflective stent（2）, the reflective stent（2）It is internally provided with reflective groove（3）, the reflective groove（3）Inner wall is coated with aluminium foil layer
（4）, and the aluminium foil layer（4）It is uniformly distributed, the reflective groove（3）Bottom center is connected with encapsulation slot（5）, and the encapsulation slot
（5）Positioned at the reflective stent（2）Bottom, the encapsulation slot（5）Bottom is connected with heat-conducting metal block（6）, and heat conduction gold
Belong to block（6）Extend vertically through the pedestal（1）, the heat-conducting metal block（6）Both sides are equipped with electrode metal column（7）, and the electricity
Pole metal column（7）It is vertically connected on the reflective groove（3）Bottom, the electrode metal column（7）Top is provided with horizontal fixation
Clamping plate（8）, the strap（8）Inner sleeve is equipped with LED chip（9）, the LED chip（9）Bottom is located at the encapsulation slot
（5）Inner cavity, and the LED chip（9）With electrode metal column（7）It is connected by routing, the LED chip（9）Top encapsulation has
Cured fluorescent glue（10）, and the fluorescent glue（10）Bottom is glued to the strap（8）Top, the fluorescent glue（10）
Top is equipped with horizontal transparent panel（11）, and the transparent panel（11）Outside is connected to the reflective groove（3）Top.
2. a kind of stent for LED encapsulation according to claim 1, it is characterised in that：The pedestal（1）With reflective branch
Frame（2）It is set as integrated formed structure, and the pedestal（1）With reflective stent（2）It is ceramic material.
3. a kind of stent for LED encapsulation according to claim 1, it is characterised in that：The reflective groove（3）For bowl
The groove of shape, and the reflective groove（3）The smooth setting of inner surface.
4. a kind of stent for LED encapsulation according to claim 1, it is characterised in that：The heat-conducting metal block（6）Top
Portion is wrapped in the encapsulation slot（5）Bottom and outside, and the heat-conducting metal block（6）For metal copper billet.
5. a kind of stent for LED encapsulation according to claim 1, it is characterised in that：The electrode metal column（7）With
Heat-conducting metal block（6）It is embedded in the pedestal（1）With reflective stent（2）It is internal.
6. a kind of stent for LED encapsulation according to claim 1, it is characterised in that：The strap（8）Inside
Positioned at the encapsulation slot（5）Inner cavity, and the strap（8）Top surface is uniformly coated with the aluminium foil layer（4）.
7. a kind of stent for LED encapsulation according to claim 1, it is characterised in that：The transparent panel（11）Outside
Edge seal is connected to the reflective groove（3）On inner wall, and the transparent panel（11）The smooth setting in top and bottom surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721905383.2U CN207602620U (en) | 2017-12-29 | 2017-12-29 | A kind of stent for LED encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721905383.2U CN207602620U (en) | 2017-12-29 | 2017-12-29 | A kind of stent for LED encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207602620U true CN207602620U (en) | 2018-07-10 |
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ID=62769372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721905383.2U Active CN207602620U (en) | 2017-12-29 | 2017-12-29 | A kind of stent for LED encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207602620U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109873065A (en) * | 2019-03-19 | 2019-06-11 | 泉州三安半导体科技有限公司 | A kind of semiconductor light-emitting elements |
-
2017
- 2017-12-29 CN CN201721905383.2U patent/CN207602620U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109873065A (en) * | 2019-03-19 | 2019-06-11 | 泉州三安半导体科技有限公司 | A kind of semiconductor light-emitting elements |
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