CN207353289U - A kind of LED encapsulation structure and automobile dimming-distance lighting system for improving light efficiency - Google Patents
A kind of LED encapsulation structure and automobile dimming-distance lighting system for improving light efficiency Download PDFInfo
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- CN207353289U CN207353289U CN201720852300.1U CN201720852300U CN207353289U CN 207353289 U CN207353289 U CN 207353289U CN 201720852300 U CN201720852300 U CN 201720852300U CN 207353289 U CN207353289 U CN 207353289U
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- light efficiency
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Abstract
The utility model discloses a kind of LED encapsulation structure and automobile dimming-distance lighting system for improving light efficiency, wherein, the LED encapsulation structure for improving light efficiency includes substrate, eutectic is pasted with several LED chips on the substrate, several reflection cavities are provided with the substrate, each LED chip is in independent reflection cavity, the surrounding of the reflection cavity is white glue reflector layer, in the reflection cavity, the top and side of LED chip are both provided with fluorescent adhesive layer, by setting multiple reflection cavities on substrate, the surrounding of each reflection cavity sets white glue reflector layer, chip front side light extraction after the light that LED chip surrounding in reflection cavity is sent is reflected by the white glue reflector layer, effectively increase product light efficiency and brightness.
Description
Technical field
The utility model is related to automobile dimming-distance light lighting area, more particularly to a kind of LED encapsulation structure for improving light efficiency and
Automobile dimming-distance lighting system.
Background technology
The packaging technology of existing automobile long-and-short distant light LED is generally mounted on ceramic base using the direct eutectic of LED flip chip
After on plate, first coat fluorescent powder or paste the technology mode of fluorescent film Molding white glue again, it is white that LED is packaged into chip surrounding
Color silica gel is fully wrapped around, only chip front side light extraction, and the light extraction of chip surrounding is blocked completely.
Existing LED encapsulating products are primarily present following a few point defects:1st, the output of four period-luminosity is have lost, light efficiency is relatively low;2、
Halogen lamp and xenon lamp are linear light sorurce, and the length about 4-6mm of its lighted region, diameter is about 1-1.2mm, it is impossible to passes through nothing
Limitation increases LED chip quantity to improve brightness;3rd, the expense for needing to increase the equipment such as fluorescent powder coating or vacuum pad pasting is put into,
Improve the cost of product.
Thus the prior art could be improved and improve.
Utility model content
In view of in place of above-mentioned the deficiencies in the prior art, the purpose of this utility model is that a kind of LED encapsulation for improving light efficiency
Structure and automobile dimming-distance lighting system, by setting multiple reflection cavities on substrate, the surrounding of each reflection cavity sets white glue
Reflector layer, chip front side light extraction after the light that the LED chip surrounding in reflection cavity is sent is reflected by the white glue reflector layer, has
Effect improves product light efficiency and brightness.
In order to achieve the above object, the utility model takes following technical scheme:
A kind of LED encapsulation structure for improving light efficiency, including substrate, eutectic is pasted with several LED chips on the substrate,
Wherein, several reflection cavities are provided with the substrate, each LED chip in independent reflection cavity, the reflection cavity
Surrounding is white glue reflector layer, and the reflection cavity is interior, the top of LED chip and side are both provided with fluorescent adhesive layer.
In the LED encapsulation structure of described raising light efficiency, the section of the white glue reflector layer is triangle, the triangle
Base be bonded with substrate, the hypotenuse is bonded with fluorescent adhesive layer.
In the LED encapsulation structure of the raising light efficiency, the triangle is isosceles triangle.
In the LED encapsulation structure of described raising light efficiency, the angular range on the hypotenuse and base for 30 °-
80°。
In the LED encapsulation structure of the raising light efficiency, the white glue reflector layer is white silicone layer.
In the LED encapsulation structure of the raising light efficiency, the bottom of the substrate is provided with cathode and anode, the cathode
The first pre-determined distance is spaced between anode, the mark part for identifying anode is additionally provided with the anode.
In the LED encapsulation structure of the raising light efficiency, it is both provided with the cathode and anode for turning on substrate just
The conductive hole of circuit between face and the back side.
In the LED encapsulation structure of the raising light efficiency, the bottom of the substrate is additionally provided with the heat dissipating layer for heat dissipation,
The heat dissipating layer is bonded with substrates into intimate, and with second pre-determined distance of cathode interval, it is default with the anode interval second
Distance.
In the LED encapsulation structure of the raising light efficiency, the heat dissipating layer is copper foil layer.
A kind of automobile dimming-distance lighting system, including convex lens, the LED light source positioned at the convex lens incident side, wherein,
The LED light source is using the LED encapsulation structure as described above for improving light efficiency.
Compared to the prior art, the LED encapsulation structure and automobile dimming-distance optical illumination provided by the utility model for improving light efficiency
In system, the LED encapsulation structure for improving light efficiency, including substrate, eutectic is pasted with several LED chips on the substrate,
Several reflection cavities are provided with the substrate, for each LED chip in independent reflection cavity, the surrounding of the reflection cavity is equal
For white glue reflector layer, the reflection cavity is interior, the top of LED chip and side are both provided with fluorescent adhesive layer, by being set on substrate
Multiple reflection cavities are put, the surrounding of each reflection cavity sets white glue reflector layer, the light that the LED chip surrounding in reflection cavity is sent
Chip front side light extraction after being reflected by the white glue reflector layer, effectively increases product light efficiency and brightness.
Brief description of the drawings
Fig. 1 is the front schematic view of the LED encapsulation structure of raising light efficiency provided by the utility model.
Fig. 2 is the schematic cross-section of the LED encapsulation structure of raising light efficiency provided by the utility model.
Fig. 3 is the side schematic view of the LED encapsulation structure of raising light efficiency provided by the utility model.
Fig. 4 is the schematic bottom view of the LED encapsulation structure of raising light efficiency provided by the utility model.
Embodiment
The LED encapsulation structure provided by the utility model for improving light efficiency and automobile dimming-distance lighting system pass through on substrate
Multiple reflection cavities are set, and the surrounding of each reflection cavity sets white glue reflector layer, what the LED chip surrounding in reflection cavity was sent
Chip front side light extraction after light is reflected by the white glue reflector layer, effectively increases product light efficiency and brightness.
To make the purpose of this utility model, technical solution and effect clearer, clear and definite, develop simultaneously implementation referring to the drawings
The utility model is further described in example.It should be appreciated that specific embodiment described herein is only explaining this practicality
It is new, it is not used to limit the utility model.
Please refer to Fig.1, Fig. 2 and Fig. 3, the LED encapsulation structure provided by the utility model for improving light efficiency are rectangle, its bag
Include substrate 10, eutectic is pasted with several LED chips 11 on the substrate 10, several LED chips 11 can serial or parallel connection, its
Described in substrate 10 use ceramic substrate 10, the LED chip 11 be preferably flip-chip, can be straight with substrate 10 without bonding wire
Fitting is connect, and chip size can accomplish smaller, be conducive to improve product integrated level.
Further, several reflection cavities 12 are additionally provided with the substrate 10, the light sent for reflecting LED chip 11
Line, each LED chip 11 are respectively positioned in independent reflection cavity 12, and the surrounding of the reflection cavity 12 is white glue reflector layer 20, and
The reflection cavity 12 is interior, the top of LED chip 11 and side are both provided with fluorescent adhesive layer 30, i.e., in the utility model, LED chip
11 surroundings are no longer fully wrapped around by white silica gel, but there are prepsetting gap between white glue reflector layer 20, the prepsetting gap with
And the top of chip is filled with fluorescent adhesive layer 30, after the light that 11 surrounding of LED chip is sent will be reflected by white glue reflector layer 20
Again from chip front side light extraction, light efficiency and brightness are also effectively increased while realizing product single side light extraction.
Specifically, the section of the white glue reflector layer 20 is triangle, and the base of the triangle is bonded with substrate 10, institute
State hypotenuse to be bonded with fluorescent adhesive layer 30, reflection cavity 12 is formed by section white glue reflector layer 20 triangular in shape, is made
The light that 11 surrounding of LED chip is sent is obtained, is reflected by the ramped shaped white glue reflector layer 20 of surrounding, so as to improve product light efficiency.
The triangle is preferably isosceles triangle, and the angular range on the hypotenuse and base is 30 ° -80 °,
Be conducive to light uniformly to be reflected, improve outgoing light homogeneity.
Further, the white glue reflector layer 20 uses white silicone layer, and the reflectivity of the white silicone layer is big
Reflected as far as possible in the luminous energy that LED chip 11 sends equal to 95%, is effectively ensured, improve light emission rate.
Preferably, after the utility model is mounted on ceramic substrate 10 using LED flip chip eutectic, first Molding is white
Color silicone layer, that is, white glue reflector layer 20, after forming reflection cavity 12, then clicks and enters the fluorescent glue prepared in advance, shape in reflection cavity 12
Into the fluorescent adhesive layer 30 of inverted trapezoidal shape, i.e. the utility model can be encapsulated using traditional LED gluing process modes, glimmering without increasing
The equipment such as the coating of light powder or vacuum pad pasting, effectively reduces product cost.
Further, Fig. 4, the bottom of the substrate 10 are provided with cathode 13 and anode 14, the cathode
The first pre-determined distance is spaced between 13 and anode 14, the mark part 141 for identifying anode 14 is additionally provided with the anode 14,
That is the both sides of 10 bottom of substrate are separately provided for the cathode 13 and anode 14 of conduction, and the first pre-determined distance of interval avoids occurring
The situation of short circuit, while the mark part 141 for identifying anode 14 is additionally provided with anode 14, to distinguish positive and negative anodes 14, keep away
Exempting from reversed circuit causes damage of product.Also, be both provided with the cathode 13 and anode 14 for turn on the front of substrate 10 with
The conductive hole 15 of circuit between the back side, since LED chip 11 is arranged at the front of substrate 10, and cathode 13 and anode 14 are arranged on
The back side of substrate 10, therefore the front of substrate 10 and the direct circuit in the back side are turned on by conductive hole 15, realize and be electrically connected.
Preferably, the bottom of the substrate 10 is additionally provided with the heat dissipating layer 16 for heat dissipation, the heat dissipating layer 16 and substrate
10 fit closely, and to realize good heat dissipation performance, and the heat dissipating layer 16 is spaced the second pre-determined distance with the cathode 13, with
The anode 14 is spaced the second pre-determined distance, since heat dissipating layer 16 generally uses metal material, good heat dissipation effect, therefore is to avoid
Short circuit, the heat dissipating layer 16 are directly arranged at intervals with cathode 13 and anode 14, ensure the safe to use of product.Specifically, institute
It is preferably copper foil layer to state heat dissipating layer 16, or the metal layer of other perfect heat-dissipatings also can be selected in other embodiments, specifically
It can be selected according to product demand.
Specifically, the LED encapsulation structure length range for improving light efficiency is 4-10mm, width range 1.6-2.5mm,
Altitude range is 0.6-0.8mm, and can increase or decrease 11 quantity of LED chip as needed, is similar to halogen lamp and hernia lamp
The linear light sorurce of lighted region, specific size can be selected according to the actual requirements.
The LED encapsulation structure technical process of raising light efficiency provided by the utility model is introduced below:
Upside-down mounting eutectic technology is using the positive and negative anodes 14 and positive and negative anodes 14 of AuSn alloys in the LED chip 11 of bottom, use
Bonder point scaling powder mode is affixed on ceramic substrate 10, by eutectic reflow ovens high temperature for a period of time, 11 bottom of LED chip
AuSn alloys on positive and negative anodes 14, melt under scaling powder effect, are combined with 10 gold medal of substrate or silver and carry out fixed chip.
The high anti-silicones of Molding whites afterwards, white size cake is put into mold center's groove, upper/lower die molding
Melt, mold temperature and clamp time be 180 DEG C/3mins, and molding position is the surrounding of substrate 10 and along 10 length side of substrate
To at some positions being parallel to each other, so that some reflection cavities 12 are formed on the substrate 10, and each LED chip 11 is positioned at independent
Reflection cavity 12 in.
Afterwards the silica gel of preset ratio and fluorescent powder are configured to obtain fluorescent glue, fluorescent glue is poured into the glue of internal diameter 10mm
Pipe, after being installed to dispenser, setting dispensing amount injects fluorescent glue in the reflection cavity 12, is put into 150 DEG C/2H of oven, is made
Fluorescent adhesive layer 30, realizes that LED chip 11 encapsulates.
So as to by way of first elder generation Molding white silicones put fluorescent glue again so that 11 surrounding of LED chip no longer by
White silica gel is fully wrapped around, but there are prepsetting gap between white glue reflector layer 20, the top of the prepsetting gap and chip
Fluorescent adhesive layer 30 is filled with, effectively improves light efficiency and the brightness of product.
In conclusion in the LED encapsulation structure provided by the utility model for improving light efficiency and automobile dimming-distance lighting system,
The LED encapsulation structure for improving light efficiency, including substrate, eutectic is pasted with several LED chips, the substrate on the substrate
On be provided with several reflection cavities, for each LED chip in independent reflection cavity, the surrounding of the reflection cavity is that white glue is anti-
Photosphere, the reflection cavity is interior, the top of LED chip and side are both provided with fluorescent adhesive layer, multiple anti-by being set on substrate
Chamber is penetrated, the surrounding of each reflection cavity sets white glue reflector layer, and the light that the LED chip surrounding in reflection cavity is sent is white by this
Chip front side light extraction after the reflection of glue reflector layer, effectively increases product light efficiency and brightness.
It is understood that for those of ordinary skills, can with technical solution according to the present utility model and
The design of its utility model is subject to equivalent substitution or change, and all these changes or replacement should all belong to appended by the utility model
Scope of the claims.
Claims (10)
1. a kind of LED encapsulation structure for improving light efficiency, including substrate, eutectic is pasted with several LED chips on the substrate, its
It is characterized in that, several reflection cavities are provided with the substrate, and each LED chip is in independent reflection cavity, the reflection
The surrounding of chamber is white glue reflector layer, and the reflection cavity is interior, the top of LED chip and side are both provided with fluorescent adhesive layer.
2. the LED encapsulation structure according to claim 1 for improving light efficiency, it is characterised in that the white glue reflector layer is cut
Face is triangle, and the base of the triangle is bonded with substrate, and the hypotenuse is bonded with fluorescent adhesive layer.
3. the LED encapsulation structure according to claim 2 for improving light efficiency, it is characterised in that the triangle is isosceles three
It is angular.
4. it is according to claim 2 improve light efficiency LED encapsulation structure, it is characterised in that the hypotenuse with
The angular range on base is 30 ° -80 °.
5. the LED encapsulation structure according to claim 2 for improving light efficiency, it is characterised in that the white glue reflector layer is white
Color silicone layer.
6. the LED encapsulation structure according to claim 1 for improving light efficiency, it is characterised in that the bottom of the substrate is set
There are cathode and anode, the first pre-determined distance is spaced between the positive electrode and negative electrode, be additionally provided with the anode negative for identifying
The mark part of pole.
7. the LED encapsulation structure according to claim 6 for improving light efficiency, it is characterised in that on the cathode and anode
It is provided with the conductive hole for turning on circuit between substrate front side and the back side.
8. the LED encapsulation structure according to claim 6 for improving light efficiency, it is characterised in that the bottom of the substrate is also set
Be equipped with the heat dissipating layer for heat dissipation, the heat dissipating layer is bonded with substrates into intimate, and with second pre-determined distance of cathode interval, with
Second pre-determined distance of anode interval.
9. the LED encapsulation structure according to claim 8 for improving light efficiency, it is characterised in that the heat dissipating layer is copper foil layer.
10. a kind of automobile dimming-distance lighting system, including convex lens, the LED light source positioned at the convex lens incident side, its feature
It is, the LED light source is using the LED encapsulation structure for improving light efficiency as described in claim 1-9 any one.
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109860164A (en) * | 2019-02-26 | 2019-06-07 | 深圳市穗晶光电股份有限公司 | A kind of automobile-used LED light source and its packaging technology based on the encapsulation of ceramic fluorescent piece |
CN111554212A (en) * | 2020-06-09 | 2020-08-18 | 安徽昂然节能环保科技有限公司 | Self-luminous emergency channel protective strip and preparation method thereof |
WO2021213204A1 (en) * | 2020-04-23 | 2021-10-28 | 深圳市聚飞光电股份有限公司 | Led substrate, led package and manufacturing method therefor, and display device |
-
2017
- 2017-07-14 CN CN201720852300.1U patent/CN207353289U/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109860164A (en) * | 2019-02-26 | 2019-06-07 | 深圳市穗晶光电股份有限公司 | A kind of automobile-used LED light source and its packaging technology based on the encapsulation of ceramic fluorescent piece |
WO2021213204A1 (en) * | 2020-04-23 | 2021-10-28 | 深圳市聚飞光电股份有限公司 | Led substrate, led package and manufacturing method therefor, and display device |
CN111554212A (en) * | 2020-06-09 | 2020-08-18 | 安徽昂然节能环保科技有限公司 | Self-luminous emergency channel protective strip and preparation method thereof |
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