CN103840063A - LED package substrate and manufacturing method thereof - Google Patents
LED package substrate and manufacturing method thereof Download PDFInfo
- Publication number
- CN103840063A CN103840063A CN201310577445.1A CN201310577445A CN103840063A CN 103840063 A CN103840063 A CN 103840063A CN 201310577445 A CN201310577445 A CN 201310577445A CN 103840063 A CN103840063 A CN 103840063A
- Authority
- CN
- China
- Prior art keywords
- cup unit
- main material
- base plate
- packaging
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73267—Layer and HDI connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Abstract
The invention discloses an LED package substrate and a manufacturing method of the LED package substrate. The LED package substrate comprises a concave cup unit containing an LED chip. The concave cup unit is composed of a transparent bottom plate and a transparent side wall, wherein fluorescent powder particles are contained in the bottom plate and the side wall, and the vertical section of the concave cup unit is of a right-angled U shape. According to the manufacturing method of the LED package substrate, a main material made of a transparent material is heated to be in the molten state or the liquid state; fluorescent powder is added to the main material, and the fluorescent powder and the main material are mixed uniformly; a mold is used for compression molding of the main material, wherein the main material is mixed with the fluorescent powder and is in the molten state or the liquid state, so that the concave cup unit containing the LED chip is formed, or the main material mixed with the fluorescent powder is made into a flat plate shape by means of forming, and the concave cup unit is formed in the flat-plate-shaped main material through the etching technology. According to the LED package substrate and the manufacturing method of the LED package substrate, transparent materials such as glass, epoxy resin and hard silica gel are mixed with the fluorescent powder for manufacturing of the concave cup unit, so that the concave cup unit has good transmission of light, the LED chip packaged in the concave cup unit can emit light penetrating through each face of the concave cup unit, and therefore the light emitting rate of an LED device is increased.
Description
Technical field
The invention belongs to technical field of semiconductor luminescence, relate in particular to base plate for packaging of a kind of LED chip and preparation method thereof.
Background technology
Light emitting semiconductor device, as light-emitting diode (LED) or laser diode etc. are widely used in a lot of fields.The appearance of light emitting semiconductor device has brought can covering visible light spectrum and higher luminous efficiency and solid-state stable light source.
LED chip mainly adopts support encapsulation or substrate package at present.As shown in Figure 1, for adopting the structural representation of LED device of support encapsulation.Support packaged LED device comprises package support 100, is arranged at the recessed cup 101 of support on package support 100, in the recessed cup 101 of support, be provided with metal bonding wire 102, LED chip 104 is arranged in the recessed cup 101 of support, and form circuit with package support 100 and be connected, in the recessed cup 101 of support, be filled with the packaging plastic 103 that has applied fluorescent material.Adopt support encapsulation LED chip exiting surface upwards, because package support 100 and the recessed cup 101 of support are made up of transparent materials, therefore, LED device only has the upper surface can bright dipping, light emission rate is low.
As shown in Figure 2, for adopting the structural representation of LED device of substrate package.Substrate package LED device comprises ceramic packaging substrate 100 ', is provided with line layer on base plate for packaging 100 ', and it is upper that LED chip 104 adopts flip chip bonding to be arranged at base plate for packaging 100 ', and LED chip is outside equipped with the packaging plastic 103 that has applied fluorescent material.Adopt substrate package LED chip, need to experience multiple high temp sintering and connect to form circuit in encapsulation process, easily to LED chip, bright dipping exerts an influence.And no matter be to adopt package support or base plate for packaging to encapsulate LED chip, on support or substrate, all there is line layer structure, therefore in the technological process of existing LED device production, generally first carry out die bond technique and allow LED chip and substrate formation circuit be connected, then carry out the coating of phosphor powder layer.
Patent publication No. is in the Chinese invention patent application of CN103258938A, to disclose a kind of LED lamp bar base plate for packaging containing fluorescent material, the main material of this base plate for packaging is the mixture of ratio fluorescent material, heat sink material and the binding material comparatively fixed, with the master that is encapsulated as of COB form, emphasis has solved LED lamp bar and the heat dissipation problem in illumination application thereof, and can realize positive and negative and side 4 π are luminous.But in this base plate for packaging, contain 70～75% Heat Conduction Material, Heat Conduction Material is aluminium oxide or aluminium nitride, is opaque material, and in light transmission, effect is poor, easily causes light loss, has increased the burden of heat dissipation design.Get improving constantly of optical efficiency along with LED, electro-optical efficiency constantly promotes, the conversion of thermal energy is fewer and feweri, and LED product is more and more less to the dependence meeting of heat radiation, the heat radiation advantage of this design actual contrast ceramic substrate or COB substrate or bright dipping advantage not obvious.
Summary of the invention
For above deficiency, the object of the present invention is to provide a kind of direct bright dipping of each face that light passes through base plate for packaging or LED base plate for packaging of a large amount of bright dippings and preparation method thereof of allowing.
To achieve these goals, the present invention takes following technical solution:
LED base plate for packaging, comprises the recessed cup unit of placing LED chip, and described recessed cup unit is made up of dianegative and transparent sidewall, and described base plate and sidewall contain fluorescent powder grain, and the vertical section shape of described recessed cup unit is Qian shape.
Preferably, described base plate and sidewall are connected as a single entity.
Preferably, described recessed cup unit is made up of glass or epoxy resin or hard silica gel.
Preferably, the shore hardness of described hard silica gel is greater than 60.
Preferably, described recessed cup unit is the adjacent layout of array format.
Preferably, described recessed cup unit is array format equi-spaced apart and is arranged on transparent connecting bottom board.
The manufacture method of LED base plate for packaging, comprises the following steps:
The main material that transparent material is formed heats, until present molten condition or liquid state;
In the main material of molten condition or liquid state, add fluorescent material, fluorescent material and main material are mixed;
Adopt mould to be mixed with molten condition or the liquid main material compression molding of fluorescent material, to form the recessed cup unit of placing LED chip.
The manufacture method of LED base plate for packaging, comprises the following steps:
The main material that transparent material is formed heats, until present molten condition or liquid state;
In the main material of molten condition or liquid state, add fluorescent material, fluorescent material and main material are mixed;
The main material that is mixed with fluorescent material is shaped to tabular;
Adopt etch process on flat main material, to form the recessed cup unit of placement LED chip.
Preferably, the recessed cup unit forming is the adjacent layout of array format, or the recessed cup unit forming is array format equi-spaced apart and is arranged on connecting bottom board.
Preferably, described main material is glass or epoxy resin or hard silica gel.
From above technical scheme, the present invention adopts as the transparent material mixed fluorescent powder such as glass, epoxy resin, hard silica gel is made recessed glass of unit, make recessed cup unit there is good light transmission, the LED chip being packaged in recessed cup unit can see through each bright dipping of recessed cup unit, thereby improves the light emission rate of LED device.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention, to the accompanying drawing of required use in embodiment or description of the Prior Art be done to simple introduction below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation of the LED device of available technology adopting support encapsulation;
Fig. 2 is the structural representation of the LED device of available technology adopting substrate package;
Fig. 3 is the structural representation of the embodiment of the present invention 1;
Fig. 4 is the sectional view of the embodiment of the present invention 1 base plate for packaging fovea superior cup unit;
Fig. 5 is the structural representation of the LED device of the embodiment of the present invention 1;
Fig. 6 is the process chart of the embodiment of the present invention 1 base plate for packaging;
Fig. 7 is the structural representation of the embodiment of the present invention 3;
Fig. 8 is the structural representation of the LED device of the embodiment of the present invention 3;
Fig. 9 is the process chart of the embodiment of the present invention 3 base plate for packaging.
Embodiment
Embodiment 1
As shown in Figure 3, LED base plate for packaging of the present invention comprises that several are the recessed cup unit 1 that array is arranged, the tight adjacent layout in described recessed cup unit 1, the interior LED chip that arranges in recessed cup unit 1.With reference to Fig. 4, each recessed cup unit 1 is made up of the base plate 1-1 being connected as a single entity and sidewall 1-2 simultaneously, and the vertical section shape of recessed cup unit 1 is Qian shape, and recessed cup does not contain line layer structure in unit 1.The main material of the recessed cup unit 1 of the present embodiment is glass, and glass contains fluorescent powder grain.
With reference to Fig. 5, while adopting the present embodiment base plate for packaging to encapsulate LED chip, LED chip 2 is directly attached at by transparent crystal-bonding adhesive on the base plate 1-1 of recessed cup unit 1, between recessed cup unit 1 inwall and LED chip 2, be filled with transparent filling glue 3, packaging plastic coating layer and electrode pattern layer be set in turn in LED chip with the recessed glass of opposite side that unit 1 is relative.The lower recess of the Wei Aobei unit, function of tonic chord district 1 of LED base plate for packaging of the present invention, base plate for packaging adopts the transparent material that contains fluorescent powder grain to make, LED chip 2 be packaged into recessed cup unit 1 interior after, each face of recessed cup unit 1 is exiting surface, light can be by the directly outwards bright dipping of each face of the recessed cup of base plate for packaging unit 1, and light emission rate is high.
As shown in Figure 6, for the process chart of the present embodiment LED base plate for packaging, first by the main material of LED base plate for packaging---glass heats, when being heated to, main material presents molten condition or when liquid, add fluorescent material, fluorescent material is evenly mixed with main material, then adopt the mould consistent with recessed cup cell configuration to be mixed with the molten condition of fluorescent material or liquid main material compression molding, form the LED base plate for packaging that multiple recessed cup cell arrays are arranged that has as shown in Figure 3.After base plate for packaging moulding is ready to, can enter the packaging technology of LED chip.
The present embodiment place different from embodiment 1 is: the main material of the present embodiment LED base plate for packaging is epoxy resin, epoxy resin is heated to after molten condition or liquid state, add fluorescent material, fluorescent material is mixed with epoxy resin, then use mould compression molding.
As shown in Figure 7, the present embodiment place different from embodiment 1 is: the LED base plate for packaging of the present embodiment arranges the recessed cup unit 1 that multiple array is arranged, it is upper that recessed cup unit 1 equi-spaced apart is arranged at connecting bottom board 1-3, in the interval between adjacent recessed cup unit 1, fills transparent filling glue.The main material of the present embodiment base plate for packaging is hard silica gel, preferably more than 60 silica gel of shore hardness, and main material contains fluorescent powder grain.
With reference to Fig. 8, while adopting the present embodiment base plate for packaging to encapsulate LED chip, LED chip 2 is fixed on by transparent crystal-bonding adhesive on the base plate 1-1 of recessed cup unit 1, between recessed cup unit 1 inwall and LED chip 2, be filled with transparent filling glue 3, packaging plastic coating layer and electrode pattern layer are set in turn in the opposite side relative with recessed cup unit 1 of LED chip, adjacent recessed cup is connected by connecting bottom board 1-3 between unit 1, and the material of connecting bottom board 1-3 is identical with main material material.LED chip 2 be packaged into recessed cup unit 1 interior after, light can be by each bright dipping of recessed glass of unit 1.
With reference to Fig. 9, the technological process of the present embodiment LED base plate for packaging is: first by the main material of LED base plate for packaging---hard silica gel heats, when being heated to, main material presents molten condition or when liquid, add fluorescent material, fluorescent material is evenly mixed with main material, main material is shaped to tabular, then uses etch process to form recessed cup cell array, the spacing between recessed cup unit can be adjusted according to the size of LED device.
LED base plate for packaging of the present invention adopts transparent material as main material, in main material, add fluorescent powder grain, after LED chip is packaged in recessed cup unit, the light that LED chip sends can see through the outside bright dipping in each side of recessed cup unit, the light transmission of recessed cup unit is good, light loss is little, and the light emission rate of LED device is high.
LED base plate for packaging of the present invention in process of production, can adopt different main materials according to needs of production, or add different fluorescent material, proportioning between fluorescent material and main material can adjust accordingly, mass ratio between the fluorescent material adding and all material (comprising main material and fluorescent material) can be between 0.05～0.5, if main material is glass, the value of fluorescent material/(main material+fluorescent material) can be 0.1, when main material is epoxy resin, the value of fluorescent material/(main material+fluorescent material) can be 0.2 etc., concrete proportioning according to demand and material properties adjust.The size of the recessed cup of the present invention unit can be according to the adjusted size of packaging LED chips, LED base plate for packaging edge can have part to extend, to be applicable to explained hereafter, LED base plate for packaging of the present invention is not containing line layer structure, and the line construction that LED chip electrode is drawn forms at subsequent technique.
In this specification, various piece adopts the mode of going forward one by one to describe, and what each part stressed is and the difference of other parts, between various piece same or similar part mutually referring to.To the above-mentioned explanation of the disclosed embodiments, make professional and technical personnel in the field can realize or use the present invention.To be apparent for those skilled in the art to the multiple modification of these embodiment, General Principle as defined herein can, in the situation that not departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention will can not be restricted to embodiment illustrated herein, but will meet the wide region consistent with principle disclosed herein and features of novelty.
Claims (10)
1.LED base plate for packaging, comprises the recessed cup unit of placing LED chip, it is characterized in that:
Described recessed cup unit is made up of dianegative and transparent sidewall, and described base plate and sidewall contain fluorescent powder grain, and the vertical section shape of described recessed cup unit is Qian shape.
2. LED base plate for packaging as claimed in claim 1, is characterized in that: described base plate and sidewall are connected as a single entity.
3. LED base plate for packaging as claimed in claim 1, is characterized in that: described recessed cup unit is made up of glass or epoxy resin or hard silica gel.
4. LED base plate for packaging as claimed in claim 3, is characterized in that: the shore hardness of described hard silica gel is greater than 60.
5. LED base plate for packaging as claimed in claim 1, is characterized in that: described recessed cup unit is the adjacent layout of array format.
6. LED base plate for packaging as claimed in claim 1, is characterized in that: described recessed cup unit is array format equi-spaced apart and is arranged on transparent connecting bottom board.
The manufacture method of 7.LED base plate for packaging, is characterized in that, comprises the following steps:
The main material that transparent material is formed heats, until present molten condition or liquid state;
In the main material of molten condition or liquid state, add fluorescent material, fluorescent material and main material are mixed;
Adopt mould to be mixed with molten condition or the liquid main material compression molding of fluorescent material, to form the recessed cup unit of placing LED chip.
The manufacture method of 8.LED base plate for packaging, is characterized in that, comprises the following steps:
The main material that transparent material is formed heats, until present molten condition or liquid state;
In the main material of molten condition or liquid state, add fluorescent material, fluorescent material and main material are mixed;
The main material that is mixed with fluorescent material is shaped to tabular;
Adopt etch process on tabular main material, to form the recessed cup unit of placement LED chip.
9. according to the manufacture method of the LED base plate for packaging described in claim 7 or 8, it is characterized in that: the recessed cup unit forming is the adjacent layout of array format, or the recessed cup unit forming is array format equi-spaced apart and is arranged on connecting bottom board.
10. according to the manufacture method of the LED base plate for packaging described in claim 7 or 8, it is characterized in that: described main material is glass or epoxy resin or hard silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310577445.1A CN103840063A (en) | 2013-11-15 | 2013-11-15 | LED package substrate and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310577445.1A CN103840063A (en) | 2013-11-15 | 2013-11-15 | LED package substrate and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103840063A true CN103840063A (en) | 2014-06-04 |
Family
ID=50803365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310577445.1A Pending CN103840063A (en) | 2013-11-15 | 2013-11-15 | LED package substrate and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103840063A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015184618A1 (en) * | 2014-06-05 | 2015-12-10 | 上海富迪照明电器有限公司 | Embedded white-light led package structure based on solid state fluorescent material and manufacturing method thereof |
| CN105322072A (en) * | 2014-07-30 | 2016-02-10 | 高玉宇 | Fluorescent composite resin substrate white light light-emitting diode device and manufacture method thereof |
| CN106025049A (en) * | 2016-07-14 | 2016-10-12 | 东莞中之光电股份有限公司 | Light-increasing CSP-standard LED packaging process and making method thereof |
| CN106558639A (en) * | 2015-09-24 | 2017-04-05 | 上海芯元基半导体科技有限公司 | The LED component and its cutting unit and manufacture method of wafer level encapsulation |
| CN108257924A (en) * | 2017-12-31 | 2018-07-06 | 安徽普发照明有限公司 | For the potting resin of high-cooling property semiconductor light emitting component |
| TWI638788B (en) | 2015-07-14 | 2018-10-21 | 博思有限公司 | Led chip scale package with color conversion materials using glass frit and method for manufacturing the same |
| CN109075128A (en) * | 2016-06-10 | 2018-12-21 | 日本电气硝子株式会社 | The manufacturing method and airtight package of airtight package |
| CN111106099A (en) * | 2019-12-10 | 2020-05-05 | 温州大学新材料与产业技术研究院 | High-power COB heat dissipation packaging structure |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002033517A (en) * | 2000-05-09 | 2002-01-31 | Nichia Chem Ind Ltd | Light emitting element and its manufacturing method |
| US20070194691A1 (en) * | 2006-02-21 | 2007-08-23 | Samsung Electro-Mechanics Co., Ltd. | Light emitting diode package structure having high light extraction efficiency and method of manufacturing the same |
| CN101060148A (en) * | 2006-04-21 | 2007-10-24 | 晶元光电股份有限公司 | Semiconductor light-emitting device |
| JP2008233517A (en) * | 2007-03-20 | 2008-10-02 | Jsr Corp | Radiation-sensitive resin composition, spacer for liquid crystal display element and method for producing the same |
| CN101661124A (en) * | 2008-08-26 | 2010-03-03 | 保视界光电股份有限公司 | Direct type backlight module and diffusion plate thereof |
| CN101980385A (en) * | 2010-07-19 | 2011-02-23 | 宁波市瑞康光电有限公司 | Method for encapsulating light-emitting diode (LED), LED and LED illumination device |
| CN102487117A (en) * | 2010-12-06 | 2012-06-06 | 矽品精密工业股份有限公司 | Light-transmitting cover plate and method for manufacturing the same, and packaging structure of light-emitting diode |
| CN203118987U (en) * | 2013-01-25 | 2013-08-07 | 廖旭文 | Double-sided luminous LED lamp panel structure |
| CN103258938A (en) * | 2013-05-03 | 2013-08-21 | 杭州耀迪科技有限公司 | Manufacturing method of heat conduction light-emitting diode (LED) light bar package substrate comprising fluorescent powder |
| CN103325916A (en) * | 2012-12-14 | 2013-09-25 | 芜湖德豪润达光电科技有限公司 | Light emitting diode packaging structure and manufacturing method thereof |
| CN103337579A (en) * | 2013-06-03 | 2013-10-02 | 高波 | Glass ceramic transparent base plate double-face stereo luminescent LED packaging |
| CN203659915U (en) * | 2013-11-15 | 2014-06-18 | 芜湖德豪润达光电科技有限公司 | LED package substrate |
-
2013
- 2013-11-15 CN CN201310577445.1A patent/CN103840063A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002033517A (en) * | 2000-05-09 | 2002-01-31 | Nichia Chem Ind Ltd | Light emitting element and its manufacturing method |
| US20070194691A1 (en) * | 2006-02-21 | 2007-08-23 | Samsung Electro-Mechanics Co., Ltd. | Light emitting diode package structure having high light extraction efficiency and method of manufacturing the same |
| CN101060148A (en) * | 2006-04-21 | 2007-10-24 | 晶元光电股份有限公司 | Semiconductor light-emitting device |
| JP2008233517A (en) * | 2007-03-20 | 2008-10-02 | Jsr Corp | Radiation-sensitive resin composition, spacer for liquid crystal display element and method for producing the same |
| CN101661124A (en) * | 2008-08-26 | 2010-03-03 | 保视界光电股份有限公司 | Direct type backlight module and diffusion plate thereof |
| CN101980385A (en) * | 2010-07-19 | 2011-02-23 | 宁波市瑞康光电有限公司 | Method for encapsulating light-emitting diode (LED), LED and LED illumination device |
| CN102487117A (en) * | 2010-12-06 | 2012-06-06 | 矽品精密工业股份有限公司 | Light-transmitting cover plate and method for manufacturing the same, and packaging structure of light-emitting diode |
| CN103325916A (en) * | 2012-12-14 | 2013-09-25 | 芜湖德豪润达光电科技有限公司 | Light emitting diode packaging structure and manufacturing method thereof |
| CN203118987U (en) * | 2013-01-25 | 2013-08-07 | 廖旭文 | Double-sided luminous LED lamp panel structure |
| CN103258938A (en) * | 2013-05-03 | 2013-08-21 | 杭州耀迪科技有限公司 | Manufacturing method of heat conduction light-emitting diode (LED) light bar package substrate comprising fluorescent powder |
| CN103337579A (en) * | 2013-06-03 | 2013-10-02 | 高波 | Glass ceramic transparent base plate double-face stereo luminescent LED packaging |
| CN203659915U (en) * | 2013-11-15 | 2014-06-18 | 芜湖德豪润达光电科技有限公司 | LED package substrate |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105431953B (en) * | 2014-06-05 | 2018-03-16 | 上海富迪照明电器有限公司 | Embedded White-light LED package structure based on solid state fluorescent material and preparation method thereof |
| CN105431953A (en) * | 2014-06-05 | 2016-03-23 | 上海富迪照明电器有限公司 | Embedded white-light LED package structure based on solid state fluorescent material and manufacturing method thereof |
| WO2015184618A1 (en) * | 2014-06-05 | 2015-12-10 | 上海富迪照明电器有限公司 | Embedded white-light led package structure based on solid state fluorescent material and manufacturing method thereof |
| US9537058B2 (en) | 2014-06-05 | 2017-01-03 | Shanghai Fudi Lighting Electronic Co., Ltd. | Embedded white light LED package structure based on solid-state fluorescence material and manufacturing method thereof |
| CN105322072A (en) * | 2014-07-30 | 2016-02-10 | 高玉宇 | Fluorescent composite resin substrate white light light-emitting diode device and manufacture method thereof |
| TWI638788B (en) | 2015-07-14 | 2018-10-21 | 博思有限公司 | Led chip scale package with color conversion materials using glass frit and method for manufacturing the same |
| CN106558639A (en) * | 2015-09-24 | 2017-04-05 | 上海芯元基半导体科技有限公司 | The LED component and its cutting unit and manufacture method of wafer level encapsulation |
| CN106558639B (en) * | 2015-09-24 | 2019-05-21 | 上海芯元基半导体科技有限公司 | The LED component and its cutting unit and production method of wafer grade encapsulation |
| CN109075128A (en) * | 2016-06-10 | 2018-12-21 | 日本电气硝子株式会社 | The manufacturing method and airtight package of airtight package |
| CN106025049B (en) * | 2016-07-14 | 2018-08-24 | 东莞中之光电股份有限公司 | The type that adds lustre to CSP standard LED package techniques and preparation method thereof |
| CN106025049A (en) * | 2016-07-14 | 2016-10-12 | 东莞中之光电股份有限公司 | Light-increasing CSP-standard LED packaging process and making method thereof |
| CN108257924A (en) * | 2017-12-31 | 2018-07-06 | 安徽普发照明有限公司 | For the potting resin of high-cooling property semiconductor light emitting component |
| CN108257924B (en) * | 2017-12-31 | 2020-07-31 | 安徽普发电气有限公司 | Packaging resin for high-heat-dissipation semiconductor light-emitting component |
| CN111106099A (en) * | 2019-12-10 | 2020-05-05 | 温州大学新材料与产业技术研究院 | High-power COB heat dissipation packaging structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103840063A (en) | LED package substrate and manufacturing method thereof | |
| KR102071463B1 (en) | Led with high thermal conductivity particles in phosphor conversion layer and the method of fabricating the same | |
| CN106531857A (en) | Chip scale LED packaging structure and packaging technology | |
| CN101123286A (en) | LED encapsulation structure and method | |
| WO2014101602A1 (en) | Led packaging structure using distant fluorescent powder layer and manufacturing method thereof | |
| CN202948972U (en) | White light light emitting diode (LED) module packaging structure | |
| CN105006511A (en) | LED package method | |
| CN101436637A (en) | High-efficiency heat-dissipating luminous high-power LED packaging structure | |
| CN105633248B (en) | LED lamp and preparation method thereof | |
| CN104993032B (en) | A kind of white light LED part and preparation method thereof | |
| US9640740B2 (en) | LED lighting device and packaging method | |
| CN205790054U (en) | EMC upside-down mounting support adds a package lens structure | |
| CN105449083B (en) | A kind of method of LED fluorescent powder glue coating | |
| CN203659915U (en) | LED package substrate | |
| CN106505138A (en) | A kind of LED encapsulation structure and preparation method thereof | |
| CN102738372A (en) | Novel LED (light emitting diode) integrated light source module and preparation method thereof | |
| CN206878028U (en) | A kind of 360 degree of uniformly light-emitting white light LEDs elements | |
| CN204857777U (en) | LED packaging structure | |
| CN205960020U (en) | Encapsulation of chip level white light LED | |
| CN205231108U (en) | White light LED wafer packaging structure | |
| CN103022327A (en) | LED packaging structure and method for manufacturing same | |
| CN103199088A (en) | Self-heat-dissipation light emitting diode (LED) light source and manufacturing method | |
| CN207602620U (en) | A kind of stent for LED encapsulation | |
| CN105470371B (en) | A kind of device and its painting method for fluorescent material coating | |
| CN110767792A (en) | COB light source and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140604 |