CN101436637A - High-efficiency heat-dissipating luminous high-power LED packaging structure - Google Patents
High-efficiency heat-dissipating luminous high-power LED packaging structure Download PDFInfo
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- CN101436637A CN101436637A CNA2008102438636A CN200810243863A CN101436637A CN 101436637 A CN101436637 A CN 101436637A CN A2008102438636 A CNA2008102438636 A CN A2008102438636A CN 200810243863 A CN200810243863 A CN 200810243863A CN 101436637 A CN101436637 A CN 101436637A
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- 238000004806 packaging method and process Methods 0.000 title abstract description 4
- 239000000758 substrate Substances 0.000 claims abstract description 121
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 55
- 238000004020 luminiscence type Methods 0.000 claims abstract description 41
- 239000013078 crystal Substances 0.000 claims abstract description 30
- 239000000741 silica gel Substances 0.000 claims abstract description 27
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 27
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- 239000002184 metal Substances 0.000 claims abstract description 15
- 238000005538 encapsulation Methods 0.000 claims description 25
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- 238000003973 irrigation Methods 0.000 claims description 25
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Abstract
The invention relates to a high-power LED packaging structure which radiates heat and illuminates efficiently and comprises a lens, a substrate and an LED luminous chip, wherein the lens is fixed on the upper surface of the substrate; the lower surface of the lens is provided with a raised mounting dent; the LED luminous chip is arranged on the upper surface of the substrate and is buckled and covered by the mounting dent; the upper surface of the substrate buckled and covered by the mounting dent is provided with a positive luminescence electrode and a negative luminescence electrode; the luminous electrodes are connected with the LED luminous chip through metal wires; the upper surface of the substrate is provided a positive connecting electrode and a negative connecting electrode which are connected with the luminous electrodes; the lower surface of the lens on the outer side of the mounting dent and the upper surface of the substrate are adhered through an annular adhesive layer; and a cavity formed by inner holes of the adhesive layer and the mounting dent is filled with silica gel; The substrate is provided with a gel-filling passage which is communicated with the cavity formed by inner holes of the adhesive layer and the mounting dent; and the lens and the substrate are made from quartz crystal. The high-power LED packaging structure has the advantages of high luminous flux, high led-out heat source, simple and practical structure and the like.
Description
Technical field
The present invention relates to a kind of LED encapsulating structure, especially a kind of high-power LED encapsulation structure of efficiency heat-dissipating luminous high.
Background technology
LED is a light-emitting diode, is a kind of of diode, and the light that sends different colours when characteristic is the electric current forward conduction comes.Great power LED is again a kind of of LED, and with respect to low-power LED, single power of great power LED is higher, and brightness is brighter, and price is higher.The low-power LED rated current all is 20mA, and it is high-power that rated current exceeds can be regarded as basically of 20mA.General power number has: 0.25w, 0.5w, 1w, 3w, 5w, 8w, 10w or the like.Main brill is 1m (lumen), and low power brill is generally mcd.This two unit can't convert.At present be widely used in places such as auto lamp, flashlight, light fixture as emerging green, environmental protection, an energy-conserving light source.
Wherein the LED encapsulating material is that the bottleneck that present great power LED is studied is how to improve heat radiation and bright dipping and package interconnect material to improve great power LED cooling to the heat radiation of great power LED and the influence of bright dipping. and the material impact that is had aspect the bright dipping.
Heat radiation is crucial for the great power LED device.If the heat that electric current produces can not be shed timely, the junction temperature that keeps PN junction is in the acceptable scope, can't obtain the stable light output and the normal useful life of device, can quicken the aging phenomenon of the materials such as silica gel in the LED simultaneously, in the useful life of great power LED, can reach 100000 hours.Behind the white light LEDs work 6000h, its light intensity was to reduce to original half there to be research to point out in 2000.Different photochromic LED optical attenuation speed also are different, and wherein redness is the slowest, blueness, and green placed in the middle, white is the fastest.With the encapsulated LED of 5MM, its packaging thermal resistance is up to 300 degree/W.Can not dispel the heat fully, cause the temperature of the chip of LED to raise, cause the device optical attenuation to accelerate.Outside the cause, epoxy resin is aging, and yellow also will make light output reduce.Great power LED produces the luminous flux doubly than the big 10-20 of original LED under big electric current, therefore must and adopt the encapsulating material of deterioration not to solve the problem of light decay by effective heat sink material.Just might be with more wider scopes of this green light source application.
The patent of relevant LED is a lot, for example in 200410027821.0, mentioned use optical glass as lens, also has the crystal glass mirror of mentioning in 200720192535.9 equally, above-described at the same time optical glass of optical glass and crystal glass mirror, the inner silicon dioxide that contains more, but its essence still is the category of glass, by its crystal glass the so-called quartz plate of this large-scale production is arranged in the Pujiang County, Zhejiang Province of China, Crystal lamp, crystal cup, quartzy tea set, quartzy Chinese chess or the like all is the high pbo glass goods basically, neither what " synthetic quartz " crystal be a kind of natural transparent quartzy mineral crystal; Synthetic quartz is that a kind of high-purity (SiO2) packs in autoclave and be mixed with the aqueous solution of mineralizer.The natural quartz of crushing is placed the bottom of container.Quartz dissolution.And carry out convection current.Crystal is formed on the young crystalline substance on autoclave top. also be hydrothermal growth process.Glass then is a kind of made amorphous body on the contrary.Even quartz glass and quartzy the two chemical composition all are silicon dioxide, all are again the transparent bodies, yet see but have differently in essence from the internal structure of the two, the method that modern age, applying X-ray was analyzed has specifically disclosed the internal structure of a large amount of crystal.Prove that now no matter its profile of all crystal how, its inside particle (atom, ion and molecule) is all made rule and arranged, the cycle that this rule mainly shows as particle repeats, thereby has constituted so-called clathrate structure.Therefore, according to the notion in modern times, every particle is done the rule arrangement in the material, promptly has grid system person and is called crystalline.Crystalline is crystal at the finite part in space.Thus, we can to crystal give a definition for: crystal is the solid with grid system.
Crystal is the solid with grid system, so claim that it is a crystal.And the quartz glass shape is like solid, but its inner particle do not make rule and arrange, and promptly do not have a grid system, so claim that it is noncrystalline or amorphous body.Specifically, the arrangement of the oxygen atom in quartzy crystal around each silicon atom is the same, and this rule is called the short range rule; Moreover, this arrangement mode of silicon and oxygen clocklike repeats in the space and forms grid system in quartzy crystal, and this rule is called long-range rule.But in the structure of quartz glass, have only the short range rule, then do not have long-range rule, also just can not form grid system, and be called amorphous body.
Because the two internal structure of quartzy and quartz glass is different, so also difference of their physical property.See following table for details:
| Title | Polarity | Index of refraction | Hardness | Density | Thermal conductivity |
| The synthetic quartz crystal | Heterogeneous body | 1.544-1.533 | 7 | 2.65g /cm3 | 140-264 |
| Quartz glass | Amorphous body | 1.460 | 6.5 | 2.20g/cm3 | 33 |
| Optical glass K9 | Amorphous body | 1.516 | 5.2 | 2.0g/cm3 | 7-20 |
| High pbo glass | Amorphous body | 1.46-1.7 | 4.65 | 2.1g/cm3 | 10-22 |
This shows that the essence of these materials is different.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, a kind of have high light flux, high high-power LED encapsulation structure of deriving thermal source, simple and practical efficiency heat-dissipating luminous high are provided.
According to technical scheme provided by the invention, the high-power LED encapsulation structure of described efficiency heat-dissipating luminous high, comprise lens, substrate and LED luminescence chip, lens are fixed in upper surface of base plate, the lens lower surface is provided with the installation depression that raises up, the LED luminescence chip places upper surface of base plate and is mounted the depression buckle closure, just be provided with at the upper surface of base plate that depression institute buckle closure is installed, negative lighting electrode, lighting electrode is connected by metal wire with the LED luminescence chip, upper surface of base plate is provided with lighting electrode and just links to each other, negative connection electrode, bonding by the adhesive layer of annular between lens lower surface that the depression outside is installed and upper surface of base plate, fill with silica gel at the endoporus of adhesive layer with installing in the formed cavity of depression, offer on the substrate to the endoporus of adhesive layer with the formed cavity of depression is installed in the glueing channel that is communicated with, and lens become by the crystal polymorph system with substrate.
Offer the heat radiation irrigation canals and ditches at base lower surface.Be provided with oscillation electrode at upper surface of base plate.Place LED luminescence chip place at substrate and offer a plurality of louvres that penetrate the substrate upper and lower surface.Substrate has at least an end to be exposed to the lens outside.
Lens and substrate are tabular.
Lens and substrate are hemisphere, offer two irrigation canals and ditches that run through its body at upper surface of base plate, and at the irrigation canals and ditches formation glueing channel of LED luminescence chip one side, the irrigation canals and ditches of LED luminescence chip opposite side form is convenient to the passage that leg shape connection electrode is inserted.
Lens are hemisphere, and substrate is a tabular.Lens and substrate are made of rock crystal or coloured crystal.
Main body of the present invention by as lens with as two high transparent crystal (SiO of substrate
2) plate is bonding and make, the heat conductivility that substrate and lens are very high because of its properties of materials all has has the high light transmittance energy simultaneously again, also can be according to different needs: the concussion function of utilizing its crystal to have, make it between lens and substrate, produce one concussion effect for a voltage by oscillation electrode on the substrate, perhaps, make the substrate orientation concussion also can only for specific voltage of oscillation electrode, make the coupled outside thermal component of substrate accelerate heat radiation.
Description of drawings
Fig. 1 is the structural representation of the embodiment of the invention 1.
Fig. 2 is the structural representation of the embodiment of the invention 2.
Embodiment
The invention will be further described below in conjunction with concrete drawings and Examples.
As shown in the figure: the present invention mainly is made of lens 1, substrate 2, LED luminescence chip 3, installation depression 4, lighting electrode 5, connection electrode 6, adhesive layer 7, silica gel 8, glueing channel 9, heat radiation irrigation canals and ditches 10, oscillation electrode 11 and louvre 12 etc.
The high-power LED encapsulation structure of efficiency heat-dissipating luminous high of the present invention, comprise lens 1, substrate 2 and LED luminescence chip 3, lens 1 are fixed in substrate 2 upper surfaces, lens 1 lower surface is provided with the installation depression 4 that raises up, LED luminescence chip 3 places substrate 2 upper surfaces and is mounted depression 4 buckle closures, just be provided with at substrate 2 upper surfaces that 4 buckle closures of depression are installed, negative lighting electrode 5, lighting electrode 5 and LED luminescence chip 3 are connected by metal wire, substrate 2 upper surfaces are provided with lighting electrode 5 and just link to each other, negative connection electrode 6, bonding by the adhesive layer 7 of annular between lens 1 lower surface that depression 4 outsides are installed and substrate 2 upper surfaces, fill with silica gel 8 at the endoporus of adhesive layer 7 with installing in the depression 4 formed cavitys, offer on the substrate 2 to the endoporus of adhesive layer 7 with depression 4 formed cavitys are installed in the glueing channel 9 that is communicated with, and lens 1 become by the crystal polymorph system with substrate 2.
Offer heat radiation irrigation canals and ditches 10 at substrate 2 lower surfaces.Be provided with oscillation electrode 11 at substrate 2 upper surfaces.Place LED luminescence chip 3 places at substrate 2 and offer a plurality of louvres 12 that penetrate substrate 2 upper and lower surfaces.Substrate 2 has at least an end to be exposed to lens 1 outside.
Lens 1 are tabular with substrate 2.
Lens 1 are hemisphere, and substrate 2 is a tabular.Lens 1 are made of rock crystal or coloured crystal with substrate 2.
According to technical scheme provided by the invention, the described accessory that improves the high-power LED encapsulation structure of brightness comprises that the material body of lens 1, substrate 2 is all made by crystal or quartz, gets rid of above material material in addition.
The present invention utilizes this concussion characteristic to make this encapsulating structure that better heat radiation arranged.
For make substrate 2 distribute fast thermal source and and the metal substrate of back between quicken the exchange thermal source, that face that quartz wafer 2 is connected with metal substrate, can prepare heat radiation irrigation canals and ditches 10 by variety of way, be used to enlarge the area of dissipation of substrate 2, simultaneously between quartz wafer 2 and metal substrate, produce the space, quickened distributing of thermal source.Also can between quartz wafer 2 and metal substrate, be placed with the glue class of heat conduction, can play the effect of quickening heat conduction equally.
According to different heat radiation irrigation canals and ditches 10, apply different voltage by oscillation electrode 11 and make substrate produce concussion, strengthened the space between quartz wafer 2 and metal substrate, produce better radiating effect.
The profile of the body of lens 1 is can be profile arbitrarily as required, in the luminous high-power LED encapsulation of orientation: rectangle preferably wherein, lens 1 lower surface is provided with the installation depression 4 that raises up, and LED luminescence chip 3 is encapsulated in the space of this installation depression 4. and the cavity of this installation depression 4 of while also is used to pour into silica gel 8 and finishes encapsulation.
The profile of the body of substrate 2 is profiles of a flat board, its two end is greater than lens, and two end expose, prepare positive and negative connection electrode 6 at this two end, glueing channel 9 by cavity after the radial system of substrate 2 has an encapsulation and finishes, and utilize this glueing channel 9 in cavity, to pour into silica gel 8 closed cavities, place LED luminescence chip 3 places at substrate 2 bodies a plurality of vertical cavities are arranged, form louvre 12, can be by two face coating elargol up and down at substrate 1 body, and utilize simultaneously in these a plurality of louvres 12 of two that pierce substrate remaining elargol up and down two elargol link to each other and quickened the derivation thermal source, above the body of substrate 2, be provided with lighting electrode 5, because of existing science and technology on crystal according to different use orders the lighting electrode 5 of arranging are technology of comparative maturity, do not do detailed explanation at this.LED luminescence chip 3 is fixed on substrate 2 preparations to be had on the one side of electric wiring, by metal wire LED luminescence chip 3 is linked to each other with positive and negative lighting electrode 5 on the substrate 2, it is bonding with lens 1 and substrate 2 to cover lens 1 blended rubber adhesion coating 7 (epoxy adhesive layer), by the time after epoxy glue solidifies, end by glueing channel 9 injects silica gel 8 in cavity, air-out is finished encapsulation.
Also can adopt according to above-described packaged type substrate is made an indent, form a face that converges reflection, and at the bottom of LED luminescence chip 3 is fixed on concave cavity, using the above material and mode encapsulates, simultaneously can lens 1 and substrate 2 be made concave shaped simultaneously, thisly be combined in this and do not make description one by one according to this scheme.
Simultaneously in the present invention according to different application targets, can in the body of lens 1 and substrate 2 connections radially prepare one or more groups irrigation canals and ditches hole and be used to insert the metal leg, and utilize this leg to remove suitable more mounting means.
According to above-described packaged type, according to the difference that heat radiation is required, can prepare one group of connection electrode that links to each other with body 6 at two ends that substrate 1 exposes, make its substrate 2 produce the receptible concussion of bonding wire by the oscillation electrode 11 different voltages that give to link to each other with body on the substrate 2, make the convection current that produces air between quartz wafer 2 belows and metal substrate, that face that the body of while quartz wafer 2 links to each other with metal substrate is because there are 10 effects of heat radiation irrigation canals and ditches, quickened the flowability of air, heat energy has been distributed as early as possible by air.
Mention high-power packaged water Jingjing body material among the present invention, body has very high light transmittance, has very high heat conduction and heat radiation rate simultaneously, by utilizing the characteristic of these material body, can make the profile that profile is a hemisphere with playing according to different application targets as the body of substrate 2 effects, simultaneously be provided with positive and negative electrode lighting electrode 5 at the body plane place of substrate 2, and preparation irrigation canals and ditches parallel and that link to each other with positive and negative electrode are gone up on the surface thereon, every irrigation canals and ditches all are used to wear two ends on substrate 2 planes, two sides of irrigation canals and ditches distribution and LED luminescence chip 3.
The outward appearance of lens 1 hemisphere identical that is an external diameter with substrate 2, be to become equally by the crystal polymorph system, and there is one depression 4 is installed is used to place LED luminescence chip 3 in lens 1 inside, perfusion silica gel 8 closed cavities, this installation depression 4 also has another effect simultaneously, be used for spacing lighting electrode 5, prevent lighting electrode 5 displacements.Connection electrode 6 is made by metal material, the end that connection electrode 6 is inserted in the cavity is according to lens 1 length that depression 4 is set connection electrode 6 to be installed, connection electrode 6 is a horizontal stroke greater than irrigation canals and ditches (knot) face inserting the part that depression 4 is installed, insert it into the part that depression 4 is installed and can not move, connection electrode 6 is inserted and part in the depression 4 is installed is linked to each other with pairing both positive and negative polarity lighting electrode 5 on the substrate 2 simultaneously.During installation, earlier LED luminescence chip 3 being fixed on preparation has on the substrate 2 of lighting electrode 5, by metal wire LED luminescence chip 3 is linked to each other with corresponding both positive and negative polarity lighting electrode 5, one group of lighting electrode 5 is being linked to each other with corresponding both positive and negative polarity connection electrode 6, connection electrode 6 is inserted in the installation depression 4 of substrate 2 and lens 1 composition by the irrigation canals and ditches of substrate 2 tops, and leg shape connection electrode 6 one ends expose.
Lens 1 are being drawn two positive and negative power supply leg leads with the external place of external power source, make great power LED form a luminous great power LED of omnirange of 360 degree towards periphery, use as the lamp pearl according to this encapsulation order ground.
Also can be behind perfusion silica gel 8 according to above-described encapsulating structure according to different requirements, simultaneously above the lens 1 of LED luminescence chip 3, add an outside and press down gravity, by pressure slowly with the silica gel 8 of packaged LED inside by louvre 12 2 of above-mentioned lens 1 or substrates, discharge section silica gel 8, solidify until silica gel 8, the silica gel 8 that reduces inner existence can play the raising luminous flux, quicken the effect of heat conduction, in the encapsulation of white light, can play the inhomogeneities that reduces fluorescent glue, reduce the effect of outside halation.
Lens 1, substrate 2 materials mentioned among the present invention simultaneously also can add fluorescence class material in process of production, thereby making lens 1 body have fluorescent characteristic can not be used in the process of its packaged LED white light above the body of LED luminescence chip 3 adding and be coated with phosphor gel, can reduce packaging technology like this, also can solve the macula lutea problem of great power LED simultaneously.In like manner reach other material that the requirement of different photochromic or colour temperature adds as required in the process of artificial growing the grain, can obtain the lens 1 or the substrate 2 of different colours, in the purpose of the combination that utilizes 2 of different lens 1 or substrates with the LED that reaches different photochromic and colour temperature.
As shown in the figure: the present invention is mainly by forming the lens that play leaded light and conductive force, and one played the adhesion chip, and the substrate that makes chip link to each other with external power source and switch on, substrate also can have an electrode to make its concussion heat radiation by body simultaneously, and the encapsulation inside of adopting different encapsulating structures and having one group of leg to insert LED according to different instructions for use, and link to each other with the positive and negative electrode of inside.
Embodiment 1
Lens 1 are the cuboid plate body of long a 3～10mm, wide 2～9mm, thick 1～5mm.In quartzy crystalline lens 1, the centre of the body of lens 1 has one depression 4 is installed, the external diameter that depression 4 is installed is a standard with the body that is not more than lens 1, and this installs depression 4 is to be used to place LED luminescence chip 3, and is applied to inject the cavity of silica gel 8 in encapsulation process.
LED luminescence chip 3 is fixed on the face that substrate 1 has circuit, with metal wire LED is connected with lighting electrode 5 on the substrate, above LED luminescence chip 3, be coated with fluorescent glue, lens 1 are sticked with glue layer 7 (epoxy adhesive layer) and substrate 2 adhesions, after the adhesive layer 7 of 2 of lens 1 and substrates solidifies, one end of the glueing channel 9 on substrate 2 injects silica gel 8, the air that to install in the depression 4 by the silica gel 8 that injects is discharged installation depression 4 by the other end simultaneously, obtain a complete LED, the length of substrate 2 exposes two sides of substrate greater than lens 1 simultaneously, and just respectively there is being one in the ground side that exposes, the negative electroplax 6 that connects is convenient to link to each other with the power supply of outside.
As preferably, end at substrate 1 is provided with an oscillation electrode 11 that can link to each other with the outside, these oscillation electrode 11 electrode tip supply voltages are 2～10V, its standard frequency is 1～360MHz, its traction degree from ± 1ppm～± 150ppm do not wait, its effect is to make its substrate 2 produce the effect of concussion, quickens the heat exchange of substrate 2 and air.Increase the photon amount simultaneously and strengthen light intensity, and when encapsulation silica gel 8, above lens 1, give simultaneously the pressure of a 0.1～3KG, silica gel 8 passes through the mode of extruding at the glueing channel 9 discharge section silica gel that inject silica gel 8 in the depression 4 with installing, and the silica gel 8 that its pressure is remained in the installation depression 4 always solidify, because of the body of silica gel 8 has its light-absorbing characteristic of refracted ray, so thereby reduced by this mode and to have installed that silica gel 8 quantity have improved light extraction efficiency in the depression 4.
Lens 1 are hemisphere with substrate 2, offer two irrigation canals and ditches that run through its body at substrate 2 upper surfaces, and at the irrigation canals and ditches formation glueing channel 9 of LED luminescence chip 3 one sides, the irrigation canals and ditches of LED luminescence chip 3 opposite sides form is convenient to the passage that leg shape connection electrode 6 is inserted.
Profile according to above encapsulation scheme crystal polymorph structure base board and quartzy crystalline lens 1 can be a hemisphere, on the plane of the hemisphere that uses as substrate 2 lighting electrode 5 is arranged.The irrigation canals and ditches that an indent is respectively arranged according to connection electrode 6 at lighting electrode 5 and external power source connecting place, patchhole as the leg that is connected with external power source, and the irrigation canals and ditches of this group are one and are parallel to LED luminescence chip 3 both sides, the outward appearance of quartzy crystalline lens be a hemisphere, and there is one depression 4 is installed on the plane of this hemisphere, form a cavity that is used to place LED luminescence chip 3, and in the installation depression 4 of lens 1, two glueing channels 9 that are communicated with its endoporus are arranged.The circuit of LED luminescence chip 3 with substrate 2 is connected,, forms one group of tie-in line that is connected with external power source in that leg shape connection electrode 6 is injected corresponding jointing holes with it, the while again shape two positive and negative electrode leg shape connection electrode 6.After lens 1 stick with glue layer 7 adhesion with substrate 2 simultaneously, in the installation depression 4 of substrate 2, inject silica gel 8 by glueing channel 9 one ends, discharge the air of installing in the depression 4 at the other end corresponding with it, form the structure of a complete great power LED, and the thermal source that distributes of this structure does not need to link to each other with the external metallization source of heat release.
Claims (9)
1, a kind of high-power LED encapsulation structure of efficiency heat-dissipating luminous high, comprise lens (1), substrate (2) and LED luminescence chip (3), lens (1) are fixed in substrate (2) upper surface, it is characterized in that: lens (1) lower surface is provided with the installation depression (4) that raises up, LED luminescence chip (3) places substrate (2) upper surface and is mounted depression (4) buckle closure, just be provided with at substrate (2) upper surface that depression (4) institute buckle closure is installed, negative lighting electrode (5), lighting electrode (5) is connected by metal wire with LED luminescence chip (3), substrate (2) upper surface is provided with lighting electrode (5) and just links to each other, negative connection electrode (6), bonding by the adhesive layer (7) of annular between lens (1) lower surface that depression (4) outside is installed and substrate (2) upper surface, fill with silica gel (8) at the endoporus of adhesive layer (7) with installing in depression (4) formed cavity, offer on the substrate (2) to the endoporus of adhesive layer (7) with depression (4) formed cavity is installed in the glueing channel (9) that is communicated with, and lens (1) become by the crystal polymorph system with substrate (2).
2, the high-power LED encapsulation structure of efficiency heat-dissipating luminous high as claimed in claim 1 is characterized in that: offer heat radiation irrigation canals and ditches (10) at substrate (2) lower surface.
3, the high-power LED encapsulation structure of efficiency heat-dissipating luminous high as claimed in claim 1 or 2 is characterized in that: be provided with oscillation electrode (11) at substrate (2) upper surface.
4, the high-power LED encapsulation structure of efficiency heat-dissipating luminous high as claimed in claim 1 is characterized in that: place LED luminescence chip (3) at substrate (2) and locate to offer a plurality of louvres (12) that penetrate substrate (2) upper and lower surface.
5, the high-power LED encapsulation structure of efficiency heat-dissipating luminous high as claimed in claim 1 is characterized in that: substrate (2) has at least an end to be exposed to lens (1) outside.
6, the high-power LED encapsulation structure of efficiency heat-dissipating luminous high as claimed in claim 1 is characterized in that: lens (1) are tabular with substrate (2).
7, the high-power LED encapsulation structure of efficiency heat-dissipating luminous high as claimed in claim 1, it is characterized in that: lens (1) are hemisphere with substrate (2), offer two irrigation canals and ditches that run through its body at substrate (2) upper surface, irrigation canals and ditches in LED luminescence chip (3) one sides form glueing channel (9), and the irrigation canals and ditches of LED luminescence chip (3) opposite side form is convenient to the passage that leg shape connection electrode (6) is inserted.
8, the high-power LED encapsulation structure of efficiency heat-dissipating luminous high as claimed in claim 1 is characterized in that: lens (1) are hemisphere, and substrate (2) is a tabular.
9, the high-power LED encapsulation structure of efficiency heat-dissipating luminous high as claimed in claim 1 is characterized in that: lens (1) are made of rock crystal or coloured crystal with substrate (2).
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