CN103363357B - A kind of LED light source with great heat radiation effect - Google Patents
A kind of LED light source with great heat radiation effect Download PDFInfo
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- CN103363357B CN103363357B CN201310301556.XA CN201310301556A CN103363357B CN 103363357 B CN103363357 B CN 103363357B CN 201310301556 A CN201310301556 A CN 201310301556A CN 103363357 B CN103363357 B CN 103363357B
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Abstract
The invention discloses a kind of LED light source with great heat radiation effect, comprise one or plurality of LEDs chip and radiator, described LED chip is directly connected by the upper surface of heat-conducting glue with described radiator; Also being provided with one deck for being electrically connected the metal conductive film networking of each LED chip or power supply input at described radiator upper surface, between described metal conductive film networking and described radiator upper surface, being provided with an insulation film; Described LED chip is connected by plain conductor with each node at described metal conductive film networking.The present invention is directly contacted with radiator base material by LED chip, thus substantially reduces heat dissipation path, thus improves radiating effect.And the present invention is disposable that radiator, light source, lens are integrated, decrease normal from the technological process being encapsulated into light fixture.
Description
Technical field
The invention belongs to LED light source technical field, be specifically related to a kind of LED light source with great heat radiation effect.
Background technology
LED light source is generally fixed on circuit boards by soldering etc. after being packaged into SMD form again, circuit board glues on a heat sink again, as shown in Figure 1, heat will pass through chip 101, crystal-bonding adhesive 102, backbone metal 103, scolding tin 104, circuit board welding pad 105, board dielectric enamelled coating 106, circuit board substrate 107, heat-conducting glue fat 108 and radiator 109 successively, and whole LED heat dissipation path is long, and heat radiation slowly, cause LED Long-Time Service temperature high, make LED chip, fluorescent material, support equivalent life is short.
As shown in Figure 2, LED light source or be packaged into COB mode, heat will pass through chip 201, crystal-bonding adhesive 202, COB substrate 203, heat-conducting glue fat 204 and radiator 205 successively, heat dissipation path is long equally, COB is high-power encapsulation, this packaged chip especially needs good heat radiation, and temperature is higher in this case.
How to increase the radiating efficiency of light source module, become the problem that LED industry urgently will solve.At present, the most a kind of mode that solves the problem increases light efficiency exactly to reduce heat output, increases area of dissipation and is convenient to heat radiation.But like this to heat radiation lifting be limited, heat dissipation path does not shorten.Meanwhile, the heat-radiating substrate reflecting rate of traditional LED light source is low, the luminous flux of meeting absorption portion light fixture, and traditional LED lamp needs to install lens and lampshade additional.
Summary of the invention
In order to promote the radiating effect of LED light source further, the invention provides a kind of LED light source with great heat radiation effect.
In order to realize foregoing invention object, the technical solution adopted in the present invention is as follows:
Have a LED light source for great heat radiation effect, comprise one or plurality of LEDs chip and radiator, described LED chip is directly connected by the upper surface of heat-conducting glue with described radiator; Also being provided with one deck for being electrically connected the metal conductive film networking of each LED chip or power supply input at described radiator upper surface, between described metal conductive film networking and described radiator upper surface, being provided with an insulation film; Described LED chip is connected by plain conductor with each node at described metal conductive film networking.
Further, above described metal conductive film networking, arrange plastic layer, described plastic layer forms a reflector in described LED chip surrounding.
Further, in described reflector, be provided with the fluorescent material glue-line covering described LED chip.
Further, above described fluorescent material glue-line, collector lens or astigmat is provided with.
Further, in described reflector, the collector lens being mixed with fluorescent material covering described LED chip or astigmat is provided with.
Further, the degree of depth of described reflector is 0.4-5 millimeter, at the bottom of described reflector cup and rim of a cup shape be square, circular or regular polygon, the sidewall of described reflector and horizontal plane angle are 90-150 degree.
Further, a collector lens or astigmat are set above each LED chip, or multiple LED chip shares a collector lens or astigmat.
Further, described radiator is rib film-type radiator or radiating tube channel type radiator.
Further, under described rib film-type radiator, can radiator fan be set, cooling liquid or gas can be set in the hot channel of described radiating tube channel type radiator.
Further, described radiator is square, circular, regular polygon, petal or other are irregularly shaped.
The present invention is directly contacted with radiator base material by LED chip, thus substantially reduces heat dissipation path, thus improves radiating effect.And the present invention is disposable that radiator, light source, lens are integrated, decrease normal from the technological process being encapsulated into light fixture.
Relative to prior art, the invention has the beneficial effects as follows:
1, LED chip directly and radiator substrate contact, and heat dissipation path is shorter, and heat radiation is good, can more large driven current density.
2, direct surface-mounted integrated circuit, reflector and reflecting surface on radiator, save LED support and aluminium base, reduces cost, recruitment light-out effect.
3, integral lens on radiator, completes optically focused or astigmatism, can save the parts such as the lens of light fixture and lampshade, reduces cost and technological process.
In order to understand object of the present invention, characteristic sum effect fully, be described further below with reference to the technique effect of accompanying drawing to design of the present invention, concrete structure and generation.
Accompanying drawing explanation
Fig. 1 is a kind of radiator structure schematic diagram of existing LED light source;
Fig. 2 is the another kind of radiator structure schematic diagram of existing LED light source;
Fig. 3 is the top view of the embodiment of the present invention 1;
Fig. 4 is the front view of the embodiment of the present invention 1;
Fig. 5 is the perspective view of the single LEDs chip of the embodiment of the present invention 1;
Fig. 6 is the sectional structure schematic diagram of Fig. 5;
Fig. 7 is the structural representation after the increase phosphor gel of Fig. 6;
Fig. 8 is the structural representation after the increase collector lens of Fig. 7;
Fig. 9 is the structural representation after the increase astigmat of Fig. 7;
Figure 10 is collector lens and phosphor gel integral structure schematic diagram;
Figure 11 is fin is circular a kind of product structure schematic diagram;
Figure 12 is fin is petal a kind of product structure schematic diagram;
Figure 13 is the structural representation that multiple LED chip shares a collector lens;
Figure 14 is the structural representation that multiple LED chip shares an astigmat;
Figure 15 is the structural representation of radiating tube channel type radiator of the present invention.
In figure:
Detailed description of the invention
As seen in figures 3-6, present embodiment discloses a kind of LED light source with great heat radiation effect, comprise one or plurality of LEDs chip 301 and radiator 304, described LED chip 301 is directly connected by the upper surface of heat-conducting glue 309 with described radiator 304, one deck is also provided with for being electrically connected the metal conductive film networking 302 of each LED chip 301 or power supply input at described radiator 304 upper surface, an insulation film 310 is provided with between described metal conductive film networking 302 and described radiator 304 upper surface, described LED chip 301 is connected by plain conductor 306 with each node at described metal conductive film networking 302, LED chip 301 directly and radiator 304 substrate contact, heat dissipation path shorter (heat that LED chip sends is directly conducted to radiator heat-dissipation), heat radiation is good, can more large driven current density.
As seen in figures 3-6, above described metal conductive film networking 302, arrange plastic layer 303, described plastic layer 303 forms a reflector 305 in described LED chip surrounding, to reflect the light that LED sends, improves light extraction efficiency.Meanwhile, plastic layer 303 material is PPA, PCT, EMC high reverse--bias white sizing material, to improve light extraction efficiency further.
As shown in Figure 7, in described reflector 305, be provided with the fluorescent material glue-line 311 covering described LED chip 301.
As shown in FIG. 8 and 9, above described fluorescent material glue-line 311, collector lens or astigmat 312 is provided with.
As shown in Figure 10, in described reflector 304, be provided with the collector lens 312 being mixed with fluorescent material covering described LED chip 301, that is to say collector lens and phosphor gel integral structure schematic diagram.Although only illustrate except collector lens and phosphor gel integral structure in figure, certain the present embodiment can also adopt astigmat and phosphor gel integral structure, is namely in described reflector 304, be provided with the astigmat 312 being mixed with fluorescent material covering described LED chip 301.
Wherein, in order to better light extraction efficiency, the degree of depth of the preferred described reflector of the present embodiment is 0.4-5 millimeter, at the bottom of described reflector cup and rim of a cup shape be square, circular or regular polygon, the sidewall of described reflector and horizontal plane angle are 90-150 degree.
As shown in Figure 11,13,14, a collector lens or astigmat are set above each LED chip 301, or multiple LED chip 301 shares a collector lens or astigmat 312.
As shown in Fig. 4-14, radiator of the present invention can be fin type radiator, in order to improve radiating efficiency further, can arrange radiator fan under described rib film-type radiator.
As shown in figure 15, radiator of the present invention can be also hot channel type radiator, is namely arrange multiple hot channel 308 in radiator 304 body.In order to improve radiating efficiency further, cooling liquid or gas can be set in the hot channel of described radiating tube channel type radiator.
Wherein, heat sink thickness can according to actual conditions adjustment such as light source powers, and radiator processing mode is machining or the castings such as cutting.
As is illustrated by figs. 11 and 12, only illustrating the structural representation that described radiator is circular and petal in figure, can also be square and regular polygon, or for other meeting that object attractive in appearance designs irregularly shaped.
Wherein, described lens are done or molding bonded by mould customization.
Wherein, plain conductor can be gold thread, and disconnect to connect chip circuit at metal conductive film networking, fixed L ED chip place, metal conductive film networking gap exposes radiator base material and fixes LED chip.If the metal film at metal conductive film networking is copper or aluminium material, the silver or golden so that bonding wire of plating 3 to 10 micron thickness on the metal film of chip.
Wherein, radiator 304 is made up of the material that heat conduction is good, as aluminium, and stainless steel, copper, aluminium nitride ceramics, aluminium oxide etc.
Wherein, LED chip is ruddiness, green glow or the positive cartridge chip of blue light.
Wherein, phosphor material powder is made up of one or more in yttrium-aluminium-garnet, Luetcium aluminum garnet, silicate, nitride, and heat conduction colloid is silica gel, silicones or epoxy resin.
Wherein, shown lens are the lens of the materials such as silica gel, glass, acrylic or epoxy resin.
Wherein, conveniently access power supply, on a heat sink and be provided with the electrode be connected for external power source.
Wherein, described plastic layer can process reflector by modes such as injection moulding or mould are fixed.
Wherein, light-focusing type lens upper surface is sphere or parabola, and astigmatism type lens surface is the optical textures such as particle dress, zigzag.
Wherein, lens implementation method is divided into disposal molding and bonding finished lens, and the former is determined mode realized by some glue, mould, and the latter uses the various lens of the bonding finished product such as silica gel or epoxy resin.
Wherein, lens are also divided into each light source to make lens, the shared lens of multiple light source (see Figure 10, these two kinds of implementations in the present invention.
As shown in figure 11, the present embodiment is open a kind of based on the preferred embodiments of the invention, and plurality of LEDs is encapsulated on circular radiator, shallow bowl cup, dome-type lens.Adopt independent collector lens.Circular heat radiation adopts the heat radiation of fin air, and chip bottom and radiator directly bond by high heat-conductive solid crystal glue.It radiator is white reflective surface that white plastic mould is customized between bowl cup.Can to throw light on use the electrode of radiator outer edge connecting power supply.
More than describe preferred embodiment of the present invention in detail, should be appreciated that those of ordinary skill in the art just design according to the present invention can make many modifications and variations without the need to creative work.Therefore, all technical staff in the art according to the present invention's design on prior art basis by logic analysis, reasoning or according to the available technical scheme of limited experiment, all should by among the determined protection domain of these claims.
Claims (5)
1. there is a LED light source for great heat radiation effect, comprise one or plurality of LEDs chip and radiator, it is characterized in that:
Described LED chip is directly connected by the upper surface of heat-conducting glue with described radiator;
Also being provided with one deck for being electrically connected the metal conductive film networking of each LED chip or power supply input at described radiator upper surface, between described metal conductive film networking and described radiator upper surface, being provided with an insulation film;
Described LED chip is connected by plain conductor with each node at described metal conductive film networking;
Above described metal conductive film networking, arrange plastic layer, described plastic layer forms a reflector in described LED chip surrounding;
The fluorescent material glue-line covering described LED chip is provided with in described reflector;
Collector lens or astigmat is provided with above described fluorescent material glue-line;
The degree of depth of described reflector is 0.4-5 millimeter, at the bottom of described reflector cup and rim of a cup shape be square, circular or regular polygon, the sidewall of described reflector and horizontal plane angle are 90-150 degree.
2. the LED light source with great heat radiation effect according to claim 1, is characterized in that:
A collector lens or astigmat are set above each LED chip, or multiple LED chip shares a collector lens or astigmat.
3. the LED light source with great heat radiation effect according to any one of claim 1-2, is characterized in that:
Described radiator is rib film-type radiator or radiating tube channel type radiator.
4. the LED light source with great heat radiation effect according to claim 3, is characterized in that:
Under described rib film-type radiator, can radiator fan be set, cooling liquid or gas can be set in the hot channel of described radiating tube channel type radiator.
5. the LED light source with great heat radiation effect according to any one of claim 1-2, is characterized in that:
Described radiator is square, circular, regular polygon, petal or other are irregularly shaped.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310301556.XA CN103363357B (en) | 2013-07-17 | 2013-07-17 | A kind of LED light source with great heat radiation effect |
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| CN201310301556.XA CN103363357B (en) | 2013-07-17 | 2013-07-17 | A kind of LED light source with great heat radiation effect |
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| CN103363357A CN103363357A (en) | 2013-10-23 |
| CN103363357B true CN103363357B (en) | 2015-12-09 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104373850B (en) * | 2014-11-19 | 2017-01-11 | 西安重装渭南光电科技有限公司 | Integrated LED light module and assembly method thereof |
| CN105371252A (en) * | 2015-12-16 | 2016-03-02 | 东莞市星曜光电照明科技有限公司 | Direct type integrally-encapsulated heat dissipation module |
| CN107448816A (en) * | 2017-07-14 | 2017-12-08 | 安徽亮亮电子科技有限公司 | A kind of novel heat-conducting plastic front board light fixture |
| CN107906424A (en) * | 2017-12-14 | 2018-04-13 | 广东工业大学 | A kind of LED spotlights |
| CN114719235A (en) * | 2022-03-17 | 2022-07-08 | 漳州汉鼎智能驱动科技有限公司 | LED lamp packaging structure |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102832294A (en) * | 2011-06-13 | 2012-12-19 | 中山市世耀光电科技有限公司 | Method for packaging LED light source and LED light source |
| CN202678401U (en) * | 2012-05-31 | 2013-01-16 | 泰州赛龙电子有限公司 | Packaging structure for high-power LED |
| CN102980065A (en) * | 2012-11-21 | 2013-03-20 | 惠州雷曼光电科技有限公司 | LED (Light-emitting Diode) light source, LED display module and LED illumination device |
| CN202871787U (en) * | 2012-09-07 | 2013-04-10 | 浙江中博光电科技有限公司 | Structure with chip directly packaged on uniform temperature plate |
| CN203010400U (en) * | 2012-12-10 | 2013-06-19 | 合肥瑞华电子科技有限责任公司 | Light-emitting diode (LED) street lamp module |
| CN203453808U (en) * | 2013-07-17 | 2014-02-26 | 晶科电子（广州）有限公司 | LED light source with good heat dissipation effect |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060125716A1 (en) * | 2004-12-10 | 2006-06-15 | Wong Lye Y | Light-emitting diode display with compartment |
| US7625104B2 (en) * | 2007-12-13 | 2009-12-01 | Philips Lumileds Lighting Company, Llc | Light emitting diode for mounting to a heat sink |
| CN102537718A (en) * | 2011-11-11 | 2012-07-04 | 深圳市瑞丰光电子股份有限公司 | Lamp with light source integrated with radiator and manufacturing method of lamp |
| CN202352727U (en) * | 2011-12-07 | 2012-07-25 | 乐健线路板（珠海）有限公司 | LED packaging substrate with bulge-shaped reflection surfaces |
| CN202474016U (en) * | 2011-12-20 | 2012-10-03 | 中山市世耀光电科技有限公司 | Packaging structure of LED light source |
| CN202405323U (en) * | 2012-01-04 | 2012-08-29 | 四川鋈新能源科技有限公司 | Structure for directly packaging LED chips on vapor chamber and lamp employing same |
| CN202817012U (en) * | 2012-04-27 | 2013-03-20 | 山东开元电子有限公司 | A LED packaging structure using a fluorescent lens |
| CN102738136A (en) * | 2012-06-20 | 2012-10-17 | 深圳市九洲光电科技有限公司 | Distributed high-voltage light emitting diode (LED) module |
| CN103151446A (en) * | 2013-03-04 | 2013-06-12 | 中国科学院半导体研究所 | Frameless light-emitting diode (LED) packaging structure and packaging method |
-
2013
- 2013-07-17 CN CN201310301556.XA patent/CN103363357B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102832294A (en) * | 2011-06-13 | 2012-12-19 | 中山市世耀光电科技有限公司 | Method for packaging LED light source and LED light source |
| CN202678401U (en) * | 2012-05-31 | 2013-01-16 | 泰州赛龙电子有限公司 | Packaging structure for high-power LED |
| CN202871787U (en) * | 2012-09-07 | 2013-04-10 | 浙江中博光电科技有限公司 | Structure with chip directly packaged on uniform temperature plate |
| CN102980065A (en) * | 2012-11-21 | 2013-03-20 | 惠州雷曼光电科技有限公司 | LED (Light-emitting Diode) light source, LED display module and LED illumination device |
| CN203010400U (en) * | 2012-12-10 | 2013-06-19 | 合肥瑞华电子科技有限责任公司 | Light-emitting diode (LED) street lamp module |
| CN203453808U (en) * | 2013-07-17 | 2014-02-26 | 晶科电子（广州）有限公司 | LED light source with good heat dissipation effect |
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Address after: 511458 Nansha District, Guangzhou, South Ring Road, No. 33, No. Patentee after: GUANGDONG APT ELECTRONICS LTD. Address before: 511458 Nansha District, Guangzhou, South Ring Road, No. 33, No. Patentee before: APT (Guangzhou) Electronics Ltd. |