CN202871787U - Structure with chip directly packaged on uniform temperature plate - Google Patents
Structure with chip directly packaged on uniform temperature plate Download PDFInfo
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- CN202871787U CN202871787U CN201220454167.1U CN201220454167U CN202871787U CN 202871787 U CN202871787 U CN 202871787U CN 201220454167 U CN201220454167 U CN 201220454167U CN 202871787 U CN202871787 U CN 202871787U
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- temperature
- chip
- uniforming plate
- solder joint
- uniforming
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Abstract
The utility model relates to a structure with chips directly packaged on a uniform temperature plate, comprising the uniform temperature plate (1), and LED chips (4) which are directly packaged on the uniform temperature plate (1). Since the LED chips and a circuit layer are disposed on the uniform temperature plate, the structure reduces use of a layer heat conduction silica gel, and greatly improves heat radiation efficiency.
Description
Technical field
The utility model relates to a kind of LED encapsulating structure, especially relates to the structure of direct packaged chip on a kind of temperature-uniforming plate.
Background technology
The universal of LED illumination application is a kind of trend, and its technology is light, mechanical, electrical, hot system combination.Integrated packaging power source has the advantage that its light-emitting area is little, assembling is easy, cost is low, yet its shortcoming is to require very high to heat radiation.Radiating treatment is concerning luminous efficiency and the life-span of led light source chip, and common LED light fitting quality problem is exactly because radiating treatment is undesirable, causes the serious light decay of chip, and then shortens the life-span of light source chip.In addition, heat also has harmful effect to the fluorescent material that produces white light, and is unfavorable to luminous efficiency equally.
The LED lamp assembled, the contact-making surface of its each material, all produce the gap because of out-of-flatness easily, mend the air heat group of bringing in the gap for removing, between contact-making surface, generally all can fill up one deck heat conductive silica gel, but the conductive coefficient of heat conductive silica gel is low, relatively metal material that lamp part uses such as copper, silver, aluminium and ceramic material etc., becoming is a thermal resistance, the impact heat radiation.
For the shortcoming of integration packaging, traditional solution can add the temperature-uniforming plate that a slice heat-conducting effect is good between packaged chip and cooling mechanism, but also therefore must increase an interface more, and then the effect of using temperature-uniforming plate is made a discount.
Moreover integration packaging is selected the chip of lateral emitting, when the chip close-packed arrays, stops each other easily light, causes the loss of light efficiency.
As shown in Figure 1, led chip 4 is encapsulated on the circuit of light sources substrate 3, if white light source is coated with last layer fluorescent material 6 again and namely forms LED integrated optical source packaged chip at this moment above led chip 4.Again heat conductive silica gel 7 is coated in packaged light source bottom, then be fixed on the temperature-uniforming plate 1; At last, heat conductive silica gel 7 is coated in temperature-uniforming plate 1 bottom, be fixed on the cooling mechanism 2, namely finish a kind of basic framework of light source module.
Radiator structure 2: metal material, be generally aluminum, structure is the fin mode;
Circuit of light sources substrate 3: the highly heat-conductive materials such as normal operation copper, aluminium, pottery;
Temperature-uniforming plate 1: metal material, be generally copper or aluminum, hollow, there are capillary structure, supporter and working fluid in the inside.That its face shaping can be is square, circular and irregular shape.
Summary of the invention
The utility model has designed the structure of direct packaged chip on a kind of temperature-uniforming plate, and the technical problem of its solution is:
When (1) existing LED encapsulates, need to use the thermal conductive silicon glue-line, the low characteristic of the conductive coefficient of heat conductive silica gel makes it become thermal resistance, affects radiating effect.
(2) in the existing LED light fixture, each led chip can reflect and stop mutually, causes easily the light consume, causes low light efficiency and high heating.
In order to solve the technical problem of above-mentioned existence, the utility model has adopted following scheme:
The structure of direct packaged chip comprises temperature-uniforming plate (1) on a kind of temperature-uniforming plate, and led chip (4) directly is encapsulated on the described temperature-uniforming plate (1).
Further, form an insulating barrier (82) at temperature-uniforming plate upper cover plate (10), be used for arranging circuit layer (31) on this insulating barrier (82), have a plurality of holes and form a plurality of led chips installation sites (15) and a plurality of chip sets installation site (14) at temperature-uniforming plate upper cover plate (10) at described insulating barrier (82), a plurality of led chips (4) are arranged at respectively on a plurality of described led chips installation sites (15), in a plurality of led chips (4) top one chip set (5) is set, chip set (5) is fixed on the chip set installation site (14), be provided with a plurality of reflectors (9) in described chip set (5), led chip (4) is arranged in reflector (9).
Further, the mode that described a plurality of led chip (4) is arranged with matrix is distributed on the temperature-uniforming plate upper cover plate (10), the both sides of any row or a row led chip (4) all are respectively equipped with a circuit layer (31), and the positive pole of every row or every row led chip (4) connects gold thread (32) or negative pole connection gold thread (33) all is connected on the same circuit layer (31).
Further, the mode that described a plurality of reflectors (9) are arranged with matrix is distributed on the described chip set (5), and each reflector (9) is back taper platform structure or inverted trapezoidal platform structure.
Further, in reflector (9), be filled with fluorescent material (6).
Further, it is fixing with hole (51), positive level solder joint hole (52) and negative level solder joint hole (53) to have support on the described chip set (5), fill up the fixing mode with hole (51), positive level solder joint hole (52) and negative level solder joint hole (53) of support by soldering described chip set (5) and temperature-uniforming plate upper cover plate (10) are fixed, circumscripted power line is connected with circuit layer (31) by the soldering in positive level solder joint hole (52) and the negative level solder joint hole (53).
Further, connect a radiator structure (2) at temperature-uniforming plate lower cover (12).
The manufacture method of direct packaged chip on a kind of temperature-uniforming plate may further comprise the steps:
Further, if make white light source, between step 3 and step 4, increase by one to the inner step of loading fluorescent material (6) of reflector (9).
Further, the fixing mode with hole (51), positive level solder joint hole (52) and negative level solder joint hole (53) of support of filling up on the chip set (5) by soldering in the step 3 is fixed described chip set (5) and temperature-uniforming plate upper cover plate (10), and circumscripted power line is connected with circuit layer (31) by the soldering in positive level solder joint hole (52) and the negative level solder joint hole (53).
The structure of direct packaged chip is compared with the conventional package structure on this temperature-uniforming plate, has following beneficial effect:
(1) the utility model is compared the use that traditional encapsulating structure reduces one deck heat conductive silica gel because led chip and circuit layer are arranged on the temperature-uniforming plate, has greatly promoted radiating efficiency.
(2) the utility model is owing to form a reflector by chip set at each led chip, and the light of avoiding led chip to send stops each other, to increase led chip light extraction efficiency and the heat dissipation capacity that has reduced chip.
(3) in the utility model every row's led chip is connected in parallel between two circuit layers, every row led chip is connected mutually, so that the led chip group of arranging with matrix can not affect other chip normal operation because of any chips fault.
(4) reflector is back taper platform structure or inverted trapezoidal platform structure in the utility model, compares existing white light LED lamp, can reduce the use amount of fluorescent material, but the brightness of illumination of light fixture has improved on the contrary.
(5) effect that chip set and temperature-uniforming plate are fixed not only can be played in the positive level solder joint hole on the utility model chips support and negative level solder joint hole, and circumscripted power line is connected with circuit layer by positive level solder joint hole and the soldering be connected in grade solder joint hole simultaneously.
(6) the inner honeycomb supporter that uses of the utility model temperature-uniforming plate, utilize robustness and the high-intensity advantage of honeycomb, avoided caving between the upper and lower cover plate, the loose structure of honeycomb can not flow to working fluid and produce any obstruction simultaneously, working fluid can carry out flow at high speed and heat transfer in the honeycomb cavity, therefore can realize the largest optimization of support effect and heat-transfer effect.
Description of drawings
Fig. 1: existing LED integrated packaging power source uses the schematic diagram of temperature-uniforming plate;
Fig. 2: the schematic diagram that insulating barrier is made on the temperature-uniforming plate in the utility model;
Fig. 3: in the utility model on temperature-uniforming plate the circuit production schematic diagram;
Fig. 4: in the utility model on the temperature-uniforming plate circuit and led chip install and fix the position schematic diagram;
Fig. 5: led chip die bond schematic diagram in the utility model;
Fig. 6: led chip is beaten the gold thread vertical view in the utility model;
Fig. 7: led chip is played the gold thread end view in the utility model;
Fig. 8: led chip support vertical view in the utility model;
Fig. 9: led chip bracket side view in the utility model;
Figure 10: light walking schematic diagram between the existing led chip;
Figure 11: light walking schematic diagram between led chip and the reflector in the utility model;
Figure 12: envelope led chip structural representation on the utility model temperature-uniforming plate;
Figure 13: envelope led chip structural representation on the utility model white light temperature-uniforming plate;
Figure 14: the structural representation of supporter in the utility model;
Figure 15: the structural representation of the monolateral thin slice of honeycomb in the utility model;
The vertical view of Figure 16: Figure 15.
Description of reference numerals:
1-temperature-uniforming plate; 10-temperature-uniforming plate upper cover plate; 11-supporter; The monolateral thin slice of 111-honeycomb; 1111-groove; 1112-connecting portion; 1113-buckling groove; 1114-snapping thin slice; 112-honeycomb hole; 12-temperature-uniforming plate lower cover; 13-inlet; 14-chip set installation site; 15-led chip installation site; 16-sealing; 2-radiator structure; 3-circuit of light sources substrate; 31-circuit layer; 32-anodal the gold thread that connects; 33-negative pole connects gold thread; 4-led chip; 41-light; 5-chip set; The fixing hole of using of 51-support; 52-positive level solder joint hole; 53-negative level solder joint hole; 54-anodal sign; 55-negative pole sign; 6-fluorescent material; 7-thermal conductive silicon glue-line; 81-ground floor film; 82-insulating barrier; 83-second layer film; 84-circuit retention position; 9-reflector; 91-reflector inwall.
Embodiment
Below in conjunction with Fig. 2 to Figure 13, the utility model is described further:
As shown in Figure 2, above the temperature-uniforming plate upper cover plate 10 of temperature-uniforming plate 1, paste the ground floor film 81 of corresponding led chip fixed position and chip set fixed position.The dielectric that then applies a floor height heat conduction in temperature-uniforming plate upper cover plate 10 other zones forms an insulating barrier 82.This insulating barrier 82 is used to form circuit layer.
As shown in Figure 3, then on such as Fig. 2 surface, stick again second layer film 83.Expose the circuit retention position on the second layer film 83, circuit turn-on contact during as follow-up led chip encapsulation.
Then in this surperficial sputter layer of copper, throw off at last second layer film 83 and ground floor film 81, namely form circuit layer 31.This circuit layer 31 is comprised of polylith, and every circuit layer 31 one or both sides all will arrange the plurality of LEDs chip.
As shown in Figure 4, finish circuit layer 31 making on the temperature-uniforming plate, circuit layer 31 belows are insulating barrier 82, and insulating barrier 82 belows are exactly temperature-uniforming plate 1.Led chip installation site 15 and chip set installation site 14 directly expose on temperature-uniforming plate 1, are beneficial to the fixing of chip cooling and chip set.
As shown in Figure 5, tin cream or elargol are coated in the led chip installation site 15 that is stayed in advance on temperature-uniforming plate 1, led chip 4 are placed on tin cream or the elargol again, with Reflow Soldering equipment led chip 4 are fixed on the temperature-uniforming plate 1.
As shown in Figure 6, with gold thread every LEDs chip and circuit layer 31 are connected, and noted the led chip positive-negative polarity.The positive pole connection gold thread 32 of each led chip 4 is connected gold thread 33 and is connected with same circuit layer 31 respectively with negative pole, every row's led chip 4 is connected in parallel between two circuit layers 31, and every row led chip 4 is connected mutually.This encapsulated circuit forms string and connects, and its advantage is not for affecting other chip normal operation because of an any LEDs chip 4 faults.
As shown in Figure 7, can find out that led chip 4 is set directly on the temperature-uniforming plate 1, be provided with insulating barrier 82 in led chip 4 both sides, be coated with circuit layer 31 at insulating barrier 82.The positive pole connection gold thread 32 of each led chip 4 is connected gold thread 33 and is connected with same circuit layer 31 respectively with negative pole.Therefore, reduce the use of one deck heat conductive silica gel between temperature-uniforming plate 1 and the led chip 4, greatly promoted radiating efficiency.
As shown in Figure 8, it is fixing with hole 51 that led chip support 5 is provided with support, is fixed on the temperature-uniforming plate 1 as chip set 5.Positive level solder joint hole 52 and negative level solder joint hole 53 can also be as connecting circuit layer 31 and external drive power supplys except playing 5 effects of fixed chip support.When being to avoid welding, the purpose that anodal sign 54 and negative pole sign 55 be set welds wrong electrode.
As shown in Figure 9, reflector 9 is the most key at this, and reflector 9 is arranged on the chip set 5.In cup, be filled with fluorescent material 6, can the light reflection of led chip 4 lateral emittings is outside to light source, increase light extraction efficiency, and then increase the light fixture light efficiency.
And then see through the curved design of reflector inwall 91, can accomplish that simple lamp distribution distributes, as being used for indoor and flood light purposes.Reflector cup inner structure can be back taper platform structure or inverted trapezoidal platform structure.Chip set 5 contour structures can also be for square and circular, and material can be plastics or metal.
As shown in figure 10, during no-reflection cup 9, the light 41 that led chip 4 sends is easily stopped by adjacent led chip 4 and loses brightness of illumination.
As shown in figure 11, when led chip 4 was provided with reflector 9, light 41 was reflected by wall of cup, and bright dipping is more, so that light efficiency improves, and reduced heat dissipation capacity.
As shown in figure 12, will as Fig. 8 the led chip support be placed on such as the temperature-uniforming plate of Fig. 6 top.Utilize first scolding tin, four supports are fixing with holes 51 all around to fill up the fixed chip support.Recycling scolding tin is filled up positive level solder joint hole 52 and negative level solder joint hole 53, makes positive level solder joint hole 52 and negative level solder joint hole 53 fill up scolding tin.
As shown in figure 13, if make white light source, behind 9 li coatings of reflector phosphor powder, send to working fluid, vacuumize to temperature-uniforming plate 1 again, at last sealing is sealed, namely finish envelope led chip structure on the white light temperature-uniforming plate.
As shown in figure 14, temperature-uniforming plate 1 comprises temperature-uniforming plate upper cover plate 10 and temperature-uniforming plate lower cover 12, and the supporter 11 between temperature-uniforming plate upper cover plate 10 and the temperature-uniforming plate lower cover 12 is honeycomb.Temperature-uniforming plate 1 inner support body 11 is comprised of the monolateral thin slice 111 of plural pieces honeycomb, shape hexagon honeycomb hole 112 in a row between the monolateral thin slice 111 of adjacent two honeycombs.Honeycomb hole 112 on the supporter forms the working fluid passage between temperature-uniforming plate upper cover plate 10 and temperature-uniforming plate lower cover 12.
As shown in figure 15, the every monolateral thin slice 111 of honeycomb comprises a plurality of grooves 1111 and a plurality of connecting portion 1112, between any two grooves 1111 by connecting portion 1112 transition, the monolateral thin slice 11 of any two honeycombs by between the connecting portion 1112 be fixedly connected to form honeycomb hole 112 or by being fixedly connected to form honeycomb hole 112 between groove 1111 bottoms.
As shown in figure 16, stamp out many buckling grooves 1113 at the monolateral thin slice 111 of honeycomb, per two buckling grooves 1113 be arranged in parallel and form a snapping thin slice 1114 between two buckling grooves 1113; Snapping thin slice 1114 on the monolateral thin slice 111 of adjacent cell is fixed by the snapping mode mutually.
The temperature-uniforming plate 1 inner honeycomb supporter 11 that uses, utilize robustness and the high-intensity advantage of honeycomb, avoided caving between the upper and lower cover plate, the loose structure of honeycomb can not flow to working fluid and produce any obstruction simultaneously, working fluid can carry out flow at high speed and heat transfer in the honeycomb cavity, therefore can realize the largest optimization of support effect and heat-transfer effect.
The above has carried out exemplary description to the utility model by reference to the accompanying drawings; obvious realization of the present utility model is not subjected to the restriction of aforesaid way; as long as the various improvement of having adopted method design of the present utility model and technical scheme to carry out; or without improving design of the present utility model and technical scheme are directly applied to other occasion, all in protection range of the present utility model.
Claims (8)
1. the direct structure of packaged chip on the temperature-uniforming plate comprises temperature-uniforming plate (1), and it is characterized in that: led chip (4) directly is encapsulated on the described temperature-uniforming plate (1).
2. the direct structure of packaged chip on the described temperature-uniforming plate according to claim 1, it is characterized in that: form an insulating barrier (82) at temperature-uniforming plate upper cover plate (10), be used for arranging circuit layer (31) on this insulating barrier (82), have a plurality of holes and form a plurality of led chips installation sites (15) and a plurality of chip sets installation site (14) at temperature-uniforming plate upper cover plate (10) at described insulating barrier (82), a plurality of led chips (4) are arranged at respectively on a plurality of described led chips installation sites (15), in a plurality of led chips (4) top one chip set (5) is set, chip set (5) is fixed on the chip set installation site (14), be provided with a plurality of reflectors (9) in described chip set (5), led chip (4) is arranged in reflector (9).
3. the direct structure of packaged chip on the described temperature-uniforming plate according to claim 2, it is characterized in that: the mode that described a plurality of led chips (4) are arranged with matrix is distributed on the temperature-uniforming plate upper cover plate (10), the both sides of any row or a row led chip (4) all are respectively equipped with a circuit layer (31), and the positive pole of every row or every row led chip (4) connects gold thread (32) or negative pole connection gold thread (33) all is connected on the same circuit layer (31).
4. the direct structure of packaged chip according to claim 2 or on the 3 described temperature-uniforming plates, it is characterized in that: the mode that described a plurality of reflectors (9) are arranged with matrix is distributed on the described chip set (5), and each reflector (9) is back taper platform structure or inverted trapezoidal platform structure.
5. the direct structure of packaged chip on the described temperature-uniforming plate according to claim 4 is characterized in that: be filled with fluorescent material (6) in reflector (9).
6. the direct structure of packaged chip on the described temperature-uniforming plate according to claim 2, it is characterized in that: it is fixing with hole (51), positive level solder joint hole (52) and negative level solder joint hole (53) to have support on the described chip set (5), fill up the fixing mode with hole (51), positive level solder joint hole (52) and negative level solder joint hole (53) of support by soldering described chip set (5) and temperature-uniforming plate upper cover plate (10) are fixed, circumscripted power line is connected with circuit layer (31) by the soldering in positive level solder joint hole (52) and the negative level solder joint hole (53).
7. according to claim 1, the direct structure of packaged chip on any one described temperature-uniforming plate in 2,3,5 or 6, it is characterized in that: at temperature-uniforming plate lower cover (12) connection one radiator structure (2).
8. the direct structure of packaged chip on the described temperature-uniforming plate according to claim 4 is characterized in that: at temperature-uniforming plate lower cover (12) connection one radiator structure (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220454167.1U CN202871787U (en) | 2012-09-07 | 2012-09-07 | Structure with chip directly packaged on uniform temperature plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220454167.1U CN202871787U (en) | 2012-09-07 | 2012-09-07 | Structure with chip directly packaged on uniform temperature plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202871787U true CN202871787U (en) | 2013-04-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220454167.1U Expired - Lifetime CN202871787U (en) | 2012-09-07 | 2012-09-07 | Structure with chip directly packaged on uniform temperature plate |
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| CN (1) | CN202871787U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102842668A (en) * | 2012-09-07 | 2012-12-26 | 浙江中博光电科技有限公司 | Structure of directly encapsulating chip on uniform temperature plate and manufacturing method of structure |
| CN103363357A (en) * | 2013-07-17 | 2013-10-23 | 晶科电子（广州）有限公司 | LED light source with well heat dissipation effect |
| CN105333759A (en) * | 2014-08-06 | 2016-02-17 | 双鸿科技股份有限公司 | Etching temperature uniformization board |
| CN113491574A (en) * | 2021-06-30 | 2021-10-12 | 深圳可思美科技有限公司 | LED light-emitting depilation device |
| CN113499135A (en) * | 2021-06-30 | 2021-10-15 | 深圳可思美科技有限公司 | LED light source module for depilation and LED depilation instrument |
| US11862529B2 (en) | 2020-09-30 | 2024-01-02 | Huawei Technologies Co., Ltd. | Chip and manufacturing method thereof, and electronic device |
-
2012
- 2012-09-07 CN CN201220454167.1U patent/CN202871787U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102842668A (en) * | 2012-09-07 | 2012-12-26 | 浙江中博光电科技有限公司 | Structure of directly encapsulating chip on uniform temperature plate and manufacturing method of structure |
| CN103363357A (en) * | 2013-07-17 | 2013-10-23 | 晶科电子（广州）有限公司 | LED light source with well heat dissipation effect |
| CN103363357B (en) * | 2013-07-17 | 2015-12-09 | 晶科电子（广州）有限公司 | A kind of LED light source with great heat radiation effect |
| CN105333759A (en) * | 2014-08-06 | 2016-02-17 | 双鸿科技股份有限公司 | Etching temperature uniformization board |
| US11862529B2 (en) | 2020-09-30 | 2024-01-02 | Huawei Technologies Co., Ltd. | Chip and manufacturing method thereof, and electronic device |
| CN113491574A (en) * | 2021-06-30 | 2021-10-12 | 深圳可思美科技有限公司 | LED light-emitting depilation device |
| CN113499135A (en) * | 2021-06-30 | 2021-10-15 | 深圳可思美科技有限公司 | LED light source module for depilation and LED depilation instrument |
| CN113499135B (en) * | 2021-06-30 | 2022-08-09 | 深圳可思美科技有限公司 | LED light source module for depilation and LED depilation instrument |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130410 |
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| CX01 | Expiry of patent term |