CN202678401U - Packaging structure for high-power LED - Google Patents
Packaging structure for high-power LED Download PDFInfo
- Publication number
- CN202678401U CN202678401U CN 201220251744 CN201220251744U CN202678401U CN 202678401 U CN202678401 U CN 202678401U CN 201220251744 CN201220251744 CN 201220251744 CN 201220251744 U CN201220251744 U CN 201220251744U CN 202678401 U CN202678401 U CN 202678401U
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- led chip
- metal substrate
- power
- electronic circuit
- type led
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Abstract
The utility model discloses a packaging structure for a high-power LED, which comprises a metal substrate and a power-typed LED chip, wherein the metal substrate is covered with an insulating heat conduction layer, the insulating heat conduction layer is covered with a mental layer, an electronic circuit is formed on the mental layer via wiring, the electronic circuit and a surface-mounted element arranged on the mental substrate are mated to form a printed circuit board with specific functions and electrical connection; the power-typed LED chip is pasted on the mental layer; electrode leading wires of the power-typed LED chip are bonded on the specific pad to form a circuit with the electronic circuit and the surface-mounted element; and epoxy resin is solidified above the power-typed LED chip. The packaging structure is simple in structure, good in heat radiation effect and easy in manufacturing.
Description
Technical field
The utility model relates to the encapsulating structure of LED, relates in particular to a kind of encapsulating structure of power-type LED.
Background technology
LED ball bubble is used the main high-power encapsulation of using in the conventional chamber.Exist dazzle easily to exceed standard in the high-power making ball bubble, and the difficult problem such as heat radiation is difficult.High-power chip is concentrated because of thermogenetic, and the limited space of ball bubble own is difficult to concentrate the heat that produces effectively to import fin high-power chip simultaneously, can affect the work of driving when serious, causes reliability decrease.Present known power-type LED adopts the length of side greater than the large scale led chip of 0.5mm mostly; this power-type LED with the large scale led chip be placed in one heat sink on; heat sink being inlaid in the insulation frame made from molding methods; be fixed with optical lens on the Insulating frame; optical lens with the led chip cover in the inner; for solving heat dissipation problem, usually also be installed on the fin heat sink.In the manufacture process, the installation of heat sink, optical lens, fin all will be finished by craft, and also to lean on the manual soft glue of filling to plug the gap between the Insulating frame, heat sink and optical lens, all these manual operationss all must very carefully be carried out at microscopically, very easily cause operator's eye fatigue, be difficult to guarantee the stability of product quality, and used parts are more, complex structure.
Summary of the invention
The encapsulating structure of the great power LED that the purpose of this utility model is to provide a kind of simple in structure, good heat dissipation effect, be easy to make.
The utility model is achieved through the following technical solutions:
The encapsulating structure of great power LED, comprise a metal substrate and power type LED chip, be coated with thermal insulation layer on the described metal substrate, be coated with the layer of metal layer on the described thermal insulation layer, form electronic circuit by wiring on the described metal level, this electronic circuit cooperates formation to have the printed circuit board (PCB) of specific function and electrical connection with surface mount elements on being arranged at metal substrate; Described power type LED chip is bonded on the metal level, and the contact conductor of described power type LED chip is bonded on the pad of appointment and forms the loop with electronic circuit and surface mount elements, and the top of described power type LED chip also is solidified with epoxy resin.
Described epoxy resin is lens-shaped.
Be provided with reflection cavity on the described metal substrate, described power type LED chip is positioned at reflection cavity.
Be connected with radiator on the described metal substrate.
Be connected with radiator on the described metal substrate.
The utility model is owing to having adopted the metal substrate with good heat radiating effect, be coated with thermal insulation layer on the described metal substrate, be coated with the layer of metal layer on the described thermal insulation layer, form electronic circuit by wiring on the described metal level, this electronic circuit cooperates formation to have the printed circuit board (PCB) of specific function and electrical connection with surface mount elements on being arranged at metal substrate; Described power type LED chip is bonded on the metal level, the contact conductor of described power type LED chip is bonded on the pad of appointment and forms the loop with electronic circuit and surface mount elements, therefore can save heat sink and fin, and double as optical lens take epoxy resin, greatly simplified the encapsulating structure of great power LED, in addition, adopt COB technology installation power type led chip on metal level, be easy to make.
The utility model compared with prior art has following beneficial effect: form electronic circuit by wiring on the described metal level, this electronic circuit cooperates with surface mount elements on being arranged at metal substrate and forms printed circuit board (PCB) and power type LED chip with specific function and electrical connection and be bonded on the metal level, so that on metal level, only need one of installation or a few power type LED chip just can satisfy requirement high-power, high light intensity, greatly simplified the encapsulating structure of great power LED, the characteristics that have simple in structure, good heat dissipation effect, are easy to make.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment.
Sequence number among the figure: 1, power type LED chip, 2, metal substrate, 3, thermal insulation layer, 4, metal level, 5, contact conductor, 6, epoxy resin, 7, reflection cavity, 8, radiator.
Embodiment
The utility model is described in further detail below in conjunction with drawings and Examples, but do not consist of any restriction of the present utility model.
Referring to shown in Figure 1, a kind of encapsulating structure of great power LED, comprise a metal substrate 2 and power type LED chip 1, be coated with thermal insulation layer 3 on the described metal substrate 2, be coated with layer of metal layer 4 on the described thermal insulation layer 3, form electronic circuit by wiring on the described metal level 4, this electronic circuit cooperates formation to have the printed circuit board (PCB) of specific function and electrical connection with surface mount elements on being arranged at metal substrate 2; Described power type LED chip 1 is bonded on the metal level 4, is provided with reflection cavity 7 on the described metal substrate 2, and described power type LED chip 1 is positioned at reflection cavity 7; The contact conductor 5 of described power type LED chip 1 is bonded on the pad of appointment and forms the loop with electronic circuit and surface mount elements, and the top of described power type LED chip 1 also is solidified with epoxy resin 6, and described epoxy resin 6 is lens-shaped; Be connected with radiator 8 by bolt on the described metal substrate 2.
Embodiment is just for the ease of understanding the technical solution of the utility model; do not consist of the restriction to the utility model protection range; every interior any simple modification, equivalent variations and modification of perhaps according to technical spirit of the present utility model above scheme being done that does not break away from technical solutions of the utility model all still belongs within the utility model protection range.
Claims (5)
1. the encapsulating structure of great power LED, comprise a metal substrate ⑵ and power type LED chip ⑴, be coated with thermal insulation layer ⑶ on the described metal substrate ⑵, be coated with layer of metal layer ⑷ on the described thermal insulation layer ⑶, described metal level ⑷ is upper to form electronic circuit by wiring, and this electronic circuit cooperates formation to have the printed circuit board (PCB) of specific function and electrical connection with surface mount elements on being arranged at metal substrate ⑵; It is characterized in that: described power type LED chip ⑴ is bonded on the metal level ⑷, the contact conductor ⑸ of described power type LED chip ⑴ is bonded on the pad of appointment and forms the loop with electronic circuit and surface mount elements, and the top of described power type LED chip ⑴ also is solidified with epoxy resin ⑹.
2. the encapsulating structure of great power LED according to claim 1, it is characterized in that: described epoxy resin ⑹ is lens-shaped.
3. the encapsulating structure of great power LED according to claim 1 and 2, it is characterized in that: be provided with reflection cavity ⑺ on the described metal substrate ⑵, described power type LED chip ⑴ is positioned at reflection cavity ⑺.
4. the encapsulating structure of great power LED according to claim 1 and 2 is characterized in that: be connected with radiator ⑻ on the described metal substrate ⑵.
5. the encapsulating structure of great power LED according to claim 3 is characterized in that: be connected with radiator ⑻ on the described metal substrate ⑵.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220251744 CN202678401U (en) | 2012-05-31 | 2012-05-31 | Packaging structure for high-power LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220251744 CN202678401U (en) | 2012-05-31 | 2012-05-31 | Packaging structure for high-power LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202678401U true CN202678401U (en) | 2013-01-16 |
Family
ID=47499281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220251744 Expired - Fee Related CN202678401U (en) | 2012-05-31 | 2012-05-31 | Packaging structure for high-power LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202678401U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103363357A (en) * | 2013-07-17 | 2013-10-23 | 晶科电子（广州）有限公司 | LED light source with well heat dissipation effect |
| CN110068392A (en) * | 2019-05-21 | 2019-07-30 | 上海市计量测试技术研究院 | A kind of luminous flux measurement device and method of LED light source |
-
2012
- 2012-05-31 CN CN 201220251744 patent/CN202678401U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103363357A (en) * | 2013-07-17 | 2013-10-23 | 晶科电子（广州）有限公司 | LED light source with well heat dissipation effect |
| CN103363357B (en) * | 2013-07-17 | 2015-12-09 | 晶科电子（广州）有限公司 | A kind of LED light source with great heat radiation effect |
| CN110068392A (en) * | 2019-05-21 | 2019-07-30 | 上海市计量测试技术研究院 | A kind of luminous flux measurement device and method of LED light source |
| CN110068392B (en) * | 2019-05-21 | 2024-03-22 | 上海市计量测试技术研究院 | Luminous flux measuring device and method for LED light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130116 Termination date: 20150531 |
|
| EXPY | Termination of patent right or utility model |