CN204834676U - LED light source module based on mirror aluminum substrate - Google Patents
LED light source module based on mirror aluminum substrate Download PDFInfo
- Publication number
- CN204834676U CN204834676U CN201520581122.4U CN201520581122U CN204834676U CN 204834676 U CN204834676 U CN 204834676U CN 201520581122 U CN201520581122 U CN 201520581122U CN 204834676 U CN204834676 U CN 204834676U
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- Prior art keywords
- mirror
- heat
- aluminum base
- led chip
- base board
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- Expired - Fee Related
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Abstract
The utility model discloses a LED light source module based on mirror aluminum substrate, including heat abstractor, mirror aluminum substrate, gluey, the LED chip of thermal insulation, the heat abstractor top is provided with the heat -conducting plate, the heat -conducting plate top is provided with mirror aluminum substrate, the mirror aluminum substrate top is provided with insulating face, insulating face top is provided with welds the board, it is provided with the solder to weld the board below, the solder tip is provided with the wire, the wire tip is provided with the LED chip, the LED chip is provided with all around thermal insulation glues, LED chip top is provided with the filling and glues. Beneficial effect lies in: have the performance of fabulous diffusion heat, reduced manufacturing cost, replace breakable ceramic substrate simultaneously, obtain better mechanical endurance.
Description
Technical field
The utility model belongs to the design field of LED light source, is specifically related to the LED light source module based on mirror-surface aluminum base board.
Background technology
Along with the exploitation of LED light source, quality and the various aspects of performance of light source internal and outside each parts also improve all gradually, also there is multiple pattern in the metal substrate wherein in LED light source, over the past two years, high-power LED illumination has complied with the trend of energy-conserving and environment-protective, obtain high speed development, more and more higher to the performance requirement of the substrate of light source, in a typical LED light source structure, the heat that LED produces is transmitted to metal substrate by insulating barrier, radiator is transmitted to again through thermal interfacial material, most heats that so just LED can be produced are diffused in ambient air by the mode of convection current.So the effect of metal substrate is most important, because as most of electronic device, heat is also the maximum threat of LED, relative to its volume, the heat that LED produces is very large, and heat not only affects the brightness of LED, have also been changed the color of light, LED finally can be caused to lose efficacy, therefore, prevent the accumulation of LED heat from just becoming more and more important.The key keeping LED to continue high brightness for a long time adopts state-of-the-art thermal management material, but the heat conductivility of common metal substrate is inadequate, shortens the useful life of LED light source.
Utility model content
The purpose of this utility model is just the LED light source module provided to solve the problem based on mirror-surface aluminum base board.
The utility model is achieved through the following technical solutions above-mentioned purpose:
Based on the LED light source module of mirror-surface aluminum base board, comprise heat abstractor, mirror-surface aluminum base board, thermal plastic insulation, LED chip, heat-conducting plate is provided with above described heat abstractor, described mirror-surface aluminum base board is provided with above described heat-conducting plate, insulation board face is provided with above described mirror-surface aluminum base board, welding plate is provided with above described insulation board face, solder is provided with below described welding plate, described solder end is provided with wire, described wire termination is provided with described LED chip, described LED chip surrounding is provided with described thermal plastic insulation, is provided with filling glue above described LED chip.
In said structure, electric current reaches in described wire through described welding plate and described solder, then reaches described LED chip through described wire, luminous through power conversion, heat reaches described heat-conducting plate through described insulation board face and described mirror-surface aluminum base board, passes in air finally by described heat abstractor.
In order to improve work quality further, described heat abstractor is connected by thermal conducting agent with heat-conducting plate, and described heat-conducting plate is connected with insulation mirror-surface aluminum base board.
In order to improve work quality further, described insulation board face is coated on the surface of described mirror-surface aluminum base board, and described insulation board face and described welding plate are welded together by described solder.
In order to improve work quality further, described welding plate is also connected by described solder with described wire, and described thermal plastic insulation is connected with described insulation board face.
In order to improve work quality further, described thermal plastic insulation is connected with described LED chip, and described filling glue covers the outer surface of described LED chip.
Beneficial effect is: the performance with fabulous dissipate heat, reduces production cost, replaces frangible ceramic substrate simultaneously, obtains better mechanical endurance.
Accompanying drawing explanation
Fig. 1 is the front view of the LED light source module based on mirror-surface aluminum base board described in the utility model;
Fig. 2 is the vertical view of the LED light source module based on mirror-surface aluminum base board described in the utility model.
1, heat abstractor; 2, heat-conducting plate; 3, mirror-surface aluminum base board; 4, insulation board face; 5, welding plate; 6, solder; 7, wire; 8, thermal plastic insulation; 9, LED chip; 10, filling glue.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail:
As Figure 1-Figure 2, based on the LED light source module of mirror-surface aluminum base board 3, comprise heat abstractor 1, mirror-surface aluminum base board 3, thermal plastic insulation 8, LED chip 9, heat-conducting plate 2 is provided with above heat abstractor 1, heat abstractor 1 passes in air in order to the heat produced by light source, in order to heat is reached in heat abstractor 1 by mirror-surface aluminum base board 3, mirror-surface aluminum base board 3 is provided with above heat-conducting plate 2, in order to arrange circuit and heat conduction, it is the integrating device of LED light source, insulation board face 4 is provided with above mirror-surface aluminum base board 3, in order to separate the conductivity of welding portion and mirror-surface aluminum base board 3, simultaneously in order to by heat by upper conductive to mirror-surface aluminum base board 3, welding plate 5 is provided with above insulation board face 4, in order to extraneous electric current is conducted in wire 7, solder 6 is provided with below welding plate 5, in order to bond welding plate 5 and mirror-surface aluminum base board 3, solder 6 end is provided with wire 7, in order to conduction current, wire 7 end is provided with LED chip 9, it is the core component of light source, in order to luminescence, LED chip 9 surrounding is provided with thermal plastic insulation 8, in order to fixed L ED chip 9 heat conduction simultaneously, filling glue 10 is provided with above LED chip 9, in order to cover LED chip 9 and heat conduction.
In said structure, electric current reaches in wire 7 through welding plate 5 and described solder 6, then reaches LED chip 9 through wire 7, and luminous through power conversion, heat reaches heat-conducting plate 2 through insulation board face 4 and mirror-surface aluminum base board 3, passes in air finally by heat abstractor 1.
In order to improve work quality further, heat abstractor 1 is connected by thermal conducting agent with heat-conducting plate 2, heat-conducting plate 2 is connected with insulation mirror-surface aluminum base board 3, insulation board face 4 is coated on the surface of mirror-surface aluminum base board 3, insulation board face 4 and welding plate 5 are welded together by solder 6, and welding plate 5 is also connected by solder 6 with described wire 7, and thermal plastic insulation 8 is connected with insulation board face 4, thermal plastic insulation 8 is connected with LED chip 9, and filling glue 10 covers the outer surface of LED chip 9.
More than show and describe general principle of the present utility model, principal character and advantage.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present utility model; under the prerequisite not departing from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and effect thing thereof.
Claims (5)
1. based on the LED light source module of mirror-surface aluminum base board, it is characterized in that: comprise heat abstractor, mirror-surface aluminum base board, thermal plastic insulation, LED chip, heat-conducting plate is provided with above described heat abstractor, described mirror-surface aluminum base board is provided with above described heat-conducting plate, insulation board face is provided with above described mirror-surface aluminum base board, welding plate is provided with above described insulation board face, solder is provided with below described welding plate, described solder end is provided with wire, described wire termination is provided with described LED chip, described LED chip surrounding is provided with described thermal plastic insulation, filling glue is provided with above described LED chip.
2. the LED light source module based on mirror-surface aluminum base board according to claim 1, is characterized in that: described heat abstractor is connected by thermal conducting agent with heat-conducting plate, and described heat-conducting plate is connected with insulation mirror-surface aluminum base board.
3. the LED light source module based on mirror-surface aluminum base board according to claim 1, is characterized in that: described insulation board face is coated on the surface of described mirror-surface aluminum base board, and described insulation board face and described welding plate are welded together by described solder.
4. the LED light source module based on mirror-surface aluminum base board according to claim 1, is characterized in that: described welding plate is also connected by described solder with described wire, described thermal plastic insulation is connected with described insulation board face.
5. the LED light source module based on mirror-surface aluminum base board according to claim 1, it is characterized in that: described thermal plastic insulation is connected with described LED chip, described filling glue covers the outer surface of described LED chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520581122.4U CN204834676U (en) | 2015-08-05 | 2015-08-05 | LED light source module based on mirror aluminum substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520581122.4U CN204834676U (en) | 2015-08-05 | 2015-08-05 | LED light source module based on mirror aluminum substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204834676U true CN204834676U (en) | 2015-12-02 |
Family
ID=54692240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520581122.4U Expired - Fee Related CN204834676U (en) | 2015-08-05 | 2015-08-05 | LED light source module based on mirror aluminum substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204834676U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107809884A (en) * | 2017-10-11 | 2018-03-16 | 四川珩必鑫电子科技有限公司 | A kind of high thermal conductivity aluminum matrix plate and its manufacturing process |
-
2015
- 2015-08-05 CN CN201520581122.4U patent/CN204834676U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107809884A (en) * | 2017-10-11 | 2018-03-16 | 四川珩必鑫电子科技有限公司 | A kind of high thermal conductivity aluminum matrix plate and its manufacturing process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151202 Termination date: 20160805 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |