CN202855802U - Heat radiating structure of COB type LED packaging unit - Google Patents
Heat radiating structure of COB type LED packaging unit Download PDFInfo
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- CN202855802U CN202855802U CN201220481346.4U CN201220481346U CN202855802U CN 202855802 U CN202855802 U CN 202855802U CN 201220481346 U CN201220481346 U CN 201220481346U CN 202855802 U CN202855802 U CN 202855802U
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- radiator
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Abstract
The utility model provides a heat radiating structure of a COB type LED packaging unit. The heat radiating structure comprises a COB type LED packaging unit and a heat radiator. The COB type LED packaging unit comprises a substrate and an LED chip mounted on the substrate. A solder layer which connects the substrate with the heat radiator is arranged between the substrate and the heat radiator. According to the heat radiating structure of the COB type LED packaging unit, solder paste is employed to weld the substrate and the heat radiator, the thermal conductivity of soldering tin is high, a heat export speed of an LED is greatly raised, the welding of tin sheets can be carried out by employing a traditional mode of brushing the solder paste and going through a reflow furnace, the processing is easy, and the cost is low.
Description
[technical field]
The utility model relates to a kind of radiator structure of COB type LED encapsulation unit, relates in particular to the Integral heat dissipation structure that adopts the scolding tin connected mode between a kind of substrate and the radiator.
[background technology]
LED (light emitting diode light-emitting diode) is lighting source of new generation, has the characteristics of energy-conserving and environment-protective,
Yet the LED luminous element time can produce heat in work, and its temperature is risen rapidly, if untimely this dissipation of heat is gone out, LED can be persistently overheating, will be because of overheating failure, and the brightness of LED and life-span will descend.Therefore, the LED luminous element is carried out radiating treatment very important.
COB(Chip-on-Board) type LED encapsulation unit is that led chip is directly sticked on a substrate, and the electrode of led chip finished with the circuit on the substrate is electrically connected, and after applying a glue-line, finishes packaging operation again.The heat that produces during led chip work goes out via the substrate conduction.
The substrate of existing COB type LED encapsulation unit also connects radiator with heat-conducting glue, strengthen heat radiation effect.Heat-conducting glue in the middle of substrate to the heat-conducting effect of radiator depends mainly on, and the thermal conductivity of heat-conducting glue is approximately about 2W/m*k, the low working temperature that directly affects LED of thermal conductivity.And the temperature of LED is higher, and the life-span of LED is shorter.
Therefore, be necessary to propose a kind of improvement project of heat conductivility of the COB of raising type LED encapsulation unit.
[utility model content]
The main purpose of the utility model is to overcome the defective of prior art, and a kind of Integral heat dissipation structure of COB type LED encapsulation unit is provided.
For achieving the above object, the utility model is by the following technical solutions:
A kind of radiator structure of COB type LED encapsulation unit, it comprises COB type LED encapsulation unit and radiator, described COB type LED encapsulation unit comprises substrate and is installed on led chip on the substrate, it is characterized in that: be provided with the soldering-tin layer that is connected described substrate and radiator between the substrate of described COB type LED encapsulation unit and radiator.
According to an embodiment of the present utility model, be formed with circular recess on the substrate of described led chip, described LED wafer is installed in the circular recess on the substrate.
According to an embodiment of the present utility model, be filled with fluorescent glue in the described circular recess, fluorescent glue produces white light in order to the photoreactivation with led chip.
The beneficial effects of the utility model: COB type LED encapsulation unit of the present utility model, one deck soldering-tin layer is set between substrate and radiator, the thermal conductivity of scolding tin is high, the thermal conductance that has improved greatly LED goes out speed, moreover the welding of tin sheet can adopt behind traditional brush tin cream the mode of Overwelding and rewelding furnace to carry out, handling ease, cost is low.
[description of drawings]
Fig. 1 is the schematic perspective view that the utility model COB type LED encapsulation unit is connected to radiator structure.
Fig. 2 is the side schematic view that the utility model COB type LED encapsulation unit is connected to radiator structure.
[embodiment]
Below in conjunction with accompanying drawing the technical solution of the utility model is further described in detail.
Because led chip can produce heat when luminous, the heat that led chip produces can be gathered on the substrate of chip, and by the substrate natural heat dissipation of fixed L ED chip, radiating rate is slow merely, therefore the packaged led module of radiator also needs to increase radiator, strengthens heat-conducting effect.
See also Figure 1 and Figure 2, it shows that this reality is novel COB type LED encapsulation unit 10 is fixed to the schematic diagram that dispels the heat on the radiator 1, wherein Fig. 1 is the schematic perspective view that a kind of COB type of the utility model LED encapsulation unit is connected to radiator structure, and Fig. 2 is the side schematic view that the utility model COB type LED encapsulation unit is connected to radiator structure.
In this embodiment, COB type LED encapsulation unit 10 of the present utility model comprises substrate 2, wherein forms a circular recess 4 at substrate 2, and at least one led chip 5 is fixed in the circular recess 4 on the substrate 2.And at described circular recess 4 interior filling fluorescent glues (not shown), fluorescent glue is in order to protecting exposed led chip, and and the photoreactivation of led chip produce white light.The arrangement mode of more than one led chip 5 on substrate 2 can be arbitrarily, for example: be formation shape, rounded etc.In other embodiment, there is no circular recess 4 on the substrate 2, led chip directly is fixed on the surface of substrate 2, and upper fluorescent glue encapsulates again.
More than be the structure of COB type LED encapsulation unit 10, when practical application, this COB type LED encapsulation unit 10 can be installed on the product that needs to install, on the circuit board such as LED flashlight, LED lamp etc. again.
As shown in Figures 1 and 2, be connected by one deck soldering-tin layer 3 between the bottom of the substrate 2 of COB type LED encapsulation unit of the present utility model and the radiator 1, by scolding tin connection substrate 2 and radiator 1.When concrete welding, can adopt traditional brush tin cream, the mode of rear Overwelding and rewelding furnace, handling ease, cost is low.Because the thermal conductivity of scolding tin is high, is about 60W/m*k, the derivation speed of the heat that has produced when greatly having improved led chip work.By soldering-tin layer 3 connection substrates 2 and radiator 1, can conduct by radiator 1 by the very fast heat that led chip 5 is produced like this.
Wherein radiator 1 can be that the high materials of rate of heat dissipation such as aluminum material, copper material or aluminum alloy materials are made, when actual welding, can carry out the catalyst Nickel Plating Treatment to the surface of radiator, make it at the film of the thin metallic nickel of Surface Creation one deck of needs connection, improve like this welding performance of scolding tin.
COB type LED encapsulation unit of the present utility model, between substrate 2 and radiator 1, one deck soldering-tin layer 3 is set, the thermal conductivity of scolding tin is high, the thermal conductance that has improved greatly LED goes out speed, and thermal conductivity is high, directly affects the working temperature of LED, under same ambient temperature, with the heat-conducting cream scheme relatively, significantly improved the derivation speed of the heat that led chip produces, reduce the joint temperature of LED.And the joint temperature of LED is lower, and the life-span of LED is longer, so this programme can improve the life-span of LED greatly.Moreover the welding of tin sheet can adopt behind traditional brush tin cream the mode of Overwelding and rewelding furnace to carry out, handling ease, and cost is low.
Above-mentioned explanation has fully disclosed embodiment of the present utility model.It is pointed out that and be familiar with the scope that any change that the person skilled in art does embodiment of the present utility model does not all break away from claims of the present utility model.Correspondingly, the scope of claim of the present utility model also is not limited only to previous embodiment.
Claims (3)
1. the radiator structure of a COB type LED encapsulation unit, it comprises COB type LED encapsulation unit and radiator, described COB type LED encapsulation unit comprises substrate and is installed on led chip on the substrate, it is characterized in that: be provided with the soldering-tin layer that is connected described substrate and radiator between described substrate and radiator.
2. the radiator structure of COB type LED encapsulation unit as claimed in claim 1 is characterized in that: be formed with circular recess on the substrate of described led chip, described LED wafer is installed in the circular recess on the substrate.
3. the radiator structure of COB type LED encapsulation unit according to claim 2 is characterized in that: be filled with fluorescent glue in the described circular recess, fluorescent glue produces white light in order to the photoreactivation with emitting led wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220481346.4U CN202855802U (en) | 2012-09-20 | 2012-09-20 | Heat radiating structure of COB type LED packaging unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220481346.4U CN202855802U (en) | 2012-09-20 | 2012-09-20 | Heat radiating structure of COB type LED packaging unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202855802U true CN202855802U (en) | 2013-04-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220481346.4U Expired - Fee Related CN202855802U (en) | 2012-09-20 | 2012-09-20 | Heat radiating structure of COB type LED packaging unit |
Country Status (1)
| Country | Link |
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| CN (1) | CN202855802U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105006515A (en) * | 2015-06-04 | 2015-10-28 | 佛山市南海区联合广东新光源产业创新中心 | LED chip heat dissipation structure |
| CN105702845A (en) * | 2016-03-02 | 2016-06-22 | 深圳市西德利集团有限公司 | LED illuminating device and light fixture |
| WO2017107399A1 (en) * | 2015-12-21 | 2017-06-29 | 福建中科芯源光电科技有限公司 | Integrated led light source heat-conduction structure and preparation method therefor |
-
2012
- 2012-09-20 CN CN201220481346.4U patent/CN202855802U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105006515A (en) * | 2015-06-04 | 2015-10-28 | 佛山市南海区联合广东新光源产业创新中心 | LED chip heat dissipation structure |
| CN105006515B (en) * | 2015-06-04 | 2018-01-19 | 佛山市南海区联合广东新光源产业创新中心 | A kind of LED chip radiator structure |
| WO2017107399A1 (en) * | 2015-12-21 | 2017-06-29 | 福建中科芯源光电科技有限公司 | Integrated led light source heat-conduction structure and preparation method therefor |
| CN105702845A (en) * | 2016-03-02 | 2016-06-22 | 深圳市西德利集团有限公司 | LED illuminating device and light fixture |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130403 Termination date: 20200920 |