CN202598179U - A power LED module - Google Patents
A power LED module Download PDFInfo
- Publication number
- CN202598179U CN202598179U CN 201220092743 CN201220092743U CN202598179U CN 202598179 U CN202598179 U CN 202598179U CN 201220092743 CN201220092743 CN 201220092743 CN 201220092743 U CN201220092743 U CN 201220092743U CN 202598179 U CN202598179 U CN 202598179U
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- Prior art keywords
- radiator
- led module
- power
- led
- led chips
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- Expired - Lifetime
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Abstract
The utility model provides a power LED module, comprising a radiator, and an insulation layer and a plurality of LED chips attached to the surface of the radiator. The insulation layer is provided with holes corresponding to the LED chips; the LED chips are adhered to the surface of the radiator directly after passing through the holes; the LED chips are provided with connecting pins; the connecting pins and the radiator are disposed on the two sides of the insulation layer; and the connecting pins of two adjacent LED chips are connected with each other. Compared with a conventional LED module, the power LED module saves a circuit board and enables the production cost to be reduced. Since the LED chips adhered to the radiator directly, the thermal resistance is low and a good heat dissipation effect is achieved.
Description
Technical field
The utility model relates to a kind of led module, especially a kind of power-type LED module.
Background technology
LED (Light Emitting Diode, light emitting diode) is a kind of new type light source, compares it with conventional light source and has longevity, energy-conservation, low-voltage, little, the free of contamination advantage of volume.
In the LED industry, high-power LED module is the core component of LED light fixture, generally by led light source, and circuit board, radiator three parts are formed, and led light source is connected on the circuit board, and circuit board depends on the radiator.
Existing high-power LED module has some shortcomings:
1, the circuit board that adopted of existing high-power LED module is an aluminium base, and price is higher;
2, existing high-power LED lamp is owing to the use of aluminium base, and heat dissipation path is long, and thermal resistance is high.
So, need a kind of new technical scheme to address the above problem.
The utility model content
The purpose of the utility model is the deficiency that exists to prior art, and the power-type LED module of the low and good heat dissipation of a kind of cost is provided.
For realizing above-mentioned purpose, the utility model power-type LED module can adopt following technical scheme:
A kind of power-type LED module comprises radiator, is attached at insulating barrier and some led chips of spreader surface; Corresponding led chip is provided with the hole on the said insulating barrier, and said led chip passes the hole and directly is adhered to spreader surface, and led chip is provided with connecting pin, and said connecting pin and radiator are positioned at the both sides of insulating barrier, and the connecting pin of said adjacent two led chips is connected.
Compare with background technology, the utility model power-type LED module has been exempted circuit board with respect to prior art, has reduced production cost; And, led chip directly is bonded on the radiator, thermal resistance is low, good heat dissipation.
Description of drawings
Fig. 1 is the three-dimensional exploded view of the utility model power-type LED module.
Fig. 2 is the schematic top plan view of the utility model power-type LED module.
The specific embodiment
Below in conjunction with accompanying drawing and specific embodiment; Further illustrate the utility model; Should understand these embodiment only be used to the utility model is described and be not used in the restriction the utility model scope; After having read the utility model, those skilled in the art all fall within the application's accompanying claims institute restricted portion to the modification of the various equivalent form of values of the utility model.
See also Fig. 1 and shown in Figure 2, the utility model discloses a kind of power-type LED module 100, comprises radiator 20, is attached at insulating barrier 30 and some led chips 40 on radiator 20 surface.Corresponding led chip 40 is provided with hole 31 on the said insulating barrier 30.Said led chip 40 passes hole 31 and directly is adhered to radiator 20 surfaces, in this embodiment, is coated with between said radiator 20 and the led chip 40 in order to bonding high-heat-conductivity glue water (not shown).Led chip 40 is provided with connecting pin 41, and said connecting pin 41 and radiator 30 are positioned at the both sides of insulating barrier 30 to prevent connecting pin 41 and radiator 30 short circuits.The connecting pin 41 of said adjacent two led chips 40 is connected through scolding tin 50 welding.In this embodiment, said insulating barrier 40 is the insulation paster, can certainly use other insulating materials replacement.
The utility model power-type LED module has been exempted circuit board with respect to prior art, has reduced production cost; And, led chip directly is bonded on the radiator, thermal resistance is low, and heat conduction is good.
Claims (4)
1. power-type LED module is characterized in that: comprise radiator, be attached at insulating barrier and some led chips of spreader surface; Corresponding led chip is provided with the hole on the said insulating barrier, and said led chip passes the hole and directly is adhered to spreader surface, and led chip is provided with connecting pin, and said connecting pin and radiator are positioned at the both sides of insulating barrier, and the connecting pin of said adjacent two led chips is connected.
2. power-type LED module according to claim 1 is characterized in that: said insulating barrier is the insulation paster.
3. power-type LED module according to claim 1 and 2 is characterized in that: the connecting pin of said adjacent two led chips is welded in together through scolding tin.
4. power-type LED module according to claim 1 is characterized in that: be coated with between said radiator and the led chip in order to bonding high-heat-conductivity glue water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220092743 CN202598179U (en) | 2012-03-13 | 2012-03-13 | A power LED module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220092743 CN202598179U (en) | 2012-03-13 | 2012-03-13 | A power LED module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202598179U true CN202598179U (en) | 2012-12-12 |
Family
ID=47315716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220092743 Expired - Lifetime CN202598179U (en) | 2012-03-13 | 2012-03-13 | A power LED module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202598179U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545423A (en) * | 2013-10-28 | 2014-01-29 | 江门市亮大照明有限公司 | LED encapsulation method |
| CN103542298A (en) * | 2013-10-28 | 2014-01-29 | 江门市亮大照明有限公司 | LED (Light Emitting Diode) sunlight packaging structure with high production efficiency |
-
2012
- 2012-03-13 CN CN 201220092743 patent/CN202598179U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545423A (en) * | 2013-10-28 | 2014-01-29 | 江门市亮大照明有限公司 | LED encapsulation method |
| CN103542298A (en) * | 2013-10-28 | 2014-01-29 | 江门市亮大照明有限公司 | LED (Light Emitting Diode) sunlight packaging structure with high production efficiency |
| CN103542298B (en) * | 2013-10-28 | 2016-03-23 | 汇高（广州）电子有限公司 | The LED fluorescent tube encapsulating structure that a kind of production efficiency is high |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121212 |