CN202101047U - High-power LED (light-emitting diode) light source module with excellent heat dissipation performance - Google Patents

High-power LED (light-emitting diode) light source module with excellent heat dissipation performance Download PDF

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Publication number
CN202101047U
CN202101047U CN2011201231965U CN201120123196U CN202101047U CN 202101047 U CN202101047 U CN 202101047U CN 2011201231965 U CN2011201231965 U CN 2011201231965U CN 201120123196 U CN201120123196 U CN 201120123196U CN 202101047 U CN202101047 U CN 202101047U
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light source
source module
heat dissipation
heat
led
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Expired - Fee Related
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CN2011201231965U
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Chinese (zh)
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陈宝如
林介本
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Individual
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Individual
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Abstract

The utility model discloses a high-power LED (light-emitting diode) light source module with excellent heat dissipation performance, which comprises a heat dissipation base, a heat dissipation circuit board and an LED device. The LED device is fitted and mounted on the upper surface of the heat dissipation circuit board. A heat conduction graphite gasket with high heat conduction coefficient in the X-Y direction is adhered between the lower surface of the heat dissipation circuit board and the heat dissipation base. In the utility model, the heat conduction graphite gasket with outstanding heat dissipation performance is adopted and then a reflow soldering process and the heat dissipation design of the heat dissipation base are combined, so that the conducting efficiency of the heat from the LED device, the heat dissipation circuit board and the heat conduction graphite gasket to the heat dissipation base is integrally and effectively improved, and thus, the LED light source module has excellent heat dissipation performance, the requirement on the design of a high-power LED lamp is met and the high-power LED light source module can be widely applied to the fields of an LED street lamp, an LED tunnel lamp, an LED projection lamp and the like.

Description

The high-power LED light source module that a kind of heat dispersion is excellent
Technical field
The utility model relates to the LED field of illuminating lamps, relates in particular to the excellent high-power LED light source module of a kind of heat dispersion.
Background technology
In recent years; LED production cost when its luminous efficiency continues to promote also constantly descends; The LED industry progressively is applied on the high power light fixtures such as LED street lamp, LED Tunnel Lamp, LED Projecting Lamp, LED bulkhead lamp capable; Based on the consideration that industrialization and product seriation are produced, people's research and development focus on the led light source module, and this led light source module is applied on the corresponding light fixture; For example, the light source module of 28W can be used for making the LED street lamp or the Projecting Lamp product of serial power such as 28W, 56W, 112W.The advantage of led light source module is: 1. the production of led light source module is prone to the production of employing scale streamline; 2. design is convenient in the structure of led light source module and heat radiation, and development cost is lower, the cycle is shorter; 3. the use of led light source module is flexible, can be applicable on the dissimilar high power light fixtures, and for example same module both can be applied in the street lamp product, also can be applied in Projecting Lamp and other light fixture products.
At present, the heat dissipation problem of high-power LED light source module is one of emphasis of research, when module is applied to outdoor lamp; The bad light fixture integral heat sink performance that causes of the heat radiation of high-power LED light source module is not enough; Temperature rise causes the light fixture luminous flux obviously to descend, poor reliability, phenomenon such as service life is short; For the heat dispersion that improves the high-power LED light source module and improve reliability, main method has: the one, and adopt heat-conducting silicone grease that thermal conductivity factor is higher than 3.0W/mk as the heat conduction bonding agent between radiating circuit plate and the radiating seat; The 2nd, employing pottery etc. has the radiating circuit plate of high thermal conductivity coefficient; The 3rd, adopt heat pipe to improve the radiating efficiency of module.The advantage of method one is that heat-conducting silicone grease is cheap, and its performance satisfies the demand of low wattage or low and middle-end high-capacity LED street lamp, and its shortcoming is that thermal conductivity factor is not enough, and crawling is even; The advantage of method two is that radiating circuit plates such as pottery can solve the heat conduction problem of LED device to the radiating circuit plate, but can not effectively solve the integral heat sink problem that LED device heat is transmitted to radiating seat, and costs an arm and a leg; The advantage of method three is to have outstanding radiating effect, but manufacturing process is complicated, and cost is too high.
In view of this, the inventor furthers investigate to the heat dispersion of led light source module, and this case produces thus.
The utility model content
The purpose of the utility model has been to provide a kind of heat dispersion excellent high-power LED light source module; It not only has excellent heat dispersion, and has solved fundamentally that the high-power LED light source module is bad because of the Heat Conduction Material performance in the prior art, structural design is unreasonable or the structural design cost is crossed problems such as height.
In order to reach above-mentioned purpose, the solution of the utility model is:
The high-power LED light source module that a kind of heat dispersion is excellent; Comprise radiating seat, radiating circuit plate and LED device; This LED device is mounted on the upper surface of above-mentioned radiating circuit plate, is bonded with the conductive graphite pad that on the X-Y direction, has high thermal conductivity coefficient between the lower surface of above-mentioned radiating circuit plate and above-mentioned radiating seat.
Above-mentioned conductive graphite pad is that thermal conductivity factor is 350~450W/mk on the X-Y direction, and Z direction thermal conductivity factor is greater than the heat conductivity graphite material of 7.0W/mk.
Above-mentioned conductive graphite pad is the sheet heat conductivity graphite material of thickness between 0.2~0.6mm.
Form several cell walls on the above-mentioned radiating seat and be the radiating groove of miniature striped dentation.
The great power LED device that above-mentioned LED device is single 1~3W perhaps is the high-power LED light source module of 5~50W for integrated form power.
Above-mentioned radiating circuit plate is the aluminium material copper coating board, and its upper surface can be provided with pad and the circuit that supplies above-mentioned LED device welding to mount.
After adopting such scheme, the utlity model has following some beneficial effect:
One, above-mentioned LED device is mounted on the radiating circuit plate, and it has shortened the heat radiation length of LED device to the radiating circuit plate, and the heat that the LED device is produced is transmitted on the radiating circuit plate immediately effectively, thereby has reduced the temperature rise of LED device immediately effectively.
Two, adopt the conductive graphite pad bonding between the lower surface of radiating circuit plate and above-mentioned radiating seat; Said conductive graphite pad has high thermal conductivity coefficient on the X-Y direction; So effectively improved the horizontal diffusivity of heat, heat is effectively evenly distributed and be transmitted on the radiating seat through the heat of longitudinal direction with the radiating circuit plate.
Three, this case is owing to adopt mounting method to be electrically connected between LED device and radiating circuit plate; Adopt the conductive graphite pad bonding between the lower surface of radiating circuit plate and above-mentioned radiating seat; Not only structural design is simple for it; Cost is low, but also has realized from the LED device arriving the excellent heat radiation of radiating seat again to the radiating circuit plate.
Four, the also plastic radiating groove that has several cell walls to be miniature striped dentation on the radiating seat of the utility model; Increased area of dissipation; Make heat effectively successively from LED device, radiating circuit plate, conductive graphite pad; Arrive radiating seat again, finally be transmitted to air, improved the integral heat sink performance of high-power LED light source module thus widely.
Description of drawings
Fig. 1 is the structural representation of the utility model high-power LED light source module one preferred embodiment;
Fig. 2 is the side view of Fig. 1;
Fig. 3 is the schematic cross-section in Fig. 1 heat radiation process.
Label declaration
Radiating seat 1 radiating groove 11
Miniature striped dentation 12 conductive graphite pads 2
Radiating circuit plate 3 LED devices 4
The specific embodiment
In order further to explain the technical scheme of the utility model, come the utility model is set forth in detail through specific embodiment below.
For the excellent high-power LED light source module of a kind of heat dispersion that the utility model designs, comprise radiating seat 1, conductive graphite pad 2, radiating circuit plate 3 and LED device 4 like Fig. 1 to Fig. 3, wherein:
LED device 4; The one of which specific embodiment is as shown in Figure 1, totally 28, is the 4*7 arranged; And specifically adopt solder reflow to be mounted on the upper surface of radiating circuit plate 3; LED device 4 is specially the great power LED device of single 1~3W, perhaps is integrated form high-power LED light source module, and power is 5~50W; Radiating circuit plate 3 is the aluminium material copper coating board; Promptly by the aluminium material substrate with cover copper wire and form; Circuit can be according to the design fabric swatch of circuit, and corresponding above-mentioned LED device 4 is in predeterminable pad and the circuit (not shown) that has 4 reflow solderings of confession LED device to mount of the upper surface of radiating circuit plate 3; Said LED device 4 is mounted on the radiating circuit plate 3; It has shortened the heat radiation length of LED device 4 to radiating circuit plate 3; The heat that LED device 4 is produced is transmitted on the radiating circuit plate 3 immediately effectively, thereby can reduce the temperature rise of LED device immediately effectively.
1 of the utility model radiating circuit plate 3 and radiating seat are provided with the conductive graphite pad 2 as heat dissipating layer; This conductive graphite pad 2 has cementability, lower surface and radiating seat 1 that can bonding said radiating circuit plate 3, and conductive graphite pad 2 has high thermal conductivity coefficient on the X-Y direction; Be specially 350~450W/mk; Z direction thermal conductivity factor is greater than 7.0W/mk, and the cutting as requested of the thickness of conductive graphite pad 2 is in the preferred embodiment; It is the sheet heat conductivity graphite material of thickness between 0.2~0.6mm, and size is consistent with the length and width of radiating circuit plate 3.
Said LED device 4 adopts the tin cream solder reflow process to be mounted on the radiating circuit plate 3, and radiating circuit plate 3 is adhered on the radiating seat 1 by conductive graphite pad 2; As shown in Figure 3, in the heat radiation of led light source module, the heat that LED device 4 produces is transmitted on the radiating circuit plate 3 at first more quickly; Then be transmitted on the conductive graphite pad 2; Because the X-Y direction of conductive graphite pad 2 has high-termal conductivity, the rapid horizontal proliferation of heat to whole conductive graphite pad 2, heat vertically is transmitted to radiating seat 1 along the Z direction of conductive graphite pad 2 more afterwards; In order to strengthen the thermolysis of radiating seat 1; Form several madial walls on the radiating seat 1 and be the radiating groove 11 of miniature striped dentation 12, the area of dissipation that it has increased radiating seat 1 has promoted the exchange heat speed of radiating seat 1 and air thus.
In sum; The utility model carries out creationary improvement from the application of backflow attachment process, conductive graphite pad 2, the heat dissipation design aspects such as structure of radiating seat 1; Main innovate point is to have adopted the exsertile conductive graphite pad 2 of thermal diffusivity; Effectively improved horizontal (the X-Y direction of above-mentioned conductive graphite pad 2) diffusivity of heat; Heat is effectively evenly distributed and be transmitted on the radiating seat 1, combine LED device 4 and the solder reflow process of radiating circuit plate 3 and the heat dissipation design of radiating seat 1 again, improved heat on the whole effectively from LED device 4, radiating circuit plate 3, conductive graphite pad 2 along the longitudinal direction (the Z direction of above-mentioned conductive graphite pad 2) of conductive graphite pad 2 heat with radiating circuit plate 3; Arrive the conduction efficiency of radiating seat 1 again; Not only structural design is simple for it, and cost is low, but also makes the led light source module have excellent heat dispersion; Satisfy high-capacity LED light fixture designing requirement, can be widely used in lighting fields such as LED street lamp, LED Tunnel Lamp, LED Projecting Lamp.
Product form of the foregoing description and graphic and non-limiting the utility model and style, the those of ordinary skill of any affiliated technical field all should be regarded as not breaking away from the patent category of the utility model to its suitable variation or modification of doing.

Claims (6)

1. the excellent high-power LED light source module of a heat dispersion; Comprise radiating seat, radiating circuit plate and LED device; It is characterized in that: above-mentioned LED device is mounted on the upper surface of above-mentioned radiating circuit plate, is bonded with the conductive graphite pad that on the X-Y direction, has high thermal conductivity coefficient between the lower surface of above-mentioned radiating circuit plate and above-mentioned radiating seat.
2. the excellent high-power LED light source module of a kind of heat dispersion as claimed in claim 1, it is characterized in that: above-mentioned conductive graphite pad is that thermal conductivity factor is 350~450W/mk on the X-Y direction, and Z direction thermal conductivity factor is greater than the heat conductivity graphite material of 7.0W/mk.
3. the excellent high-power LED light source module of a kind of heat dispersion as claimed in claim 1, it is characterized in that: above-mentioned conductive graphite pad is the sheet heat conductivity graphite material of thickness between 0.2~0.6mm.
4. the excellent high-power LED light source module of a kind of heat dispersion as claimed in claim 1 is characterized in that: form the radiating groove that several cell walls are miniature striped dentation on the above-mentioned radiating seat.
5. the excellent high-power LED light source module of a kind of heat dispersion as claimed in claim 1, it is characterized in that: the great power LED device that above-mentioned LED device is single 1~3W perhaps is the high-power LED light source module of 5~50W for integrated form power.
6. the excellent high-power LED light source module of a kind of heat dispersion as claimed in claim 1, it is characterized in that: above-mentioned radiating circuit plate is the aluminium material copper coating board, its upper surface can be provided with pad and the circuit that supplies above-mentioned LED device welding to mount.
CN2011201231965U 2011-04-22 2011-04-22 High-power LED (light-emitting diode) light source module with excellent heat dissipation performance Expired - Fee Related CN202101047U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011201231965U CN202101047U (en) 2011-04-22 2011-04-22 High-power LED (light-emitting diode) light source module with excellent heat dissipation performance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011201231965U CN202101047U (en) 2011-04-22 2011-04-22 High-power LED (light-emitting diode) light source module with excellent heat dissipation performance

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CN202101047U true CN202101047U (en) 2012-01-04

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102610737A (en) * 2012-03-21 2012-07-25 广州市鸿利光电股份有限公司 Heat-radiating device of high-power LED (Light Emitting Diode)
CN102927484A (en) * 2012-11-26 2013-02-13 殷逢宝 High-power LED lamp

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102610737A (en) * 2012-03-21 2012-07-25 广州市鸿利光电股份有限公司 Heat-radiating device of high-power LED (Light Emitting Diode)
CN102927484A (en) * 2012-11-26 2013-02-13 殷逢宝 High-power LED lamp
CN102927484B (en) * 2012-11-26 2013-11-20 殷逢宝 High-power LED lamp

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C17 Cessation of patent right
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Granted publication date: 20120104

Termination date: 20130422