CN203298237U - High-efficiency heat dissipating power-supply-integrated LED (light emitting diode) light source module - Google Patents

High-efficiency heat dissipating power-supply-integrated LED (light emitting diode) light source module Download PDF

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Publication number
CN203298237U
CN203298237U CN2013203703527U CN201320370352U CN203298237U CN 203298237 U CN203298237 U CN 203298237U CN 2013203703527 U CN2013203703527 U CN 2013203703527U CN 201320370352 U CN201320370352 U CN 201320370352U CN 203298237 U CN203298237 U CN 203298237U
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CN
China
Prior art keywords
light source
supply
source module
led light
circuit board
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2013203703527U
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Chinese (zh)
Inventor
褚峰峰
刘军波
戎帆
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HEBEI XINGHUO LIGHTING CO Ltd
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HEBEI XINGHUO LIGHTING CO Ltd
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Priority to CN2013203703527U priority Critical patent/CN203298237U/en
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Publication of CN203298237U publication Critical patent/CN203298237U/en
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Abstract

The utility model relates to a high-efficiency heat dissipating power-supply-integrated LED light source module. The high-efficiency heat dissipating power-supply-integrated LED light source module comprises a PCB (printed circuit board) for electric connection and a plurality of LED chips arranged on the surface of the PCB, wherein the PCB and the LED chips are connected through sheet tinned copper foil heat sinks, and the PCB is also provided with an LED power supply. The high-efficiency heat dissipating power-supply-integrated LED light source module can protectively reduce the junction temperature of the LED chips well and prolong the service life; due to the fact that a PTC (positive temperature coefficient) thermistor current-limiting high-voltage mains supply direct-drive power supply and LED light sources are integrated on one circuit board to form the power-supply-integrated module, mass production is facilitated, and the metal material consumption can be reduced to the largest extent. The material cost is saved and the mass production is obtained, the production efficiency and the product reliability can be largely improved, and the cost and the fault rate can be reduced obviously.

Description

High efficiency and heat radiation power supply integration LED light source module
Technical field
The utility model relates to lighting field, particularly a kind of high efficiency and heat radiation power supply integration LED light source module.
Background technology
When LED light source is luminous, also can produce a large amount of heat, if these heats are not left and will shorten the service life of LED light source.The above high power LED light source of tradition 1W will complete electrical connection and heat radiation by metal or ceramic base wiring board, the heat sink light source module that is combined into, but metal base circuit board exists a thermal conductivity factor to be difficult to surmount the insulating barrier of 3w/mk in order to realize electrical isolation between electrical connection layer and metal substrate, thermal conductivity factor also is difficult to surmount 150w/mk although ceramic substrate does not structurally have insulating barrier, and complex process is expensive.So the metal base circuit board of extensive use at present becomes the maximum bottleneck on LED chip and lamp cooling structure passage, so which kind of efficient radiator structure light fixture adopts all can't tackle the problem at its root, finally cause a large amount of heat accumulation of LED chip, have a strong impact on the service life of LED light source.
The utility model content
In order to address the aforementioned drawbacks and deficiency, the utility model embodiment provides a kind of junction temperature better and the high efficiency and heat radiation power supply integration LED light source module of long service life.Described technical scheme is as follows:
The utility model proposes a kind of high efficiency and heat radiation power supply integration LED light source module, comprise for the PCB circuit board that is electrically connected and several LED chips of being located at its surface, it is characterized in that, described PCB circuit board by zinc-plated heat sink connection of Copper Foil matter of sheet, also is provided with LED power supply on described PCB circuit board with LED chip.
Preferential as technique scheme, described PCB circuit board is fixedly connected with setting by high thermal conductive silicon film metallic heat dissipating part.
Preferential as technique scheme, described zinc-plated Copper Foil matter is heat sink is two-sided Via Design.
The beneficial effect that the technical scheme that the utility model embodiment provides is brought is: the utility model relates to a kind of power supply integration LED light source modular structure; can better protect and reduce the LED chip junction temperature; increase the service life; and PTC thermistor current limliting high pressure civil power is directly driven to power supply and LED light source be integrated on a wiring board and make the power supply integration module; be convenient to batch production, and reduced to greatest extent the consumption of metal material.Not only saved material cost but also be convenient to batch production, can greatly enhance productivity and product reliability, be significantly reduced to originally and fault rate.
The accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, in below describing embodiment, the accompanying drawing of required use is briefly described, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the high efficiency and heat radiation power supply integration LED light source modular structure schematic diagram that provides in the present embodiment 1;
Fig. 2 is the heat sink distribution schematic diagram of the zinc-plated Copper Foil matter of sheet that provides in the present embodiment 1;
Fig. 3 is the heat sink enlarged diagram of the zinc-plated Copper Foil matter of the sheet that provides of the present embodiment 1;
Fig. 4 is the PCB circuit board, high thermal conductive silicon film, metallic heat dissipating part three location diagram.
The specific embodiment
For making the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing, the utility model embodiment is described in further detail.
Embodiment 1
The utility model proposes a kind of high efficiency and heat radiation power supply integration LED light source module, as shown in Figure 1, Figure 2, Figure 3, Figure 4, comprise for the PCB circuit board 1 that is electrically connected and several LED chips of being located at its surface, described PCB circuit board 1 is connected by the zinc-plated Copper Foil matter heat sink 2 of sheet with LED chip, on described PCB circuit board, also is provided with the LED power supply.
As shown in Figure 4, described 1PCB circuit board is connected with 4 metallic heat dissipating parts by 3 high thermal conductive silicon films.
As shown in Figure 3, described zinc-plated Copper Foil matter is heat sink is two-sided Via Design.
The foregoing is only preferred embodiment of the present utility model, not in order to limit the utility model, all within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.

Claims (3)

1. high efficiency and heat radiation power supply integration LED light source module, comprise for the PCB circuit board that is electrically connected and several LED chips of being located at its surface, it is characterized in that, described PCB circuit board by zinc-plated heat sink connection of Copper Foil matter of sheet, also is provided with LED power supply on described PCB circuit board with LED chip.
2. high efficiency and heat radiation power supply integration LED light source module according to claim 1, is characterized in that, described PCB circuit board is fixedly connected with setting by high thermal conductive silicon film metallic heat dissipating part.
3. high efficiency and heat radiation power supply integration LED light source module according to claim 1, is characterized in that, described zinc-plated Copper Foil matter is heat sink is two-sided Via Design.
CN2013203703527U 2013-06-26 2013-06-26 High-efficiency heat dissipating power-supply-integrated LED (light emitting diode) light source module Expired - Fee Related CN203298237U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013203703527U CN203298237U (en) 2013-06-26 2013-06-26 High-efficiency heat dissipating power-supply-integrated LED (light emitting diode) light source module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013203703527U CN203298237U (en) 2013-06-26 2013-06-26 High-efficiency heat dissipating power-supply-integrated LED (light emitting diode) light source module

Publications (1)

Publication Number Publication Date
CN203298237U true CN203298237U (en) 2013-11-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013203703527U Expired - Fee Related CN203298237U (en) 2013-06-26 2013-06-26 High-efficiency heat dissipating power-supply-integrated LED (light emitting diode) light source module

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CN (1) CN203298237U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180340682A1 (en) * 2017-05-24 2018-11-29 Osram Sylvania Inc. Lighting device modules

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180340682A1 (en) * 2017-05-24 2018-11-29 Osram Sylvania Inc. Lighting device modules

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20131120

Termination date: 20160626