CN202691967U - LED (Light Emitting Diode) lamp cap radiating structure - Google Patents

LED (Light Emitting Diode) lamp cap radiating structure Download PDF

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Publication number
CN202691967U
CN202691967U CN201220219090XU CN201220219090U CN202691967U CN 202691967 U CN202691967 U CN 202691967U CN 201220219090X U CN201220219090X U CN 201220219090XU CN 201220219090 U CN201220219090 U CN 201220219090U CN 202691967 U CN202691967 U CN 202691967U
Authority
CN
China
Prior art keywords
led
led chip
copper foil
foil layer
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201220219090XU
Other languages
Chinese (zh)
Inventor
肖开文
郑胜
温雨泉
郭伟涛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meizhou Rui Sheng Polytron Technologies Inc
Original Assignee
MEIZHOU RUIXIN ELECTRONICS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MEIZHOU RUIXIN ELECTRONICS CO Ltd filed Critical MEIZHOU RUIXIN ELECTRONICS CO Ltd
Priority to CN201220219090XU priority Critical patent/CN202691967U/en
Application granted granted Critical
Publication of CN202691967U publication Critical patent/CN202691967U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses an LED (Light Emitting Diode) lamp cap radiating structure, which comprises an aluminum base plate and an LED chip, wherein the LED chip is fixedly arranged on the aluminum base plate to form an LED luminous member; a copper foil layer with a heat conduction effect is arranged between the LED chip and the aluminum base plate and covers the aluminum base plate, and an insulating layer with heat conduction and insulation effects is arranged between the copper foil layer and the aluminum base plate; the copper foil layer is provided with an independent electronic element layout circuit for providing power for the LED chip to form a similar single-layer or multi-layer PCB (Printed Circuit Board) structure, so that high-efficiency heat conduction to the aluminum base plate for the LED chip through the large-area copper foil layer can be realized, thereby timely radiating heat produced by the LED chip to the entire aluminum base plate, and power can also be provided for the LED chip by using the independent electronic element layout circuit on the copper foil layer, thereby effectively increasing the utilization rate of the copper foil layer; and thus, the LED lamp cap structure is more compact, and the LED lamp cap radiating structure has the advantages of simple structure, skillful conception, high heat conduction efficiency, good radiating effect and suitability for generalization and use.

Description

A kind of LED lamp head heat radiation structure
Technical field
The utility model relates to lighting apparatus manufacturing technology field, is a kind of technological improvement of LED lamp head heat radiation structure specifically.。
Background technology
At present, LED lamp kind is very many on the market, the structure of most of LED lamps comprises lamp holder, inside is cooling base and the lampshade of hollow structure, the illuminating part of LED lamp holder is fixed on the highly heat-conductive material substrate by led chip and consists of, it is simple in structure, has long service life, advantages such as illuminating ray is even and welcome by the user, but the LED holder structure of prior art generally adopts aluminium base to carry out the heat conduction and heat radiation effect, the thermolysis of aluminium base is apparent in view, but conductive force but is slower, the timely heat of heat that is difficult in time led chip to be produced is passed to whole aluminium base and dispels the heat, easily cause the led chip heat build-up of LED lamp holder too high, with regard to the light decay phenomenon of easy too fast appearance even the service life of shortening LED lamp.Thereby design a kind of compact conformation, be skillfully constructed, can realize that it is design of the present utility model place that heat high efficiencies of heat transfer that led chip is produced is carried out the LED lamp head heat radiation structure of thermolysis to the whole aluminium base.
Summary of the invention
The purpose of this utility model is the shortcoming that overcomes above-mentioned prior art, a kind of compact conformation is provided, is skillfully constructed, can realizes the LED lamp head heat radiation structure that heat high efficiencies of heat transfer that led chip is produced is carried out thermolysis to the whole aluminium base.
The utility model can be achieved through the following technical solutions:
The utility model discloses a kind of LED lamp head heat radiation structure, this LED lamp head heat radiation structure comprises the aluminium base with thermolysis, be arranged on the led chip on the aluminium base, led chip is fixed on the LED illuminating part that consists of on the aluminium base, be provided with the copper foil layer of conductive force between described led chip and the aluminium base, copper foil layer be covered on the aluminium base and and aluminium base between be provided with the insulating barrier with heat conduction and insulating effect.
Offer independently and provide for led chip the electronic component layout circuit of power supply on the described copper foil layer, formation is similar to single or multiple lift PCB board structure of circuit, realize both can being undertaken to the aluminium base high-efficiency heat conduction by copper foil layer for led chip, because copper product has more excellent heat conductivility than aluminum or aluminum alloy material, the heat that led chip is produced in time leaves to whole aluminium base, can adopt again the independent electronic component placement circuit on copper foil layer to provide power supply etc. for led chip, effective frugally cost of product, utilized the utilization rate of copper foil layer, made the LED fitting structure compacter.
The utility model compared with prior art has the following advantages:
The utility model is provided with the copper foil layer of conductive force between led chip and aluminium base, copper foil layer be covered on the aluminium base and and aluminium base between be provided with the insulating barrier with heat conduction and insulating effect, offer independently and provide for led chip the electronic component layout circuit of power supply on the described copper foil layer, formation is similar to single or multiple lift PCB board structure of circuit, realize both can being undertaken to the aluminium base high-efficiency heat conduction by large-area copper foil layer for led chip, the heat that led chip is produced in time leaves to whole aluminium base, can adopt again the independent electronic component placement circuit on copper foil layer to provide power supply etc. for led chip, effective frugally cost of product, utilized the utilization rate of copper foil layer, make the LED fitting structure compacter, it is simple in structure, is skillfully constructed, and heat transfer efficiency is high, good heat dissipation effect is fit to generally promote the use of.
Description of drawings
Accompanying drawing 1 is the utility model structural representation;
Accompanying drawing 2 is the utility model cross-sectional view.
The specific embodiment
Come the utility model is further described below in conjunction with Figure of description:
Shown in accompanying drawing 1 and accompanying drawing 2, the present embodiment discloses a kind of LED lamp head heat radiation structure, this LED lamp head heat radiation structure comprises the aluminium base 1 with thermolysis, be arranged on the led chip 2 on the aluminium base, led chip is fixed on the LED illuminating part that consists of on the aluminium base, be provided with the copper foil layer 3 of conductive force between described led chip and the aluminium base, copper foil layer be covered on the aluminium base and and aluminium base between be provided with the insulating barrier 4 with heat conduction and insulating effect.
Offer independently and provide for led chip the electronic component layout circuit 5 of power supply on the described copper foil layer, formation is similar to single or multiple lift PCB board structure of circuit, realize both can being undertaken to the aluminium base high-efficiency heat conduction by copper foil layer for led chip, because copper product has more excellent heat conductivility than aluminum or aluminum alloy material, the heat that led chip is produced in time leaves to whole aluminium base, can adopt again the independent electronic component placement circuit on copper foil layer to provide power supply etc. for led chip, effective frugally cost of product, utilized the utilization rate of copper foil layer, made the LED fitting structure compacter.
The utility model design can be applied on the aluminium base of difformity different structure, to realize making the LED light fixture of different structure, such as LED light pipe, LED bulb lamp etc.
The above is preferred embodiment of the present utility model only, is not that the utility model is done any pro forma restriction; But the those of ordinary skill of all industry is all implemented the utility model with the above shown in the by specification accompanying drawing swimmingly; But all those skilled in the art can utilize the disclosed above technology contents and a little change, the modification of making and the equivalent variations that develops within not breaking away from the technical solutions of the utility model scope, be equivalent embodiment of the present utility model; Simultaneously, the change of any equivalent variations that all foundations essence technology of the present utility model is done above embodiment, modify with differentiation etc., all still belong within the protection domain of the technical solution of the utility model.

Claims (2)

1. LED lamp head heat radiation structure, comprise the aluminium base (1) with thermolysis, be arranged on the led chip (2) on the aluminium base, led chip is fixed on the LED illuminating part that consists of on the aluminium base, it is characterized in that: be provided with the copper foil layer (3) of conductive force between described led chip and the aluminium base, copper foil layer be covered on the aluminium base and and aluminium base between be provided with the insulating barrier (4) with heat conduction and insulating effect.
2. LED lamp head heat radiation structure according to claim 1 is characterized in that: the electronic component layout circuit (5) that offers independently and provide for led chip power supply on the described copper foil layer.
CN201220219090XU 2012-05-16 2012-05-16 LED (Light Emitting Diode) lamp cap radiating structure Expired - Fee Related CN202691967U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201220219090XU CN202691967U (en) 2012-05-16 2012-05-16 LED (Light Emitting Diode) lamp cap radiating structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201220219090XU CN202691967U (en) 2012-05-16 2012-05-16 LED (Light Emitting Diode) lamp cap radiating structure

Publications (1)

Publication Number Publication Date
CN202691967U true CN202691967U (en) 2013-01-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201220219090XU Expired - Fee Related CN202691967U (en) 2012-05-16 2012-05-16 LED (Light Emitting Diode) lamp cap radiating structure

Country Status (1)

Country Link
CN (1) CN202691967U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110770500A (en) * 2017-06-13 2020-02-07 夏普株式会社 Illumination device and display device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110770500A (en) * 2017-06-13 2020-02-07 夏普株式会社 Illumination device and display device

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Legal Events

Date Code Title Description
GR01 Patent grant
C14 Grant of patent or utility model
TR01 Transfer of patent right

Effective date of registration: 20160719

Address after: 514100, Meizhou, Guangdong province Jiaoling County town, No. 79 West Peak Road, No. two floor

Patentee after: Meizhou Rui Sheng Polytron Technologies Inc

Address before: 514000, 232, five Li Ting, north of Meijiang District, Guangdong, Meizhou

Patentee before: Meizhou Ruixin Electronics Co.,Ltd.

Effective date of registration: 20160719

Address after: 514100, Meizhou, Guangdong province Jiaoling County town, No. 79 West Peak Road, No. two floor

Patentee after: Meizhou Rui Sheng Polytron Technologies Inc

Address before: 514000, 232, five Li Ting, north of Meijiang District, Guangdong, Meizhou

Patentee before: Meizhou Ruixin Electronics Co.,Ltd.

C41 Transfer of patent application or patent right or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130123

Termination date: 20200516

CF01 Termination of patent right due to non-payment of annual fee