CN203225276U

CN203225276U - Led integrated light source module

Info

Publication number: CN203225276U
Application number: CN 201320057899
Authority: CN
Inventors: 刘军波; 康世灿; 何娜
Original assignee: HEBEI XINGHUO LIGHTING CO Ltd
Current assignee: HEBEI XINGHUO LIGHTING CO Ltd
Priority date: 2013-02-01
Filing date: 2013-02-01
Publication date: 2013-10-02
Anticipated expiration: 2023-02-01

Abstract

The utility model provides an LED integrated light source module. The LED integrated light source module comprises a high reflectance mirror plane aluminous substrate with a polishing processed surface, wherein the substrate is provided with an LED chip and a ring bar used for barring the LED chip seal glue, a metal support used for electrical connection is embedded in the ring bar, when the LED chip is fixed on the metal substrate, the metal support and the LED chip are connected by conductive wires to achieve electrical conduction. The LED integrated light source module has high heat conductivity and high light efficiency; is simple to manufacture, low in cost, and economical in manufacture cost as well as manpower cost; and is convenient to install with modularization, and can be directly installed and used by manufacturers, thereby reducing a plurality of processing steps and effectively improving product reliability.

Description

The LED integrated light source module

Technical field

The utility model relates to the LED lighting field, particularly a kind of LED integrated light source module.

Background technology

Led light source also can produce a large amount of heat when producing light, can not shorten the useful life of led light source if these heats are not left.The above power stage led light source of tradition 1W will be finished to be electrically connected with heat dispersion heat sink and be combined into light source module by metal or ceramic base wiring board, but metal base circuit board exists a conductive coefficient to be difficult to surmount the insulating barrier of 3w/mk in order to realize electrical isolation being electrically connected between layer and the metal substrate, conductive coefficient also is difficult to surmount 150w/mk though ceramic substrate does not structurally have insulating barrier, and complex process is expensive.So the metal base circuit board of extensive use at present becomes the maximum bottleneck on the heat dissipation channel between led chip and lamp cooling structure, so light fixture adopt which kind of efficiently radiator structure all can't tackle the problem at its root, finally cause a large amount of heat accumulation of led chip, have a strong impact on the useful life of led light source.

The utility model content

In order to improve the useful life of led light source, the utility model embodiment provides a kind of good heat dissipation, and the high LED integrated light source module of light efficiency.Described technical scheme is as follows:

The utility model proposes a kind of LED integrated light source module, comprise that the surface is through the high reflectance aluminium matter minute surface substrate of polishing processing, described substrate is provided with led chip and is used for the box dam of enclosing led chip packaging plastic, be inlaid with in the described box dam be used to being electrically connected metallic support, when described led chip is fixed on the aluminium matter minute surface substrate, described metallic support is connected by lead with led chip, to realize electrically conducting.

Preferential as technique scheme, described box dam is made of two concentric circles, and the space between two circle constitutes the led chip put area.

Preferential as technique scheme, described substrate is provided with location hole, and described box dam is fixed on the substrate by location hole.

Preferential as technique scheme, described led chip is fixed on the reflecting surface of aluminium matter minute surface substrate.

The beneficial effect that the technical scheme that the utility model embodiment provides is brought is:

One, high thermal conductivity, the present invention adopts the direct solid brilliant packing forms on aluminum substrate of led chip, and the heat that chip light emitting is produced is directly transferred on the aluminum substrate, has that radiating rate is fast, good heat dissipation effect, heat radiation wait advantage fully.

Two, high light efficiency, the used substrate of the present invention adopts the aluminium matter minute surface substrate of high reflectance, can reflect away by the maximum light that led chip is emitted, thereby reaches the effect that promotes light efficiency.

Three, low cost, technology is simple, has saved cost of manufacture and human cost.

Four, easy for installation, this product is modularity, uses producer and can directly install and use, and reduces a large amount of technological processes, can effectively improve product reliability.

Description of drawings

Fig. 1 is the LED integrated light source module structural representation that provides among the utility model embodiment 1;

Fig. 2 is Fig. 1 profile.

Embodiment

For making the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing the utility model execution mode is described in further detail.

Embodiment 1

The utility model proposes a kind of LED integrated light source module, as shown in Figure 1 and Figure 2, comprise aluminium matter minute surface substrate 1, described substrate adopts the minute surface aluminium sheet of high heat conduction, high reflectance, its conductive coefficient is 237 w/mk, reflectivity to have solved the heat dissipation problem of led light source, has also improved the efficient of led light source up to more than 90%.Described substrate 1 is provided with led chip and is used for the box dam 2 of enclosing led chip packaging plastic, be inlaid with in the described box dam 2 be used to being electrically connected metallic support 4, when described led chip was fixed on the substrate 1, described metallic support 4 was connected to realize electrically conducting with led chip by lead.

Described box dam 2 is made of two concentric circles, and the space between two circle constitutes led chip put area 3.

Described substrate 1 is provided with location hole 5, and described box dam 2 is fixed on the substrate 1 by location hole 5.

Described led chip is fixed on the reflecting surface of substrate, and the heat of the luminous generation of its led chip directly conducts by substrate.Solid brilliant 3 location at heat-conducting substrate 1 of led chip, the arrangement of led chip and connected mode are decided according to the specification of product, be used on the box dam 2 realizing that the metallic support 4 of electrically conducting is embedded in box dam 2, as shown in Figure 2, box dam 2 is by the accurate location of location hole 5 realizations with substrate 1, by be connected the electrically conducting of back realization integral body with the embedded metal support 4 usefulness leads on the box dam 2, the heat that chip light emitting produces after the conducting can be directly transferred to the effect that reaches rapid heat radiation on the substrate 1 after the led chip welding was finished.

The utility model adopts the aluminium matter minute surface substrate of high reflectance, and the light that led chip sends is maximized to reflect away by substrate, has reduced greatly because the energy of substrate absorption loss water reaches the lifting light efficiency.And the support 4 that is electrically connected improved, reduce design size, increase light-emitting area, reached light-emitting area big and luminous evenly, can effectively reduce the effect of dazzle.

It should be noted that at last: above embodiment only in order to the technical solution of the utility model to be described, is not intended to limit; Although with reference to previous embodiment the utility model is had been described in detail, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment puts down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the spirit and scope of each embodiment technical scheme of the utility model.

Claims

1. LED integrated light source module, it is characterized in that, comprise that the surface is through the high reflectance aluminium matter minute surface substrate of polishing processing, described substrate is provided with led chip and is used for the box dam of enclosing led chip packaging plastic, be inlaid with in the described box dam be used to being electrically connected metallic support, when described led chip was fixed on the aluminum substrate, described metallic support was connected by lead with led chip, to realize electrically conducting.

2. LED integrated light source module according to claim 1 is characterized in that, described box dam is made of two concentric circles, and the space between two circle constitutes the led chip put area.

3. LED integrated light source module according to claim 1 is characterized in that, described substrate is provided with location hole, and described box dam is fixed on the substrate by location hole.

4. LED integrated light source module according to claim 1 is characterized in that, described led chip is fixed on the reflecting surface of aluminium matter minute surface substrate.