CN202647316U - LED (Light Emitting Diode) illuminating lamp of compound heat radiation substrate - Google Patents
LED (Light Emitting Diode) illuminating lamp of compound heat radiation substrate Download PDFInfo
- Publication number
- CN202647316U CN202647316U CN2012202883833U CN201220288383U CN202647316U CN 202647316 U CN202647316 U CN 202647316U CN 2012202883833 U CN2012202883833 U CN 2012202883833U CN 201220288383 U CN201220288383 U CN 201220288383U CN 202647316 U CN202647316 U CN 202647316U
- Authority
- CN
- China
- Prior art keywords
- heat radiation
- led
- heat
- lamp
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 45
- 230000005855 radiation Effects 0.000 title claims abstract description 31
- 150000001875 compounds Chemical class 0.000 title abstract 4
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 58
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 57
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- 239000010949 copper Substances 0.000 claims abstract description 24
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000002788 crimping Methods 0.000 claims abstract description 3
- 239000002131 composite material Substances 0.000 claims description 27
- 239000011324 bead Substances 0.000 abstract description 8
- 238000005286 illumination Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 238000005253 cladding Methods 0.000 abstract 2
- -1 aluminum compound Chemical class 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 230000000191 radiation effect Effects 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 description 19
- 239000006185 dispersion Substances 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 3
- 239000010974 bronze Substances 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000001149 thermolysis Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model relates to the technical field of semiconductor illumination, in particular to an LED (Light Emitting Diode) illuminating lamp of a compound heat radiation substrate. The LED illuminating lamp comprises a lamp head, a plastic lamp head base, a heat radiation aluminum shell with wings, a compound heat radiation substrate, an LED lamp bead and an acrylic transparent lamp shade, wherein the compound heat radiation substrate comprises an aluminum plate layer connected with the heat radiation aluminum shell with the wings, a copper cladding layer plated on the aluminum plate layer, a heat conduction insulation layer which is in crimping connection with the copper cladding layer, and a PCB (Printed Circuit Board); and the LED lamp bead is welded on the PCB. By using the copper and aluminum compound heat radiation substrate as a substrate welded and fixed with the lamp bead in the LED lamp, the heat radiation of the LED bead during working is effectively accelerated; and compared with the traditional aluminum heat radiation substrate, the LED illuminating lamp provided by the utility model has the advantages of greatly improving heat radiation property and being remarkable in heat conduction and heat radiation effects.
Description
Technical field
The utility model relates to technical field of semiconductor illumination, specifically relates to a kind of LED lighting of composite radiating substrate.
Background technology
LED is directly to be the luminescent device of visible light and radiant energy with electric energy conversion.Because LED does not rely on filament luminous, energy conversion efficiency is very high, can reach in theory the energy consumption of incandescent lamp 10%, compares fluorescent lamp, and LED also can reach 60% energy-saving effect.The special performance of its high energy saving makes LED become one of high-tech product of tool development prospect of 21 century.Compare with the traditional lighting mode, LED has the advantages such as volume is little, safe, pollution-free, non-maintaining, fast response time.Along with the raising of semiconductor production and application technology, will be become the again revolution of lighting system after incandescent lamp, fluorescent lamp by the leading semiconductor lighting of LED.LED also makes major contribution for promotion energy-saving and emission-reduction, environmental protection when causing the illumination revolution.
Along with the memory of Urbanization in China, green, efficient, energy-conservation, long-life LED illumination enters into people's the visual field gradually.At present, the LED lighting engineering reaches its maturity, and the high-power LED light source effect has reached 100lm/W.
LED is a photoelectric device, and except converting electric energy to luminous energy, remaining electric energy is energy transform into heat energy nearly all in its course of work, and the temperature of LED is raise.In great power LED, heat radiation is a large problem.For example, if 1 its photoelectric transformation efficiency of 10W white light LEDs module is 30%, the electric energy energy transform into heat energy that 7W is then arranged, if do not add cooling measure, then the device core temperature of great power LED can rise rapidly, when its junction temperature (TJ) rises above maximum allowable temperature (generally being 150 ℃), great power LED can damage because of overheated.Therefore in the LED Lighting Design, heat radiation is that the LED lamp needs key problems-solving.Because the temperature capacity of LED own is poor, so effectively being dispersed in the air, goes the heat that produces in the time of LED must being worked, guarantee chip operation under the temperature of safety, ability is real like this embodies long-life advantage.
Scrutinizing the heat dissipation path of high-power LED lighting fixture, is from LED lamp pearl-heat-radiating substrate-radiating shell-surrounding air.LED lamp pearl is heat point source, and the heat that its work produces at first will pass to radiating shell by heat-radiating substrate and be dispersed in the air.The quality of therefore heat-radiating substrate heat conduction, heat dispersion directly has influence on job stability and the service life of LED lighting.The structure of heat dissipation substrate of present LED lighting is three layers: ground floor is line layer, is equivalent to the copper-clad plate of common PCB; The second layer is insulating barrier, and insulating barrier is one deck low thermal resistance heat-conducting insulation material; The 3rd layer is radiating base layer, and radiating base layer all adopts aluminium base.The thermal conductivity factor of aluminium is high, and good heat dissipation can derive internal heat effectively.If but heat conduction, the heat dispersion of contrast aluminium and copper material can find that the thermal conductivity factor of copper is 397W/m.k, the thermal conductivity factor of aluminium is 201 W/m.k; And the specific heat capacity of aluminium is 0.88 * 103J/(kg. ℃), the specific heat capacity of copper is that the specific heat capacity of 0 bronze medal is 0.39 * 103J/(kg. ℃).We know that thermal conductivity factor is larger, and heat conductivility is better; The larger heat dispersion of specific heat capacity is better.The heat conductivility that this shows copper is more faster than aluminium, but heat dispersion does not have aluminium good, and the radiating rate of aluminium is fast, and heat conductivility is not as copper.
Summary of the invention
The purpose of this utility model is different heat conduction, the heat dissipation characteristics according to the aluminum bronze metal material, overlay coating Copper Foil at original aluminum, form aluminum bronze composite radiating substrate, the advantages of the quick heat radiating of the quick conductive of copper and aluminium is got up, greatly improve the LED lighting of the composite radiating substrate of LED lighting radiating effect.
The LED lighting of a kind of composite radiating substrate of the utility model is achieved by following technical proposals: a kind of LED lighting of composite radiating substrate comprises lamp holder, plastic lantern headstock, band wing heat radiation aluminum hull, composite radiating substrate, LED lamp pearl, acrylic Transparent lamp shade, described composite radiating substrate comprise with the aluminum layer that is bolted with wing heat radiation aluminum hull, be plated on the aluminum layer cover the copper layer, with cover heat conductive insulating layer and the PCB wiring board that the copper lamination connects in succession; The bead weld of described LED lamp is connected on the PCB wiring board.
The LED lighting of a kind of composite radiating substrate of the utility model has following beneficial effect compared with prior art: LED lamp pearl is heat point source, and this heat comes as not conducting rapidly, and the speed of then distributing will be affected.As one after another drop of water in the plane, if do not spread out rapidly, the time that its evaporation needs certainly will will be grown.The effect of composite radiating substrate of the present utility model is exactly the whole aluminium surface that the heat that the LED heat point source produces at first is transmitted to rapidly heat-radiating substrate by Copper Foil, then the thermolysis by aluminium sheet and aluminium casing with the heat Quick diffusing in surrounding air, reach the purpose that improves the LED radiating effect, make operating efficiency and the stability of LED lighting be guaranteed that more prolong service life.
LED lamp of the present utility model bead weld is connected on the PCB wiring board of composite radiating substrate, the heat point source that produces during LED work, pass to covering on the Copper Foil of heat-radiating substrate by the heat conductive insulating layer, because the excellent heat conducting performance of copper, rapidly the heat of heat point source is transmitted to the surface of aluminum plate of heat-radiating substrate, the good heat dispersion of aluminium sheet can be fast with the dissipation of heat on the surface heat radiation aluminum hull inner chamber to light fixture band wing, and through the heat radiation aluminum hull with dissipation of heat in surrounding air.The aluminum layer of composite radiating substrate with link into an integrated entity the heat radiation of the LED light fixture of being more convenient for the heat radiation aluminum hull of wing.
The utility model copper, aluminium composite radiating substrate organically combine copper aluminium, the heat conduction that has not only replenished aluminium is not as good as copper, also remedy the heat radiation of copper not as the problem of aluminium, given full play to the separately advantage of two kinds of metal materials, thereby reached the rapidly effect of heat transfer, quick heat radiating.
Heat radiation when the utility model uses copper, aluminium composite radiating substrate to connect fixing substrate and effectively accelerated the work of LED lamp pearl as lamp bead weld in the LED light fixture, compare with present aluminum cooling substrates, the heat dispersion of the utility model LED light fixture greatly improves, the heat conduction and heat radiation successful.
Description of drawings
The LED lighting of a kind of composite radiating substrate of the utility model has following accompanying drawing:
Fig. 1 is the LED lighting lamp structure schematic diagram of a kind of composite radiating substrate of the utility model;
Fig. 2 relates to a kind of local structure for amplifying schematic diagram of LED lighting of composite radiating substrate.
Wherein: 1, lamp holder; 2, plastic lantern headstock; 3, with the heat radiation aluminum hull of wing; 4, composite radiating substrate; 5, LED lamp pearl; 6, acrylic Transparent lamp shade; 7, PCB wiring board; 8, heat conductive insulating layer; 9, cover the copper layer; 10, aluminum layer.
The specific embodiment
Be further described below in conjunction with the LED lighting technical scheme of drawings and Examples to a kind of composite radiating substrate of the utility model.
Such as Fig. 1-shown in Figure 2, the LED lighting of a kind of composite radiating substrate of the utility model comprises lamp holder 1, plastic lantern headstock 2, band wing heat radiation aluminum hull 3, composite radiating substrate 4, LED lamp pearl 5, acrylic Transparent lamp shade 6, described composite radiating substrate 4 comprise with the aluminum layer 10 that is bolted with wing heat radiation aluminum hull 3, be plated on the aluminum layer 10 cover copper layer 9, with the heat conductive insulating layer 8 and the PCB wiring board 7 that cover 9 crimping of copper layer and be connected; Described LED lamp pearl 5 is welded on the PCB wiring board 7.
Structure of heat dissipation substrate of the present utility model is four layers:
Ground floor is line layer 7, is equivalent to the copper-clad plate of common PCB, adopts the circuit common board manufacturing method to make;
The second layer is insulating barrier 8, and insulating barrier is one deck low thermal resistance heat-conducting insulation material;
The 3rd layer for covering copper layer 9, the Copper Foil that namely plates in surface of aluminum plate;
The 4th layer is aluminum layer 10, is welded to connect common composition heat dissipating layer with copper foil layer, and aluminum layer 10 is bolted with heat radiation aluminum hull 3 with wing.
The structure of the utility model LED lighting such as Fig. 1-shown in Figure 2, wherein the bead weld of LED lamp is connected on the PCB wiring board 7 of composite radiating substrate, the heat point source that produces during LED work passes to covering on the Copper Foil 9 of heat-radiating substrate by heat conductive insulating layer 8, because the excellent heat conducting performance of copper, rapidly the heat of heat point source is transmitted to aluminum layer 10 surfaces of whole heat-radiating substrate, the good heat dispersion of aluminium sheet can be fast with the dissipation of heat on the aluminum layer 10 surfaces inner chamber to the heat radiation aluminum hull 3 of light fixture band wing, and through heat radiation aluminum hull 3 with dissipation of heat in surrounding air.The aluminum layer 10 of composite radiating substrate links into an integrated entity the heat radiation of the LED light fixture of being more convenient for the heat radiation aluminum hull 3 with wing.
Claims (1)
1. the LED lighting of a composite radiating substrate, comprise lamp holder (1), plastic lantern headstock (2), band wing heat radiation aluminum hull (3), composite radiating substrate (4), LED lamp pearl (5), acrylic Transparent lamp shade (6), it is characterized in that: described composite radiating substrate (4) comprises the aluminum layer (10) that is bolted with band wing heat radiation aluminum hull (3), be plated on the aluminum layer (10) cover copper layer (9), with the heat conductive insulating layer (8) and the PCB wiring board (7) that cover copper layer (9) crimping and be connected; Described LED lamp pearl (5) is welded on the PCB wiring board (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202883833U CN202647316U (en) | 2012-06-19 | 2012-06-19 | LED (Light Emitting Diode) illuminating lamp of compound heat radiation substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202883833U CN202647316U (en) | 2012-06-19 | 2012-06-19 | LED (Light Emitting Diode) illuminating lamp of compound heat radiation substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202647316U true CN202647316U (en) | 2013-01-02 |
Family
ID=47416420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012202883833U Expired - Fee Related CN202647316U (en) | 2012-06-19 | 2012-06-19 | LED (Light Emitting Diode) illuminating lamp of compound heat radiation substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202647316U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103090231A (en) * | 2013-01-22 | 2013-05-08 | 钦州盛和电子科技有限公司 | High-power light-emitting diode (LED) module and manufacturing method thereof |
-
2012
- 2012-06-19 CN CN2012202883833U patent/CN202647316U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103090231A (en) * | 2013-01-22 | 2013-05-08 | 钦州盛和电子科技有限公司 | High-power light-emitting diode (LED) module and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201293238Y (en) | Outdoor lighting equipment with active heat radiating device and outdoor lighting system thereof | |
| CN201289055Y (en) | High power LED lamp heat radiator | |
| CN201232984Y (en) | Radiating module for LED lamp | |
| CN202501224U (en) | Ultraviolet light emitting diode (UV LED) light source | |
| CN201412808Y (en) | Radiating structure of LED lamp | |
| CN201425286Y (en) | Heat dissipation structure of LED lamp | |
| CN202647316U (en) | LED (Light Emitting Diode) illuminating lamp of compound heat radiation substrate | |
| CN203375406U (en) | Heat dissipation device for LED lamp and LED light source module | |
| CN202432487U (en) | High-power integrated LED (light-emitting diode) mining lamp with efficient heat dissipation function | |
| CN202581022U (en) | High-power LED (Light-emitting Diode) ceiling light | |
| CN201983233U (en) | Heat dissipation and heat insulation device of LED (light-emitting diode) lamp | |
| CN201866649U (en) | LED (light-emitting diode) industrial and mining lamp with matrix arrangement chips | |
| CN203533494U (en) | Heat dissipation system of high-power LED lamp | |
| CN202561588U (en) | Energy-saving high-power light-emitting diode (LED) street lamp | |
| CN202791891U (en) | Groove type radiator for LED lamp | |
| CN201475738U (en) | High-power LED lamp | |
| CN201779625U (en) | High-power LED heat radiating device | |
| CN204592990U (en) | For the multicore array integrated morphology of LED light source | |
| CN201589145U (en) | LED street lamp cap | |
| CN202024127U (en) | Combined type light-emitting diode (LED) module | |
| CN201858559U (en) | Miniwatt LED energy saving lamp | |
| CN202613278U (en) | High-power light-emitting diode (LED) car lamp | |
| CN201057381Y (en) | High power semiconductor lighting lamp | |
| CN202432369U (en) | Improved large-power integrated light emitting diode (LED) streetlamp with heat radiation structure | |
| CN202065789U (en) | Light-emitting diode (LED) factory workshop lighting lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20131202 Address after: 810007 Pioneer Park, Xining Economic Development Zone, Xining, Qinghai Patentee after: Xining Gesang Solar Energy Co., Ltd. Patentee after: Nimajiangcai Patentee after: Chen Hao Address before: 810006 No. 141, Qilian Road, Xining, Qinghai Patentee before: Chen Hao Patentee before: Nimajiangcai |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130102 Termination date: 20150619 |
|
| EXPY | Termination of patent right or utility model |