CN201289055Y - High power LED lamp heat radiator - Google Patents
High power LED lamp heat radiator Download PDFInfo
- Publication number
- CN201289055Y CN201289055Y CNU2008202039400U CN200820203940U CN201289055Y CN 201289055 Y CN201289055 Y CN 201289055Y CN U2008202039400 U CNU2008202039400 U CN U2008202039400U CN 200820203940 U CN200820203940 U CN 200820203940U CN 201289055 Y CN201289055 Y CN 201289055Y
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- Prior art keywords
- radiator
- heat sink
- power led
- heat radiation
- led lamp
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- Expired - Fee Related
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Abstract
The utility model relates to a high-power LED lamp radiator, including a radiator basal body for installing a light emitting chip and a radiating fin installed on the radiator basal body. The radiating fin is arranged in such a way of radiating to the outside of the radiator basal body using the radiator basal body as centre so as to form a shape of sunflower and is arranged around the outside periphery of the radiator basal body. The radiating fins are arranged on the radiator basal body in equal-arc angle. The high-power LED lamp radiator of the utility model has simple structure, which effectively enlarges the radiating area, and which is good for improving the radiating speed and prolonging the service life.
Description
Technical field
The utility model relates to a kind of radiator of LED lamp, particularly a kind of high-power LED (Light-Emitting Diode) lamp radiator that is applied to.
Background technology
In the LED lamp of the prior art, caloric value is bigger during because of its work, in order to keep the job stability of LED lamp, generally is provided with radiator on the LRD lamp.The miniaturization of existing especially LED lamp forward, high-power and high-luminance direction develop, and its caloric value is also just bigger, and be also just more and more higher to the heat dissipation equipment requirement of LED lamp.The existing radiator that is used for the LED lamp, generally all be to adopt the electronic type radiator, electric fan is installed on luminescence chip, the general only suitable low power LED lamp of this electronic type radiator fan, and the radiator of working as this structure is used for outdoor use, suffering all kinds of exposing to the sun and rain, although add protective cover thereon, also is easy damage; At this situation, stacked heat radiation fin structure has appearred in the radiator that improves in the technology book, it is laminated into the lamella radiator with the die casting aluminium sheet, but this die casting aluminium material is relatively more loose and density unevenness is even, its heat-conducting effect is undesirable, and its radiating fin can only be accomplished more than 2 millimeters, the die casting aluminium that causes unit volume, area of dissipation is little, thereby make radiating rate slow, thereby can't reach the temperature requirements that makes high-powered LED lamp maintain operate as normal, overheated operating temperature not only causes the waste of the energy, and cause the physical characteristic in the high-powered LED lamp to change easily, and make high-powered LED lamp can't reach predetermined brightness, influence its service life and usefulness.So the radiator of these two kinds of structures is to meet the demands for the high-powered LED lamp more than the 30W of centralized encapsulation, can only be used for ornament lamp or indicator lamp, can't be suitable for the more heat radiation requirement of high-powered LED lamp.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, and a kind of high-power LED (Light-Emitting Diode) lamp radiator simple in structure, that effectively improve radiating rate and increase the service life is provided.
Goal of the invention of the present utility model is achieved in that a kind of high-power LED (Light-Emitting Diode) lamp radiator, comprise the heat sink and the heat radiation wing of being located on the heat sink that are used to install luminescence chip, heat sink and the heat radiation wing structure that is formed in one, it is characterized in that: described heat radiation wing is that the outside of middle mind-set heat sink is radial setting with heat sink, forms the shape of heronsbill.
Described heat radiation wing is around the outer circumference setting of heat sink.
Described heat radiation wing each other with etc. arc angle be arranged on the heat sink.
Described heat radiation wing is the fin that extruded aluminum is made.
The thickness of described heat radiation wing is below 2 millimeters or 2 millimeters.
The utility model improves the high-power LED (Light-Emitting Diode) lamp radiator of prior art, the heat radiation wing of being located on the heat sink is that the outside of middle mind-set heat sink is radial setting with heat sink, form the shape of heronsbill, and the heat radiation wing effectively enlarges the area of radiator around the outer circumference setting of heat sink; Simultaneously, this heat radiation wing is the fin that is processed by extruded aluminum, compare with die casting aluminium radiator, the thickness of the heat radiation wing of the utility model high-power LED (Light-Emitting Diode) lamp radiator is below 2 millimeters or 2 millimeters, and this heat radiation wing each other with etc. arc angle be arranged on the heat sink, when being the luminescence chip running, the heat of its generation is absorbed by heat sink rapidly, and pass to the heat radiation wing fast, reach the effect of quick heat radiating, guarantee that high-powered LED lamp maintains the demand of normal working temperature, thereby make the LED lamp reach predetermined brightness, increase the service life greatly and usefulness.
Description of drawings
Fig. 1 is the structural representation of heat sink in the utility model.
Fig. 2 is the structural representation of the utility model most preferred embodiment.
Fig. 3 is the internal anatomy of the utility model structural representation.
The specific embodiment
The utility model will be further described below in conjunction with accompanying drawing.
To shown in Figure 2, high-power LED (Light-Emitting Diode) lamp radiator of the present utility model comprises being used to that the heat sink 1 of luminescence chip 3 is installed and being located at heat radiation wing 2 on the heat sink 1 according to Fig. 1, heat sink 1 and heat radiation wing 2 structure that is formed in one.The heat radiation wing of wherein being located on the heat sink 12 is that the center is radial setting with heat sink 1, form the shape of heronsbill, heat radiation wing 2 is around the outer circumference setting of heat sink 1, this heat radiation wing 2 each other with etc. arc angle be arranged on the heat sink 1, and this heat radiation wing 2 all is the aluminium that adopts squash type machine-shaping, thermal conductivity factor height because of the thermal conductivity ratio die casting aluminium of extruded aluminum, so more can strengthen the radiating effect of radiator, and heat spreader structures simply, can effectively increase the service life thus; Simultaneously, the thickness of heat radiation wing 2 is below 2 millimeters or 2 millimeters, specifically can be made into 2 millimeters, 1.8 millimeters, 1.5 millimeters, 1.2 millimeters, 1 millimeter, 0.8 millimeter or 0.7 millimeter equal thickness, helps to enlarge area of dissipation.
According to shown in Figure 3, the centre of heat sink 1 is the holder 4 suitable with luminescence chip 3, and luminescence chip 3 is installed on the holder 4, and the contact-making surface between luminescence chip 3 and the holder 4 scribbles heat conductive silica gel.This holder 4 is provided with locating hole, and luminescence chip 3 firmly on holder 4, makes luminescence chip 3 closely be connected with heat sink 1 by screw.Therefore, when high-powered LED lamp moved, the heat that luminescence chip 3 produces passed on the holder 4 and is absorbed by heat sink 1 rapidly, and passed to heat radiation wing 2, reached the purpose of Rapid Thermal conduction and heat radiation.These luminescence chip 3 tops are provided with optical lens 5, are provided with sealing ring 6 therebetween.These optical lens 5 tops are provided with adaptive with it gland 7, and gland 7 is pressed in optical lens 5 tops, and this gland 7 is provided with installing hole, and heat sink 1 is provided with installing hole corresponding with it, by bolt gland 7 is fixed on the heat sink 1.High-power LED (Light-Emitting Diode) lamp radiator of the present utility model, by using optical lens 5 effectively the light source of concentrating to be amplified, thereby satisfy the needs of illumination, and heat sink 1 is handled with the surperficial optional majority kind of heat radiation wing 2, more corrosion-resistant as making it after the oxidation processes, also prolong the service life of high-powered LED lamp, the color of oxidation can freely be selected, thereby increases the attractive in appearance of high-powered LED lamp.
Claims (5)
1, a kind of high-power LED (Light-Emitting Diode) lamp radiator, comprise the heat sink (1) that is used to install luminescence chip (3) and be located at heat radiation wing (2) on the heat sink (1), heat sink (1) and heat radiation wing (2) structure that is formed in one, it is characterized in that: described heat radiation wing (2) for the outside of middle mind-set heat sink (1) is radial setting, forms the shape of heronsbill with heat sink (1).
2, high-power LED (Light-Emitting Diode) lamp radiator according to claim 1 is characterized in that: described heat radiation wing (2) is around the outer circumference setting of heat sink (1).
3, high-power LED (Light-Emitting Diode) lamp radiator according to claim 2 is characterized in that: described heat radiation wing (2) each other with etc. arc angle be arranged on the heat sink (1).
4, high-power LED (Light-Emitting Diode) lamp radiator according to claim 3 is characterized in that: the fin that described heat radiation wing (2) is made for extruded aluminum.
5, high-power LED (Light-Emitting Diode) lamp radiator according to claim 4 is characterized in that: the thickness of described heat radiation wing (2) is below 2 millimeters or 2 millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202039400U CN201289055Y (en) | 2008-11-19 | 2008-11-19 | High power LED lamp heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202039400U CN201289055Y (en) | 2008-11-19 | 2008-11-19 | High power LED lamp heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201289055Y true CN201289055Y (en) | 2009-08-12 |
Family
ID=40980738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008202039400U Expired - Fee Related CN201289055Y (en) | 2008-11-19 | 2008-11-19 | High power LED lamp heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201289055Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102080794A (en) * | 2011-03-03 | 2011-06-01 | 格瑞电子（厦门）有限公司 | LED (light emitting diode) radiating illumination device |
| CN102235650A (en) * | 2010-04-30 | 2011-11-09 | 杨继远 | High-power light-emitting diode (LED) radiator and using method thereof |
| WO2011140720A1 (en) * | 2010-05-14 | 2011-11-17 | Qin Biao | Heat dissipation-optimized led lamp and light fitting thereof |
| CN103542272A (en) * | 2012-07-13 | 2014-01-29 | 欧司朗股份有限公司 | Lighting device |
| CN103582282A (en) * | 2012-07-25 | 2014-02-12 | 欧司朗股份有限公司 | Circuit board and electronic module and light-emitting module comprising same |
| CN108343850A (en) * | 2010-04-02 | 2018-07-31 | Ge照明解决方案有限责任公司 | The LED light that lightweight is heat sink and uses the lightweight heat sink |
-
2008
- 2008-11-19 CN CNU2008202039400U patent/CN201289055Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108343850A (en) * | 2010-04-02 | 2018-07-31 | Ge照明解决方案有限责任公司 | The LED light that lightweight is heat sink and uses the lightweight heat sink |
| CN102235650A (en) * | 2010-04-30 | 2011-11-09 | 杨继远 | High-power light-emitting diode (LED) radiator and using method thereof |
| WO2011140720A1 (en) * | 2010-05-14 | 2011-11-17 | Qin Biao | Heat dissipation-optimized led lamp and light fitting thereof |
| CN102080794A (en) * | 2011-03-03 | 2011-06-01 | 格瑞电子（厦门）有限公司 | LED (light emitting diode) radiating illumination device |
| CN102080794B (en) * | 2011-03-03 | 2014-07-02 | 格瑞电子（厦门）有限公司 | LED (light emitting diode) radiating illumination device |
| CN103542272A (en) * | 2012-07-13 | 2014-01-29 | 欧司朗股份有限公司 | Lighting device |
| CN103582282A (en) * | 2012-07-25 | 2014-02-12 | 欧司朗股份有限公司 | Circuit board and electronic module and light-emitting module comprising same |
| CN103582282B (en) * | 2012-07-25 | 2018-05-18 | 欧司朗股份有限公司 | Circuit board, electronic module and light emitting module including the circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090812 Termination date: 20121119 |