CN203309835U - LED heat-insulating radiator with semiconductor refrigerating chip - Google Patents

LED heat-insulating radiator with semiconductor refrigerating chip Download PDF

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Publication number
CN203309835U
CN203309835U CN2013200399099U CN201320039909U CN203309835U CN 203309835 U CN203309835 U CN 203309835U CN 2013200399099 U CN2013200399099 U CN 2013200399099U CN 201320039909 U CN201320039909 U CN 201320039909U CN 203309835 U CN203309835 U CN 203309835U
Authority
CN
China
Prior art keywords
semiconductor refrigerating
refrigerating chip
heat
radiator
semiconductor chilling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2013200399099U
Other languages
Chinese (zh)
Inventor
姚善良
陈金国
张秀志
王蒙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HUBEI CHUJI SCIENCE & TECHNOLOGY Co Ltd
Original Assignee
HUBEI CHUJI SCIENCE & TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HUBEI CHUJI SCIENCE & TECHNOLOGY Co Ltd filed Critical HUBEI CHUJI SCIENCE & TECHNOLOGY Co Ltd
Priority to CN2013200399099U priority Critical patent/CN203309835U/en
Application granted granted Critical
Publication of CN203309835U publication Critical patent/CN203309835U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to an LED heat-insulating radiator with a semiconductor refrigerating chip. The LED heat-insulating radiator comprises the semiconductor refrigerating chip, a driving source and cooling fins. The semiconductor refrigerating chip is fixedly connected with a heat dissipation substrate. The semiconductor refrigerating chip is cylindrical, the inner side of the semiconductor refrigerating chip is a refrigerating surface, and the outer side face of semiconductor refrigerating chip is connected with the cooling fins. The LED heat-insulating radiator with the semiconductor refrigerating chip has the advantages of being simple in structure, low in cost and good in effect.

Description

With semiconductor chilling plate and have the LED radiator of heat insulating function
Technical field
The utility model belongs to the illumination application, relates to a kind of with semiconductor chilling plate and have the LED radiator of heat insulating function.
Background technology
The LED light fixture is compared with conventional lamp, have many-sided advantages such as power consumption is little, life-span length, environmental protection, the power consumption of the LED light fixture of equal brightness only has 10% of incandescent lamp, the LED lamp life reaches 40,000 hours, be 50 times of service life of incandescent lamp, these advantages make LED light fixture occupation rate of market more and more higher.But LED light fixture itself is the Shortcomings part also, be mainly manifested in that caloric value is high, the easy burn-out LED chip.Mainly because the LED light fixture is a photoelectric device, only have in the course of the work the electric energy of less than 40% to be converted into luminous energy, remaining electric energy is energy transform into heat energy all, LED chip temperature is at work constantly raise, if heat spreads out of not in time, while surpassing 65 ℃, will affect the service life of LED light fixture, if temperature surpasses 90 ℃, even also have the danger of burning.There are the deficiencies such as poor radiation in the design of existing LED lamp.Also there is the labyrinth of employing to carry out the LED lamp of radiating and cooling, but, because manufacturing cost is too high, be not suitable for applying.
At present, the heat radiation of high-brightness LED lamp on market, adopts sheet metal heat radiation more, exists that complex structure, effect are general, the high in cost of production problem.
Summary of the invention
In order to solve the problem of existence, the purpose of this utility model is to provide a kind of radiator structure of LED with semiconductor chilling plate, makes that its radiator structure is simple, cost is low, effective.
The technical scheme that its technical problem that solves the utility model adopts is:
With semiconductor chilling plate and have the LED radiator of heat insulating function, comprise semiconductor chilling plate, driving power and fin, described semiconductor chilling plate is fixedly connected with heat-radiating substrate, is cylindrical shape, and inboard is chill surface, and its lateral surface is connected with fin.
During use, the heat of the luminous generation of LED lamp passes to fin by radiator aluminium base plate, and driving power work produces heat, passes to fin by semiconductor chilling plate, and fin outwards distributes heat again.During semiconductor chilling plate work, interior cold outer heat, guarantee that in the driving power space, temperature is suitable, and stop the heat of the luminous generation of LED lamp to be delivered to driving power.
The beneficial effects of the utility model are, radiator structure is simple, cost is low, effective.
The accompanying drawing explanation
Fig. 1 is the utility model cross-sectional view;
Fig. 2 is the utility model top view.
In figure: 1-light fixture fixed mount, the 2-semiconductor chilling plate, the 3-driving power, 4-driving power support, 5-first connects wire, the 6-LED lamp, the 7-lampshade, the 8-radiator aluminium base plate, 9-second connects wire, 21-fin.
The specific embodiment
The utility model is described in more detail below in conjunction with accompanying drawing:
As shown in Figure 1 and Figure 2, the LED radiator structure of the utility model band semiconductor chilling plate, comprise semiconductor chilling plate 2, driving power 3 and fin 21, described semiconductor chilling plate 2 with above radiator aluminium base plate 8, be fixedly connected with, for cylindrical shape, inboard is chill surface, its lateral surface is fixedly connected with metal fin 21, there is driving power 3 inside, driving power 3 is fixed by a plurality of driving power supports 4, and described driving power 3 connects wire 5, second by first and connects wire 9 respectively to LED lamp 6 and semiconductor chilling plate 2 power supplies.
During use, the heat of LED lamp 6 luminous generations passes to fin 21 by radiator aluminium base plate 8, and driving power 3 work produce heat, pass to fin 21 by semiconductor chilling plate 2, and fin 21 outwards distributes heat again.

Claims (1)

1. with semiconductor chilling plate and have the LED radiator of heat insulating function, comprise semiconductor chilling plate, driving power and fin, described semiconductor chilling plate is fixedly connected with heat-radiating substrate, is cylindrical shape, and inboard is chill surface, and its lateral surface is connected with fin.
CN2013200399099U 2013-01-24 2013-01-24 LED heat-insulating radiator with semiconductor refrigerating chip Expired - Fee Related CN203309835U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013200399099U CN203309835U (en) 2013-01-24 2013-01-24 LED heat-insulating radiator with semiconductor refrigerating chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013200399099U CN203309835U (en) 2013-01-24 2013-01-24 LED heat-insulating radiator with semiconductor refrigerating chip

Publications (1)

Publication Number Publication Date
CN203309835U true CN203309835U (en) 2013-11-27

Family

ID=49616043

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013200399099U Expired - Fee Related CN203309835U (en) 2013-01-24 2013-01-24 LED heat-insulating radiator with semiconductor refrigerating chip

Country Status (1)

Country Link
CN (1) CN203309835U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104728805A (en) * 2013-12-19 2015-06-24 西安恒飞电子科技有限公司 Power supply device for driving LED lamp
CN104731029A (en) * 2013-12-20 2015-06-24 西安恒飞电子科技有限公司 Power source capable of being controlled remotely

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104728805A (en) * 2013-12-19 2015-06-24 西安恒飞电子科技有限公司 Power supply device for driving LED lamp
CN104731029A (en) * 2013-12-20 2015-06-24 西安恒飞电子科技有限公司 Power source capable of being controlled remotely

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
EXPY Termination of patent right or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20131127

Termination date: 20150124