CN202469988U - Wing plate type three-dimensional light emitting diode (LED) heat radiator - Google Patents
Wing plate type three-dimensional light emitting diode (LED) heat radiator Download PDFInfo
- Publication number
- CN202469988U CN202469988U CN2012200773970U CN201220077397U CN202469988U CN 202469988 U CN202469988 U CN 202469988U CN 2012200773970 U CN2012200773970 U CN 2012200773970U CN 201220077397 U CN201220077397 U CN 201220077397U CN 202469988 U CN202469988 U CN 202469988U
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- China
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- heat
- led
- plate type
- heat radiation
- radiator
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- 239000003292 glue Substances 0.000 claims description 4
- 230000002035 prolonged Effects 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- -1 silicon lipid Chemical class 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910000553 6063 aluminium alloy Inorganic materials 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000414 obstructive Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000002588 toxic Effects 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
Abstract
The utility model relates to a wing plate type three-dimensional light emitting diode (LED) heat radiator. According to the heat radiator structure for the conventional high-power LED lamp, a chip is arranged below the heat radiator; and effective heat radiation of the heat radiator depends on the surface area of the heat radiator. According to the wing plate type three-dimensional LED heat radiator, two layers of thin plate type heat radiation sheets are provided; a thin heat conduction sheet is clamped between the two heat radiation sheets; an integrated LED chip is embedded on one layer of heat radiation sheet; folded sheets are arranged at two ends of each heat radiation sheet; protruded curved surfaces are formed on the folded sheets; the folded sheets and the curved surfaces on the folded sheets form a wing-shaped double-layer heat radiation structure; strip-type slots are formed on the folded sheets and the curved surfaces at two ends of each heat radiation sheet; and rims of two ends of the heat conduction sheet are sealed by sealing heat conduction rubber. By adopting the three-dimensional wing plate type heat radiation sheet structure, the wing plate type three-dimensional LED heat radiator has the advantage that the heat radiation area of the LED chip is enlarged; the heat radiation efficiency is improved due to the heat conduction sheet; and the service life of an LED lamp is effectively prolonged.
Description
Technical field
The utility model belongs to the LED technical field of lamps, is specifically related to a kind of flange plate type 3 D stereo LED radiator.
Background technology
Light-emitting diodes degree pipe LED is as new generation of green environment protection solid lighting source, has a series of advantages such as few, photochromic pure, all solid state, the light weight of power consumption, volume are little, environmental protection.Have portion of energy when LED is luminous and be converted into heat, the led chip temperature is raise.And temperature to the influence of the service behaviour of led chip greatly, and high temperature can cause the photon of chip outgoing to reduce, and the colour temperature quality descends, and it is aging to accelerate chip, shortens serious consequences such as device lifetime.Therefore for guaranteeing the LED operate as normal, must its heat that comes out be distributed timely.At present the great power LED chip application is more and more, and great power LED can only be converted into luminous energy with about 10% ~ 15% input power according to data, and all the other 85% ~ 90% are converted into heat energy.The high-power LED light source is divided into two types again, and a kind of is array distributed great power LED light source, and it is several LED to be carried out array distribution arrange.Another kind is an integrated form great power LED light source, will count that LEDs is integrated to be packaged together.This LED light fixture of two types is different because of LED chip layout mode, distribution curve flux, take up room and dispel the heat above different.Comparatively speaking, it is light that the light fitting quality that integrated form great power LED light source is processed is wanted, and materials will lack aspect encapsulating material, and the requirement that also can reach street lighting is compared with array distributed great power LED light source in the luminous intensity distribution aspect, is later street lamp development trend.But because comparing array, heat radiation wants difficult, so the lost of life, become an obstruction set accepted way of doing sth high-power LED light source development key difficult problem.
It is the mode that chip is installed in the finned radiator below that traditional high-power LED lamp is the top with heat spreader structures, and its efficiently radiates heat depends on radiator surface area basically.The heat of led chip mainly relies on the base plate of radiator conduction, and is that LED installs the temperature of the temperature of upper area far above the radiator edge forever, because its heat must progressively be conducted to the radiator edge by led chip installation surface zone.And the main flow radiator all adopts 6063 aluminium, and its thermal conductivity generally is no more than 200K/W.Simultaneously, in traditional handicraft, all be coated with thermal conductive silicon lipid material in the middle of radiator and the led chip, its thermal conductivity is basically between several K/W and tens K/W.Like this, just be difficult to make the heat of led chip to be able to more effectively conduct more through radiator.
Summary of the invention
The purpose of the utility model provides and a kind ofly can effectively improve the heat dissipation capacity of led chip, the flange plate type 3 D stereo LED radiator that prolongs its service life.
The technical scheme that the utility model adopted is:
A kind of flange plate type 3 D stereo LED radiator is provided with integrated LED chip, it is characterized in that:
Described radiator is provided with the fin of two-layer plate-shaped, and two fin therebetween are established lamelliform conducting strip;
Described integrated LED chip is embedded in wherein on one deck fin;
The two ends of described fin are provided with turns up sheet, turns up sheet and is provided with the curved surface of heaving, and turns up sheet and forms wing double-deck radiator structure with the curved surface on it.
Turning up of described fin two ends is provided with the bar shaped fluting on sheet and the curved surface.
Described conducting strip edges at two ends is sealed heat-conducting glue and is sealed.
The utlity model has following advantage:
1, has higher radiating efficiency.Can the heat that led chip or large power semiconductor device produced be distributed fast, effectively reduce the semiconductor devices junction temperature, prolong the semiconductor devices life-span.
2, save material, reduce cost.Compare traditional heat-dissipating device structure, it is lighter that efficient 3 D stereo heat spreader structures can be done, and saves a large amount of non-ferrous metals, and effectively reduce the radiator cost, has good economic benefits and social benefit.
3, the long-life.Traditional heat-dissipating device and chip contact-making surface adopt materials such as silicone grease mostly, have certain service life.And efficient 3 D stereo radiator adopts high conducting strip to guarantee that radiator contacts with the effective of chip, its stable performance, and corrosion-resistant resistance to oxidation, the theoretical life-span is an endless.
4, environmental protection.Radiator all material 100% is recyclable, does not contain Toxic matter, and is free from environmental pollution.
Description of drawings
Fig. 1 is the utility model structure chart.
Among the figure, the 1-fin, the 2-conducting strip, 3-seals heat-conducting glue, 4-integrated LED chip.
The specific embodiment
Below in conjunction with the specific embodiment the utility model is carried out detailed explanation.
The described a kind of flange plate type 3 D stereo LED radiator of the utility model is applicable to that single integrated chip is not more than the LED light fixture of 40W.Radiator is provided with 1, two fin 1 therebetween of fin of two-layer plate-shaped and establishes lamelliform conducting strip 2.Integrated LED chip 4 is embedded in wherein on one deck fin 1.The two ends of fin 1 are provided with turns up sheet, turns up sheet and is provided with the curved surface of heaving, and turns up sheet and forms wing double-deck radiator structure with the curved surface on it.Turning up of fin 1 two ends is provided with the bar shaped fluting on sheet and the curved surface.Conducting strip 2 edges at two ends are sealed heat-conducting glue 3 and are sealed.Wing laminal fin 1 has bigger area of dissipation; Turning up the bar shaped that all is provided with on sheet and the curved surface slots to its booster action that dispels the heat; All fin 1 structure all adopts 1060 pure aluminum materials; 6063 traditional aluminium of its thermal conductivity ratio exceed more than 10%, can be more fast the heat of led chip be conducted.
Claims (3)
1. a flange plate type 3 D stereo LED radiator is provided with integrated LED chip (4), it is characterized in that:
Described radiator is provided with the fin (1) of two-layer plate-shaped, and two fin (1) therebetween is established lamelliform conducting strip (2);
Described integrated LED chip (4) is embedded in wherein on one deck fin (1);
The two ends of described fin (1) are provided with turns up sheet, turns up sheet and is provided with the curved surface of heaving, and turns up sheet and forms wing double-deck radiator structure with the curved surface on it.
2. a kind of flange plate type 3 D stereo LED radiator according to claim 1 is characterized in that:
Turning up of described fin (1) two ends is provided with the bar shaped fluting on sheet and the curved surface.
3. a kind of flange plate type 3 D stereo LED radiator according to claim 1 and 2 is characterized in that:
Described conducting strip (2) edges at two ends is sealed heat-conducting glue (3) and is sealed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200773970U CN202469988U (en) | 2012-03-05 | 2012-03-05 | Wing plate type three-dimensional light emitting diode (LED) heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200773970U CN202469988U (en) | 2012-03-05 | 2012-03-05 | Wing plate type three-dimensional light emitting diode (LED) heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202469988U true CN202469988U (en) | 2012-10-03 |
Family
ID=46918144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200773970U Withdrawn - After Issue CN202469988U (en) | 2012-03-05 | 2012-03-05 | Wing plate type three-dimensional light emitting diode (LED) heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202469988U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102588925A (en) * | 2012-03-05 | 2012-07-18 | 陕西唐华能源有限公司 | Wing plate type three-dimensional light-emitting diode (LED) radiator |
| CN107246596A (en) * | 2017-06-20 | 2017-10-13 | 哈尔滨工业大学（威海） | Heat abstractor for LED chip and the LED/light source using the device |
-
2012
- 2012-03-05 CN CN2012200773970U patent/CN202469988U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102588925A (en) * | 2012-03-05 | 2012-07-18 | 陕西唐华能源有限公司 | Wing plate type three-dimensional light-emitting diode (LED) radiator |
| CN102588925B (en) * | 2012-03-05 | 2014-06-04 | 陕西唐华能源有限公司 | Wing plate type three-dimensional light-emitting diode (LED) radiator |
| CN107246596A (en) * | 2017-06-20 | 2017-10-13 | 哈尔滨工业大学（威海） | Heat abstractor for LED chip and the LED/light source using the device |
| CN107246596B (en) * | 2017-06-20 | 2019-12-06 | 哈尔滨工业大学（威海） | heat dissipation device for LED chip and LED light source using same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20121003 Effective date of abandoning: 20140604 |
|
| RGAV | Abandon patent right to avoid regrant |