CN201779625U - High-power LED heat radiating device - Google Patents
High-power LED heat radiating device Download PDFInfo
- Publication number
- CN201779625U CN201779625U CN2010205060843U CN201020506084U CN201779625U CN 201779625 U CN201779625 U CN 201779625U CN 2010205060843 U CN2010205060843 U CN 2010205060843U CN 201020506084 U CN201020506084 U CN 201020506084U CN 201779625 U CN201779625 U CN 201779625U
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- heat radiating
- heat
- main body
- pcb board
- radiating device
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Abstract
The utility model discloses a high-power LED heat radiating device, comprising an LED heat radiating support, a double-sided molded PCB (Printed Circuit Board) and an auxiliary heat radiating device. The PCB is arranged between the heat radiating support and the auxiliary heat radiating device and comprises a main body, a copper foil and a heating radiating hole, the copper foil is arranged on the upper surface and the lower surface of the main body, the heat radiating hole penetrates through the upper surface and the lower surface of the main body, and high heat-conduction glue is arranged between the PCB and the heat radiating support. The utility model has simple structure, is made of common industrial materials, and has the characteristics of strong heat radiation capability, low cost and the like.
Description
Technical field
The utility model belongs to a kind of large-power light-emitting diodes heat abstractor, is specifically related to a kind of pcb board (printed circuit board (PCB)) of double-faced forming.
Background technology
LED is photoelectric device, has only 15%～25% electric energy to convert luminous energy in its course of work, and remaining electric energy nearly all converts heat energy to, and the temperature of LED is raise.In great power LED, heat radiation is a big problem.For example, 1 10W white light LEDs is if its photoelectric transformation efficiency is 20%, then there is the electric energy of 8W to convert heat energy to, if do not add cooling measure, then the device core temperature of great power LED can rise rapidly, when its junction temperature (TJ) rises above maximum allowable temperature (generally being 150 ℃), great power LED can damage because of overheated.Therefore in the high-power LED lamp design, topmost design work is exactly a heat dissipation design.At present, a lot of dual platens, multi-layer sheet density height, power are big, and heat distributes difficulty.Conventional pcb substrate such as FR4, CEM3 are the non-conductors of heat, layer insulation, and heat distributes and does not go out.The electronic equipment local pyrexia is not got rid of, and causes the electronic devices and components high temperature failure.
Summary of the invention
The purpose of this utility model is in order to overcome the deficiencies in the prior art, to provide a kind of heat-sinking capability strong high-power LED heat radiating device.
The technical solution adopted in the utility model is: a kind of high-power LED heat radiating device, comprise the cooling stand of LED, the pcb board and the heat radiation auxiliary appliance of double-faced forming, and described pcb board is arranged between cooling stand and the heat radiation auxiliary appliance; Described pcb board comprises main body, Copper Foil and louvre, and described Copper Foil is arranged on the upper surface and the lower surface of main body, is provided with the louvre that runs through upper and lower surface in the main body, is provided with high-heat-conductivity glue between described pcb board and the cooling stand.
As preferably, the material of described main body is the insulation material.
As preferably, be provided with high heat-conducting medium in the described louvre.
The utility model is provided with a kind of double-faced forming pcb board as a kind of high-power heat abstractor on the heat radiation auxiliary appliance, pcb board adopts materials such as Copper Foil, high conduction material, insulation material, makes heat pass to reverse side from the front, makes the pcb board heat radiation faster.
The utility model pcb board is provided with louvre, realizes the thermoelectricity shunting of pcb board heat radiation, and pcb board can be from backside heat.
The utility model is provided with high-heat-conductivity glue between the pcb board of double-faced forming and LED light emitting source, the heat on the cooling stand of LED light emitting source can be transmitted on the pcb board rapidly.
The utility model adopts LED light emitting source, natural daylight, zero radiation, efficient low-consume, long, environmental protection of life-span.
Beneficial effect: the utility model is simple in structure, and the material of use is industrial common used material, has characteristics such as heat-sinking capability is strong, with low cost.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is the structural representation of the pcb board of the utility model double-faced forming;
Fig. 3 is the vertical view of Fig. 2.
The specific embodiment
The utility model is described in further detail below in conjunction with the drawings and specific embodiments:
As shown in Figure 1, 2, 3: a kind of high-power LED heat radiating device, comprise the cooling stand 1 of LED, the pcb board 2 and the heat radiation auxiliary appliance 3 of double-faced forming, described pcb board 2 is arranged between cooling stand 1 and the heat radiation auxiliary appliance 3; Described pcb board 2 comprises main body 4, Copper Foil 5 and louvre 6, and described Copper Foil 5 is arranged on the upper surface and the lower surface of main body 4, is provided with the louvre 6 that runs through upper and lower surface in the main body 4, is provided with high-heat-conductivity glue between described pcb board 2 and the cooling stand 1.The material of described main body 4 is the insulation material.Be provided with high heat-conducting medium in the described louvre 6.
Claims (3)
1. high-power LED heat radiating device is characterized in that: comprise the cooling stand (1) of LED, the pcb board (2) and the heat radiation auxiliary appliance (3) of double-faced forming, described pcb board (2) is arranged on cooling stand (1) and dispels the heat between the auxiliary appliance (3); Described pcb board (2) comprises main body (4), Copper Foil (5) and louvre (6), described Copper Foil (5) is arranged on the upper surface and the lower surface of main body (4), be provided with the louvre (6) that runs through upper and lower surface in the main body (4), be provided with high-heat-conductivity glue between described pcb board (2) and the cooling stand (1).
2. a kind of high-power LED heat radiating device according to claim 1 is characterized in that: the material of described main body (4) is the insulation material.
3. a kind of high-power LED heat radiating device according to claim 1 is characterized in that: described louvre is provided with high heat-conducting medium in (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205060843U CN201779625U (en) | 2010-08-26 | 2010-08-26 | High-power LED heat radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205060843U CN201779625U (en) | 2010-08-26 | 2010-08-26 | High-power LED heat radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201779625U true CN201779625U (en) | 2011-03-30 |
Family
ID=43792836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205060843U Expired - Fee Related CN201779625U (en) | 2010-08-26 | 2010-08-26 | High-power LED heat radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201779625U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738317A (en) * | 2011-04-12 | 2012-10-17 | 上海矽卓电子科技有限公司 | Packaging method for light source used in LED fluorescent lamp and light source |
| CN104534428A (en) * | 2014-12-02 | 2015-04-22 | 江苏鸿佳电子科技有限公司 | Highly-radiated circuit board of LED lamp |
-
2010
- 2010-08-26 CN CN2010205060843U patent/CN201779625U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738317A (en) * | 2011-04-12 | 2012-10-17 | 上海矽卓电子科技有限公司 | Packaging method for light source used in LED fluorescent lamp and light source |
| CN104534428A (en) * | 2014-12-02 | 2015-04-22 | 江苏鸿佳电子科技有限公司 | Highly-radiated circuit board of LED lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110330 Termination date: 20130826 |