CN102738317A - Packaging method for light source used in LED fluorescent lamp and light source - Google Patents
Packaging method for light source used in LED fluorescent lamp and light source Download PDFInfo
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- CN102738317A CN102738317A CN2011100959429A CN201110095942A CN102738317A CN 102738317 A CN102738317 A CN 102738317A CN 2011100959429 A CN2011100959429 A CN 2011100959429A CN 201110095942 A CN201110095942 A CN 201110095942A CN 102738317 A CN102738317 A CN 102738317A
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Abstract
The invention provides a packaging method for a light source used in an LED fluorescent lamp. The light source uses a two-sided copper-clad plate as a substrate, and copper foil on a front side of the substrate is divided into a plurality of solid crystal areas and current channels. Gold wire welding zones are disposed closed to the solid crystal areas on the current channels. The solid crystal areas are provided with thermal vias throughout the substrate to conduct heat of the solid crystal areas to the copper foil on a back side of the substrate. The packaging method comprises: first, coating solid crystal glue on the solid crystal areas, placing LED chips on the solid crystal glue of the solid crystal areas and pressing the LED chips; then, welding gold wires; and at last, packaging hemispheric fluorescent sillca gel on the LED chips and the gold wires. The invention also discloses a light source used in a high power LED fluorescent lamp manufactured by the above packaging method. The light source manufactured by the above packaging method is characterized by little thermal resistance interface, high heat dissipation efficiency, etc.
Description
Technical field
The present invention relates to illuminating LED fluorescent lamp, particularly the LED fluorescent lamp is with the method for packing of light source and the light source that adopts this method for packing to make.
Background technology
The normal fluorescent lamp that uses of traditional room lighting; Exist the life-span short, energy consumption big, the shortcoming of mercury pollution, flicker; Therefore people have developed solid-state illumination and have used the LED fluorescent lamp; There is serious heat dissipation problem in existing high-capacity LED fluorescent lamp, light efficiency, light field, light decay, solution that always can't be real.Especially the high-capacity LED base is pulled with urea plate or fiber board more serious as the fluorescent lamp of circuit board; The high-capacity LED fluorescent lamp is nothing more than with following two kinds of light sources on the market: one. individual particle pearl encapsulated LED plug-in unit in the circuit board of urea plate or fiber board as light source, two. the SMD encapsulated LED paster of individual particle in the circuit board of urea plate, fiber board or substrates such as aluminium, copper as light source.No matter one or two all is that packaged LED is installed on the circuit board, heat radiation has the thermal resistance interface of multilayer to thermal conductance, exists heat radiation bad.At present, adopt two-sided Copper Foil urea or fiber board or half fiber board, directly be packaged into the high-capacity LED fluorescent lamp and do not see that with the design of light source relevant document discloses as LED solid brilliant support and circuit substrate.
Summary of the invention
The purpose of this invention is to provide the method for packing of a kind of LED fluorescent lamp with light source, the light source thermal resistance interface of adopting this method for packing to make is few, radiating efficiency is high.
LED fluorescent lamp of the present invention is with the method for packing of light source; It adopts double face copper as substrate; The Copper Foil of substrate front side is divided into some crystal bonding areas and current channel, on current channel, near the crystal bonding area place gold thread weld zone is set, the thermal hole that runs through substrate in the crystal bonding area setting is with the heat energy of the conduction crystal bonding area Copper Foil to substrate back; At first at crystal bonding area coating crystal-bonding adhesive; Led chip is placed on the crystal-bonding adhesive of crystal bonding area, compacting, weld gold thread then, at last the hemispheric fluorescence silica gel of encapsulation on led chip and gold thread.
Said substrate front side constitutes the Copper Foil of current channel also as a kind of channel that dispels the heat; Be that the heat energy that led chip produces outwards distributes via the Copper Foil that gold thread is transmitted to the formation current channel; The area that substrate front side constitutes the Copper Foil of current channel preferably accounts for more than 50% of substrate front side area, and the big more radiating effect of area is good more.
The preferred urea plate of the base material of said substrate, fiber board or half fiber board, the integral thickness of substrate is 0.8～1.2mm, the thickness of Copper Foil is not less than 0.02mm.
Further, can also be before solid crystalline substance, remove the reverberation coating that gold thread weld zone and solid brilliant point (being the part that crystal bonding area contacts with led chip) other zone silver-plated or golden all is coated with a bed thickness in said substrate front side, with the raising reflecting brightness, the enhancing light efficiency.
The present invention also provides a kind of high-capacity LED fluorescent lamp to use light source; Said light source is processed on circuit substrate by the directly solid crystalline substance of some led chips; Said circuit substrate adopts double face copper; The positive Copper Foil of circuit substrate is divided into some crystal bonding areas and current channel; The current channel of each crystal bonding area both sides is provided with the gold thread weld zone, and the gold thread weld zone is connected with solid brilliant led chip at crystal bonding area through gold thread, and said crystal bonding area setting runs through the Copper Foil of the thermal hole of substrate with heat energy to the substrate back of conduction crystal bonding area.
The area that substrate front side constitutes the Copper Foil of current channel preferably accounts for more than 50% of substrate front side area, is the bigger the better.Like this, the heat energy that led chip produces is transmitted to the Copper Foil that constitutes current channel via gold thread, realizes heat radiation by this Copper Foil.
In the preferred 20mm of distance between the two adjacent LEDs chip.
The preferred urea plate of the base material of said substrate, fiber board or half fiber board, the integral thickness of substrate is 0.8～1.2mm, the thickness of Copper Foil is not less than 0.02mm.Preferably, with said substrate front side except that gold thread weld zone and solid brilliant point silver-plated or golden other zone reflector layer all is set.
The present invention adopts double face copper as LED solid brilliant support and circuit substrate, and the directly solid crystalline substance of led chip has reduced the thermal resistance interface on circuit substrate, improved radiating efficiency.Its light source has multiple heat radiation channel; Comprise full wafer Copper Foil heat radiation through substrate back; Copper Foil through the substrate front side crystal bonding area and thermal hole are given the thermal energy conduction of led chip the full wafer Copper Foil of substrate back; Through gold thread the thermal energy conduction of led chip is dispelled the heat to large stretch of Copper Foil that substrate front side constitutes current channel, thereby can improve radiating efficiency greatly.
Owing to, both can protect light-emitting diode at the solid brilliant hemispheric fluorescence silica gel that on led chip on the circuit substrate and gold thread, encapsulates, can obtain best luminous wide-angle again, can realize the above light field effectiveness of 170 degree.
Since substrate front side except that gold thread weld zone and solid brilliant point silver-plated or golden other zone reflector layer all is set, reflective surface area is big, light efficiency is good, can improve reflecting brightness about 10～15%.
Description of drawings
Fig. 1 is the structural representation of embodiment high-capacity LED fluorescent lamp with light source.
Fig. 2 is the enlarged drawing of A portion among Fig. 1.
Embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is further specified.
Fig. 1 shows the structure of embodiment high-capacity LED fluorescent lamp with light source.In order more clearly to represent the assembly relation between led chip and the circuit substrate, A portion among Fig. 1 is amplified, as shown in Figure 2, wherein, the part in the hemispheric fluorescence silica gel is dotted.
See figures.1.and.2, this high-capacity LED fluorescent lamp is processed on circuit substrate 11 by the directly solid crystalline substance of some led chips 12 with light source 1.Said circuit substrate 11 adopts double face copper; The Copper Foil at substrate 11 back sides is for covering the full wafer Copper Foil at the whole back side; Circuit substrate 11 positive Copper Foils are divided into some crystal bonding areas 112 and current channel 111; The current channel of each crystal bonding area both sides is provided with gold thread weld zone 114; Gold thread weld zone 114 is connected with solid brilliant led chip 12 at crystal bonding area through gold thread 13, and said crystal bonding area 112 settings run through the Copper Foil of the thermal hole (being plated-through hole) 113 of substrate 11 with heat energy to substrate 11 back sides of conduction crystal bonding area.Each led chip 12 and hemispheric fluorescence silica gel 14 of connected gold thread 13 top encapsulation can be protected led chip 12 on the one hand, can obtain best luminous wide-angle on the other hand, can realize the light field effectiveness more than 170 degree.
Distance between the two adjacent LEDs chip 12 is less than 20mm.
The preferred urea plate of the base material of substrate 11, fiber board or half fiber board, the integral thickness of substrate 11 is 0.8～1.2mm, the thickness of Copper Foil is not less than 0.02mm.Cost is lower than aluminium base or copper base, and radiating effect is superior to aluminium base or copper base.
Above-mentioned high-capacity LED fluorescent lamp is with the method for packing of light source 1: adopt double face copper as substrate 11; Substrate 11 positive Copper Foils are divided into some crystal bonding areas 112 and current channel 111; On current channel 111, gold thread weld zone 114 is set near crystal bonding area 112 places; The thermal hole 113 that runs through substrate 11 crystal bonding area 112 setting at first is coated with crystal-bonding adhesives at crystal bonding area 112 with the heat energy of the conduction crystal bonding area Copper Foil to substrate 11 back sides, led chip 12 is placed on the crystal-bonding adhesive of crystal bonding area, compacting; Weld gold thread 13 then, at last the fluorescence silica gel 14 of encapsulation semi arch ball on led chip 12 and gold thread 13.
Reflector layer is provided with before solid crystalline substance; Concrete grammar is: before solid crystalline substance; All be coated with the reverberation coating of a bed thickness except that gold thread weld zone 114 and silver-plated or golden other zone of solid brilliant point in said substrate 11 fronts, reverberation coating can select for use pure white lacquer, nonconducting silver to coat with lacquer etc.
This high-capacity LED fluorescent lamp is with light source 1 and the supporting use of radiator; Radiator should have and a suitable plane of substrate 11 sizes; The full wafer Copper Foil at this plane of radiator and substrate 11 back sides closely pastes and touches, and during light source 1 work, the heat energy of substrate 11 is given radiator through the quick conduction of the full wafer Copper Foil at substrate 11 back sides; On the other hand; A part of heat energy that led chip 12 produces is successively through the Copper Foil of crystal bonding area 112, the full wafer Copper Foil that substrate 11 back sides are given in thermal hole 113 conduction, and then conduction also has to radiator; A part of heat energy that led chip 12 produces gives substrate the 11 positive large stretch of thick Copper Foils that constitute said current channel 111 through gold thread 13 conduction, by the thick Copper Foil heat radiation of this sheet.
Claims (9)
1. a LED fluorescent lamp is with the method for packing of light source; It is characterized in that: adopt double face copper as substrate; The Copper Foil that substrate (11) is positive is divided into some crystal bonding areas (112) and current channel (111), goes up at current channel (111) and locates to be provided with gold thread weld zone (114) near crystal bonding area (112), and the thermal hole (113) that runs through substrate crystal bonding area (112) setting is with the heat energy that the conducts crystal bonding area Copper Foil to substrate back; At first at crystal bonding area (112) coating crystal-bonding adhesive; Led chip (12) is placed on the crystal-bonding adhesive of crystal bonding area, compacting, weld gold thread (13) then, at last encapsulation hemispheric fluorescence silica gel (14) on led chip and gold thread.
2. method for packing according to claim 1 is characterized in that: the area that said substrate front side constitutes the Copper Foil of current channel (111) accounts for more than 50% of substrate front side area.
3. method for packing according to claim 1 is characterized in that: the base material of said substrate is urea plate, fiber board or half fiber board, and the integral thickness of substrate is 0.8～1.2mm, and the thickness of Copper Foil is greater than 0.02mm.
4. method for packing according to claim 1 is characterized in that: before solid crystalline substance, remove the reverberation coating that gold thread weld zone (114) and solid brilliant other zone of putting silver-plated or golden all are coated with a bed thickness in said substrate front side.
5. a high-capacity LED fluorescent lamp is used light source; It is characterized in that: said light source (1) is processed on circuit substrate (11) by the directly solid crystalline substance of some led chips (12); Said circuit substrate adopts double face copper; The positive Copper Foil of circuit substrate (11) is divided into some crystal bonding areas (112) and current channel (111); The current channel of each crystal bonding area both sides is provided with gold thread weld zone (114), and gold thread weld zone (114) are connected with solid brilliant led chip (12) at crystal bonding area through gold thread (13), and said crystal bonding area (112) setting is run through the Copper Foil of the thermal hole (113) of substrate with heat energy to the substrate back of conduction crystal bonding area.
6. high-capacity LED fluorescent lamp according to claim 5 is used light source, it is characterized in that: the area that said substrate front side constitutes the Copper Foil of current channel (111) accounts for more than 50% of substrate front side area.
7. high-capacity LED fluorescent lamp according to claim 5 is used light source, it is characterized in that: the distance between the two adjacent LEDs chip is less than 20mm.
8. high-capacity LED fluorescent lamp according to claim 5 is used light source, it is characterized in that: the base material of said substrate is urea plate, fiber board or half fiber board, and the integral thickness of substrate is 0.8～1.2mm, and the thickness of Copper Foil is greater than 0.02mm.
9. high-capacity LED fluorescent lamp according to claim 5 is used light source, it is characterized in that: said substrate front side except that gold thread weld zone (114) and solid brilliant point silver-plated or golden other zone reflector layer all is set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100959429A CN102738317A (en) | 2011-04-12 | 2011-04-12 | Packaging method for light source used in LED fluorescent lamp and light source |
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| CN2011100959429A CN102738317A (en) | 2011-04-12 | 2011-04-12 | Packaging method for light source used in LED fluorescent lamp and light source |
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| CN102738317A true CN102738317A (en) | 2012-10-17 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103346239A (en) * | 2013-06-28 | 2013-10-09 | 苏州东山精密制造股份有限公司 | Method for manufacturing LED substrate, LED and LED crystallization method |
| CN104864293A (en) * | 2015-05-28 | 2015-08-26 | 成都斯科泰科技有限公司 | Large-power LED lamp with high heat conduction performance |
| CN105280794A (en) * | 2014-06-19 | 2016-01-27 | 厦门汇耕电子工业有限公司 | Electric-thermal separated, LED chip integrated and high-reflectivity circuit board and manufacture method thereof |
| WO2016202213A1 (en) * | 2015-06-16 | 2016-12-22 | 吴少健 | Led fluorescent tube |
| CN106793588A (en) * | 2016-12-26 | 2017-05-31 | 皆利士多层线路版(中山)有限公司 | Wiring board and preparation method thereof |
| CN110473946A (en) * | 2018-05-09 | 2019-11-19 | 深圳市聚飞光电股份有限公司 | Novel LED support and LED |
| CN110770500A (en) * | 2017-06-13 | 2020-02-07 | 夏普株式会社 | Illumination device and display device |
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| US20090273005A1 (en) * | 2006-07-24 | 2009-11-05 | Hung-Yi Lin | Opto-electronic package structure having silicon-substrate and method of forming the same |
| CN101707230A (en) * | 2009-10-13 | 2010-05-12 | 中外合资江苏稳润光电有限公司 | Method for manufacturing high-power white light LED |
| CN201549500U (en) * | 2009-12-17 | 2010-08-11 | 李亚平 | All-metal heat conducting double-sided radiating LED substrate |
| CN201779625U (en) * | 2010-08-26 | 2011-03-30 | 江苏均英光电有限公司 | High-power LED heat radiating device |
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| US20090273005A1 (en) * | 2006-07-24 | 2009-11-05 | Hung-Yi Lin | Opto-electronic package structure having silicon-substrate and method of forming the same |
| CN101707230A (en) * | 2009-10-13 | 2010-05-12 | 中外合资江苏稳润光电有限公司 | Method for manufacturing high-power white light LED |
| CN201549500U (en) * | 2009-12-17 | 2010-08-11 | 李亚平 | All-metal heat conducting double-sided radiating LED substrate |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103346239A (en) * | 2013-06-28 | 2013-10-09 | 苏州东山精密制造股份有限公司 | Method for manufacturing LED substrate, LED and LED crystallization method |
| CN105280794A (en) * | 2014-06-19 | 2016-01-27 | 厦门汇耕电子工业有限公司 | Electric-thermal separated, LED chip integrated and high-reflectivity circuit board and manufacture method thereof |
| CN104864293A (en) * | 2015-05-28 | 2015-08-26 | 成都斯科泰科技有限公司 | Large-power LED lamp with high heat conduction performance |
| WO2016202213A1 (en) * | 2015-06-16 | 2016-12-22 | 吴少健 | Led fluorescent tube |
| CN106793588A (en) * | 2016-12-26 | 2017-05-31 | 皆利士多层线路版(中山)有限公司 | Wiring board and preparation method thereof |
| CN110770500A (en) * | 2017-06-13 | 2020-02-07 | 夏普株式会社 | Illumination device and display device |
| CN110473946A (en) * | 2018-05-09 | 2019-11-19 | 深圳市聚飞光电股份有限公司 | Novel LED support and LED |
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Application publication date: 20121017 |