CN202691653U - LED (light emitting diode) module - Google Patents
LED (light emitting diode) module Download PDFInfo
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- CN202691653U CN202691653U CN2012202269502U CN201220226950U CN202691653U CN 202691653 U CN202691653 U CN 202691653U CN 2012202269502 U CN2012202269502 U CN 2012202269502U CN 201220226950 U CN201220226950 U CN 201220226950U CN 202691653 U CN202691653 U CN 202691653U
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- light
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- emitting diode
- led
- circuit layer
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Abstract
The utility model provides an LED (light emitting diode) module, which includes a ceramic base plate, a circuit layer, at least one light emitting component, and a drive circuit component. The ceramic base plate is provided with a groove arranged on the upper surface thereof. The circuit layer is arranged on the upper surface of the ceramic base plate. The light emitting component is arranged in the groove and electrically connected with the circuit layer. The drive circuit component is arranged on the upper surface of the ceramic base plate and is electrically connected with the circuit layer. Through providing the ceramic base plate provided with the groove during the formation, the difficulty in machining a high-hardness ceramic base plate can be effectively prevented. A sealing compound is accommodated in the groove, is positioned easily and forms a lens shape.
Description
Technical field
The utility model relates to a kind of light emitting module, relates in particular to a kind of light emitting diode that adopts as the light emitting module of light source.
Background technology
Owing to have energy-conservation advantage, light emitting diode is little by little played the part of a key player in lighting field.In order to replace the incandescent lamp of power consumption, light emitting diode bulb must adopt more simple structure or technique, in order to manufacturing cost is reduced to the degree that the consumer can receive.
Light emitting diode bulb has now begun to adopt chip direct package (Chip on Board) mode, directly be fixed on light-emitting diode chip for backlight unit on the circuit board, give up existing in advance encapsulation LED chip, more packaged light-emitting diode is installed in the mode on the circuit board.
In addition, for the heat that light-emitting diode chip for backlight unit is produced when operating leaves rapidly, circuit board commonly used adopts aluminium base or ceramic substrate to help heat radiation mostly.But owing to sequentially be coated with insulating barrier and circuit layer on the aluminium base, the mat insulating barrier is electrically insulated circuit layer and aluminium base, and the heat-conducting effect of insulating barrier is poor, and meeting is so that the discount of integral heat sink effect.Ceramic substrate then is difficult for processing to make the structures such as groove, so that can't fix fluorescent glue or sealing by the mat groove, also can't the mat groove controls the reflection angle of light-emitting diode chip for backlight unit institute isolychn, to reach required lighting angle.
In addition, existing light emitting diode bulb is arranged at drive circuit in the lamp socket mostly, passes lamp socket with electric wire again and connects drive circuit, and volume and the weight of drive circuit are larger usually, and lamp socket need to be reserved suitable inner space and come accommodating drive circuit.
The utility model content
The purpose of this utility model is to provide a kind of light-emitting diode (LED) module, ceramic substrate with this groove is provided with sinter molding, light-emitting component can directly be encapsulated be arranged in the groove, use the reflection angle of control light-emitting component institute isolychn, to reach required lighting angle.
For reaching above-mentioned purpose, the utility model provides a kind of light-emitting diode (LED) module, comprises:
One ceramic substrate has a groove that is located thereon the surface;
One circuit layer is positioned at the upper surface of this ceramic substrate;
At least one light-emitting component is arranged in this groove and with this circuit layer and is electrically connected; And
The one drive circuit element is arranged at the upper surface of this ceramic substrate and is electrically connected with this circuit layer.
Above-mentioned light-emitting diode (LED) module, wherein this ceramic substrate is that ceramic powders is via the sinter molding part.
Above-mentioned light-emitting diode (LED) module, wherein this circuit layer is formed on this ceramic substrate by common burning mode.
Above-mentioned light-emitting diode (LED) module, wherein this groove has one and presss from both sides the side face at an obtuse angle with this upper surface.
Above-mentioned light-emitting diode (LED) module, wherein this circuit layer is extended in this groove by the upper surface of this ceramic substrate.
Above-mentioned light-emitting diode (LED) module wherein also comprises a sealing that is arranged in this groove.
Above-mentioned light-emitting diode (LED) module wherein comprises a plurality of light-emitting components that are arranged in this groove and are electrically connected with this circuit layer.
The utility model has the ceramic substrate of this groove when moulding is provided, and can effectively avoid the unmanageable difficulty of high-hardness ceramic substrate.And accommodating this sealing of mat groove, make sealing locate easily and form lens shape.
Below in conjunction with the drawings and specific embodiments the utility model is described in detail, but not as to restriction of the present utility model.
Description of drawings
Fig. 1 is the stereogram according to the light-emitting diode (LED) module of an embodiment of the present utility model;
Fig. 2 is according to a cutaway view of the light-emitting diode (LED) module of an embodiment of the present utility model; And
Fig. 3 is according to a stereogram of the light-emitting diode (LED) module of another embodiment of the present utility model.
Wherein, Reference numeral
Components of drive circuit 40 electronic components 50
The specific embodiment
Relevant the technical content and a detailed description of the present utility model cooperate description of drawings as follows:
As shown in Figure 1, the light-emitting diode (LED) module of a foundation embodiment of the present utility model comprises a ceramic substrate 10, a circuit layer 20, one light-emitting components 30, one drive circuit element 40, and most electronic components 50.
This ceramic substrate 10 has a groove 12 that is located thereon surface 11.This ceramic substrate 10 is via sinter molding by ceramic powders.Cooperate by suitable mould, make this ceramic substrate 10 when moulding, have this groove 12, and need not utilize other following process modes to make this groove at general flat ceramic material, can avoid the unmanageable difficulty of high-hardness ceramic substrate.
This circuit layer 20 is positioned at the upper surface 11 of this ceramic substrate 10.This circuit layer 20 is that copper or other conductive material are made, its generation type can utilize thick film or film mode via high temperature sintering to be formed on this ceramic substrate 10, its sintering temperature need be lower than the fusing point of ceramic substrate 10.This circuit layer 20 is extended in this groove 12 by the upper surface 11 of this ceramic substrate 10, and forms two independently contacts in the bottom of groove 12.
This light-emitting component 30 is arranged in this groove 12, and is electrically connected with contact that this circuit layer 20 is positioned at this groove 12.This light-emitting component 30 is the light-emitting diode chip for backlight unit of crystal covering type (flip-chip encapsulation), during actual enforcement, also can adopt the light-emitting diode chip for backlight unit with Bipolar electrode or rectilinear electrode, and is electrically connected with the routing packaged type with corresponding circuit layer.
This components of drive circuit 40 is arranged at the upper surface 11 of this ceramic substrate 10, and is electrically connected with this circuit layer 20, so that components of drive circuit 40 can be luminous by circuit layer 20 these light-emitting components 30 of driving.In addition, those electronic components 50 can be the passive electronic components such as resistance, electric capacity.By components of drive circuit 40 is set directly on the ceramic substrate 10, when light-emitting diode (LED) module of the present utility model is applied to bulb, drive circuit can be set separately in lamp socket, can effectively save the space, dwindle volume and the cost of bulb.
In addition, the light-emitting diode (LED) module of present embodiment also comprises a sealing 60 that is arranged in this groove 12.This sealing 60 is transparent material, and during practical application, this sealing 60 also can comprise to change the fluorescent material of wavelength of light, in order to change the color of part light-emitting component 30 emitted lights.
Because this groove 12 can be in order to accommodating this sealing 60, this is so that put the adhesive material that places on this ceramic substrate 10 in gluing process, can be located by groove 12 easily, and can form the required shape that is similar to convex lens, namely make sealing 60 as lens of light-emitting component 30.
As shown in Figure 2, specifically, this groove 12 have one with the side face 121 at upper surface 11 folder one obtuse angle of this ceramic substrate 10.By this, the upwards reflection of light that light-emitting component 30 is sent towards this side face 121 is to promote the luminous efficiency of Integral luminous diode (led) module.
As shown in Figure 3, be the light-emitting diode (LED) module according to another embodiment of the present utility model, it is roughly same as the previously described embodiments, and difference is that the light-emitting diode (LED) module of present embodiment includes a plurality of light-emitting components 30 that are arranged in this groove 12 and are electrically connected with this circuit layer 20.Cover by a plurality of light-emitting components 30 being arranged at jointly in the groove 12 and with sealing 60, also luminous intensity can be improved, to satisfy the demand of high brightness.
In sum, by the ceramic powders sinter molding, the suitable mould of arranging in pairs or groups makes this ceramic substrate 10 have this groove 12 when moulding, can effectively avoid the unmanageable difficulty of high-hardness ceramic substrate., adhesive material can be positioned easily and form lens shape with accommodating this sealing 60 by this groove 12.In addition, by components of drive circuit 40 is arranged on the ceramic substrate 10, when making light-emitting diode (LED) module of the present utility model be applied to bulb, drive circuit need not be set separately in lamp socket, with effective saving space, dwindle volume and the cost of bulb.
Certainly; the utility model also can have other various embodiments; in the situation that does not deviate from the utility model spirit and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the utility model.
Claims (7)
1. a light-emitting diode (LED) module is characterized in that, comprises:
One ceramic substrate has a groove that is located thereon the surface;
One circuit layer is positioned at the upper surface of this ceramic substrate;
At least one light-emitting component is arranged in this groove and with this circuit layer and is electrically connected; And
The one drive circuit element is arranged at the upper surface of this ceramic substrate and is electrically connected with this circuit layer.
2. light-emitting diode (LED) module according to claim 1 is characterized in that, this ceramic substrate is that ceramic powders is via the sinter molding part.
3. light-emitting diode (LED) module according to claim 1 is characterized in that, this circuit layer is formed on this ceramic substrate by common burning mode.
4. light-emitting diode (LED) module according to claim 1 is characterized in that, this groove has one and presss from both sides the side face at an obtuse angle with this upper surface.
5. light-emitting diode (LED) module according to claim 1 is characterized in that, this circuit layer is extended in this groove by the upper surface of this ceramic substrate.
6. light-emitting diode (LED) module according to claim 1 is characterized in that, also comprises a sealing that is arranged in this groove.
7. light-emitting diode (LED) module according to claim 1 is characterized in that, comprises a plurality of light-emitting components that are arranged in this groove and are electrically connected with this circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202269502U CN202691653U (en) | 2012-05-18 | 2012-05-18 | LED (light emitting diode) module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202269502U CN202691653U (en) | 2012-05-18 | 2012-05-18 | LED (light emitting diode) module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202691653U true CN202691653U (en) | 2013-01-23 |
Family
ID=47547271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012202269502U Expired - Fee Related CN202691653U (en) | 2012-05-18 | 2012-05-18 | LED (light emitting diode) module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202691653U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103322460A (en) * | 2013-07-17 | 2013-09-25 | 乐健科技（珠海）有限公司 | Novel LED candle lamp and LED light source module |
| CN103423617A (en) * | 2012-05-18 | 2013-12-04 | 元宏国际股份有限公司 | Light emitting diode module |
-
2012
- 2012-05-18 CN CN2012202269502U patent/CN202691653U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103423617A (en) * | 2012-05-18 | 2013-12-04 | 元宏国际股份有限公司 | Light emitting diode module |
| CN103322460A (en) * | 2013-07-17 | 2013-09-25 | 乐健科技（珠海）有限公司 | Novel LED candle lamp and LED light source module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130123 Termination date: 20150518 |
|
| EXPY | Termination of patent right or utility model |