CN103423617A - Light emitting diode module - Google Patents
Light emitting diode module Download PDFInfo
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- CN103423617A CN103423617A CN2012101569044A CN201210156904A CN103423617A CN 103423617 A CN103423617 A CN 103423617A CN 2012101569044 A CN2012101569044 A CN 2012101569044A CN 201210156904 A CN201210156904 A CN 201210156904A CN 103423617 A CN103423617 A CN 103423617A
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- emitting diode
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Abstract
The invention discloses a light emitting diode module which comprises a ceramic substrate, a circuit layer, at least one light emitting element and a driving circuit element. The ceramic substrate is provided with a groove formed in the upper surface of the ceramic substrate, the circuit layer is arranged on the upper surface of the ceramic substrate, the light emitting element is arranged in the groove and electrically connected with the circuit layer, and the driving circuit element is arranged on the upper surface of the ceramic substrate and electrically connected with the circuit layer. Due to the fact that the ceramic substrate provided with the groove when formed is provided, the difficulty that the high-hardness ceramic substrate is hard to machine can be effectively avoided. Due to the fact that sealing glue is contained in the groove, the sealing glue is easily positioned and forms a lens shape.
Description
Technical field
The present invention relates to a kind of light emitting module, relate in particular to a kind of light emitting module of light emitting diode as light source that adopt.
Background technology
Energy-conservation owing to having advantages of, light emitting diode is little by little played the part of a key player in lighting field.In order to replace the incandescent lamp of power consumption, light emitting diode bulb must adopt more simple structure or technique, in order to manufacturing cost is reduced to the degree that the consumer can receive.
Light emitting diode bulb has now started to adopt chip direct package (Chip on Board) mode, by light-emitting diode chip for backlight unit, directly be fixed on circuit board, give up existing encapsulation LED chip in advance, more packaged light-emitting diode is arranged on to the mode on circuit board.
In addition, for the heat that light-emitting diode chip for backlight unit is produced when operating leaves rapidly, circuit board commonly used adopts aluminium base or ceramic substrate to help heat radiation mostly.But owing to sequentially being coated with insulating barrier and circuit layer on aluminium base, the mat insulating barrier is electrically insulated circuit layer and aluminium base, and the heat-conducting effect of insulating barrier is poor, can make the integral heat sink effect give a discount.Ceramic substrate is difficult for processing to make the structures such as groove, so that can't fix fluorescent glue or sealing by the mat groove, also can't the mat groove controls the reflection angle of light-emitting diode chip for backlight unit institute isolychn, to reach required lighting angle.
In addition, existing light emitting diode bulb is arranged at drive circuit in lamp socket mostly, then connects drive circuit with electric wire through lamp socket, and volume and the weight of drive circuit are larger usually, and lamp socket need to be reserved suitable inner space and carry out accommodating drive circuit.
Summary of the invention
The object of the present invention is to provide a kind of light-emitting diode (LED) module, ceramic substrate with this groove is provided with sinter molding, light-emitting component can directly be encapsulated and be arranged in groove, use the reflection angle of controlling light-emitting component institute isolychn, to reach required lighting angle.
For reaching above-mentioned purpose, the invention provides a kind of light-emitting diode (LED) module, comprise:
One ceramic substrate, have a groove that is located thereon surface;
One circuit layer, be positioned at the upper surface of this ceramic substrate;
At least one light-emitting component, be arranged in this groove and with this circuit layer and be electrically connected; And
The one drive circuit element, be arranged at the upper surface of this ceramic substrate and be electrically connected with this circuit layer.
Above-mentioned light-emitting diode (LED) module, wherein this ceramic substrate by ceramic powders via sinter molding.
Above-mentioned light-emitting diode (LED) module, wherein this circuit layer is formed on this ceramic substrate by common burning mode.
Above-mentioned light-emitting diode (LED) module, wherein this groove has one and presss from both sides the side face at an obtuse angle with this upper surface.
Above-mentioned light-emitting diode (LED) module, its this circuit layer is extended in this groove by the upper surface of this ceramic substrate.
Above-mentioned light-emitting diode (LED) module, wherein also comprise a sealing be arranged in this groove.
Above-mentioned light-emitting diode (LED) module, wherein this sealing comprises fluorescent material.
Above-mentioned light-emitting diode (LED) module, wherein comprise a plurality of light-emitting components that are arranged in this groove and are electrically connected with this circuit layer.
The present invention has the ceramic substrate of this groove when moulding is provided, and can effectively avoid the unmanageable difficulty of high-hardness ceramic substrate.And accommodating this sealing of mat groove, make sealing locate easily and form lens shape.
Below in conjunction with the drawings and specific embodiments, describe the present invention, but not as a limitation of the invention.
The accompanying drawing explanation
Fig. 1 is the stereogram according to the light-emitting diode (LED) module of one embodiment of the invention;
Fig. 2 is according to a cutaway view of the light-emitting diode (LED) module of one embodiment of the invention; And
Fig. 3 is according to a stereogram of the light-emitting diode (LED) module of another embodiment of the present invention.
Wherein, Reference numeral
Components of drive circuit 40 electronic components 50
The specific embodiment
Relevant the technical content and a detailed description coordinate accompanying drawing to be described as follows:
As shown in Figure 1, according to the light-emitting diode (LED) module of one embodiment of the invention, comprise a ceramic substrate 10, circuit layer 20, one light-emitting components 30, one drive circuit element 40, and a plurality of electronic component 50.
This ceramic substrate 10 has a groove 12 that is located thereon surface 11.This ceramic substrate 10 is via sinter molding by ceramic powders.Coordinate by suitable mould, make this ceramic substrate 10 there is this groove 12 when moulding, and need not utilize other following process modes to make this groove on general flat ceramic material, can avoid the unmanageable difficulty of high-hardness ceramic substrate.
This circuit layer 20 is positioned at the upper surface 11 of this ceramic substrate 10.This circuit layer 20 be for copper or other conductive material made, its generation type can utilize thick film or film mode via high temperature sintering to be formed on this ceramic substrate 10, its sintering temperature need be lower than the fusing point of ceramic substrate 10.This circuit layer 20 is extended in this groove 12 by the upper surface 11 of this ceramic substrate 10, and forms two independently contacts in the bottom of groove 12.
This light-emitting component 30 is arranged in this groove 12, and is electrically connected with the contact that this circuit layer 20 is positioned at this groove 12.The light-emitting diode chip for backlight unit that this light-emitting component 30 is crystal covering type (flip-chip encapsulation), during actual enforcement, also can adopt the light-emitting diode chip for backlight unit with Bipolar electrode or rectilinear electrode, and be electrically connected to the routing packaged type with corresponding circuit layer.
This components of drive circuit 40 is arranged at the upper surface 11 of this ceramic substrate 10, and is electrically connected with this circuit layer 20, so that components of drive circuit 40 can drive this light-emitting component 30 luminous by circuit layer 20.In addition, those electronic components 50 can be the passive electronic components such as resistance, electric capacity.By components of drive circuit 40 is set directly on ceramic substrate 10, when light-emitting diode (LED) module of the present invention is applied to bulb, drive circuit can be set in lamp socket separately, can effectively save space, dwindle volume and the cost of bulb.
In addition, the light-emitting diode (LED) module of the present embodiment also comprises a sealing 60 be arranged in this groove 12.This sealing 60 is transparent material, and during practical application, this sealing 60 also can comprise to change the fluorescent material of wavelength of light, in order to change the color of part light-emitting component 30 emitted lights.
Because this groove 12 can be in order to accommodating this sealing 60, this makes in gluing process and is put and be placed in the adhesive material on this ceramic substrate 10, can be located by groove 12 easily, and can form the required shape that is similar to convex lens, namely make the lens of sealing 60 as light-emitting component 30.
As shown in Figure 2, specifically, this groove 12 have one with the side face 121 at upper surface 11 folder one obtuse angles of this ceramic substrate 10.By this, the light that light-emitting component 30 is sent towards this side face 121 is reflection upwards, to promote the luminous efficiency of Integral luminous diode (led) module.
As shown in Figure 3, light-emitting diode (LED) module for the foundation another embodiment of the present invention, it is roughly same as the previously described embodiments, and difference is that the light-emitting diode (LED) module of the present embodiment includes a plurality of light-emitting components 30 that are arranged in this groove 12 and are electrically connected with this circuit layer 20.Cover by a plurality of light-emitting components 30 being arranged at jointly in groove 12 and with sealing 60, also luminous intensity can be improved, to meet the demand of high brightness.
In sum, by the ceramic powders sinter molding, the suitable mould of arranging in pairs or groups, make this ceramic substrate 10 have this groove 12 when moulding, can effectively avoid the unmanageable difficulty of high-hardness ceramic substrate.By this groove 12, with accommodating this sealing 60, can make adhesive material be positioned easily and to form lens shape.In addition, by components of drive circuit 40 is arranged on ceramic substrate 10, while making light-emitting diode (LED) module of the present invention be applied to bulb, drive circuit need not be set in lamp socket separately, effectively to save space, dwindle volume and the cost of bulb.
Certainly; the present invention also can have other various embodiments; in the situation that do not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art are when making according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (8)
1. a light-emitting diode (LED) module, is characterized in that, comprises:
One ceramic substrate, have a groove that is located thereon surface;
One circuit layer, be positioned at the upper surface of this ceramic substrate;
At least one light-emitting component, be arranged in this groove and with this circuit layer and be electrically connected; And
The one drive circuit element, be arranged at the upper surface of this ceramic substrate and be electrically connected with this circuit layer.
2. light-emitting diode (LED) module according to claim 1, is characterized in that, this ceramic substrate by ceramic powders via sinter molding.
3. light-emitting diode (LED) module according to claim 1, is characterized in that, this circuit layer is formed on this ceramic substrate by common burning mode.
4. light-emitting diode (LED) module according to claim 1, is characterized in that, this groove has one and presss from both sides the side face at an obtuse angle with this upper surface.
5. light-emitting diode (LED) module according to claim 1, is characterized in that, this circuit layer is extended in this groove by the upper surface of this ceramic substrate.
6. light-emitting diode (LED) module according to claim 1, is characterized in that, also comprises a sealing be arranged in this groove.
7. light-emitting diode (LED) module according to claim 6, is characterized in that, this sealing comprises fluorescent material.
8. light-emitting diode (LED) module according to claim 1, is characterized in that, comprises a plurality of light-emitting components that are arranged in this groove and are electrically connected with this circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101569044A CN103423617A (en) | 2012-05-18 | 2012-05-18 | Light emitting diode module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101569044A CN103423617A (en) | 2012-05-18 | 2012-05-18 | Light emitting diode module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103423617A true CN103423617A (en) | 2013-12-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101569044A Pending CN103423617A (en) | 2012-05-18 | 2012-05-18 | Light emitting diode module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103423617A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103996785A (en) * | 2014-06-04 | 2014-08-20 | 宁波亚茂照明电器有限公司 | Built-in drive full-angle light-emitting LED light source and packaging process |
| WO2015110086A1 (en) * | 2014-01-27 | 2015-07-30 | 上海三思电子工程有限公司 | Led lighting apparatus, light shade, and circuit manufacturing method for the apparatus |
| JP2017126439A (en) * | 2016-01-13 | 2017-07-20 | シチズン時計株式会社 | LED light bulb |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101409997A (en) * | 2007-10-12 | 2009-04-15 | 台达电子工业股份有限公司 | Co-baking ceramic module |
| KR20110028672A (en) * | 2009-09-08 | 2011-03-22 | (주)와이에스썸텍 | The method for producing circuit board with high heat sink |
| CN102339929A (en) * | 2010-07-29 | 2012-02-01 | 富士迈半导体精密工业（上海）有限公司 | Method for manufacturing LED (Light-Emitting Diode) light-emitting component |
| KR20120039590A (en) * | 2012-03-08 | 2012-04-25 | 장일호 | Method of manufacturing high power white led package module |
| CN202691653U (en) * | 2012-05-18 | 2013-01-23 | 元宏国际股份有限公司 | LED (light emitting diode) module |
-
2012
- 2012-05-18 CN CN2012101569044A patent/CN103423617A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101409997A (en) * | 2007-10-12 | 2009-04-15 | 台达电子工业股份有限公司 | Co-baking ceramic module |
| KR20110028672A (en) * | 2009-09-08 | 2011-03-22 | (주)와이에스썸텍 | The method for producing circuit board with high heat sink |
| CN102339929A (en) * | 2010-07-29 | 2012-02-01 | 富士迈半导体精密工业（上海）有限公司 | Method for manufacturing LED (Light-Emitting Diode) light-emitting component |
| KR20120039590A (en) * | 2012-03-08 | 2012-04-25 | 장일호 | Method of manufacturing high power white led package module |
| CN202691653U (en) * | 2012-05-18 | 2013-01-23 | 元宏国际股份有限公司 | LED (light emitting diode) module |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015110086A1 (en) * | 2014-01-27 | 2015-07-30 | 上海三思电子工程有限公司 | Led lighting apparatus, light shade, and circuit manufacturing method for the apparatus |
| CN103996785A (en) * | 2014-06-04 | 2014-08-20 | 宁波亚茂照明电器有限公司 | Built-in drive full-angle light-emitting LED light source and packaging process |
| JP2017126439A (en) * | 2016-01-13 | 2017-07-20 | シチズン時計株式会社 | LED light bulb |
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Application publication date: 20131204 |