KR20120039590A - Method of manufacturing high power white led package module - Google Patents

Method of manufacturing high power white led package module Download PDF

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Publication number
KR20120039590A
KR20120039590A KR1020120023743A KR20120023743A KR20120039590A KR 20120039590 A KR20120039590 A KR 20120039590A KR 1020120023743 A KR1020120023743 A KR 1020120023743A KR 20120023743 A KR20120023743 A KR 20120023743A KR 20120039590 A KR20120039590 A KR 20120039590A
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KR
South Korea
Prior art keywords
lens
housing
white light
printed circuit
package module
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KR1020120023743A
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Korean (ko)
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장일호
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장일호
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Priority to KR1020120023743A priority Critical patent/KR20120039590A/en
Publication of KR20120039590A publication Critical patent/KR20120039590A/en
Priority to KR1020120119204A priority patent/KR101255671B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE: A high power white light LED package module and a manufacturing method thereof are provided to improve a protection against heat performance by loading an LED ship on a substrate metal layer of a metal printed circuit board. CONSTITUTION: An LED chip(55) is loaded in a metal printed circuit board(50). The metal printed circuit board comprises penetration hole of count bore or count sink shape. A lens(20) comprises a bonding groove in order to be attached and detached to housing. The lens has white lights of various color temperatures according to materials of a fluorescent material(30). The housing is molded by ceramic materials or engineering plastics in which heat resistance is excellent. The lens is formed into various shapes in order to control directional angles.

Description

고출력 백색광 엘이디 패키지 모듈 및 그 제조방법 {METHOD OF MANUFACTURING HIGH POWER WHITE LED PACKAGE MODULE}High power white light LED package module and manufacturing method {METHOD OF MANUFACTURING HIGH POWER WHITE LED PACKAGE MODULE}

본 발명은 표면실장(SMT) 공정이 필요하지 않은 단일 고출력 백색광 LED 패키지 모듈 및 이의 제조 방법에 관한 것으로, 더욱 구체적으로는 방열기능을 수행하는 금속 인쇄회로기판과 별도의 렌즈를 탈착할 수 있는 하우징을 금속 인쇄회로기판에 성형하는 것 및 형광체 재료가 내부에 포함된 렌즈를 구비한 그 제조 방법에 관한 것이다.
The present invention relates to a single high power white light LED package module and a method for manufacturing the same, which do not require a surface mount (SMT) process, and more particularly, a housing that can detach a metal printed circuit board and a separate lens that perform a heat dissipation function. The present invention relates to a method for forming a metal printed circuit board and a manufacturing method including a lens having a phosphor material contained therein.

최근, LED 조명 제품은 제조원가 절감 및 제조 단순화를 위해 방열 성능의 향상된 고출력 백색광 LED 패키지를 요구하고 있으며, 조명 제품이 사용되는 장소의 용도에 알맞은 백색광의 색온도 및 지향각(viewing angle)을 요구하고 있는 추세이다.
Recently, LED lighting products require improved high-output white light LED packages with heat dissipation to reduce manufacturing costs and simplify manufacturing, and require a color temperature and a viewing angle of white light suitable for a place where the lighting product is used. It is a trend.

이러한 요구는 고출력 백색광 LED 패키지의 집적화에 따른 높은 방열 특성과 형광체의 열 안정성이 확보되어야 하며, 또한, 요구되는 백색광의 색온도 및 지향각(viewing angle)을 갖는 렌즈만을 손쉽게 교환할 수 있는 구조가 되어야 한다.
This demand should ensure a high heat dissipation characteristics and thermal stability of the phosphor according to the integration of a high-power white light LED package, and also be a structure that can be easily replaced only the lens having the required color temperature and viewing angle of the white light. do.

일반적으로 제조되는 고출력 백색광 LED 패키지는 표면실장(SMT) 공정이 필요한 리드프레임 구조와 금속 인쇄회로 기판에 칩온보드(chip on board) 구조로 되어 있다.
In general, high power white light LED packages manufactured have a lead frame structure requiring a surface mount (SMT) process and a chip on board structure on a metal printed circuit board.

그러나, 표면실장(SMT) 공정이 필요한 리드프레임 구조는 방열부(heat sink)의 크기가 제한적이기 때문에 열용량이 작고, 표면실장(SMT)후 솔더(solder)를 통해 기판으로 대부분 열 방출이 되기 때문에 열저항이 높다. 또한, 칩온보드(chip on board) 구조는 방열 특성은 좋으나, 백색광을 구현하기 위해 LED 칩 위에 형광체 재료가 도포되어 있어 형광체 재료의 열 안정성에 취약하다.
However, the lead frame structure requiring the surface mount (SMT) process has a small heat capacity because of the limited size of the heat sink, and since most of the heat is released to the substrate through the solder after the surface mount (SMT). High heat resistance In addition, the chip on board structure has good heat dissipation characteristics, but is vulnerable to thermal stability of the phosphor material because phosphor material is coated on the LED chip to realize white light.

이러한, 종래의 리드프레임 및 칩온보드(chip on board)를 이용한 백색광 LED 패키지는 제조시에 빛의 색온도가 고정되기 때문에 생산 수율이 변화가 많고, 백색광의 색온도를 변경하기 위해서는 LED 패키지 전체를 교체하여야 하기 때문에 제조원가가 상승하는 문제가 있다.
In the conventional white light LED package using a lead frame and a chip on board, since the color temperature of the light is fixed at the time of manufacture, the production yield varies, and in order to change the color temperature of the white light, the entire LED package must be replaced. Therefore, there is a problem that the manufacturing cost rises.

이러한 요구 및 문제점을 해결하기 위한 본 발명은 방열 성능을 향상시키고, 형광체 재료의 열화를 방지하여 며, 손쉽게 다양한 백색광의 색온도를 변경하고, 지향각을 조절할 수 있는 고출력 백색광 LED 패키지 모듈의 제조방법을 제공하는 것을 목적으로 한다.
The present invention to solve this need and problem is to improve the heat dissipation performance, to prevent the degradation of the phosphor material, to easily change the color temperature of various white light, and to manufacture a high output white light LED package module that can adjust the directivity angle It aims to provide.

전술한 기술적 과제를 달성하기 위한 본 발명의 특징은 LED 칩이 탑제될 (a) 금속 인쇄회로기판을 준비하는 단계; (b) 상기 금속 인쇄회로기판에 하우징을 성형하는 단계; (c) 상기 하우징이 성형된 금속 인쇄회로기판에 LED 칩을 탑제하고 패키징하는 단계; (d) 상기 하우징에 결속할 렌즈를 성형하는 단계; (e) 상기 렌즈에 형광체 재료를 도포하는 단계; (f) 상기 형광체 재료가 도포된 렌즈를 하우징에 결속하는 단계로 구성되는 것을 특징으로 한다.
Features of the present invention for achieving the above technical problem is the step of (a) preparing a metal printed circuit board on which the LED chip is mounted; (b) forming a housing on the metal printed circuit board; (c) mounting and packaging an LED chip on a metal printed circuit board having the housing formed thereon; (d) shaping the lens to be bound to the housing; (e) applying a phosphor material to the lens; (f) binding the lens on which the phosphor material is applied to the housing.

전술한 (a) 단계는 하부로부터 기판금속층, 절연층, 배선금속층, 보호층으로 적층된 인쇄회로기판으로 절연층은 LED 칩이 탑제되는 부분만 제거되며, 배선금속층은 탑제되는 LED 칩의 개수에 따라 배선부의 개수와 트레이스의 형상이 달라지며, 보호층은 LED 칩이 탑제되는 부분과 LED 패키징시 사용되는 와이어본딩용 패드와 외부 전원연결 단자 패드만을 제외하고 상부의 모든 층을 덮도록 형성한다.
Step (a) described above is a printed circuit board laminated with a substrate metal layer, an insulating layer, a wiring metal layer, and a protective layer from below, and the insulating layer is removed only a portion where the LED chip is mounted, and the wiring metal layer is applied to the number of LED chips mounted thereon. Accordingly, the number of wirings and the shape of the traces are different, and the protective layer is formed to cover all the upper layers except for the portion where the LED chip is mounted and the wire bonding pad and external power connection terminal pad used for LED packaging.

여기서, (a) 단계는 상기 (b) 단계를 수행하기 위해 하나의 금속 인쇄회로기판으로 구성되거나 같은 형태의 금속 인쇄회로기판을 여러 개로 배열하는 형태로 구성된다.
Here, the step (a) is composed of a single metal printed circuit board or a plurality of metal printed circuit boards of the same type in order to perform the step (b).

전술한 (b) 단계는 상기 (a) 단계에서 준비된 금속 인쇄회로기판과 인써트 몰드(insert mold) 방식으로 성형될 경우, 상기 하우징이 금속 인쇄회로기판에 고정하여 성형되도록 상기 (a) 단계에서 금속 인쇄회로기판에 다수의 카운트보어, 카운트싱크 형상의 관통홀을 형성한다.
Step (b) described above is performed in the step (a) so that the housing is fixed to the metal printed circuit board and molded when the metal printed circuit board prepared in step (a) and the insert mold are molded. A plurality of count bores and count sink shaped through holes are formed in the printed circuit board.

또한, (b) 단계에서는 (f) 단계의 렌즈를 회전하여 하우징에 결속되도록 하우징의 외부면에 결속 홈을 형성한다.
In addition, in step (b), a binding groove is formed on the outer surface of the housing so that the lens of step (f) is rotated to bind to the housing.

전술한 (c) 단계는 상기 (b) 단계에서 하우징이 성형된 반사기내 금속 인쇄회로기판에 LED 칩에 대해 다이본딩, 와이어본딩 공정을 수행한 후 투명한 고내열성 실리콘 및 합성수지로 밀봉하여 경화한다.
Step (c) is performed by performing a die bonding and wire bonding process on the LED chip on the metal printed circuit board in the reflector in which the housing is molded in step (b), and sealing and curing with transparent high heat resistant silicone and synthetic resin.

전술한 (d) 단계는 상기 (b) 단계의 하우징의 내부 반사면의 상부와 맞닿는 렌즈의 하부면에 형광체 재료가 도포될 공간이 형성되며, (f) 단계의 형광체 재료가 도포된 렌즈를 회전하여 하우징에 결속되도록 렌즈의 내부면에 결속홈을 형성한다.
In the above-mentioned step (d), a space is formed on the lower surface of the lens which is in contact with the upper portion of the inner reflective surface of the housing of step (b), and a space is formed to rotate the lens on which the phosphor material is applied in step (f). To form a binding groove in the inner surface of the lens to bind to the housing.

또한, (d) 단계에서는 백색광의 지향각을 조절하기 위해 다양한 형상의 렌즈가 형성된다.
In addition, in step (d), lenses of various shapes are formed to adjust the directivity angle of the white light.

전술한 (e) 단계는 상기 (d) 단계에서 성형된 렌즈의 하부면의 위치에 형광체 재료를 투명한 액상 실리콘 및 에폭시와 혼합하여 액상 형태로 도포한 후 열 경화하고 또는 UV를 조사하여 경화하는 것과 경화 후 시트 형태로 부착하는 방법으로 형성된다.
The above-mentioned step (e) is performed by mixing the phosphor material with the transparent liquid silicone and epoxy at the position of the lower surface of the lens formed in the step (d) and applying it in liquid form, followed by heat curing or UV irradiation curing. After curing, it is formed by attaching in the form of a sheet.

전술한 (f) 단계는 상기 (e) 단계의 형광체 재료가 도포된 렌즈와 (b) 단계에서 성형된 하우징과 회전하여 탈착이 가능하도록 결속된다.
Step (f) described above is coupled to the lens to which the phosphor material of step (e) is applied and the housing formed in step (b) to rotate and detach.

본 발명은 금속 인쇄회로기판의 기판 금속층 위에 LED 칩이 탑제되어 방열 성능이 향상되고, 형광체 재료와 LED 칩이 일정 간격을 갖고 있어 형광체 재료의 열 안정성이 향상되며, 형광체 재료가 도포된 렌즈만을 손쉽게 교체함으로써 다양한 색온도의 백색광과 지향각을 구현할 수 있다.
According to the present invention, the LED chip is mounted on the substrate metal layer of the metal printed circuit board to improve heat dissipation performance, and the phosphor material and the LED chip have a predetermined interval, thereby improving thermal stability of the phosphor material, and easily applying only the lens to which the phosphor material is applied. By replacing it, white light and directivity angles of various color temperatures can be realized.

또한, 종래의 백색광 LED 패키지는 제조시에 색온도가 고정되어 생산 수율이 변화가 많고, 백색광의 색온도를 변경하기 위해서는 LED 패키지 전체를 교체하여야 하기 때문에 발생하는 제조원가의 상승 문제를 해결할 수 있다.
In addition, the conventional white light LED package has a fixed color temperature at the time of manufacturing, the production yield is changed a lot, and the problem of the increase in manufacturing cost caused by the need to replace the entire LED package to change the color temperature of the white light.

따라서, 본 발명은 종래의 고출력 백색광 LED 패키지보다 향상된 장점을 제공하며, 최근 수요가 증가하고 있는 LED 조명분야에 널리 이용될 수 있다.
Accordingly, the present invention provides improved advantages over conventional high power white light LED packages, and can be widely used in the field of LED lighting, which is recently in increasing demand.

도1은 본 발명의 일 실시예에 따른 고출력 백색광 LED 패키지 모듈의 사시도이다.
도2는 도1의 고출력 백색광 LED 패키지 모듈의 분해 사시도이다.
도3은 본 발명의 일 실시예에 따른 금속 인쇄회로기판의 평면도이다.
도4는 본 발명의 일 실시예에 따른 금속 인쇄회로기판의 저면도이다.
도5는 본 발명의 일 실시예에 따른 금속 인쇄회로기판를 준비하는 단계에서의 배열 구조를 설명하기 위한 평면도이다.
도6은 본 발명의 일 실시예에 따른 인쇄회로기판에 하우징을 성형한 단계에서의 사시도이다.
도7은 본 발명의 일 실시예에 따른 패키징 공정을 수행한 단계에서의 사시도이다.
도8은 본 발명의 일 실시예에 따른 렌즈의 성형 및 성형된 렌즈에 형광체 재료를 도포하는 단계에서의 사시도이다.
도9는 도1의 고출력 백색광 LED 패키지 모듈의 결절된 측면도이다.1 is a perspective view of a high power white light LED package module according to an embodiment of the present invention.
FIG. 2 is an exploded perspective view of the high power white light LED package module of FIG. 1. FIG.
3 is a plan view of a metal printed circuit board according to an exemplary embodiment of the present invention.
4 is a bottom view of a metal printed circuit board according to an exemplary embodiment of the present invention.
FIG. 5 is a plan view illustrating an arrangement structure in a step of preparing a metal printed circuit board according to an embodiment of the present invention. FIG.
Figure 6 is a perspective view of the step of forming the housing on the printed circuit board according to an embodiment of the present invention.
7 is a perspective view at the stage of performing a packaging process according to an embodiment of the present invention.
8 is a perspective view of the molding of the lens according to an embodiment of the present invention and applying the phosphor material to the molded lens.
9 is a broken side view of the high power white light LED package module of FIG.

이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예에 따른 고출력 백색광 LED 패키지 모듈의 제조방법에 대하여 구체적으로 설명한다.
Hereinafter, a method of manufacturing a high power white light LED package module according to a preferred embodiment of the present invention with reference to the accompanying drawings will be described in detail.

도1은 첨부된 도면을 참조하여 본 발명의 바람직한 실시예에 따른 고출력 백색광 LED 패키지 모듈(10)의 사시도이고, 도2는 도1의 고출력 백색광 LED 패키지 모듈(10)의 분해 사시도이다. 도1 및 도2를 참조하면, 본 발명의 고출력 백색광 LED 패키지 모듈(10)는 렌즈(20), 형광체 재료(30), 하우징(40), 금속 인쇄회로기판(50)을 포함한다.
1 is a perspective view of a high power white light LED package module 10 according to a preferred embodiment of the present invention with reference to the accompanying drawings, Figure 2 is an exploded perspective view of the high power white light LED package module 10 of FIG. 1 and 2, the high power white light LED package module 10 of the present invention includes a lens 20, a phosphor material 30, a housing 40, and a metal printed circuit board 50.

먼저, 고출력 백색광 LED 패키지 모듈(10)을 제조하기 위해서는 도3, 4, 5에서 도시된 바와 같은 금속 인쇄회로기판(50)를 준비한다.
First, in order to manufacture the high power white light LED package module 10, a metal printed circuit board 50 as shown in FIGS. 3, 4 and 5 is prepared.

금속 인쇄회로기판(50)은 하부로부터 기판금속층(53), 절연층(56), 배선금속층(57), 보호층으로 적층된 인쇄회로기판으로 절연층(56)은 LED 칩(55)이 탑제되는 부분만 제거되며, 배선금속층(57)은 탑제되는 LED 칩(55)의 개수에 따라 직렬 및 병렬 또는 직렬과 병렬을 혼합한 배선부의 개수와 트레이스의 형상이 달라지며, 보호층은 LED 칩(55)이 탑제되는 부분과 LED 패키징시 사용되는 와이어본딩용 패드와 외부 전원연결 패드(54)만을 제외하고 상부의 모든 층을 덮도록 형성한다.
The metal printed circuit board 50 is a printed circuit board laminated with a substrate metal layer 53, an insulating layer 56, a wiring metal layer 57, and a protective layer from below, and the insulating layer 56 has an LED chip 55 mounted thereon. Only the portions to be removed are removed, and the wiring metal layer 57 has a different shape and number of traces in series and in parallel or a combination of series and parallel according to the number of LED chips 55 mounted thereon. 55) is formed to cover all the upper layer except for the mounting portion and the wire bonding pad and the external power connection pad 54 used in the LED packaging.

여기서, 도3 및 도5에서 도시한 바와 같은 하나의 금속 인쇄회로기판(50)을 구성하거나 같은 형태의 금속 인쇄회로기판(50)을 여러 개로 배열하는 형태로 구성된다.
Here, one metal printed circuit board 50 as shown in FIGS. 3 and 5 is configured, or a plurality of metal printed circuit boards 50 of the same type are arranged.

기판금속층(53)의 재료는 알루미늄 또는 구리 등의 열 전도성 합금재료를 사용하여 만들어지며, 하우징(40)이 금속 인쇄회로기판(50)에 고정하여 성형되도록 금속 인쇄회로기판(50)에 다수의 카운트보어, 카운트싱크 형상의 관통홀(52)이 형성된다.
The material of the substrate metal layer 53 is made of a thermally conductive alloy material such as aluminum or copper, and a plurality of metal printed circuit boards 50 are formed to fix the housing 40 to the metal printed circuit board 50. A through hole 52 having a count bore and a count sink shape is formed.

이에 따라, 탑제되는 LED 칩(55)의 하부를 통해 기판금속층(53)으로 신속한 열 방출이 가능해진다.
Accordingly, rapid heat dissipation is possible to the substrate metal layer 53 through the lower portion of the LED chip 55 mounted thereon.

다음, 도6에서 도시된 바와 같은 도3, 4, 5에서 준비된 금속 인쇄회로기판(50) 위에 하우징(40)을 성형한다. 여기서는 인써트 몰드(insert mold) 방식으로 성형할 경우, 하우징(40)의 관통홀 지지부(43)에 의해 금속 인쇄회로기판(50)과 분리되지 않도록 고정 되어지며, 렌즈(20)를 회전하여 하우징(40)에 결속되도록 하우징(40)의 외부면에 하우징 결속홈(42)을 형성한다. 재질은 내열성이 우수한 엔지니어링 플라스틱 또는 세라믹 소재를 사용하여 만들어지며, 하우징(40) 내부의 반사기(41)는 반사율을 높이기 위해 별도의 코팅막을 형성할 수 있다.
Next, the housing 40 is formed on the metal printed circuit board 50 prepared in FIGS. 3, 4, and 5 as shown in FIG. In this case, when molding in an insert mold method, the through hole support 43 of the housing 40 is fixed so as not to be separated from the metal printed circuit board 50, and the lens 20 is rotated so that the housing ( The housing binding groove 42 is formed on the outer surface of the housing 40 so as to bind to the 40. The material is made of an engineering plastic or ceramic material having excellent heat resistance, and the reflector 41 inside the housing 40 may form a separate coating film to increase the reflectance.

다음, 도7에서 도시된 바와 같은 도6에서 준비된 하우징(40)이 성형된 반사기(41)내 금속 인쇄회로기판(50)에 탑제된 LED 칩(55)에 대해 다이본딩 및 와이어본딩 공정을 수행한 후 투명한 고내열성 실리콘 또는 합성수지 등의 패키징 봉지제(61)를 밀봉하여 경화한다.
Next, a die bonding and wire bonding process is performed on the LED chip 55 mounted on the metal printed circuit board 50 in the reflector 41 in which the housing 40 prepared in FIG. 6 as shown in FIG. After that, the packaging encapsulant 61 such as transparent high heat resistant silicone or synthetic resin is sealed and cured.

여기서, 패키징 봉지제(61)는 LED 칩(55), 다이접착제, 금속와이어가 외부로부터 발생할 수 있는 손상으로부터 보호하는 역할을 하며, LED 칩(55)에서 발광된 UV 또는 청색 파장대의 빛을 투과하며, 렌(20)에 도포된 형광체 재료(30)를 통해 백색광으로 여기된다.
Here, the packaging encapsulant 61 serves to protect the LED chip 55, the die adhesive, and the metal wire from damage that may occur from the outside, and transmits the UV or blue wavelength band emitted from the LED chip 55. And excited with white light through the phosphor material 30 applied to the len 20.

도8은 도7에서 도시된 바와 같은 패키징이 완료된 금속 인쇄회로기판(50) 위의 하우징(40)과 탈착이 가능한 렌즈(20)를 성형하고, 렌즈(20)에 형광체 재료(30)를 도포하는 단계에서의 사시도이다.
FIG. 8 forms a detachable lens 20 with a housing 40 on a metal printed circuit board 50 having a packaging as shown in FIG. 7, and applies a phosphor material 30 to the lens 20. It is a perspective view at the stage to perform.

여기서, 렌즈(20)는 유리 또는 PC, PMMA 등의 투과율이 높은 합성수지을 사용하여 성형하고, 성형된 렌즈(20)의 형광체 도포면(21) 위치에 형광체 재료(30)를 투명한 액상 실리콘 및 에폭시와 혼합하여 액상 형태로 도포한 후 열 경화하고 또는 UV를 조사하여 경화하는 것과 경화 후 시트 형태로 부착하는 방법으로 형성되며, 하우징(40)의 반사기(41)와 대향하는 렌즈(20)의 형광체 도포면(21)은 원형, 사각형, 직사각형, 타원형, 다각형 등의 다양한 형상으로 제조할 수 있다.
Here, the lens 20 is molded using glass or a synthetic resin having a high transmittance such as PC or PMMA, and the phosphor material 30 is mixed with transparent liquid silicone and epoxy at the phosphor coating surface 21 of the molded lens 20. It is formed by applying in a liquid form and then heat-curing or curing by irradiation with UV and attaching it in the form of a sheet after curing, and the phosphor coating surface of the lens 20 facing the reflector 41 of the housing 40 ( 21 may be manufactured in various shapes such as round, square, rectangular, elliptical, polygonal and the like.

따라서, 도포되는 형광체 재료(30)의 재질에 따라 다양한 색온도의 백색광을 갖는 렌즈(20)를 구비하게 된다.
Therefore, the lens 20 having white light of various color temperatures is provided according to the material of the phosphor material 30 to be applied.

또한, 도6에서 성형된 하우징(40)의 하우징 결속홈(42)에 상응하는 렌즈 결속홈(22)을 형성하여 손쉽게 탈착이 가능해지며, 렌즈(20)의 형상은 원하는 지향각을 구현하기 위해 다양한 형상으로 제조할 수 있다.
In addition, by forming a lens binding groove 22 corresponding to the housing binding groove 42 of the housing 40 molded in Figure 6 can be easily removable, the shape of the lens 20 to achieve the desired orientation angle It can be produced in various shapes.

다음, 렌즈(20)와 하우징(30)이 결속될 때, 렌즈(20)에 도포된 형광체 재료(30)와 금속 인쇄회로기판(50)에 장착된 LED 칩(55)과는 일정한 간격을 갖게 되어 종래의 LED 칩(55) 위에 형광체 재료(30)가 도포된 방식보다 형광체 재료(30)의 열 안정성이 향상된다.
Next, when the lens 20 and the housing 30 are bound, there is a constant distance between the phosphor material 30 applied to the lens 20 and the LED chip 55 mounted on the metal printed circuit board 50. Thus, the thermal stability of the phosphor material 30 is improved compared to the method in which the phosphor material 30 is applied on the conventional LED chip 55.

도9는 도1의 고출력 백색광 LED 패키지 모듈(10)의 일부의 결절된 측면도를 도시한다.
FIG. 9 shows a nodular side view of a portion of the high power white light LED package module 10 of FIG. 1.

20 : 렌즈 21 : 형광체 도포면
22 : 렌즈 결속홈 30 : 형광체 재료
40 : 하우징 41 : 반사기
42 : 하우징 결속홈 43 : 관통홀 지지부
50 : 금속 인쇄회로기판 51 : LED 칩 탑재부
52 : 카운트보어, 싱크 관통홀 53 : 기판금속층
54 : 전원연결 패드 55 : LED 칩
56 : 절연층 57 : 배선금속층
61 : 패키징 봉지재20 lens 21 phosphor coated surface
22 lens binding groove 30 phosphor material
40 housing 41 reflector
42: housing binding groove 43: through hole support
50: metal printed circuit board 51: LED chip mounting portion
52: count bore, sink through hole 53: substrate metal layer
54: power connection pad 55: LED chip
56: insulating layer 57: wiring metal layer
61: packaging encapsulant

Claims (10)

LED 칩을 탑제하고, 하우징을 성형하기 위한 금속 인쇄회로기판; 및 상기 하우징과 상응하여 탈착할 수 있는 구조와 형광체 재료를 내부에 갖는 다양한 형상의 렌즈를 포함하는 것을 특징으로 하는 고출력 백색광 LED 패키지 모듈.A metal printed circuit board on which the LED chip is mounted and the housing is molded; And lenses of various shapes having a structure and a phosphor material detachable therein corresponding to the housing. 제1항에 있어서,
상기 금속 인쇄회로기판은 LED 칩이 탑제될 부분에는 절연층이 존재하지 않고, LED 칩의 하부를 통해 기판금속층으로 열 방출이 이루어지는 구조를 갖는 것을 특징으로 하는 고출력 백색광 LED 패키지 모듈.The method of claim 1,
The metal printed circuit board of the high power white light LED package module, characterized in that the insulating layer does not exist in the portion where the LED chip is mounted, the heat is emitted to the substrate metal layer through the lower portion of the LED chip. 제1항에 있어서,
상기 금속 인쇄회로기판은 하우징이 고정하여 성형되도록 카운트보어, 카운트싱크 형상의 관통 홀을 갖는 것을 특징으로 하는 고출력 백색광 LED 패키지 모듈.The method of claim 1,
The metal printed circuit board is a high power white light LED package module, characterized in that the through-hole has a count bore, the count sink shape so that the housing is fixed and molded. 제1항에 있어서,
상기 하우징은 내열성이 우수한 엔지니어링 플라스틱 또는 세라믹 소재의 재질로 성형하는 것을 특징으로 하는 고출력 백색광 LED 패키지 모듈The method of claim 1,
The housing is a high-output white light LED package module, characterized in that molded in a material of engineering plastic or ceramic material with excellent heat resistance 제1항에 있어서,
상기 하우징은 상기 렌즈를 회전하여 탈착할 수 있도록 하우징에 결속홈을 갖는 것을 특징으로 하는 고출력 백색광 LED 패키지 모듈.The method of claim 1,
The housing is a high power white light LED package module, characterized in that it has a binding groove in the housing to be detachable by rotating the lens. 제1항에 있어서,
상기 렌즈는 상기 하우징에 회전하여 탈착할 수 있도록 렌즈에 결속홈을 갖는 것을 특징으로 하는 고출력 백색광 LED 패키지 모듈.The method of claim 1,
The lens is a high power white light LED package module, characterized in that it has a binding groove in the lens to be detachable by rotating in the housing. 제1항에 있어서,
상기 렌즈는 상기 하우징의 반사기와 대향하는 렌즈의 형광체 도포면에 형광체 재료를 도포할 수 있도록 원형, 사각형, 직사각형, 타원형, 다각형 등의 형상과 같은 공간을 형성하며, 상기 금속 인쇄회로기판에 탑제된 LED 칩과 일정한 간격을 갖는 것을 특징으로 하는 고출력 백색광 LED 패키지 모듈.The method of claim 1,
The lens forms a space such as a circle, a rectangle, a rectangle, an ellipse, a polygon, and the like so as to apply a phosphor material on a phosphor coating surface of the lens facing the reflector of the housing, and the LED mounted on the metal printed circuit board. A high power white light LED package module, characterized in that it has a constant distance from the chip. 제7항에 있어서
상기 렌즈의 형광체 재료는 투명한 액상 실리콘 또는 에폭시와 혼합하여 액상 형태로 도포한 후 열 경화하고 또는 UV를 조사하여 경화하는 것과 경화 후 시트 형태로 부착하는 방법을 포함하는 것을 특징으로 하는 고출력 백색광 LED 패키지 모듈.The method of claim 7, wherein
The phosphor material of the lens is mixed with transparent liquid silicone or epoxy, and then applied in a liquid form, followed by heat curing or curing by irradiation with UV and attaching in a sheet form after curing. module. 제1항에 있어서
상기 렌즈는 백색광의 지향각을 조절하기 위해 다양한 형상을 갖는 것을 특징으로 하는 고출력 백색광 LED 패키지 모듈The method of claim 1
The lens has a high output white light LED package module, characterized in that it has a variety of shapes to adjust the directivity angle of the white light 제9항에 있어서
상기 렌즈는 투과율이 높은 합성수지 또는 석영, 유리 소재의 재질로 성형하는 것을 특징으로 하는 고출력 백색광 LED 패키지 모듈. The method of claim 9
The lens is a high power white light LED package module, characterized in that the molding of high transmittance synthetic resin or quartz, glass material.
KR1020120023743A 2012-03-08 2012-03-08 Method of manufacturing high power white led package module KR20120039590A (en)

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