CN202834816U - Light-emitting device - Google Patents
Light-emitting device Download PDFInfo
- Publication number
- CN202834816U CN202834816U CN2012202268020U CN201220226802U CN202834816U CN 202834816 U CN202834816 U CN 202834816U CN 2012202268020 U CN2012202268020 U CN 2012202268020U CN 201220226802 U CN201220226802 U CN 201220226802U CN 202834816 U CN202834816 U CN 202834816U
- Authority
- CN
- China
- Prior art keywords
- light
- emitting device
- platform part
- circuit layer
- support portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
A light-emitting device comprises a light seat, a circuit layer, at least one light-emitting diode chip, a driving circuit element, a plurality of electric elements and a conductive connector. The light seat comprises a supporting portion and a platform portion connected at one side of the supporting portion. The circuit layer is arranged at the platform portion, the light-emitting diode chip is arranged on the platform portion and forms electric connection with the circuit layer, the driving circuit is arranged on the platform portion and forms electric connection with the circuit layer, the plurality of electrical elements are arranged on the platform portion and forms electric connection with the circuit layer, and the conductive connector is arranged at the other end of the supporting portion.
Description
Technical field
The utility model relates to a kind of light-emitting device, relates in particular to a kind of light emitting diode that utilizes as the light-emitting device of light emitting source.
Background technology
Light emitting diode (light emitting diode, LED) have that volume is little, long service life, the advantage such as cracky, not mercurous and power saving not, therefore little by little replace the status of fluorescent tube and incandescent lamp bulb, be widely used in lighting source and decorative light-source.
Yet light emitting diode is compared to other light sources, and the power large light emitting diode of healing more easily produces the problem of heat radiation, and its main cause is that light emitting diode can't be by infrared radiation to dispel the heat.Secondly, the multi-level encapsulation of light emitting diode makes and produces the junction thermal resistance between different junctions, causes light emitting diode can't effectively reduce temperature.Generally speaking, too high operating temperature meeting is so that light emitting diode reduces light output quantity (light decay) and produces colour cast, and the accelerated luminescence diode is aging, and shortened its service life.
Secondly, for increasing radiating effect, existing light emitting diode bulb is to use the metal with high thermal conductivity coefficient, as: aluminium, as lamp socket, with the heat energy that accelerates to produce when the diversion light emitting diode bulb is lighted; Yet metal itself also has high conductivity, therefore when the user changes or touches this light emitting diode bulb, may produce Danger Electric shock risk.
The utility model content
Described in view of prior art, a purpose of the present utility model is to provide a kind of light-emitting device, and the lamp socket of this light-emitting device is to use ceramic post sintering to form, and has good thermal conductivity and insulating properties.
For achieving the above object, the utility model provides a kind of light-emitting device, comprises:
One lamp socket has the platform part that a support portion and is connected in a side of this support portion;
One circuit layer is arranged at this platform part;
At least one light-emitting diode chip for backlight unit is arranged at this platform part and forms electric connection with this circuit layer;
The one drive circuit element is arranged at this platform part and forms electric connection with this circuit layer;
A plurality of electronic components are arranged at this platform part and form electric connection with this circuit layer; And
One conductive contact is arranged at the opposite side of this support portion.
Above-mentioned light-emitting device, wherein this support portion and this platform part are formed in one.
Above-mentioned light-emitting device, wherein this support portion and this platform part are identical ceramic powders sinter molding part.
Above-mentioned light-emitting device, wherein this support portion and this platform part are different ceramic powders sinter molding parts.
Above-mentioned light-emitting device, wherein this circuit layer is formed at this platform part by common burning mode.
Above-mentioned light-emitting device, wherein this platform part has a groove.
Above-mentioned light-emitting device, wherein this circuit layer is extended in this groove by this platform part.
Above-mentioned light-emitting device wherein also comprises a printing opacity colloid that is arranged in this groove.
Above-mentioned light-emitting device wherein also comprises a printing opacity cover body, is combined with this lamp socket and seals this light-emitting diode chip for backlight unit.
Above-mentioned light-emitting device wherein also comprises a plurality of wires, and an end of these a plurality of wires is connected in this conductive contact, and the other end is connected in this circuit layer.
Above-mentioned light-emitting device, wherein this platform part also comprises a perforation, and an end of these a plurality of wires is connected to this circuit layer by this perforation.
Above-mentioned light-emitting device, wherein the outside wall surface of this support portion comprises a plurality of fin that are radial arrangement, and these a plurality of fin and this support portion are formed in one.
Comprehensive the above, lamp socket of the present utility model is to use the ceramic post sintering moulding, it has good thermal conductivity, the heat energy that produces when thereon light-emitting diode chip for backlight unit of diversion setting, components of drive circuit and electronic component operation rapidly; Secondly, the lamp socket that pottery is made has high-insulativity, gets an electric shock in the time of can avoiding personnel to install, and increases safety in utilization.
Below in conjunction with the drawings and specific embodiments the utility model is described in detail, but not as to restriction of the present utility model.
Description of drawings
Fig. 1 is the stereogram of the light-emitting device of the utility model the first embodiment;
Fig. 2 is the cutaway view of the light-emitting device of the utility model the first embodiment;
Fig. 3 is the stereogram of the light-emitting device of the utility model the second embodiment;
Fig. 4 is the partial sectional view of the light-emitting device of the utility model the second embodiment;
Fig. 5 is the stereogram of the light-emitting device of the utility model the 3rd embodiment;
Fig. 6 is the light-emitting device cutaway view of the utility model the 3rd embodiment.
Wherein, Reference numeral
10,10a, 10b light-emitting device
110,110a lamp socket
112,112b support portion
114,114a, 114b platform part
1,120 first sides
1,122 second sides
1124 fin
114 platform part
1140,1140b perforation
The 1142a groove
120 circuit layers
130 light-emitting diode chip for backlight unit
140 components of drive circuit
150 electronic components
160 conductive contacts
170 printing opacity cover bodies
180 wires
190a printing opacity colloid
The 192a Wavelength conversion substance
The specific embodiment
Please refer to the accompanying drawing of enclosing, above extra purpose, feature and the advantage of reaching of the present utility model will be understood by following illustrative and non-limiting the describing better in detail of preferred embodiment of the present utility model.
Cooperate and consult Fig. 1 and Fig. 2, be respectively stereogram and the cutaway view of the light-emitting device of the utility model the first embodiment.This light-emitting device 10 comprises a lamp socket 110, a circuit layer 120, at least one light-emitting diode chip for backlight unit 130, one drive circuit element 140, a plurality of electronic component 150, a conductive contact 160 and a printing opacity cover body 170.
This lamp socket 110 is to use the ceramic powders sintering to form, and has the advantages such as high stability, high-insulativity and good heat conductive effect.This lamp socket 110 has a support portion 112 and a platform part 114, and this support portion 112 has one first side 1120 and second side 1122 in contrast to this first side 1120.The diameter of this support portion 112 be from this first side 1120 towards moving closer to this second side 1122 constriction gradually, make this support portion 112 roughly cup-shaped.The outside wall surface of this support portion 112 comprises a plurality of fin 1124 that are radial arrangement, the heat energy that produces when using this light-emitting diode chip for backlight unit 130 of rapidly diversion and lighting, and these a plurality of fin 1124 preferably are formed in one with this support portion 112.
This platform part 114 is connected in this first side 1120 of this support portion 112, and this platform part 114 has at least one perforation 1140.In the present embodiment, this support portion 112 and this platform part 114 are to use identical ceramic powders, as: aluminium oxide (Al2O3), through sinter molding, and preferably, this support portion 112 and this platform part 114 are formed in one, thus, not only can effectively simplify production process, more can strengthen the physical strength of this lamp socket 110.
This circuit layer 120 is positioned at this platform part 114, this circuit layer 120 be for copper, silver or other conductive material made, its generation type can utilize thickness or film mode via high temperature sintering to be formed on this platform part 114.
This light-emitting diode chip for backlight unit 130 is arranged at this platform part 114, and forms electric connection with this circuit layer 120.The quantity of this light-emitting diode chip for backlight unit 130 can be for one or more, in the present embodiment, take one as the example explanation.This light-emitting diode chip for backlight unit 130 can be crystal covering type (flip-chip encapsulation) light-emitting diode chip for backlight unit, be electrically connected for directly forming with this circuit layer 120, perhaps, this light-emitting diode chip for backlight unit 130 also can be the light-emitting diode chip for backlight unit of Bipolar electrode or rectilinear electrode, and engages (wire bonding) mode and the 120 formation electric connections of this circuit layer by routing.
This components of drive circuit 140 and these a plurality of electronic components 150 are arranged at this platform part 114 respectively, and be electrically connected with this circuit layer 120, these a plurality of components of drive circuit 140 and this a plurality of electronic components 150 cooperate this light-emitting diode chip for backlight unit 130 of driving luminous, wherein these a plurality of electronic components 150 can be resistance, electric capacity or other passive electronic component, and cooperate electronic circuits such as consisting of rectification, filtering, light modulation with this components of drive circuit 140.By this light-emitting diode chip for backlight unit 130, this components of drive circuit 140 and this electronic component 150 directly are arranged on the platform part 114, can drive circuit be set separately in these 112 inside, support portion, can effectively dwindle the volume of this lamp socket 110.
This conductive contact 160 is connected in this second side 1122 of this support portion 112, and this conductive contact 160 is for being bolted in the general contact holder (not shown), in order to be electrically connected to an AC power; In the present embodiment, this conductive contact 160 can be E26 or E27 conductive contact, does not then limit with this during actual enforcement.A plurality of wires 180 are to connect this conductive contact 160 and this conductive layer 120, in order to this conductive contact 160 from the power delivery of this contact holder acquisition to this conductive layer 120, with these a plurality of components of drive circuit 140 of conducting, this a plurality of electronic components 150 and this light-emitting diode chip for backlight unit 130.In the present embodiment, these a plurality of wires 180 are positioned at this supporting seat 112 inside, and the one end connects this conductive contact 160, and the other end is to connect this circuit layer 120 by this perforation 1140, to be electrically connected this conductive contact 160 and this circuit layer 120.
This printing opacity cover body 170 is arranged at this first side 1120 of this support portion 112, and reaches these a plurality of electronic components 150 with this this light-emitting diode chip for backlight unit 130 of support portion 112 fitted seal, this components of drive circuit 140.This printing opacity cover body 170 is to use the light-transmitting materials such as resin, plastic cement or glass to make, and can be transparence, translucent or cloudy surface shape according to the difference of light penetration rate; In the present embodiment, this printing opacity cover body 170 roughly is hemispherical, and during actual enforcement, this printing opacity cover body 170 can be the cover body of other special lamp shape according to the difference of application scenario.
Cooperate and to consult Fig. 3 and Fig. 4, be stereogram and the partial sectional view of the light-emitting device of the utility model the second embodiment.The light-emitting device 10a of the present embodiment and the light-emitting device 10 of the first embodiment are similar, and identical element marking is with identical symbol.Difference that it should be noted that both is: the platform part 114a of lamp socket 110a as shown in Figures 3 and 4.
This platform part 114a has a groove 1142a, this groove 1142a cooperates by suitable mould, make this lamp socket 110a when moulding, have this groove 1142a, and need not utilize other following process mode to make this groove 1142a at this platform part 114a, thus, can simplify production process and promote yield.
This circuit layer 120 is positioned at this platform part 114a, and is extended in this groove 1142a by this platform part 114a, and forms two contacts independently in the bottom of this groove 1142a.This light-emitting component 130 is arranged in this groove 1142a, and is electrically connected with this two point.
Secondly, the light-emitting device 10a of the present embodiment also comprises a printing opacity colloid 190a who is arranged at 1142a in this groove, and this printing opacity colloid 190a coats this light-emitting diode chip for backlight unit 130, and roughly is hemispherical, uses to promote and gets optical efficiency.This printing opacity colloid 190a inside can also comprise a Wavelength conversion substance 192a, and this Wavelength conversion substance 192a is subject to the part light that this light-emitting diode chip for backlight unit 130 sends and excites rear generation one light wavelength conversion line.In the present embodiment, the light that this light-emitting diode chip for backlight unit 130 sends is take blue light as example, and this Wavelength conversion substance 192a is stimulated this light wavelength conversion line of rear generation take gold-tinted as example, can be for forming white light behind this light wavelength conversion line and the other parts blue light mixed light; When reality is implemented, photochromic after exciting of photochromic and this Wavelength conversion substance 192a that can adjust this light-emitting diode chip for backlight unit 130 according to actual demand and restriction.
The function of other element of light-emitting device 10a and related description, in fact the light-emitting device 10 with the first embodiment is identical, does not repeat them here.Light-emitting device 10a is to reaching the function identical with light-emitting device 10.
Cooperate and to consult Fig. 5 and Fig. 6, be stereogram and the cutaway view of the light-emitting device of the utility model the 3rd embodiment.The light-emitting device 10b of the present embodiment and the light-emitting device 10 of the first embodiment are similar, and identical element marking is with identical symbol.Difference that it should be noted that both is: use at least two kinds of ceramic powders sintering to form such as Fig. 5 and lamp socket 110b shown in Figure 6.
In the present embodiment, support portion 112b forms with carborundum (SiC) sintering, and platform part 114b forms with alumina sintering, and preferably, this support portion 112b and this platform part 114b are formed in one.The combination of the ceramic raw material by two unlike materials not only can make this lamp socket 110b have different colors, makes to reach aesthetic; Secondly, this platform part 114b that utilizes the aluminium oxide of white tone to form can reflect the light that this light-emitting diode chip for backlight unit 130 sends, and makes the light of the overwhelming majority all can be towards the direction outgoing of this printing opacity cover body 170; And this support portion 112b that utilizes the high carborundum of hardness to form, the carborundum that can reduce the probability of damaged in collision and can avoid being black tone absorbs the light that light-emitting diode chip for backlight unit 130 sends.
In addition, the centre of this platform part 114b has a perforation 1140b, and by this, a plurality of wires 180 can be electrically connected this circuit layer 120 and this conductive contact 160 by this 1140b that bores a hole.This components of drive circuit 140 and these a plurality of electronic components 150 are arranged at this platform part 114b respectively, and are surrounded on this perforation 1140b.
The light-emitting device 10b of the present embodiment also comprises a plurality of light-emitting diode chip for backlight unit 130, these a plurality of light-emitting diode chip for backlight unit 130 are arranged at equally spacedly this platform part 114b and around these components of drive circuit 140 and these a plurality of electronic components 150, use and reduce the probability that light is covered by this components of drive circuit 140 and this a plurality of electronic components 150.
The function of other element of light-emitting device 10b and related description, in fact identical with the first embodiment light-emitting device 10, do not repeat them here.Light-emitting device 10b is to reaching the function identical with light-emitting device 10.
Comprehensive the above, lamp socket of the present utility model is to use the ceramic post sintering moulding, it has good thermal conductivity, the heat energy that produces when thereon light-emitting diode chip for backlight unit of diversion setting, components of drive circuit and electronic component operation rapidly; Secondly, the lamp socket that pottery is made has high-insulativity, gets an electric shock in the time of can avoiding personnel to install, and increases safety in utilization.
Certainly; the utility model also can have other various embodiments; in the situation that do not deviate from the utility model spirit and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the utility model.
Claims (12)
1. a light-emitting device is characterized in that, comprises:
One lamp socket has the platform part that a support portion and is connected in a side of this support portion;
One circuit layer is arranged at this platform part;
At least one light-emitting diode chip for backlight unit is arranged at this platform part and forms electric connection with this circuit layer;
The one drive circuit element is arranged at this platform part and forms electric connection with this circuit layer;
A plurality of electronic components are arranged at this platform part and form electric connection with this circuit layer; And
One conductive contact is arranged at the opposite side of this support portion.
2. light-emitting device according to claim 1 is characterized in that, this support portion and this platform part are formed in one.
3. light-emitting device according to claim 2 is characterized in that, this support portion and this platform part are identical ceramic powders sinter molding part.
4. light-emitting device according to claim 2 is characterized in that, this support portion and this platform part are different ceramic powders sinter molding parts.
5. light-emitting device according to claim 1 is characterized in that, this circuit layer is formed at this platform part by common burning mode.
6. light-emitting device according to claim 1 is characterized in that, this platform part has a groove.
7. light-emitting device according to claim 6 is characterized in that, this circuit layer is extended in this groove by this platform part.
8. light-emitting device according to claim 6 is characterized in that, also comprises a printing opacity colloid that is arranged in this groove.
9. light-emitting device according to claim 1 is characterized in that, also comprises a printing opacity cover body, is combined with this lamp socket and seals this light-emitting diode chip for backlight unit.
10. light-emitting device according to claim 1 is characterized in that, also comprises a plurality of wires, and an end of these a plurality of wires is connected in this conductive contact, and the other end is connected in this circuit layer.
11. light-emitting device according to claim 10 is characterized in that, this platform part also comprises a perforation, and an end of these a plurality of wires is connected to this circuit layer by this perforation.
12. light-emitting device according to claim 1 is characterized in that, the outside wall surface of this support portion comprises a plurality of fin that are radial arrangement, and these a plurality of fin and this support portion are formed in one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202268020U CN202834816U (en) | 2012-05-18 | 2012-05-18 | Light-emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202268020U CN202834816U (en) | 2012-05-18 | 2012-05-18 | Light-emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202834816U true CN202834816U (en) | 2013-03-27 |
Family
ID=47946519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012202268020U Expired - Fee Related CN202834816U (en) | 2012-05-18 | 2012-05-18 | Light-emitting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202834816U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103423615A (en) * | 2012-05-18 | 2013-12-04 | 元宏国际股份有限公司 | Light-emitting device |
-
2012
- 2012-05-18 CN CN2012202268020U patent/CN202834816U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103423615A (en) * | 2012-05-18 | 2013-12-04 | 元宏国际股份有限公司 | Light-emitting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10627098B2 (en) | LED filament and LED light bulb having the same | |
| JP2016539480A (en) | Spiral LED filament and light bulb using the spiral LED filament | |
| JP2012248687A (en) | Light-emitting module and illumination apparatus | |
| CN201539737U (en) | LED lamp | |
| CN203892915U (en) | Linear LED (light-emitting diode) luminous body and LED lighting lamp | |
| TWM437919U (en) | Light emission device | |
| CN202708685U (en) | Light-emitting diode (LED) bulb | |
| CN203868766U (en) | Efficient heat-dissipation LED lamp | |
| CN103775858A (en) | 4 pi emergent light LED (Light Emitting Diode) light emitting pipe with chip flipped in transparent ceramic tube and illuminating lamp | |
| CN106468404A (en) | LED filament and LEDbulb lamp | |
| US20140016324A1 (en) | Illuminant device | |
| CN104896324B (en) | Illumination light source and lighting device | |
| CN202834816U (en) | Light-emitting device | |
| CN203218334U (en) | LED bulb lamp packaging structure | |
| CN104747934A (en) | LED lighting device providing directed beams | |
| CN203273408U (en) | Light source for illumination | |
| CN103423617A (en) | Light emitting diode module | |
| CN202691653U (en) | LED (light emitting diode) module | |
| CN203322806U (en) | LED (light-emitting diode) light source module capable of linear light emitting | |
| CN203489066U (en) | Whole-body light-emitting LED light source and LED lamp | |
| CN103423615A (en) | Light-emitting device | |
| CN206505946U (en) | A kind of LED/light source of specular removal | |
| CN202691654U (en) | Light emitting device | |
| CN204534218U (en) | The height heat radiation four sides light emitting LED lamp of a kind of light source and power supply one | |
| CN204885156U (en) | LED light source module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130327 Termination date: 20140518 |