CN203489066U - Whole-body light-emitting LED light source and LED lamp - Google Patents
Whole-body light-emitting LED light source and LED lamp Download PDFInfo
- Publication number
- CN203489066U CN203489066U CN201320618722.4U CN201320618722U CN203489066U CN 203489066 U CN203489066 U CN 203489066U CN 201320618722 U CN201320618722 U CN 201320618722U CN 203489066 U CN203489066 U CN 203489066U
- Authority
- CN
- China
- Prior art keywords
- led chip
- light source
- led
- led light
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a whole-body light-emitting LED light source which comprises a substrate, an LED chip arranged on the substrate and a fluorescent gel layer. The substrate is transparent, a through hole is formed in the transparent substrate, a thermoelectric connecting piece is arranged in the through hole, one end, close to the LED chip, of the thermoelectric connecting piece is connected with an LED chip connected electrode, the other end of the thermoelectric connecting piece is connected with a circuit connected electrode, and the LED chip connected electrode is electrically connected with the LED chip. According to the whole-body light-emitting LED light source, the transparent substrate and the thermoelectric connecting piece are adopted, the light-emitting angle can be enlarged, the heat dissipation performance can be improved, the using stability of the whole-body light-emitting LED light source is improved, and the service life is prolonged. The utility model further discloses an LED lamp. As the transparent substrate in the whole-body light-emitting LED light source is perpendicular to a circuit board, and vertical installation is adopted, in the LED lamp, approximate six faces of the whole-body light-emitting LED light source can emit light, the light-emitting angle is greatly enlarged, and 360-degree light emitting can be almost achieved.
Description
Technical field
The utility model relates to LED light source field, is specifically related to a kind of LED light source and LED light fixture of entirely lighting.
Background technology
Semiconductor light-emitting-diode (LED) is a kind of semiconductor that can be visible ray by electric energy conversion, it has changed the luminous principle luminous with electricity-saving lamp tricolor powder of incandescent lamp tungsten filament, and employing electroluminescence, the advantage of LED is very obvious, has that the life-span is long, light efficiency is high, an advantage such as radiationless and low-power consumption.LED has started to be widely used in the fields such as outdoor lighting, view brightening, agricultural illumination.
LED illumination is considered to one of 21 century field most with prospects, and it, also will be for promoting energy-saving and emission-reduction, set up conservation-minded society and make major contribution when causing illumination revolution.Semiconductor light-emitting-diode (LED) illumination just replaces traditional lighting industry with irresistible trend, in < < semiconductor lighting development in science and technology " 12 " ad hoc planning > >, propose, country is by the special product of supporting to have independent intellectual property right of emphasis.
At present, what LED illumination was the most frequently used is exactly white light LEDs, white light LEDs has the advantages such as low-voltage, low energy consumption, long-life, high reliability, easy care, meet the energy-conservation requirement with environmental protection of Green Lighting Project, the main path that produces white light LEDs has following several: one, utilize the principle of three primary colours and at present three kinds of LED of fertile red, green, blue in the ratio of light intensity 1:2:0.38, mix white light; Two, blue led chip is combined with the gold-tinted fluorescent material that can effectively be excited by blue light and is formed white light; Three, adopt to send out the LED chip of ultraviolet light and can effectively be excited by ultraviolet light and launch the fluorescent material of red, green, blue three primary colours, producing polychrome and be mixed to form white light.Wherein, modal is to apply one deck yellow fluorescent powder at blue-light LED chip.
Chip LED(patch light-emitting diode) light source is a kind of as LED light source, has been subject to application more and more widely.Existing chip LED light source mainly comprises PCB substrate (printed circuit board) and is arranged on PCB substrate upper conductor support, and wire support extends to bottom from the side of substrate, forms respectively two electrodes, and this two electrode connects for external circuit.Traditional chip LED light source at most only can be accomplished 5 bright dippings, has limited the rising angle of chip LED light source, and simultaneously the light loss that of chip cannot bright dipping have also been caused at the back side, has finally reduced the light efficiency of LED light source.
Granted publication is number for the Chinese utility model patent of CN202797085U discloses a kind of novel C hip LED device, comprises metal substrate, at least one is arranged at the LED chip of metal substrate upper surface and the packing colloid that metal substrate, LED chip are sealed together; Described metal substrate comprises at least one chip mount portion and two electrode parts, between described electrode part, by described packing colloid, realize and being electrically insulated, described metal substrate bottom also comprises the rib that at least one caves inward from described metal substrate lower surface, and described packing colloid is filled rib into a single integrated structure with the packing colloid outside rib.Although above-mentioned Chip LED device architecture is simple, device air tightness is good, and thermal diffusivity improves,, its lighting angle is still less, and thermal diffusivity and luminous efficiency need further to be improved simultaneously.
Utility model content
The utility model provides a kind of LED light source of entirely lighting, adopts transparency carrier and thermoelectricity connector, can improve lighting angle and thermal diffusivity.
A kind of LED light source of entirely lighting, comprise substrate, be arranged on LED chip on substrate and for LED chip being encapsulated in to the fluorescent adhesive layer on substrate, described substrate is transparency carrier, described transparency carrier is provided with through hole, described through hole is built-in with thermoelectricity connector, described thermoelectricity connector is connected with LED chip connecting electrode near one end of described LED chip, and the other end of described thermoelectricity connector is connected with circuit connecting electrode, and described LED chip connecting electrode is electrically connected to described LED chip.
In the utility model, adopt transparency carrier, make LED chip send light source and also can see through transparency carrier, thereby greatly improved the lighting angle of the LED light source of the utility model entirely lighting.Between LED chip connecting electrode and circuit connecting electrode, by thermoelectricity connector, be connected, thermoelectricity connector can be realized on the one hand being electrically connected between LED chip connecting electrode and circuit connecting electrode, and thermoelectricity connector also can play good thermolysis on the other hand.
General LED chip has positive and negative polarities, and the LED chip connecting electrode being connected with LED chip both positive and negative polarity is also two, and thermoelectricity connector is also set to two, and the circuit connecting electrode being connected with external circuit plate is also two.
In order to obtain better utility model effect, below as of the present utility model preferably:
Described substrate is glass transparent substrate, ceramic transparency carrier or plastic, transparent substrate, and because the utility model has adopted thermoelectricity connector, therefore, above-mentioned three kinds of transparency carriers can meet user demand well.Further preferably, described substrate is ceramic transparency carrier, not only has good thermal conductivity and temperature tolerance, and realize six luminous, realize the effect of entirely lighting.
The material of described LED chip connecting electrode and circuit connecting electrode is the alloy of a kind of or two or more compositions in gold, silver, nickel, aluminium, tin, select above-mentioned conductive material not only to there is good electric conductivity, and easily by modes such as coatings, be arranged on described substrate.
In a tubular form, instant heating electrical connector hollow, has increased the heat exchange area of thermoelectricity connector to described thermoelectricity connector, can play better thermolysis.
The material of described thermoelectricity connector is copper, silver or aluminium etc., and the thermoelectricity connector of above-mentioned material all has good electric conductivity and heat conductivility.
Described thermoelectricity connector is near the outer rim of described substrate, due to the LED light source of the utility model entirely lighting in use, need fillet welding in the vertical position to be connected on circuit board, thereby increase the lighting angle while using, thermoelectricity connector is arranged on to the outer edge area near substrate, be the also outer rim of close substrate of circuit connecting electrode, thereby facilitate circuit connecting electrode and the welding of external circuit plate.
Described circuit connecting electrode extends to the outer rim of described substrate, further facilitates circuit connecting electrode and the welding of external circuit plate.
The surface area of described circuit connecting electrode is greater than the surface area of described LED chip connecting electrode, facilitates the external of circuit connecting electrode on the one hand, on the other hand, is conducive to the conduction of heat.
Described LED chip is a plurality of, a plurality of LED chips form LED chip array, because thermoelectricity connector in the utility model has improved the thermal diffusivity of the LED light source of the utility model entirely lighting, therefore, the utility model LED chip can arrange a plurality of, still meet heat radiation requirement, there will not be because excess Temperature causes the situation that luminous efficiency is low, thus the luminous intensity of the LED light source of raising the utility model entirely lighting and the raising illumination uniformity.
Each LED chip in described LED chip array adopts series connection or/and mode in parallel connects, generally in LED chip array, adopt series and parallel connections mode and use, be the LED chip that each branch road is in series with some, then these branch circuit parallel connections are formed to LED chip array together.Between the branch road being connected in parallel, if a certain branch road is not worked, can not affect other branch roads, if the some LED chips in a certain branch road are not worked, can cause this branch road normally to work, but can not affect other branch roads, thereby guarantee the normal use of the LED light source of the utility model entirely lighting.
Described fluorescent adhesive layer covers on described LED chip and substrate, fluorescent adhesive layer comprises fluorescent material and packaging body, specifically can adopt two kinds of forms, it is a kind of that to be that described fluorescent adhesive layer comprises two-layer, at described LED chip and substrate, be coated with successively yellow fluorescence layer and encapsulated layer, another kind is that described fluorescent adhesive layer is one deck, and fluorescent material and packaging body mix and cover on described LED chip and substrate.
Described fluorescent material can adopt prior art, as one or more in yttrium-aluminium-garnet, silicate, nitride, nitrogen oxide, fluogermanate.Multiplely refer to two or morely, comprise two kinds.
The shape of described fluorescent adhesive layer can determine according to actual needs, and the profile of described fluorescent adhesive layer can be any geometry.
The material of described packaging body can be selected prior art, specifically can select the hybrid of epoxy resin, silica gel resin or epoxy and silica gel resin etc.
Compared with prior art, the utility model advantage specific as follows:
The LED light source of entirely lighting of the present utility model, adopts transparency carrier, makes LED chip send light source and also can see through transparency carrier, thereby greatly improved the lighting angle of the LED light source of the utility model entirely lighting.Between two LED chip connecting electrodes and two circuit connecting electrodes, by thermoelectricity connector, be connected, thermoelectricity connector can play good electrical connection and thermolysis, improve the stability in use of the LED light source of entirely lighting of the present utility model, and increase the service life.The LED light source excellent performance of entirely lighting of the present utility model, designs by realizing luminous intensity distribution flexibly to the adjusting of phosphor powder layer, packing colloid shape, to meet various application scenarios, has broad application prospects.
In the utility model LED light fixture, in the LED light source of entirely lighting, transparency carrier is vertical with circuit board, adopt the vertical LED light source by entirely lighting to be arranged on circuit board, preferred version adopts vertical welding, make in the utility model LED light fixture, the LED light source of entirely lighting can be nearly 6 luminous, greatly improve lighting angle, almost can realize 360 degree luminous, can improve light extraction efficiency 30%～50%.
Accompanying drawing explanation
Fig. 1 is a kind of structural representation of the LED light source of the utility model entirely lighting;
Fig. 2 is the another kind of structural representation of the LED light source of the utility model entirely lighting.
The specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further details.
As shown in Figure 1, a kind of concrete structure for the LED light source of entirely lighting, comprise transparency carrier 1, be arranged on LED chip 2 and fluorescent adhesive layer on transparency carrier 1, on transparency carrier 1, LED chip 2 place one sides are provided with two LED chip connecting electrodes 3, on transparency carrier 1, with respect to the opposite side of LED chip 2 place one sides, be provided with between 4, two LED chip connecting electrodes 3 of two circuit connecting electrodes and two circuit connecting electrodes 4 and be connected by the thermoelectricity connector 5 being arranged on transparency carrier 1.Transparency carrier 1 Ceramics transparency carrier, LED chip connecting electrode 3 and circuit connecting electrode 4 are gold electrode.Thermoelectricity connector 5 in a tubular form, instant heating electrical connector 5 hollows, the material of thermoelectricity connector be silver.Thermoelectricity connector 5 one end are connected with LED chip connecting electrode 3, and the other end is connected with circuit connecting electrode 4, and thermoelectricity connector 5 is near the outer rim of transparency carrier 1, and circuit connecting electrode 4 is the outer rim of close transparency carrier 1 also, and extend to the outer rim of transparency carrier 1.The surface area of circuit connecting electrode 4 is greater than the surface area of LED chip connecting electrode 3.LED chip 2 is 1.Fluorescent adhesive layer covers on LED chip 2 and transparency carrier 1, and fluorescent adhesive layer comprises fluorescent material and packaging body, and fluorescent material adopts cerium doped yttrium aluminum garnet yellow fluorescent powder (YAG:Ce
3+yellow fluorescent powder, Y
2.94al
5o
12: 0.06Ce
3+), packaging body is selected silica gel (Hangzhou Si Beier electronics corporation, SC7502 transparent silica gel).In Fig. 1, fluorescent adhesive layer adopts two-layer structure, and LED chip 2 and transparency carrier 1 are coated with yellow fluorescence layer 6 and encapsulated layer 7 successively, and encapsulated layer 7 is silica gel packaging layer.Encapsulated layer 7 is semicircle.Transparency carrier 1 is 2cm*2cm*0.5cm, and the radius of encapsulated layer 7 is 0.9cm.The thickness of tubulose thermoelectricity connector 5 is 0.2mm, and internal diameter is 0.16cm.
The preparation of the LED light source of entirely lighting comprises:
1) through-thickness perforate on transparency carrier 1, then two thermoelectricity connectors 5 are placed in hole, at the two ends of thermoelectricity connector 5 welding LED chip connecting electrode 3 and circuit connecting electrode 4;
2) LED chip 2 is connected with LED chip connecting electrode 3, and covers fluorescent adhesive layer;
The preparation that covers fluorescent adhesive layer comprises following concrete steps:
A) by 8g polyvinyl alcohol (powder, Japan's Kuraray, PVA-124, average degree of polymerization is 1700～1800) be dissolved in 100g deionized water, after standing 16 hours, 80 ℃ of waters bath with thermostatic control, stir, in whipping process, be accompanied by the evaporation of moisture, the polyvinyl alcohol hydrogel (53.33g) that to be finally mixed with containing polyvinyl alcohol mass percent be 15%;
B) 0.2g ammonium dichromate is dissolved in 133.13g deionized water to the ammonium dichromate aqueous solution (133.33g) that to be mixed with containing ammonium dichromate mass percent be 0.15%;
C) polyvinyl alcohol hydrogel that is 15% containing polyvinyl alcohol mass percent is mixed with the ammonium dichromate aqueous solution that is 0.15% containing ammonium dichromate mass percent, stir and make it mix the sensitization colloid (186.66g) that formation has light sensitive characteristic;
D) by the cerium doped yttrium aluminum garnet yellow fluorescent powder (YAG:Ce of 180mg
3+yellow fluorescent powder, Y
2.94al
5o
12: 0.06Ce
3+) pour in sensitization colloid, under gold-tinted environment, operate, mix, obtain phosphor slurry;
E) get blue-light LED chip (German Aixtron company, the substrate GaN-based blue-light LED chip of Si, 1w), the cleaning fluid first mixing with volume ratio 1:0.5 alcohol and acetone cleans 10 minutes, then 120 ℃ of thermostatic drying chamber inner dryings 15 minutes, obtain clean blue-light LED chip;
F) by glue evenning table, phosphor slurry is coated in to clean blue-light LED chip, in the oven environment of 70 ℃, dry 15 minutes, after oven dry, under the electric current of 15mA, light blue-light LED chip, time for exposure is at 2s, in the hot bath of 90 ℃, develop, oven dry afterwards obtains the yellow fluorescence layer that contains sensitization colloid;
G) at the blue-light LED chip that is coated with yellow fluorescence layer, at power, be to remove photoresist 50 minutes in 70w, the oxygen flow plasma degumming machine that is 15sccm, use silica gel machine by silica gel (Hangzhou Si Beier electronics corporation the blue-light LED chip after removing photoresist again, SC7502 transparent silica gel) inject mould cup, after the demoulding and in the insulating box of 140 ℃, solidify 1.5h, obtain the LED light source of entirely lighting.
LED light fixture, the LED light source that comprises shell, circuit board and entirely lighting, in the LED light source of entirely lighting, transparency carrier 1 is vertical with circuit board, adopt the vertical LED light source by entirely lighting to be arranged on circuit board, two circuit connecting electrode 4(on transparency carrier 1 i.e. two gold electrodes) by solder(ing) paste, be welded on circuit board, be electrically connected to circuit board.
As shown in Figure 2, another kind of concrete structure for the LED light source of entirely lighting, comprise transparency carrier 1, be arranged on LED chip 2 and fluorescent adhesive layer on transparency carrier 1, on transparency carrier 1, LED chip 2 place one sides are provided with two LED chip connecting electrodes 3, on transparency carrier 1, with respect to the opposite side of LED chip 2 place one sides, be provided with between 4, two LED chip connecting electrodes 3 of two circuit connecting electrodes and two circuit connecting electrodes 4 and be connected by the thermoelectricity connector 5 being arranged on transparency carrier 1.Transparency carrier 1 is selected glass transparent substrate, and LED chip connecting electrode 3 and circuit connecting electrode 4 are silver electrode.Thermoelectricity connector 5 in a tubular form, instant heating electrical connector 5 hollows, the material of thermoelectricity connector is copper.Thermoelectricity connector 5 one end are connected with LED chip connecting electrode 3, and the other end is connected with circuit connecting electrode 4, and thermoelectricity connector 5 is near the outer rim of transparency carrier 1, and circuit connecting electrode 4 is the outer rim of close transparency carrier 1 also, and extend to the outer rim of transparency carrier 1.The surface area of circuit connecting electrode 4 is greater than the surface area of LED chip connecting electrode 3.LED chip 2 is 1.Fluorescent adhesive layer covers on LED chip 2 and transparency carrier 1, and fluorescent adhesive layer comprises fluorescent material and packaging body, and fluorescent material adopts cerium doped yttrium aluminum garnet yellow fluorescent powder (YAG:Ce
3+yellow fluorescent powder, Y
2.94al
5o
12: 0.06Ce
3+), packaging body select epoxy resin (Huizhou flourishing age reaches Science and Technology Ltd., LED dedicated transparent casting glue, the transparent viscosity of TDC-006 is low, high heat-resisting, anti-aging).In Fig. 1, fluorescent adhesive layer adopts double-layer structure, and LED chip 2 and transparency carrier 1 are coated with yellow fluorescence layer 6 and encapsulated layer 7 successively.Encapsulated layer 7 is cuboid.Transparency carrier 1 is 2cm*2cm*0.5cm, and the radius of encapsulated layer 7 is 1.8cm*1.8cm*0.9cm.The thickness of tubulose thermoelectricity connector 5 is 0.2mm, and internal diameter is 0.16cm.
The preparation of the LED light source of entirely lighting comprises:
1) through-thickness perforate on transparency carrier 1, then two thermoelectricity connectors 5 are placed in hole, at the two ends of thermoelectricity connector 5 welding LED chip connecting electrode 3 and circuit connecting electrode 4;
2) LED chip 2 is connected with LED chip connecting electrode 3, and covers fluorescent adhesive layer;
The preparation that covers fluorescent adhesive layer comprises following concrete steps:
A) by 8g polyvinyl alcohol (powder, Japan's Kuraray, PVA-124, average degree of polymerization is 1700～1800) be dissolved in 100g deionized water, after standing 16 hours, 80 ℃ of waters bath with thermostatic control, stir, in whipping process, be accompanied by the evaporation of moisture, the polyvinyl alcohol hydrogel (53.33g) that to be finally mixed with containing polyvinyl alcohol mass percent be 15%;
B) 0.2g ammonium dichromate is dissolved in 133.13g deionized water to the ammonium dichromate aqueous solution (133.33g) that to be mixed with containing ammonium dichromate mass percent be 0.15%;
C) polyvinyl alcohol hydrogel that is 15% containing polyvinyl alcohol mass percent is mixed with the ammonium dichromate aqueous solution that is 0.15% containing ammonium dichromate mass percent, stir and make it mix the sensitization colloid (186.66g) that formation has light sensitive characteristic;
D) by the cerium doped yttrium aluminum garnet yellow fluorescent powder (YAG:Ce of 180mg
3+yellow fluorescent powder, Y
2.94al
5o
12: 0.06Ce
3+) pour in sensitization colloid, under gold-tinted environment, operate, mix, obtain phosphor slurry;
E) (strong (Aixtron) company is liked to think by Germany to get blue-light LED chip, the substrate GaN-based blue-light LED chip of Si, 1w), the cleaning fluid first mixing with volume ratio 1:0.5 alcohol and acetone cleans 10 minutes, then 120 ℃ of thermostatic drying chamber inner dryings 15 minutes, obtain clean blue-light LED chip;
F) by glue evenning table, phosphor slurry is coated in to clean blue-light LED chip, in the oven environment of 70 ℃, dry 15 minutes, after oven dry, under the electric current of 15mA, light chip, time for exposure 2s, in the hot bath of 90 ℃, develop, oven dry afterwards obtains the yellow fluorescence layer that contains sensitization colloid;
G) at the blue-light LED chip that is coated with yellow fluorescence layer, at power, be to remove photoresist 50 minutes in 70w, the oxygen flow plasma degumming machine that is 15sccm, use silica gel machine by silica gel (Hangzhou Si Beier electronics corporation the blue-light LED chip after removing photoresist again, SC7502 transparent silica gel) inject mould cup, after the demoulding and in the insulating box of 140 ℃, solidify 1.5h, obtain the LED light source of entirely lighting.
LED light fixture, the LED light source that comprises shell, circuit board and entirely lighting, in the LED light source of entirely lighting, transparency carrier 1 is vertical with circuit board, adopt the vertical LED light source by entirely lighting to be arranged on circuit board, two circuit connecting electrode 4(on transparency carrier 1 i.e. two silver electrodes) by solder(ing) paste, be welded on circuit board, be electrically connected to circuit board.
A kind of concrete structure of the LED light source of entirely lighting, structure can be with reference to figure 1, comprise transparency carrier 1, be arranged on LED chip 2 and fluorescent adhesive layer on transparency carrier 1, on transparency carrier 1, LED chip 2 place one sides are provided with two LED chip connecting electrodes 3, on transparency carrier 1, with respect to the opposite side of LED chip 2 place one sides, be provided with between 4, two LED chip connecting electrodes 3 of two circuit connecting electrodes and two circuit connecting electrodes 4 and be connected by the thermoelectricity connector 5 being arranged on transparency carrier 1.Transparency carrier 1 is selected glass transparent substrate, and LED chip connecting electrode 3 and circuit connecting electrode 4 are gold electrode.Thermoelectricity connector 5 in a tubular form, instant heating electrical connector 5 hollows, the material of thermoelectricity connector is copper.Thermoelectricity connector 5 one end are connected with LED chip connecting electrode 3, and the other end is connected with circuit connecting electrode 4, and thermoelectricity connector 5 is near the outer rim of transparency carrier 1, and circuit connecting electrode 4 is the outer rim of close transparency carrier 1 also, and extend to the outer rim of transparency carrier 1.The surface area of circuit connecting electrode 4 is greater than the surface area of LED chip connecting electrode 3.LED chip 2 is 1.Fluorescent adhesive layer covers on LED chip 2 and transparency carrier 1, fluorescent adhesive layer comprises fluorescent material and packaging body, fluorescent adhesive layer is one deck, fluorescent material and packaging body mix and cover on LED chip 2 and transparency carrier 1, i.e. different from fluorescent adhesive layer in Fig. 1, in Fig. 1, fluorescent adhesive layer adopts double-layer structure.LED chip 2 adopts blue-light LED chips (German Aixtron company, the substrate GaN-based blue-light LED chip of Si, 1w), encapsulated layer 7 adopts epoxy resin, and (Huizhou flourishing age reaches Science and Technology Ltd., LED dedicated transparent casting glue, the transparent viscosity of TDC-006 is low, high heat-resisting, anti-aging).Encapsulated layer 7 is semicircle.Transparency carrier 1 is 2cm*2cm*0.5cm, and the radius of encapsulated layer 7 is 0.9cm.The thickness of tubulose thermoelectricity connector 5 is 0.2mm, and internal diameter is 0.16cm.
The preparation of the LED light source of entirely lighting comprises:
1) through-thickness perforate on transparency carrier 1, then two thermoelectricity connectors 5 are placed in hole, at the two ends of thermoelectricity connector 5 welding LED chip connecting electrode 3 and circuit connecting electrode 4;
2) LED chip 2 is connected with LED chip connecting electrode 3, and covers fluorescent adhesive layer, cover fluorescent adhesive layer and adopt traditional dosing technology, by the cerium doped yttrium aluminum garnet yellow fluorescent powder (YAG:Ce of 180mg
3+yellow fluorescent powder) (Huizhou flourishing age reaches Science and Technology Ltd., and LED dedicated transparent casting glue TDC-006), after mixing is mixed well, then injects mould cup, after the demoulding, in insulating box, solidifies, and obtains the LED light source of entirely lighting with epoxy resin.
LED light fixture, the LED light source that comprises shell, circuit board and entirely lighting, in the LED light source of entirely lighting, transparency carrier 1 is vertical with circuit board, adopt the vertical LED light source by entirely lighting to be arranged on circuit board, two circuit connecting electrode 4(on transparency carrier 1 i.e. two gold electrodes) by solder(ing) paste, be welded on circuit board, be electrically connected to circuit board.
A kind of concrete structure of the LED light source of entirely lighting, structure can be with reference to figure 2, comprise transparency carrier 1, be arranged on LED chip 2 and fluorescent adhesive layer on transparency carrier 1, on transparency carrier 1, LED chip 2 place one sides are provided with two LED chip connecting electrodes 3, on transparency carrier 1, with respect to the opposite side of LED chip 2 place one sides, be provided with between 4, two LED chip connecting electrodes 3 of two circuit connecting electrodes and two circuit connecting electrodes 4 and be connected by the thermoelectricity connector 5 being arranged on transparency carrier 1.Transparency carrier 1 Ceramics transparency carrier, LED chip connecting electrode 3 and circuit connecting electrode 4 are silver electrode.Thermoelectricity connector 5 in a tubular form, instant heating electrical connector 5 hollows, the material of thermoelectricity connector be silver.Thermoelectricity connector 5 one end are connected with LED chip connecting electrode 3, and the other end is connected with circuit connecting electrode 4, and thermoelectricity connector 5 is near the outer rim of transparency carrier 1, and circuit connecting electrode 4 is the outer rim of close transparency carrier 1 also, and extend to the outer rim of transparency carrier 1.The surface area of circuit connecting electrode 4 is greater than the surface area of LED chip connecting electrode 3.LED chip 2 is 1.Fluorescent adhesive layer covers on LED chip 2 and transparency carrier 1, fluorescent adhesive layer comprises fluorescent material and packaging body, fluorescent adhesive layer is one deck, fluorescent material and packaging body mix and cover on LED chip 2 and transparency carrier 1, i.e. different from fluorescent adhesive layer in Fig. 1, in Fig. 1, fluorescent adhesive layer adopts double-layer structure.LED chip 2 adopts blue-light LED chips, and (1w), encapsulated layer 7 adopts silica gel (Hangzhou Si Beier electronics corporation, SC7502 transparent silica gel) for German Ai Siqiang Aixtron company, the substrate GaN-based blue-light LED chip of Si.Encapsulated layer 7 is cuboid.Transparency carrier 1 is 2cm*2cm*0.5cm, and the radius of encapsulated layer 7 is 1.8cm*1.8cm*0.9cm.The thickness of tubulose thermoelectricity connector 5 is 0.2mm, and internal diameter is 0.16cm.
The preparation of the LED light source of entirely lighting comprises:
1) through-thickness perforate on transparency carrier 1, then two thermoelectricity connectors 5 are placed in hole, at the two ends of thermoelectricity connector 5 welding LED chip connecting electrode 3 and circuit connecting electrode 4;
2) LED chip 2 is connected with LED chip connecting electrode 3, and covers fluorescent adhesive layer, cover fluorescent adhesive layer and adopt traditional dosing technology, by the cerium doped yttrium aluminum garnet yellow fluorescent powder (YAG:Ce of 180mg
3+yellow fluorescent powder) after mixing well with silica gel (Hangzhou Si Beier electronics corporation, SC7502 transparent silica gel) mixing, then inject mould cup, after the demoulding and in the insulating box of 140 ℃, solidify 1.5h, obtain the LED light source of entirely lighting.
LED light fixture, the LED light source that comprises shell, circuit board and entirely lighting, in the LED light source of entirely lighting, transparency carrier 1 is vertical with circuit board, adopt the vertical LED light source by entirely lighting to be arranged on circuit board, two circuit connecting electrode 4(on transparency carrier 1 i.e. two silver electrodes) by solder(ing) paste, be welded on circuit board, be electrically connected to circuit board.
Comparative example 1
Omit the step that in embodiment 1, step g) ionic medium resist remover is processed, other are with embodiment 1.
Comparative example 2
Its colour temperature of LED light source, luminous efficiency and the colour rendering index of the entirely lighting of embodiment 1～4 and comparative example 1～2 preparation is as shown in table 1.Luminous efficiency is that under the current excitation of 350mA under the environment temperature of 25 ℃, LED light source continuous operation records, and has surveyed respectively 30min and the luminous efficiency under 72 hours.
Table 1
As known from Table 1, from embodiment 1～4, the LED light source ad hoc structure of the utility model entirely lighting and the specific preparation method of combined with fluorescent glue-line, can improve the luminous efficiency of the LED light source of the utility model entirely lighting, simultaneously, under long-time use, stability is better, still can keep higher luminous efficiency, in addition, colour rendering index is also higher, and colour rendering is good, has guaranteed the colour developing quality of light source.
Comparative example 1 is known with comparative example 1, the step of processing due to omission plasma degumming machine in comparative example 1, therefore, in long use procedure, LED chip can constantly produce heat, makes the variable color of polyvinyl alcohol rete, thereby causes the luminous efficiency of LED light source to decline obviously.
Comparative example 1 is known with comparative example 2, comparative example 2 does not arrange thermoelectricity connector 5, make the thermal diffusivity variation of LED light source, in long use procedure, easily cause the temperature of LED light source very high, the quantum efficiency of yellow fluorescent powder is reduced, cause the decay of light efficiency, thereby cause the light efficiency of integral LED light source to decline.
Claims (10)
1. the LED light source of an entirely lighting, comprise substrate, be arranged on LED chip on substrate and for LED chip being encapsulated in to the fluorescent adhesive layer on substrate, it is characterized in that, described substrate is transparency carrier, described transparency carrier is provided with through hole, described through hole is built-in with thermoelectricity connector, described thermoelectricity connector is connected with LED chip connecting electrode near one end of described LED chip, the other end of described thermoelectricity connector is connected with circuit connecting electrode, and described LED chip connecting electrode is electrically connected to described LED chip.
2. the LED light source of entirely lighting according to claim 1, is characterized in that, described substrate is glass transparent substrate, ceramic transparency carrier or plastic, transparent substrate.
3. the LED light source of entirely lighting according to claim 1, is characterized in that, described thermoelectricity connector in a tubular form.
4. the LED light source of entirely lighting according to claim 1, is characterized in that, described thermoelectricity connector is near the outer rim of described substrate.
5. the LED light source of entirely lighting according to claim 1, is characterized in that, described circuit connecting electrode extends to the outer rim of described substrate.
6. the LED light source of entirely lighting according to claim 1, is characterized in that, the surface area of described circuit connecting electrode is greater than the surface area of described LED chip connecting electrode.
7. the LED light source of entirely lighting according to claim 1, is characterized in that, described LED chip is a plurality of, and a plurality of LED chips form LED chip array.
8. the LED light source of entirely lighting according to claim 7, is characterized in that, each LED chip in described LED chip array adopts series connection or/and mode in parallel connects.
9. the LED light source of entirely lighting according to claim 1, is characterized in that, described fluorescent adhesive layer covers on described LED chip and substrate.
10. a LED light fixture, it is characterized in that, the LED light source that comprises the entirely lighting described in shell, circuit board and claim 1～9 any one, in the LED light source of described entirely lighting, transparency carrier is vertical with described circuit board, and the circuit connecting electrode on described transparency carrier is electrically connected to described circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320618722.4U CN203489066U (en) | 2013-09-29 | 2013-09-29 | Whole-body light-emitting LED light source and LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320618722.4U CN203489066U (en) | 2013-09-29 | 2013-09-29 | Whole-body light-emitting LED light source and LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203489066U true CN203489066U (en) | 2014-03-19 |
Family
ID=50259899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320618722.4U Expired - Lifetime CN203489066U (en) | 2013-09-29 | 2013-09-29 | Whole-body light-emitting LED light source and LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203489066U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108332174A (en) * | 2018-02-07 | 2018-07-27 | 武汉大学 | A kind of cooling system and method applied to high-power LED (light emitting diode) lighting equipment light-emitting surface |
| CN110928048A (en) * | 2019-12-13 | 2020-03-27 | 武汉华星光电技术有限公司 | Backlight module and manufacturing method thereof |
-
2013
- 2013-09-29 CN CN201320618722.4U patent/CN203489066U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108332174A (en) * | 2018-02-07 | 2018-07-27 | 武汉大学 | A kind of cooling system and method applied to high-power LED (light emitting diode) lighting equipment light-emitting surface |
| CN110928048A (en) * | 2019-12-13 | 2020-03-27 | 武汉华星光电技术有限公司 | Backlight module and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101769524B (en) | Light emitting diode lamp and light engine thereof | |
| US20160363267A1 (en) | Led filament, led filament assembly and led bulb | |
| CN104600181A (en) | LED (Light Emitting Diode) light bar and preparation method thereof | |
| CN201539737U (en) | LED lamp | |
| CN201039523Y (en) | A high color index high-power white light LED part | |
| CN101771028B (en) | White-light LED chip and manufacturing method thereof | |
| CN203489066U (en) | Whole-body light-emitting LED light source and LED lamp | |
| CN103500786A (en) | Full-angle luminous LED (light-emitting diode) light source and preparation method thereof | |
| CN207097867U (en) | A kind of yellowish-white light LED road lamp of unstressed configuration powder type | |
| CN105185891A (en) | LED package-free structure and package-free method thereof | |
| CN104993035A (en) | Warm white light LED luminescent apparatus | |
| CN201547559U (en) | High-power LED lamp | |
| CN203586033U (en) | 360-degree non-light-tight car lamp | |
| CN204497262U (en) | A kind of good large power white light LED that dispels the heat | |
| CN207831021U (en) | High-power LED bulb | |
| CN108019630B (en) | High-power LED bulb | |
| CN208422957U (en) | A kind of integrated LED multi-chip three-dimension packaging light source | |
| CN203322806U (en) | LED (light-emitting diode) light source module capable of linear light emitting | |
| CN203377265U (en) | LED packaging structure | |
| CN208951719U (en) | A kind of light emitting device and light-emitting component | |
| CN207674291U (en) | Energy saving high-power LED mine lamp | |
| CN207674244U (en) | Intelligent LED ground light | |
| CN208093557U (en) | A kind of direct-injection type light source | |
| CN203339225U (en) | Non-encapsulation chip LED lighting illumination structure | |
| CN204361095U (en) | A kind of HV-COB LED light source excited based on long-distance fluorescent powder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: Hangzhou City, Zhejiang province 311122 Yuhang District Xianlin Street Xian Xing Lu 31, No. 33 Patentee after: HANGZHOU HANGKE OPTOELECTRONICS STOCK Ltd.,Corp. Address before: Hangzhou City, Zhejiang province 310022 Dengyun Road No. 425 five floor Patentee before: HANGZHOU HANGKE OPTOELECTRONICS STOCK Ltd.,Corp. |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Yuhang Xianlin District of Hangzhou City, Zhejiang province 311122 Xian Xing Lu 31, No. 33 Patentee after: HANGZHOU HANGKE OPTOELECTRONICS GROUP Co.,Ltd. Address before: Hangzhou City, Zhejiang province 311122 Yuhang District Xianlin Street Xian Xing Lu 31, No. 33 Patentee before: HANGZHOU HANGKE OPTOELECTRONICS STOCK Ltd.,Corp. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140319 |