CN206505946U

CN206505946U - A kind of LED/light source of specular removal

Info

Publication number: CN206505946U
Application number: CN201720147306.9U
Authority: CN
Inventors: 杜久; 高海生
Original assignee: Shenzhen City Laidisen Environmental Protection Energy Saving Technology Co Ltd
Current assignee: Shenzhen City Laidisen Environmental Protection Energy Saving Technology Co Ltd
Priority date: 2017-02-17
Filing date: 2017-02-17
Publication date: 2017-09-19
Anticipated expiration: 2027-02-17

Abstract

The utility model discloses a kind of LED/light source of specular removal, including two size identical substrates, the substrate is transparent or translucent, LED chip group is provided with along the two ends of the length direction of the substrate, covered with fluorescent material adhesive layer in the LED chip group, and the LED chip group includes multiple LED wafers and printing or the laminating printed circuit being constructed from a material that be electrically conducting in the substrate surface, it is electrically connected between multiple LED wafers with the printed circuit, two substrates intersect into cross, and the LED chip group on two substrates is electrically connected with by scolding tin and the printed circuit.The LED/light source of specular removal provided by the utility model, total does not need bonding wire, and the light that LED chip group is produced is sent in up and down, left and right multiple faces simultaneously, so as to realize uniformity and 360 degree of effects lighted without dead angle.

Description

A kind of LED/light source of specular removal

Technical field

The utility model belongs to technical field of LED illumination, and in particular to a kind of LED/light source of specular removal.

Background technology

Osram lamp of the artificial light sources since most is to state-of-the art electricity-saving lamp, and their illumination mode is to four sides all the time It is luminous from all directions, all it is 360 degree of luminous illuminating products.

The luminous characteristics of traditional LED lamp tool are, with direction one to property, may only to project one to a fixed direction Individual light beam, because existing LED is made up of substrate, chip, insulating cement, gold thread, fluorescent material etc., the wherein core of LED/light source Piece is all packaged on nontransparent substrate, and the most frequently used nontransparent substrate is exactly aluminium base.The defect of existing product is chip It is encapsulated in the last light splitting of nontransparent substrate to be blocked by nontransparent substrate, the launch angle of light is maximum also to only have 180 degree, light Utilization rate it is low.This allow for photocurrent versus light intensity that traditional LED sends out light beam towards a specific direction be applied to room lighting can be by Very big limitation, can not easily come into huge numbers of families.To make LED illumination product can be widely applied to indoor common photograph The fields such as bright, commercial lighting, office lighting, fill up the deficiency of traditional LED illumination, 360 degree of beam angle space luminescence LED productions of research Product become the problem for being badly in need of solving.

Although in the market also has 360 degree of luminous LED products, such as notification number is CN204441280U, entitled flip The Chinese utility model patent of formula LED lamp, its structure is to include a substrate, multigroup crystal covering type LED chip and fluorescent material glue-line, The crystal covering type LED chip is installed on the substrate, and the fluorescent material glue-line is covered in crystal covering type LED chip, and substrate is Transparent, in metallic circuit of the substrate surface provided with printing, crystal covering type LED chip is electrically connected by its electrode with the metallic circuit Connect, to reach that, without bonding wire, the light of generation can be sent to fluorescent material glue-line direction and glass plate direction, constitute 360 ° simultaneously Luminous effect.But there are several shortcomings in the patented product：1st, the light that the LED chip is produced can be simultaneously to fluorescent material glue-line Direction and glass plate direction are sent, constitute 360 ° of luminous effects, but be due to phosphor gel layer and glass plate refractive index not One, it is uneven through the light of its generation, it is impossible to realize 360 ° of effects without dead angle uniformly light-emitting；2nd, the LED lamp needs to set When counting the bigger product of success rate, the increase amplitude of volume also can be with increase, for doing some small sizes and needing power big LED lamp product do not apply to.

Utility model content

The defect existed for prior art, the utility model provides a kind of 360 ° without dead angle, and light uniformity The LED/light source of specular removal.

The purpose of this utility model is achieved through the following technical solutions：

A kind of LED/light source of specular removal, including two size identical substrates, the substrate are transparent or translucent, It is provided with along the two ends of the length direction of the substrate in LED chip group, and the LED chip group covered with fluorescent material sealing Layer, the LED chip group includes multiple LED wafers and printing or the laminating print being constructed from a material that be electrically conducting in the substrate surface It is electrically connected between brush circuit, multiple LED wafers with the printed circuit, two substrates intersect into cross LED chip group in type, and two substrates is electrically connected with by scolding tin and the printed circuit.

Preferably, wherein the two sides of the substrate is printed or laminating has the printed circuit being constructed from a material that be electrically conducting, two Individual above LED wafer is fixed on the two sides of the substrate by insulating cement using two-sided mode for dispensing glue, and the LED wafer Connected by printed circuit.

Preferably, wherein the transparent or semitransparent substrate is one kind in glass, ceramics or plastics.

Preferably, wherein the printed circuit is fine silver circuit.

Preferably, wherein the fluorescent material adhesive layer is by silica gel material compression molding, and its be shaped as rectangle, it is circular or ellipse It is circular.

Preferably, wherein the LED chip is strip, length direction of multiple LED wafers along LED chip group is equal It is even to arrange and connected by the printed circuit, it is provided with metal electrode film, institute positioned at two ends of length direction on the substrate Metal electrode film is stated to be electrically connected with printed circuit.

Compared with prior art, the utility model at least has advantages below：

The LED/light source of specular removal provided by the utility model, by transparent or translucent, and intersects into ten On the substrate of font printing or it is laminating have the printed circuit being constructed from a material that be electrically conducting, be respectively provided with the length direction of substrate both sides Have covered with fluorescent material adhesive layer in LED chip group, the LED chip group, the LED chip group includes multiple LED wafers, many Connected between the individual LED wafer by printed circuit, pass through scolding tin and printed circuit electricity between each described LED chip Property connection, it is not necessary to bonding wire；The light that LED chip group is produced is sent in up and down, left and right multiple faces simultaneously, so as to realize uniform Consistent and 360 degree of effects lighted without dead angle.

Brief description of the drawings

Fig. 1 is the structural representation of the LED/light source of specular removal provided by the utility model；

Fig. 2 is LED chip group in the LED/light source of specular removal provided by the utility model and laterally cuing open after substrate in combination Face structural representation.

Fig. 3 for specular removal provided by the utility model LED/light source in substrate structural representation.

Wherein, 1, substrate；2nd, LED chip group；21st, printed circuit；22nd, LED wafer；23rd, scolding tin；3rd, fluorescent material sealing Layer；11st, positive electrode；12nd, negative electrode.

Embodiment

The utility model is described in further detail with reference to the accompanying drawings and examples, following examples be it is descriptive, It is not limited, it is impossible to which protection domain of the present utility model is limited with this.

As shown in Figure 1-Figure 3, the utility model provides a kind of LED/light source of specular removal, including two size identicals Substrate 1, the substrate 1 is transparent or translucent, and LED chip group 2 is provided with along the two ends of the length direction of substrate 1, the LED Covered with fluorescent material adhesive layer 3 on chipset 2, by setting different types of fluorescent material adhesive layer 3 to change light colour temperature, LED wafer 22 and fluorescent material is protected not to be damaged by external force, moreover it is possible to protect the steam of outside to enter LED chip group 2 well It is internal；Alternatively, it is also possible to by using the good fluorescent material adhesive layer 3 of thermal conductivity, the fluorescent material adhesive layer 3 be use silica gel for Base material, adds transparent and good thermal conductivity filler and fluorescent material, a kind of heat-conducting medium material of vulcanization, and then by LED The luminous heat produced of chipset 2 is quickly exported, and extends the service life of LED chip group；Wherein LED chip group 2 includes multiple LED wafer 22 and printing or the laminating printed circuit 21 being constructed from a material that be electrically conducting in the surface of substrate 1, multiple LED wafers 22 it Between intersect into cross with the electrical communication of printed circuit 21, two substrates 1, and LED chip group 2 on two substrates 1 leads to Scolding tin 23 is crossed to be electrically connected with printed circuit 21.The LED/light source of specular removal provided by the utility model, it has without bonding wire Effect solves to be connected in the case that LED/light source works using wire rod between substrate 1 and substrate 1 easily to be taken off due to producing heat Fall, also inaesthetic shortcoming；The light that LED chip group 2 is produced simultaneously is sent in up and down, left and right multiple faces simultaneously, so that real The luminous effect of existing 360 degree of uniformities.

For the luminous effect of 360 ° of uniformities for further improving the LED/light source, can it be printed on the two sides of substrate 1 Brush or it is laminating have a printed circuit 21 being constructed from a material that be electrically conducting, two or more LED wafer 22 uses two-sided point by insulating cement The mode of glue is fixed on the two sides of substrate 1 (referred to as two-sided die bond), and LED wafer is connected by printed circuit 21, the setting phase LED/light source for setting LED chip group 2 (one side die bond) on the one side of substrate 1,360 ° of illumination effect is further carried Height, when power is the same, the volume of the LED/light source of two-sided die bond is a quarter of one side die bond LED/light source in theory, significantly Reduce the volume of LED/light source.

Wherein, substrate 1 is one kind in glass, ceramics or plastics, and substrate 1 is transparent or translucent, the setting LED chip group light extraction is not only improved to greatest extent, and is derived the heat that LED chip group is sent to greatest extent；Using Ceramic material is as substrate 1, with excellent heat conductivity, reliable electrical insulating property, low dielectric constant and dielectric loss Can, it is the preferable cooling encapsulation material of large scale integrated circuit of new generation, semiconductor module circuit and high power device；For one A little not high LED/light sources of power can be used as substrate 1 using glass material；It is medium and require the LED of light quality for power Light source then can such as select heat-conducting plastic from plastic material as substrate 1；For high-power LED/light source, then it can select Ceramic material is as substrate 1, and the ceramic material preferably selects porous ceramic film material.

Wherein, printed circuit 21 is fine silver circuit, has conduction property good as circuit material using fine silver, product is light Small, resistance is small and the advantages of long service life, so as to ensure that the illumination effect and service life of LED/light source.

Wherein, fluorescent material adhesive layer 3 is by silica gel material compression molding, and silica gel material refers to that main chain is replaced by silicon and oxygen atom Constitute, the rubber of two organic groups be generally connected with silicon atom, it has prominent resistant of high or low temperature, chemical resistance with And rectangular, circle can be designed the need for excellent resistance to ag(e)ing, and specifications and models and good appearance according to LED chip group The various shapes such as shape or ellipse.

Wherein, LED chip group 2 is strip, and length direction of multiple LED wafers 22 along LED chip group 2 is uniformly arranged simultaneously Connected, be provided with substrate 1 positioned at two ends of length direction in metal electrode film, metal electrode film just by printed circuit 21 Electrode 11 and negative electrode 12 are electrically connected with by scolding tin 23 with printed circuit 21.

The utility model accesses LED/light source on external power source when specifically used, and external power source gives LED/light source conveying Suitable voltage and current, opens LED/light source.

More than, only the utility model preferably embodiment, but the protection domain of utility model is not limited to This, any one skilled in the art is in the technical scope that the utility model is disclosed, the change that can be readily occurred in Or replace, it should all cover within protection domain of the present utility model.Therefore, protection domain of the present utility model should be with right The protection domain of claim is defined.

Claims

1. a kind of LED/light source of specular removal, it is characterised in that including two size identical substrates, the substrate it is transparent or It is translucent, it is provided with along the two ends of the length direction of the substrate in LED chip group, the LED chip group covered with glimmering Light powder adhesive layer, and the LED chip group include multiple LED wafers and printing or it is laminating in the substrate surface by conduction material It is electrically connected between the printed circuit that material is constituted, multiple LED wafers with the printed circuit, two substrates are mutually handed over Pitch into cross, and LED chip group on two substrates passes through scolding tin and be electrically connected with the printed circuit.

2. the LED/light source of specular removal according to claim 1, it is characterised in that the two sides of the substrate print or Laminating to have the printed circuit being constructed from a material that be electrically conducting, two or more LED wafer is solid using two-sided mode for dispensing glue by insulating cement Due on the two sides of the substrate, and the LED wafer is connected by printed circuit.

3. the LED/light source of specular removal according to claim 1 or 2, it is characterised in that the transparent or semitransparent substrate is One kind in glass, ceramics or plastics.

4. the LED/light source of specular removal according to claim 3, it is characterised in that the printed circuit is fine silver circuit.

5. the LED/light source of specular removal according to claim 4, it is characterised in that the fluorescent material adhesive layer is by silica gel material Expect compression molding, and it is shaped as rectangle, circular or ellipse.

6. the LED/light source of specular removal according to claim 5, it is characterised in that the LED chip is strip, multiple Length direction of the LED wafer along LED chip group is uniformly arranged and connected by the printed circuit, is located on the substrate Two ends of length direction are provided with metal electrode film, and the metal electrode film is electrically connected with printed circuit.