CN203218334U - LED bulb lamp packaging structure - Google Patents

LED bulb lamp packaging structure Download PDF

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Publication number
CN203218334U
CN203218334U CN2013202216105U CN201320221610U CN203218334U CN 203218334 U CN203218334 U CN 203218334U CN 2013202216105 U CN2013202216105 U CN 2013202216105U CN 201320221610 U CN201320221610 U CN 201320221610U CN 203218334 U CN203218334 U CN 203218334U
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CN
China
Prior art keywords
luminous
heat conducting
led
light emitting
stem
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Active
Application number
CN2013202216105U
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Chinese (zh)
Inventor
左洪波
张学军
杨舒敏
王宽晓
褚淑霞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HARBIN LIUXIA OPTOELECTRONIC TECHNOLOGY CO., LTD.
Original Assignee
Harbin Aurora Optoelectronics Technology Co Ltd
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Publication date
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Priority to CN2013202216105U priority Critical patent/CN203218334U/en
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Abstract

The utility model provides an LED bulb lamp packaging structure, which comprises a transparent lampshade, a lamp base, and light emitting bodies, a stem, a wire connecting plate, a heat conducting base and a driving power which are arranged in the transparent lampshade and the lamp base, wherein the light emitting bodies comprise 4 LED light emitting bodies, each LED light emitting body adopts two sapphire wafers as the heat conducting transparent plates, the lengths of the two wafers are different, two ends of the relatively longer wafer are plated with metal film layers as electrodes, chips are fixed on the heat conducting transparent plates coated with fluorescence glue film, the upper parts of the light emitting bodies are mutually connected by adopting a series mode through the wire connecting plate in a plug-pull manner, the lower parts are connected with the heat conducting base in the plug-pull manner, and the wire connecting plate and the stem are connected for fixing the wire connecting plate and the heat conducting base. According to the LED bulb lamp packaging structure, the LED light emitting bodies are manufactured by taking the sapphire wafers as the heat conducting transparent plates, the light emitting efficiency is high, the light emergent angle is large, the assembly is simple, and the reliability is high.

Description

A kind of LED bulb lamp encapsulating structure
(1) technical field
The invention belongs to LED encapsulation technology field, be specifically related to a kind of encapsulating structure of multi-chip high power white light LEDs bulb lamp.
(2) background technology
The earth resource transition utilizes, problems such as environmental pollution is serious have been beaten alarm bell to people, for the sustainable development in the whole world, people must tap a new source of energy, improve resource utilization, reduce waste discharge, and deep research work is also launched at this field in countries in the world at present.
People still be unable to do without illumination in the middle of the work in life, and China is populous, and the electric consumption on lighting amount accounts for 12% of whole society's total electricity consumption, and therefore, exploitation energy-conserving and environment-protective lighting becomes China's sustainable development, administers the most important thing of environmental work.
Advantages such as LED has the luminous efficiency height, power consumption is low, volume is little, long service life, environmental protection are optimal conventional light source substitutes.Yet, at present the LED lamp fitting structure, luminous efficiency, heat radiation, etc. the aspect also unsatisfactory.Only having under the prerequisite identical even more low production cost with the traditional lighting product, can obtain higher light efficiency, the LED lamp just might be popularized in the general lighting field.
People are obtaining very quantum jump aspect the making of LED lamp now, and the highest light efficiency surpasses 130Lm/W, also has portioned product to put goods on the market.But there are a lot of problem demanding prompt solutions in the LED lamp also being far from reaching the level that substitutes conventional light source aspect cost of manufacture and the product stability at present.The LED lamp generally adopts pinned, SMD or COB pattern according to module now.Compare with conventional light source, LED lamp lighting angle is less, is 180 ~ 270 degree; The assembling chip substrate has PCB, MCPCB, ceramic substrate etc. usually, and these substrates are all light tight, makes the back side of chip can't bright dipping, influences amount of light.For solving the chip cooling problem, it is heat sink often to adopt aluminium to do, and this can make the weight of whole lamp bigger, reaches more than 5 times of incandescent lamp.
(3) summary of the invention
The purpose of this utility model is to provide a kind of LED luminous element of making for the heat conduction light-passing board with the sapphire wafer, and luminous efficiency height, rising angle are big, the LED bulb lamp encapsulating structure that assembling is simple, reliability is high.
The purpose of this utility model is achieved in that it comprises by transparent lamp shade, lamp socket, and be arranged on transparent lamp shade, luminous element in the lamp socket, stem stem, line connection board, heat conducting base and driving power, luminous element comprises 4 LED luminous elements, it is the heat conduction light-passing board that the LED luminous element adopts two sapphire wafers, two wafer length differences, relatively long wafer two ends metal-plated membrane layer is as electrode, chip is fixed on the heat conduction light-passing board that is covered with fluorescent coating, luminous element top takes series model to interconnect with the plug form by line connection board, the bottom takes the plug form to link to each other with heat conducting base equally, and line connection board and stem stem are connected and fixed line plate and heat conducting base.
The utility model also has some technical characterictics like this:
1, sapphire printing opacity heat-conducting plate can be different shapes such as square, rectangle, circle.
2, can take the formal dress mode to connect with gold thread on the luminous element between the chip, also can do prewired circuit at sapphire plate and adopt the upside-down mounting mode to connect.
3, can take between the luminous element to connect or the mode of connection in series-parallel combination connects.
4, stem stem and top line connection board are that transparent heat-conducting resin, plastics, glass, transparent ceramic or sapphire are made.
5, heat conducting base is that aluminium nitride heat conductive insulating pottery is made.
The utility model adopts sapphire wafer to do the sapphire heat conduction light-passing board of chip module, with the form of some chips with formal dress or upside-down mounting, take to connect or the mode of connection in series-parallel combination is fixed on two ends and is coated with conductive metal electrode even has produced on the sapphire heat conduction light-passing board of prewired circuit.Fluorescent material and high-heat-conductivity glue are mixed, be pressed into fluorescent coating.Fluorescent coating is cut into suitable size, with the automatic rubberizing machine fluorescent coating is covered and be of a size of on 35 * 1 * 0.8mm sapphire heat conduction light-passing board intensification curing fluorescent coating.With full-automatic solid brilliant machine heat-conducting glue on led chip back side point, chip is fixed on the sapphire plate heat conduction printing opacity that is covered with fluorescent coating, connect chip chamber and sapphire heat conduction light-passing board two ends metal electrode with automatic wire bonding machine with gold thread.Fluorescent coating is pasted on the sapphire heat conduction light-passing board of another piece 30 * 1 * 0.8mm.The one side that above-mentioned two heat conduction light-passing boards are covered with fluorescent coating is staggered relatively in the middle of special mould, solidify fluorescent coating, form a LED luminous element.Make requirement according to light fixture, sapphire heat conduction light-passing board can be different shapes such as square, rectangle, circle.The outer 360 degree coating fluorescent powders of chip, the position that is connected with top line connection board and bottom heat conductive insulating base of ceramic is reserved at sapphire heat conduction light-passing board two ends, and total is a luminous element.With transparent heat-conducting resin, plastics, glass, transparent ceramic or sapphire make have with the LED lamp in designed luminous element the number slot and the prefabricated circuit connection lines plate that are complementary, luminous element one end is inserted the corresponding slot of top line connection board, the other end links to each other with the heat conducting base slot, and then link to each other with the output of drive circuit, at last transparent lamp shade is linked to each other with lamp socket.Connect between luminous element and fix by line connection board, stem stem and heat conducting base, rock preventing.
The beneficial effects of the utility model are: 1) adopt sapphire wafer as multi-chip modules heat conduction light-passing board, the light that active layer sends can see through substrate, makes the chip module can nearly 360 spend bright dippings; 2) the LED lamp source is made up of several luminous elements, adds the transparent lamp shade greater than 300 degree, and the lighting angle of bulb can be reached more than 300 degree; 3) luminous element and line connection board and heat conducting base connected mode are the mode of clamping, and installation process is simple, the rate of finished products height; 4) insulating properties of the excellence that has of sapphire single-crystal, good thermal conductivity, and need not between conductive layer to isolate with insulating barrier, heat can be directly transferred on the sapphire heat conduction light-passing board, and thermal resistance is reduced; 5) connected mode of luminous element and heat conducting base, sapphire heat conduction light-passing board and pedestal contact area are bigger, the heat that produces during chip operation can directly be derived from heat conducting base with heat conducting form fast, has overcome the deficiency that traditional structure mainly conducts heat by forms of radiation; 6) do not adopt heat sink structure in the fitting structure, light fitting quality is light.
(4) description of drawings
Fig. 1 is the utility model structural representation.
(5) embodiment
Below in conjunction with the drawings and specific embodiments the utility model is elaborated.
In conjunction with Fig. 1, present embodiment is by transparent lamp shade 1, lamp socket 2(underlying scolding tin contact 3) and place inner several LED luminous elements 4, stem stem 7, heat conduction printing opacity line connection board 5, bottom heat conducting base 6 and driving power are formed.As light source, it is the heat conduction light-passing board that luminous element adopts two sapphire wafers by 4 luminous elements, two wafer length differences, and relatively long wafer two ends metal-plated membrane layer is as electrode.Fluorescent material and high-heat-conductivity glue are mixed, be pressed into fluorescent coating.Fluorescent coating is cut into suitable size, with the automatic rubberizing machine fluorescent coating is covered and be of a size of on 35 * 1 * 0.8mm sapphire heat conduction light-passing board intensification curing fluorescent coating.With full-automatic solid brilliant machine heat-conducting glue on led chip back side point, chip is fixed on the sapphire heat conduction light-passing board that is covered with fluorescent coating, connect chip chamber and sapphire heat conduction light-passing board two ends metal electrode with automatic wire bonding machine with gold thread.Fluorescent coating is pasted on the sapphire heat conduction light-passing board of another piece 30 * 1 * 0.8mm.The one side that above-mentioned two heat conduction light-passing boards are covered with fluorescent coating is staggered relatively in the middle of special mould, and solidified glue film forms a LED luminous element.Luminous element top takes series model to interconnect with the plug form by heat conduction printing opacity line connection board 5, and the bottom takes the plug form to link to each other with the heat conducting base 6 of aluminium nitride insulation equally.Line connection board and stem stem 7 adopt transparent resin to make, and play the effect that is connected and fixed upper guide heat penetration light line connection board and bottom heat conducting base.

Claims (3)

1. LED bulb lamp encapsulating structure, it comprises by transparent lamp shade, lamp socket, and be arranged on transparent lamp shade, luminous element in the lamp socket, stem stem, line connection board, heat conducting base and driving power, it is characterized in that luminous element comprises 4 LED luminous elements, it is the heat conduction light-passing board that the LED luminous element adopts two sapphire wafers, two wafer length differences, relatively long wafer two ends metal-plated membrane layer is as electrode, chip is fixed on the heat conduction light-passing board that is covered with fluorescent coating, luminous element top takes series model to interconnect with the plug form by line connection board, the bottom takes the plug form to link to each other with heat conducting base equally, and line connection board and stem stem are connected and fixed line plate and heat conducting base.
2. a kind of LED bulb lamp encapsulating structure according to claim 1 is characterized in that can taking between the chip on the described luminous element formal dress mode to connect with gold thread, also can do prewired circuit at sapphire plate and adopt the upside-down mounting mode to connect.
3. a kind of LED bulb lamp encapsulating structure according to claim 2 is characterized in that can taking between the described luminous element to connect or the mode of connection in series-parallel combination connects.
CN2013202216105U 2013-04-27 2013-04-27 LED bulb lamp packaging structure Active CN203218334U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013202216105U CN203218334U (en) 2013-04-27 2013-04-27 LED bulb lamp packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013202216105U CN203218334U (en) 2013-04-27 2013-04-27 LED bulb lamp packaging structure

Publications (1)

Publication Number Publication Date
CN203218334U true CN203218334U (en) 2013-09-25

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103712105A (en) * 2013-12-26 2014-04-09 四川柏狮光电技术有限公司 Full light distribution type LED bulb lamp with twisted-line-shaped lamp filaments distributed
CN103994349A (en) * 2014-05-04 2014-08-20 杭州杭科光电股份有限公司 LED bulb lamp with high lighting efficiency
WO2016191903A1 (en) * 2015-05-29 2016-12-08 杭州杭科光电股份有限公司 Led bulb lamp with drive power supply integrated within bulb shell

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103712105A (en) * 2013-12-26 2014-04-09 四川柏狮光电技术有限公司 Full light distribution type LED bulb lamp with twisted-line-shaped lamp filaments distributed
CN103994349A (en) * 2014-05-04 2014-08-20 杭州杭科光电股份有限公司 LED bulb lamp with high lighting efficiency
WO2016191903A1 (en) * 2015-05-29 2016-12-08 杭州杭科光电股份有限公司 Led bulb lamp with drive power supply integrated within bulb shell

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: HARBIN LIUXIA OPTOELECTRONIC TECHNOLOGY CO., LTD.

Free format text: FORMER OWNER: HARBIN AURORA OPTOELECTRONICS TECHNOLOGY CO., LTD.

Effective date: 20141201

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20141201

Address after: 150001 Harbin, Nangang, West District, large straight street, No. 357

Patentee after: HARBIN LIUXIA OPTOELECTRONIC TECHNOLOGY CO., LTD.

Address before: 150001 Nangang District, Heilongjiang, and Hing Road, No. 116, Harbin

Patentee before: Harbin Aurora Optoelectronics Technology Co., Ltd.

PE01 Entry into force of the registration of the contract for pledge of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: LED bulb lamp packaging structure

Effective date of registration: 20180921

Granted publication date: 20130925

Pledgee: Longjiang bank Limited by Share Ltd Harbin Development Zone sub branch

Pledgor: HARBIN LIUXIA OPTOELECTRONIC TECHNOLOGY CO., LTD.

Registration number: 2018990000855

PC01 Cancellation of the registration of the contract for pledge of patent right
PC01 Cancellation of the registration of the contract for pledge of patent right

Date of cancellation: 20200509

Granted publication date: 20130925

Pledgee: Longjiang bank Limited by Share Ltd Harbin Development Zone sub branch

Pledgor: HARBIN LIUXIA OPTOELECTRONIC TECHNOLOGY Co.,Ltd.

Registration number: 2018990000855