CN106468404A - LED filament and LEDbulb lamp - Google Patents

Abstract

The present invention discloses a kind of LED filament, including support, two metal electrodes, LED chip group and the silica gel mixed with fluorescent material.Two metal electrodes are respectively arranged at two sides of described support；LED chip group includes multiple LED chips, and the plurality of LED chip is configured in described support, and is respectively and electrically connected to described metal electrode；Silica gel mixed with fluorescent material wraps up described LED chip group and wraps up at least part of of each electrode of described two metal electrodes, and wrapped metal electrode is in the metallic electrode portion in described support.

Description

LED filament and LEDbulb lamp

Technical field

The present invention relates to lighting field is and in particular to a kind of LED filament and LEDbulb lamp.

Background technology

LED has environmental protection, energy-conservation, high efficiency and long-life advantage, therefore currently suffers from attention in recent years, gradually Replace the status of traditional lighting light fixture.But the luminous of LED has directivity, unlike conventional lamp can make big wide angular range How illumination, therefore design and reach ultra wide-angle, the LED lamp of all-round optical illumination, then becomes the mesh that LED industry makes great efforts research and development Mark.

In recent years, one kind can allow LED light source be similar to conventional tungsten silk bulb lamp and light, and reach the LED of full angle illumination Silk is day by day paid attention to by industry.The making of this LED filament be by plurality of LEDs chip concatenation be fixed on a piece of narrow and small elongated On glass substrate, then whole glass substrate is wrapped up with the silica gel mixed with fluorescent material, then carry out electrical connection and can complete.But Glass substrate heat conduction is not good, and easily ruptures because of vibrations, causes the concatenation of LED chip to break and lost efficacy.So changing with regard to someone Metal basal board for not easy fracture replaces, although metal basal board has preferable thermal conduction characteristic, itself cannot printing opacity, meeting There is the defect of shield lights, cause LED filament luminous efficiency low, and the needs that full angle lights can not be met.Therefore such as The tenacity of what strengthening LED filament and the luminous efficiency of simultaneously taking into account its thermal conduction characteristic and LED filament just becomes LED illumination industry The target made joint efforts.

Content of the invention

The embodiment of the present invention provides a kind of tenacity that can strengthen LED filament to take into account its luminous efficiency and radiating again simultaneously Novel LED bulb lamp, whereby to solve problem of the prior art.

For solving the above problems, the embodiment of the present invention provides a kind of LED filament, including：Including support, two metal electrodes, LED chip group and the silica gel mixed with fluorescent material.Two metal electrodes are respectively arranged at two sides of described support；LED chip group bag Multiple LED chips are included, the plurality of LED chip is configured in described support, and is respectively and electrically connected to described metal electrode； Silica gel mixed with fluorescent material wraps up described LED chip group and the metallic electrode portion being located in described support.In other words, root According to the present invention, each side of multiple LED chips is all contacted with silica gel.

Another embodiment of the present invention provides a kind of LED filament, including：Two flat brackets, two metal electrodes, LED chip group And the silica gel mixed with fluorescent material；Two metal electrodes are respectively arranged between described two flat brackets；LED chip group includes multiple LED chip, is respectively and electrically connected to described two metal electrodes, and is configured at described two flat brackets and described two metal electrodes Between；Silica gel mixed with fluorescent material is configured between described two flat brackets, for wrapping up described LED chip group and parcel institute State two metal electrodes each electrode at least part of, wrapped metal electrode be in described support part metals electricity Pole.In other words, according to the present invention, each side of multiple LED chips is all contacted with silica gel.

Another embodiment of the present invention provides a kind of LEDbulb lamp, including：Lamp housing, metal mandril, radiator, lamp socket and Metallic conduction support, lamp housing has opening；Metal mandril is used for substituting the gas in described LEDbulb lamp and providing described The function of LEDbulb lamp heat conduction；Radiator is connected with the opening of described lamp housing, has lid in the opening near described lamp housing Version, for supporting described metal mandril, and by described metal mandril transmitted be thermally conducted to described LEDbulb lamp outside；Lamp Seat, connects described radiator；Metallic conduction support is arranged on the cover plate of described radiator, for connecting and supporting multiple LED Filament；The plurality of LED filament of each of which include no lower supporter, be respectively arranged at described no lower supporter two sides two gold medals Belong to electrode, include the LED chip group of multiple LED chips, be configured in described no lower supporter, with the silica gel mixed with fluorescent material, At least part of, the wrapped metal electrode wrapping up described LED chip group and wrapping up each electrode of described two metal electrodes It is in the metallic electrode portion in described support.In other words, according to the present invention, each side of multiple LED chips all with Silica gel contacts.

Another embodiment of the present invention provides a kind of LEDbulb lamp, including：Lamp housing, ceramic stem, radiator, lamp socket and Metallic conduction support, lamp housing has opening；Ceramic stem is used for substituting the gas in described LEDbulb lamp and providing described The function of LEDbulb lamp heat conduction；Radiator is connected with the opening of described lamp housing, has lid in the opening near described lamp housing Version, for supporting described ceramic stem, and by described ceramic stem transmitted be thermally conducted to described LEDbulb lamp outside；Lamp Seat, connects described radiator；Metallic conduction support is arranged on the cover plate of described radiator, for connecting and supporting multiple LED Filament；The plurality of LED filament of each of which include no lower supporter, be respectively arranged at described no lower supporter two sides two gold medals Belong to electrode, include the LED chip group of multiple LED chips, be configured in described no lower supporter, with the silica gel mixed with fluorescent material, At least part of, the wrapped metal electrode wrapping up described LED chip group and wrapping up each electrode of described two metal electrodes It is in the metallic electrode portion in described support.In other words, according to the present invention, each side of multiple LED chips all with Silica gel contacts.

According to the present invention, in order to reach all-round to luminous, support is high temperature resistant light transmissive material with the material of flat bracket. Silica gel mixed with fluorescent material wraps up described LED chip.Compared with prior art, each side of LED chip all with mixed with fluorescence The silica gel contact of powder, so that having the LEDbulb lamp of LED filament, no matter being provided on support or on flat bracket, Omnidirectional can light and lift the luminous efficiency of filament.

Brief description

Accompanying drawing described herein is used for providing a further understanding of the present invention, constitutes the part of the application, this Bright schematic description and description is used for explaining the present invention, does not constitute inappropriate limitation of the present invention.In the accompanying drawings：

Figure 1A is the LED filament structural representation that first embodiment of the invention has multiple LED chip series connection；

Figure 1B is that first embodiment of the invention has multiple LED chips LED filament knot signal composition in parallel；

Fig. 1 C is the LED filament schematic configuration diagram in first embodiment of the invention with multiple LED chips, shows two gold medals Belong to electrode to be fixed on printing opacity support；

Fig. 1 D is the structural side view of the support of another embodiment of the present invention LED filament；

Fig. 2 is that another embodiment of the present invention has multiple LED chips LED filament knot signal composition in parallel；

Fig. 3 is the LED filament structural representation that another embodiment of the present invention has multiple LED chip series connection；

Fig. 4 shows the partial enlargement structure chart of region A in Fig. 3；

Fig. 5 is that second embodiment of the invention has multiple LED chips LED filament knot signal composition in parallel；

Fig. 6 shows the partial enlargement structure chart of region B in Fig. 5；

Fig. 7 is the LED filament structural representation of third embodiment of the invention；

Fig. 8 shows the partial enlargement structure chart of the LED filament of 3rd embodiment shown in Fig. 7；

Fig. 9 is that fourth embodiment of the invention has multiple LED chips schematic diagram in parallel；

Figure 10 shows the LED lamp bulb structure schematic diagram made by LED filament of application one embodiment of the invention；

Figure 11 shows the lamp design figure connecting radiator in Figure 10；And

Figure 12 illustrates the amplification assumption diagram of a-quadrant in Figure 11.

Specific embodiment

Hereinafter detailed features and the advantage of the present invention are described in embodiments in detail with specific embodiment, its content foot So that any those skilled in the art understand the technology contents of the present invention and are capable of, and according to this specification Disclosure of that, claim and schema, any person of an ordinary skill in the technical field can be readily understood upon the present invention The purpose of correlation and advantage.Below example further describes the viewpoint of the present invention, but non-anyways to limit this The category of invention.

To censure particular element as employed some vocabulary in the middle of description and claim, but to be not intended to limit this Invention." one " or " described " used in the description, although presenting in the singular, unless otherwise specified, is explaining On also include plural form.In addition, using " inclusion ", "comprising", " having " etc. or its any other variant meaning in description Covering comprising of nonexcludability, so that including a series of process of key elements, method, commodity or system not only include that A little key elements, but also include other key elements being not expressly set out, or also include for this process, method, commodity or The intrinsic key element of system.In the absence of more restrictions, the key element being limited by sentence "including a ...", does not arrange Remove and also there is other identical element in the process including described key element, method, commodity or system.

Figure 1A show the embodiment that the present invention is arranged at the LED filament 11 in LEDbulb lamp.The embodiment of the present invention LED filament 11 includes：Support 115, two metal electrodes 112 being respectively arranged on 115 liang of sides of support, the tool in support 115 Gold thread 113 that the LED chip group having multiple LED chips 111 is connected with the LED chip 111 in LED chip group and located at Frame 115 internal package lives the silica gel 114 of LED chip 111 and gold thread 113.

Support 115 includes two support side edge 1152 and two non-supported sides 1151.Support 115 is bottomless side Frame, length can be between 10mm to 40mm, and width can be between 2mm to 5mm, and thickness can be between 0.3mm to 2mm. The transmittance of support 115 may be defined as the light transmittance to visible ray and is more than 50%.The material of support 115 can be high temperature resistant printing opacity material Material, can be selected for high temperature resistant translucent silica gel or other has the various plastics of same nature, and its optical index is between parcel LED chip Between 111 silica gel and air.Because support 115 does not have bottom, do not have doubting of shield lights on entirely comprehensive Consider, can all-round to luminous and lift the luminous efficiency of filament.In one embodiment it is also possible to appropriateness in support 115 mix Fluorescent material, makes the support (i.e. printing opacity support) that can light.In other words, according to the present invention, multiple LED chips 111 each Side is all contacted with silica gel 114.Support 115 have two parallel parallel to the non-supported side 1151 setting and two to the support setting Side 1152, in support side edge 1152, difference pre-embedding metal part is as the metal electrode 112 of LED filament 11, the size of metalwork It is about 3 × 1mm, thickness is 0.4mm.Predeterminable some holes (not shown) in the middle of metalwork, with such as insert molding During (insert molding) fabrication techniques support 115, metalwork can be embedded in die cavity, allow as support 115 Material condenses through these holes again, so to metal electrode 112 steadiness in the support side edge 1152 of support 115 have good Good help.The outboard end of the metal electrode 112 on support 115 can arrange a hole or hook (not shown), for LED filament 11 Use as electrical connection when assembling LEDbulb lamp.Support 115 also can arrange metallic conduction circuit above, props up for being placed on LED chip 111 in the middle of frame 115 is electrically connected.

Described LED chip group can be previously positioned on a carrier, to be connected plurality of LEDs chip 111 shape with gold thread routing Become LED string.Then by LED string dislocation in the centre of support 115, with gold thread routing by the head and the tail two LEDs core of LED string Piece 111 does electrical connection with the metal electrode 112 at support 115 two ends.Again by the high heat conduction mixed with fluorescent material above support 115 Silica gel 114 is coated the centre of support 115 and is covered all of LED chip group and the metal electrode 112 within support 115.Connect The carrier removed under LED chip group, then will be mixed with fluorescence from support 115 back side (above corresponding aforesaid support) continuation The high heat conduction silica gel 114 of powder inject support 115 centre and fully wrapped around live LED chip group and the metal within support 115 Electrode 112.Silica gel 114 cooling completes after condensing to be had the LED filament 11 of support 115 and makes.Aforesaid carrier also may be used With the silica gel plate higher from hardness, reuse into strips through processing cutting, so avoid the need for removing carrier and from support 115 back sides reinject high heat conduction silica gel 114, can simplify the fabrication steps of filament.

LED chip group can be that single LEDs chip is constituted, and may also be two LEDs chips and constitute naturally it is also possible to as front institute State is that plurality of LEDs chip portfolio by more than or equal to three forms.In one embodiment, the shape of long strip type can be used as LED A kind of selection of chip.The chip of long strip type spreads equally distributed problem compared with no current, so being not necessarily intended on primary electrode Along with extension electrode to help current spread.And excessive electrode can cover LED chip and light, affect its luminous efficiency.Example LED chip as 10 × 20 specifications is just very applicable, between deducting between LED chip taking up to a LED filament of 40mm as a example Away from afterwards, 18 LEDs chips above it, should be placed.Additionally, the conductive printing opacity of plated surface last layer in LED chip 111 Indium tin oxide (Indium Tim Oxide, ITO), the uniform diffusion profile of electric current and luminous efficiency for chip also can be Lifting.

Figure 1B is the LED filament structural representation of first embodiment of the invention LED chip 111 parallel connection.Figure 1A and Figure 1B's Difference is, the LED chip 111 of Figure 1A is to be connected in series to, and the LED chip 111 of Figure 1B is in parallel Connect.The production method of the LED filament structure of Figure 1B is similar to Figure 1A, refers to the explanation of the embodiment of Figure 1A, therefore here is not Repeat again.

In the present embodiment, taking hollow no bottom framework as a example, as illustrated in figures ia and ib, but the present invention does not limit support 115 In this, support 115 can also have other forms.It is exemplified below other embodiment to illustrate.

Fig. 1 C is the LED filament schematic configuration diagram with multiple LED chips 111, shows that two metal electrodes 112 are fixed on On support 115.The structure of the LED filament 11 of Fig. 1 C can also be applied to the LED filament of Figure 1A or Figure 1B.

Fixing device include the protuberance 115A being formed on support 115 and corresponding to protuberance 115A's and formed Hole 112A on metal electrode 112.When assembling LED filament 11, the metal electrode 112 with hole 112A is placed on On the protuberance 115A of support 115, thus metal electrode 112 is fixed on support 115, to simplify the process of assembling.

Fig. 1 D is the structural side view of another embodiment of the present invention medium-height trestle.In Fig. 1 D, two support platforms 119 are formed at In two support side edge 1152 of support 115, for supporting two metal electrodes 112 respectively.LED chip group is by gold thread 113 dozens Line connect into series connection and be connected with the metal electrode 112 in support platform 119, and inject silica gel 114 thus fully wrapped around live LED chip 111 and gold thread 113.In other words, according to the present invention, each side of multiple LED chips 111 is all connect with silica gel 114 Touch.Two metal electrode 112 structure of the present embodiment can also be applied to the electrode structure of Figure 1A and Figure 1B.

Fig. 2 is that another embodiment of the present invention has multiple LED chips LED filament knot signal composition in parallel.In fig. 2, Support 115 is two flat brackets 117,118 arranged in parallel, and has multiple LED chips 111 and metal electrode 112 is joined It is placed between two flat brackets 117 and 118, and LED chip 111 connects metal electricity by gold thread 113 routing in parallel Pole 112.Fully wrapped around firmly LED chip 111 and gold between two flat brackets 117 and 118 of silica gel 114 injection support 115 Line 113.In this embodiment, the first wire 117a is formed on flat bracket 117, thus the positive terminal by LED chip 111 It is electrically connected to one of metal electrode 112, the negative pole end of LED chip 111 is electrically connected to metal by the second wire 118a Electrode 112 is wherein another.In one embodiment, fixing device be arranged to by two metal electrodes 112 be fixed on two put down Between board mount 117 and 118.

In one embodiment, LED filament has further included printing opacity auxiliary carrier, for supporting LED chip group.

In one embodiment, flat bracket 117 and 118 includes multiple auxiliary support frames, and each auxiliary support frame is respectively Support each LED chip 111.

Fig. 3-6 show another embodiment of LED filament of the present invention, holds above-mentioned manufacture method and slightly makes and changes.In LED After the metal electrode 212 at string and support 215 two ends does electrical connection with gold thread routing, can be by the carrier under LED chip 211 First remove, then LED string is put in mould together with support 215, by mixed with fluorescent material in the way of model (molding) The internal and fully wrapped around firmly LED string of support 215 is filled up in high heat conduction silica gel 214 injection, you can complete the LED with support 215 Filament 21 makes.But when inside silica gel 214 injection support 215, be not necessarily to fill up and had time inside whole support 215 Between, as long as appropriateness all LED chips 211 can be wrapped, such as shown in Fig. 3 to Fig. 6.By by modelling mould design or The change of coating silica gel method, inside the silica gel 214 of injection unfilled support 215, is only complete to wrap LED chip 211st, gold thread 213 and the metal electrode 212 within support 215.In another embodiment, can be formed in chip outer layer Mirror adjusts lighting angle.By way of not being fully filled with support 215, the space being available allows LED string to be easier to radiate. Because the LED chip 211 in LED filament 21 is to be connected with gold thread 213, and gold thread 213 itself has splendid ductility, can The stress that in release LED string, LED chip 211 extrudes in good time, is less likely to occur the problem of electrical connection broken string.

Aforesaid LED string is to be combined in the way of being electrically coupled, but the connected mode between LED chip 211 Do not limit here one pattern, the electrical connection of chip also can be by the metallic conduction circuit (not shown) of laying on support 215 To complete.For example the anelectrode of all LED chips 211 can be connected to the metal of support 215 top by gold thread 213 in Figure 5 Conducting wire, then it is connected to the metal electrode 212 of the support side edge 2152 positioned at support 215 by metallic conduction circuit.Likewise, The negative electrode of all LED chips 211 is connected to the metallic conduction circuit of support 215 lower section by gold thread 213, then by metallic conduction Connection is to the metal electrode 212 of another support side edge 2152 of support 215.Therefore forming LED string is with electrically in parallel Mode combine.But the chip of LED string is electrically connected and is not limited to both patterns, it is possible to use many cores After piece is composed in series a junior unit, then the metallic conduction circuit multiple junior units being connected to support 215 with gold thread 213 On, form parallel coupled electrical connection and combine.

Fig. 7 and Fig. 8 is the schematic diagram of the LED filament of another embodiment of the present invention.The support 315 of filament is also bottomless Frame, its material is high temperature resistant light transmissive material, can be selected for high temperature resistant translucent silica gel or other has the various plastics of same nature.

As illustrated in figs. 7 and 8, different part is that there are many auxiliary stands the inside of support 315 with previous embodiment 3153, protruded by two non-supported sides 3151 of support 315 are corresponding, its function is primarily used to support LED chip 311.Cause There is no bottom for support 315, so not having the doubt of shield lights, the luminous efficiency of LED filament 31 can be lifted.With previous reality Apply described in example, in the two ends support side edge 3152 of support 315, pre-embedding metal part is as the metal electrode 312 of filament 31, metalwork Size as it was previously stated, predeterminable some holes in the middle of it, then with such as insert molding (insert molding) fabrication techniques In stent procedures, metalwork can be embedded in die cavity, allow the material as support 315 to condense again through these holes, so There is good help to steadiness on support for the metal electrode 312.The non-supported side 3152 of support 315 and the auxiliary protruded Metallic conduction circuit also can be set above support 3153, be subsequently placed on the LED chip 311 in the middle of support 315 to be electrically connected. Due to metallic conduction circuit also can be furnished with auxiliary stand 3153, therefore the present embodiment LED chip 311 except being beaten with gold thread It is also possible to select to form electrical connection in the way of flip (flip-chip) structure outside the mode of line forms electrical connection, Exclude the not convenient of gold thread routing.The coating method of silica gel 314 can also only be coated with the periphery of single LEDs chip 311, is not required to fill out Inside full whole support 315, be only complete wrap LED chip 311, or even lens adjustment can be formed in chip outer layer Lighting angle, and the space being available allows LED to be easier to radiate.

Traditional LED filament is after completing all chip making technologies it is necessary to epitaxial wafer is cut apart into many LED chip.In an embodiment of the present invention, it is not necessarily to LED cuts apart into the LED core of many completely Piece is using.In one embodiment it is also possible to use plurality of LEDs chipset one junior unit of synthesis, plurality of LEDs chip is arranged Row growth bar shaped LED light bar, is more suitable for for making LED light source, so not only can save many on LED chip making technology Road chip cutting step, can also reduce the number of times of die bond routing in LED chip packaging technology, to overall process rate matter Amount lifting is very helpful.Additionally, the Sapphire Substrate of epitaxial wafer may be substituted for usual glass substrate on market, it is not required to Will in addition again by cemented for LED chip on other substrates or support, and the heat conductivity of sapphire substrate is up to 120W/mK, far Not worse than the 1W/mK of traditional glass.It is very big good that radiating effect for LED chip on filament and luminous efficiency lifting have Place.And the LED chip group on LED light bar can stamp gold thread with packaging technology each other and be electrically connected it is also possible to by half Conductor making technology plates plain conductor to connect between LED core blade unit.

The LED light bar completing can affix metal electrode in its two ends bottom with high-heat-conductivity glue or tin cream, then to encapsulate The technique of routing is stamped gold thread between the LED chip and metal electrode at LED light bar two ends and is done electrical connection, can also cover in addition The metal electrode to bind LED light bar two ends for the mode of brilliant encapsulation.Finally again the LED light bar carrying metal electrode is put into mould In, superscribe the silica gel mixed with fluorescent material in the way of model in LED light bar periphery, you can complete the making of LED filament.Metal As it was previously stated, its middle some hole predeterminable, in model processing procedure, silica gel can coagulate the size of electrode through these holes again Knot, so has good help to the steadiness of metal electrode.

Further, in all embodiments of the invention, LED core blade unit is selected with long strip type for a kind of.As front institute State, LED chip group can be that single LEDs chip constitutes or formed by plurality of LEDs chip portfolio.The LED core of long strip type Piece spreads equally distributed problem compared with no current, so being not necessarily intended on primary electrode along with extension electrode to help electric current to expand Dissipate.Excessive electrode can cover LED chip and light, and affect its luminous efficiency.And the LED chip group of long strip type more may conform to LED The planform demand of filament.In one embodiment, LED chip group Aspect Ratio can be set in 2:1～10:1.Further, it is contemplated that To the problem of radiating, the LED chip arrangement in strip LED chip group should not be excessively intensive, and distance each other at least should Should be 1 to 3mm, or be designed to LED chip in LED chip group when lighting, and light when different, but light in turn, also may be used Not light all of LED chip in LED chip group, reduce the generation of thermal source, and the LED chip that part is not lighted can make It is used in other purposes, for example, can be selected for plurality of LEDs chipset synthesis bridge rectifier, the alternating current that market is supplied is changed Use for unidirectional current LED chip.In another embodiment it is also possible to the parallel coupled electrical of adjustment LED chip group connects, as Fig. 9 institute Show.In the LED chip group parallel coupled electrical connected mode with Fig. 5 for the Fig. 2, make LED chip group 411 positive and negative electrode of part reverse simultaneously It is linked to the conducting wire on support.When this LED filament connects alternating current power supply, only it is in the LED chip group 411 of forward current Can be bright, the LED chip group 411 being in backward current then will not be bright.All therefore between the positive and negative periodic conversion of alternating current power supply LED chip group 411 can light in turn, can reduce LED chip group 411 thermal source produce, switching electronic can also be reduced simultaneously The cost of device.

In another embodiment, LED core blade unit can also use high-power LED chip, then to be grasped with low current Make, although such LED core blade unit maintains under the situation of low current density, still can possess enough brightness, and LED chip Substantial amounts of thermal source will not be produced, make overall luminous efficiency good.

But the present invention LED core blade unit that can use of creation be not limited to described previously and LED chip species model Enclose, such as AC type light emitting diode (AC LED) and high-pressure type light emitting diode (HV LED) are also the choosing making LED filament Select.Because LED illumination utensil must use civil power, and the power supply being provided on the market is high-voltage ac power, is not appropriate for straight Connect using the electronic component increasing rectification and blood pressure lowering extra on LED light source it is necessary on LED illumination utensil.Due to LED itself It is a kind of diode assembly, suitable combination has functions that rectification, and the concatenation of plurality of LEDs is similar to many resistance strings It is linked togather, high-tension current can be born, therefore AC type light emitting diode and high-pressure type light emitting diode is also highly suitable for use in Make LED filament, it is possible to reduce the cost of rectification and electronic pressure device.

Traditional bulb lamp in manufacturing process, in order to avoid tungsten filament in combustion synthesis in air oxidation scission lost efficacy, therefore The glass structure thing that a loudspeaker stem stem can be designed is enclosed within the opening of glass lamp housing and is sintered sealing, then passes through loudspeaker core again The port of post connects vacuum pump and the air within lamp housing is substituted into nitrogen, it is to avoid the tungsten filament combustion oxidation within lamp housing, more finally Port sintering sealing by loudspeaker stem stem.Additionally, aerial water also can will be spread by substituting of gas inside lamp housing simultaneously Mist removes in the lump.Further, refer to Figure 10, Figure 10 shows the LEDbulb lamp 1 of the LED filament 11 using previous process. LEDbulb lamp 1 includes lamp housing 12, a plurality of LED filament 11, for connect and support LED filament 11 metallic conduction support 13, For the gas substituted in LEDbulb lamp 1 and heat conduction is provided the metal mandril 14 of function, connect metal mandril 14 and by metal Plastic lamp base 16 outside LEDbulb lamp that what stem stem 14 was transmitted be thermally conducted to, radiator 15, lamp holder 17 and located at lamp holder 17 In drive circuit (not shown).Light efficiency in order to improve LEDbulb lamp 1 shows, and lamp housing 12 must possess preferable printing opacity Degree and heat-conducting effect, therefore, the present embodiment is preferred using glass lamp housing, possesses the plastic lantern of high printing opacity and high heat conduction effect in addition Shell also may be selected, and considers the demand to low colour temperature bulb lamp for the market segment, can appropriateness adulterate with flavous in lamp housing Material, or plate the flavous thin film of last layer, the indigo plant that the micro absorption part LED chip of appropriateness is sent in envelope inner surface Light, is showed with the colour temperature downgrading LEDbulb lamp 1.As it was previously stated, vacuum pump can be by the sky within lamp housing 12 through metal mandril 14 Gas substitutes the ratio mixing helping nitrogen or nitrogen and helium appropriateness, to improve the thermal conductivity of gas in lamp housing 12, simultaneously Eliminate the water smoke hiding in air.Additionally, lacking the heat conduction auxiliary of metal rack, the heat that LED filament 11 produces is difficult directly Connect and be transmitted to outside lamp housing, but to absorb, through metal mandril 14, the thermal source that LED filament 11 radiates it is possible to rapidly will It is thermally conducted to radiator 15 to discharge outside lamp housing 12.If additionally, in view of the problem improving light efficiency performance, tradition may also be employed The not glass stem of extinction, and the Graphene again having high heat conduction characteristic in its plated surface last layer light-permeable gets final product improved heat radiation Problem.The radiator 15 slightly cylinder in hollow is centered around the opening of lamp housing 12, and the driving electricity of LED filament 11 can be placed in inside Road, material can be selected for metal, pottery or the high heat conduction plastics with good heat conductive effect.When from metal material (such as Al Aluminum) when coming as radiator 15, because the thermal conduction characteristic of metal material is very well, but very poor (the such as aluminum of its thermal radiation property Radiance only about 0.1), so surface needs coating just to have strengthening thermal radiation effect, such as aluminium oxide (radiance about 0.4) Preferably thermal radiation effect.Radiator 15 is additionally provided with a cover plate 1501 in the open end near lamp housing 12, and its surface can apply Upper aluminium oxide or the reflecting coating of white, so can increase the heat-conducting area of radiator 15 and improve thermal radiation property, fully inhale Receive the heat that LED filament 11 produces and conduct extraneous to spherical shell, two light that LED filament 11 can be sent reflect outside lamp housing with Improve light efficiency.Additionally, the hole (not shown) being passed through with metallic conduction support 13 for metal mandril 14 is provided with cover plate 1501. Drive circuit be can pass through metallic conduction support 13 and is electrically connected with a plurality of LED filament 11, provides power supply with lightening LED lamp silk 11 On LED chip, the input lead of the drive circuit other end is then electrically connected with the lamp holder 17 of LEDbulb lamp 1 tail end.

As it was previously stated, traditional bulb lamp is in manufacturing process, can be enclosed within the opening of glass lamp housing with loudspeaker stem stem and add To sinter sealing, because both materials are all glass, can mutually melt therefore after high temperature sintering and reach the purpose of sealing.But After present invention creation changes using metal mandril 14, the sintering sealing effectiveness of metal and glass relatively cannot be reached as glass horn core Radiator 15 structure that the effect of post, therefore the present embodiment are directed to connection metal mandril 14 is adjusted, to reach ball sealer bubble The purpose of lamp lamp housing.As shown in figure 11, the external form of radiator 15 is just as a bottle cap covering is at the opening of lamp housing 12, its edge There is kink 1502 be connected with the opening glass of lamp housing 12.Refer to Figure 12, in the centre at the port of kink 1502 has Recessed depressed part 1503, the rough opening thickness of glass than lamp housing 12 of its width is a little big, therefore the whole opening of lamp housing 12 End can be enveloped by the complete covering of depressed part 1503.Appropriateness the good fluid sealant of sealing can be inserted in depressed part 1503, Radiator 15 and the connection more shape of lamp housing 12 is allowed to consolidate.Plastic lamp base 16 can be set up again between radiator 15 and lamp holder 17, with Attendant's device or the safety of removal bulb lamp.

The arrangement mode of a plurality of LED filament 11 can assume uprightly symmetrical pattern arrangement around metal mandril 14.But In view of the demand of all-round optical illumination, filament preferably using tiltedly put and non-parallel to metal mandril 14 by the way of preferable.LED filament 11 Interior LED chip can appropriateness be driven shinny from jumbo chip with small current, to reach the purpose of relatively low heating, allows The light efficiency of LED filament 11 can exceed 180lm/W, and the whole lamp brightness of LEDbulb lamp 1 so can be allowed to surmount 700lm easily.This Outward, for whole bulb lamp, the ornaments optimum position of lamp source is the ball immediate vicinity of lamp housing, and long filament cannot All ornaments, in this region, therefore can reach preferably all-round light effect from several more shorter LED filament, at this In embodiment, the length of LED filament is ideal with below 20mm, and 15～10mm is optimal selection.Additionally, lamp source is disperseed Becoming a plurality of short filament that thermal source can be allowed to disperse, not only can increasing the overall radiating effect of LEDbulb lamp, even if pushing up most in lamp housing 12 At the position at end, light rate of change also can be far below 50%, i.e. the brightness of lamp housing top is not less than the brightest position of LEDbulb lamp The 50% of brightness.

Aforesaid metal mandril can also be changed into ceramic stem in the present embodiment, the material of ceramic material can be oxidation Aluminum or aluminium nitride, its thermal radiation absorption rate is high more than glass, therefore can more effectively absorb the heat that LED filament is sent, will Outside heat derives LEDbulb lamp.In other embodiments, the material of radiator (together with the screw socket of LEDbulb lamp) is also optional With there is the ceramic material of good heat conductive effect it is possible to integrally formed with ceramic stem, the screw socket of LEDbulb lamp can be removed from Need to be glued with radiator and increase the thermal resistance of LED filament heat dissipation path, there is more preferable radiating effect.

In the present embodiment, the luminous efficiency of LEDbulb lamp is, for example, 30～400lm/W, preferably 50～250lm/ W.The whole lamp brightness of LEDbulb lamp is for example up to 800lm.The colour temperature of LEDbulb lamp is 2200K～6500K, preferably 2500K～4000K.In addition, the shape of gel coated LED chip can be square or rectangular, its vertical and horizontal ratio As for 1:1～1:100.

The foregoing is only embodiments of the invention, be not limited to the present invention, for those skilled in the art For member, the present invention can have various modifications and variations.All any modifications within the spirit and principles in the present invention, made, Equivalent, improvement etc., should be included within scope of the presently claimed invention.

Claims (23)

1. a kind of LED filament is it is characterised in that include：

Support；

Two metal electrodes, are respectively arranged at two sides of described support；

LED chip group, includes multiple LED chips, the plurality of LED chip is configured in described support, and electrically connects respectively It is connected to described metal electrode；

Mixed with the silica gel of fluorescent material, each electrode of the described LED chip group of parcel and described two metal electrodes of parcel is at least Part, wrapped metal electrode is in the metallic electrode portion in described support.

2. LED filament according to claim 1 is it is characterised in that described support includes two support side edge and two non- Support side, described two metal electrodes are respectively arranged at described two support side edge.

3., it is characterised in that having further included fixing device, being configured to will be described for LED filament according to claim 2 Two metal electrodes are fixed in described two support-side of described support.

4. LED filament according to claim 2 is it is characterised in that be respectively formed with two in described two support side edge Support platform, for supporting described two metal electrodes.

5., it is characterised in that having further included fixing device, being configured to will be described for LED filament according to claim 4 Two metal electrodes are fixed in described two support-side of described support.

6. LED filament according to claim 1 is it is characterised in that described two metal electrodes are respectively embedded in described support Described two support side edge.

7. LED filament according to claim 1 it is characterised in that described two metal electrodes include respectively multiple and described The hole that support combines.

8. LED filament according to claim 1 is it is characterised in that described support is made up of light transmissive material.

9. LED filament according to claim 8 is it is characterised in that the material of described support is silica gel.

10. LED filament according to claim 1 it is characterised in that each side of the plurality of LED chip with described Silica gel contact containing phosphor powder.

11. LED filament according to claim 1 are it is characterised in that described support is no boundary frame area.

12. LED filament according to claim 11 it is characterised in that in the plurality of LED chip most chips arbitrary The all at least part of silica gel touching containing fluorescent material in face.

13. LED filament according to claim 1 it is characterised in that further including auxiliary stand, for supporting described LED core Piece group.

14. LED filament according to claim 13 are it is characterised in that described support includes multiple auxiliary support frames, each Described auxiliary support frame supports each described LED chip respectively.

A kind of 15. LED filament are it is characterised in that include：

Two flat brackets；

Two metal electrodes, are respectively arranged between described two flat brackets；

LED chip group, including multiple LED chips, is respectively and electrically connected to described two metal electrodes, and it is flat to be configured at described two Between board mount and described two metal electrodes；

Mixed with the silica gel of fluorescent material, it is configured between described two flat brackets, for wrapping up described LED chip group and parcel institute State two metal electrodes each electrode at least part of, wrapped metal electrode is in the part in described two flat brackets Metal electrode.

16. LED filament according to claim 15 are it is characterised in that described flat bracket is made up of light transmissive material.

17. LED filament according to claim 15 are it is characterised in that the material of described flat bracket is silica gel.

18. LED filament according to claim 15 it is characterised in that each side of the plurality of LED chip with described Silica gel contact containing phosphor powder.

19. LED filament according to claim 15, it is characterised in that having further included fixing device, are configured to institute State two metal electrodes to be fixed between described two flat brackets.

20. LED filament according to claim 14 are it is characterised in that further include for supporting the auxiliary of described LED chip group Help support.

21. LED filament according to claim 20 it is characterised in that described flat bracket includes multiple auxiliary support frames, Each described auxiliary support frame supports each described LED chip respectively.

A kind of 22. LEDbulb lamp are it is characterised in that include：

Lamp housing, has opening；

Metal mandril, for the gas substituted in described LEDbulb lamp and the function of providing described LEDbulb lamp heat conduction；

Radiator, is connected with the opening of described lamp housing, has lid version in the opening near described lamp housing, described for supporting Metal mandril, and by described metal mandril transmitted be thermally conducted to described LEDbulb lamp outside；

Lamp socket, connects described radiator；

Metallic conduction support, is arranged on the cover plate of described radiator, for connecting and supporting multiple LED filament；

The plurality of LED filament of each of which include no lower supporter, be respectively arranged at described no lower supporter two sides two gold medals Belong to electrode, include the LED chip group of multiple LED chips, be configured in described no lower supporter, with the silica gel mixed with fluorescent material, At least part of, the wrapped metal electrode wrapping up described LED chip group and wrapping up each electrode of described two metal electrodes It is in the metallic electrode portion in described support.

A kind of 23. LEDbulb lamp are it is characterised in that include：

Lamp housing, has opening；

Ceramic stem, for the gas substituted in described LEDbulb lamp and the function of providing described LEDbulb lamp heat conduction；

Radiator, is connected with the opening of described lamp housing, has lid version in the opening near described lamp housing, described for supporting Ceramic stem, and by described ceramic stem transmitted be thermally conducted to described LEDbulb lamp outside；

Lamp socket, connects described radiator；

Metallic conduction support, is arranged on the cover plate of described radiator, for connecting and supporting multiple LED filament；

The plurality of LED filament of each of which include no lower supporter, be respectively arranged at described no lower supporter two sides two gold medals Belong to electrode, include the LED chip group of multiple LED chips, be configured in described no lower supporter, with the silica gel mixed with fluorescent material, Wrap up described LED chip group and the metallic electrode portion being located in described support.