CN207458998U - A kind of encapsulating structure for improving G9 lamp bulb - Google Patents
A kind of encapsulating structure for improving G9 lamp bulb Download PDFInfo
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- CN207458998U CN207458998U CN201721389614.9U CN201721389614U CN207458998U CN 207458998 U CN207458998 U CN 207458998U CN 201721389614 U CN201721389614 U CN 201721389614U CN 207458998 U CN207458998 U CN 207458998U
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- cob
- lamp beads
- lamp
- quartz glass
- lamp bulb
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Abstract
The utility model discloses a kind of encapsulating structure for improving G9 lamp bulb, COB lamp beads, pin, support plate, molybdenum sheet and quartz glass including multiple series connection；Wherein, pin is fixed in molybdenum sheet and the both ends of pin are exposed outside molybdenum sheet, and COB lamp beads are connected by lead with molybdenum sheet, and pin is connected with COB lamp beads, COB lamp beads are arranged on support plate and COB lamp beads are arranged in quartz glass, and silica gel liquid is filled between the gap of COB lamp beads and quartz glass.G9 lamp bulb product brightness after improvement can greatly improve, and improve thermal conductivity, reach better heat dissipation effect, improve the service life of G9 lamp bulb.
Description
Technical field
The utility model is related to bulb envelope technical field, particularly a kind of encapsulating structure for improving G9 lamp bulb.
Background technology
Energy-saving lamp has been used whole 20 years from appearance to popularization, and two years that LEDG9 CFL lightings take less than
Just cover the sky and the earth, the growth of this acceleration formula is all unexpected for enterprise or dealer.
With the fast development of LEDG9 lamp bead Lighting Industries, the usage amount of LEDG9 lamp bead sheathing materials also increases rapidly.
LED illumination sheathing material, i.e. light-scattering material refer to pass light through and can effectively scatter the material of light.Its energy
Electricity, line source are changed into line, area source.
The high brightness of LEDG9 lamp beads, it is low in calories save power consumption well, also comply with the pursuit of people's low-carbon environment-friendly.So
And the light that LED is sent is that directionality is stronger that the shortcomings that penetrating light, being point light source, cause is that light is dazzling, human eye is difficult to receive,
And irradiated area is small.If as illumination using when light must be scattered to can be only achieved the effect of illumination.LEDG9 lamps and lanterns
The appearance for having the makrolon light expanding material of the features such as high transparency, high diffusivity, uniform light solves this and asks well
Topic.
Along with G9 lamp bulb utilizes the advantage of COB products, low thermal resistance, high heat conduction are arrived using small-power chip direct package
Rapid cooling on aluminum substrate, chip area is small, and radiating efficiency is done, driving current is small.
With the gradual maturation of LED application markets, user is higher and higher to the stabilization of product, reliability requirement, particularly
Under equal conditions, it is desirable that product can realize more preferably energy efficiency indexes, lower power consumption and more competitive product valency
Lattice.This is based on, compared with traditional LEDSMD paster type encapsulations and high-power encapsulation, chip on board（COB）Integration packaging skill
Art on metal base printed circuit board, directly radiates plurality of LEDs chip direct package as a lighting module by substrate,
The manufacturing process and its cost of stent can not only be reduced, but also with the heat dissipation advantage for reducing thermal resistance, therefore as illumination enterprise
A kind of packaged type that owner pushes away.
COB light source is in addition to perfect heat-dissipating, cost are low, moreover it is possible to carry out personalized designs.But technically,
COB encapsulation is there are still part the deficiencies of light decay, short life, poor reliability, will be the master of following encapsulation development as being resolved
Lead one of direction.Energy-saving lamp is from occurring having used whole 20 years to popularization, and when LEDG9 CFL lightings take less than 2 years
Between just cover the sky and the earth, although G9 lamp bulb use scope is very wide, utilization rate is also higher, and market increases also relatively rapid, G9 lamps
Bubble also has its some shortcomings to need to improve.The heat dissipation of G9 lamp bulb is to influence a factor of its luminance raising, existing G9 lamp bulb
Encapsulation on heat-conducting effect it is also not so good.
The content of the invention
Technical problem to be solved in the utility model is overcome the deficiencies in the prior art and provides a kind of improvement G9 lamp bulb
Encapsulating structure, the G9 lamp bulb product brightness after improvement can greatly improve, and improve thermal conductivity, reach better heat dissipation effect, carry
The high service life of G9 lamp bulb.
The utility model uses following technical scheme to solve above-mentioned technical problem：
According to a kind of encapsulating structure for improving G9 lamp bulb described in the utility model, the COB lamp beads including multiple series connection are drawn
Foot, support plate, molybdenum sheet and quartz glass；Wherein, pin is fixed in molybdenum sheet and the both ends of pin are exposed outside molybdenum sheet, COB lamp beads
It is connected by lead with molybdenum sheet, pin is connected with COB lamp beads, and COB lamp beads are arranged on support plate and COB lamp beads are arranged on quartzy glass
In glass, silica gel liquid is filled between the gap of COB lamp beads and quartz glass.
As a kind of further prioritization scheme of encapsulating structure for improving G9 lamp bulb described in the utility model, support plate is square
Shape.
As it is described in the utility model it is a kind of improve G9 lamp bulb the further prioritization scheme of encapsulating structure, COB lamp beads
There is fluorescent powder in outer surface.
As it is described in the utility model it is a kind of improve G9 lamp bulb the further prioritization scheme of encapsulating structure, multiple series connection
COB lamp beads are arranged on support plate in the form of an array.
As it is described in the utility model it is a kind of improve G9 lamp bulb the further prioritization scheme of encapsulating structure, multiple series connection
COB lamp beads are arranged on support plate and are rectangle.
The utility model compared with prior art, has following technique effect using above technical scheme：
（1）Prior art using helium as heat-conducting medium, and the thermal conductivity factor of silica gel（0.35）It is far longer than helium
The thermal conductivity factor of gas（0.144）, substantially increase the thermal conductivity of G9 lamp bulb；
（2）Existing product amount is relatively low, and the G9 lamp bulb product brightness after improvement can greatly improve；
（3）Product Visual effect after improvement is more beautiful；
（4）Thermal conductivity is improved, improves the service life of G9 lamp bulb.
Description of the drawings
Fig. 1 is COB lamp bead schematic diagrames.
Fig. 2 is COB, molybdenum sheet, lead, pin link schematic diagram.
Fig. 3 is quartz glass schematic diagram.
Fig. 4 is that light source pincers put schematic diagram.
Fig. 5 is product schematic diagram.
Reference numeral in figure is construed to：1- lamp beads, 2- molybdenum sheets, 3- pins, 4- leads, 5- quartz glass, 6- silica gel.
Specific embodiment
The technical solution of the utility model is described in further detail below in conjunction with the accompanying drawings：
Fig. 1 is COB lamp bead schematic diagrames；COB lamp beads are the light source of G9 lamp bulb, so first have to do is exactly 1 He of lamp bead
The pin 3 of light bulb connects, and lamp bead lamp bead is to be connected the pin 3 of light bulb by molybdenum sheet 2 and lead 4, with spot welding
Mode links together lamp bead, molybdenum sheet 2, pin 3, lead 4, as shown in Figure 2；
Fig. 3 is quartz glass schematic diagram；Quartz glass is for encapsulating G9 lamp bulb sheathing material, and quartz glass has light
In addition diffusion and the function of heat conduction also act as the function of protection light bulb internal components, lamp bead device and resistor- capacitor after encapsulation
Part improves the performance and service life of device in closed environment；
Specific operation is：Fig. 2 pincers are put to the inside of the quartz glass after thawing on envelope bubble board, it will be in Fig. 2
Stable structure in quartz glass, as shown in Figure 4；
Fig. 5 is G9 lamp bulb schematic diagram, and concrete operations are after lamp bead 1 is stablized, by silica gel liquid from the opening of quartz glass 5
The inside of place's injection quartz glass 5, lamp bead 1 is wrapped in silica gel 6, it is impossible to have the outside that lamp bead 1 is exposed at silica gel 6, silica gel 6 floods
Do not have lamp bead 1, finally carry out last sealing on envelope bubble board, G9 lamp bulb is put into after sealing the oven of 150 DEG C/2h into
Row baking, finished product are as shown in Figure 5.
The utility model integrates the LED lamp bead after die bond, bonding wire, sealing adhesive process using support plate, multi-wafer；Quartz glass has
There is preferable heat conductivility, and light transmission is preferable, and the product appearance after encapsulation is perfect, and client is acceptant；High-sintering process into
Ripe, quartz glass needs higher temperature that could melt, and is sintered out perfect G9 lamp bulb shape, achievees the effect that envelope bubble；By silica gel
Inside quartz glass is filled in, baking-curing as Heat Conduction Material for the first time on the product, improves the thermal diffusivity of the product
Energy.
According to the utility model proposes improve G9 lamp bulb encapsulating structure and G9 lamp bulb heat conduction problem, including：G9
The encapsulating structure of light bulb, because to add heat conductive silica gel in inside quartz glass, the encapsulation order of G9 lamp bulb can also change；
The filling of heat conductive silica gel, silica gel needs to add silica gel in inside quartz glass before quartz glass sealing, before envelope is steeped,
Filling gel liquid, has reached better heat dissipation effect between COB and quartz glass gap.Silica gel wraps up COB lamp beads,
Then silica gel is enclosed in inside quartz glass, in closed environment.The filling gel inside G9 lamp bulb not only promotes heat conduction effect
Fruit, and because silica gel has refraction action, further improve the brightness of G9 lamp bulb.
The above content is combine specific preferred embodiment further detailed description of the utility model, it is impossible to
Assert that the specific implementation of the utility model is confined to these explanations.For the ordinary skill of the utility model technical field
For personnel, without departing from the concept of the premise utility, several simple deductions or replacement can also be made, should all be regarded
To belong to the scope of protection of the utility model.
Claims (5)
1. a kind of encapsulating structure for improving G9 lamp bulb, which is characterized in that COB lamp beads, pin including multiple series connection, support plate, molybdenum
Piece and quartz glass；Wherein, pin be fixed in molybdenum sheet and the both ends of pin expose outside molybdenum sheet, COB lamp beads by lead with
Molybdenum sheet connects, and pin is connected with COB lamp beads, and COB lamp beads are arranged on support plate and COB lamp beads are arranged in quartz glass, in COB
Silica gel liquid is filled between the gap of lamp bead and quartz glass.
2. a kind of encapsulating structure for improving G9 lamp bulb according to claim 1, which is characterized in that support plate is rectangle.
A kind of 3. encapsulating structure for improving G9 lamp bulb according to claim 1, which is characterized in that the outer surface of COB lamp beads
There is fluorescent powder.
A kind of 4. encapsulating structure for improving G9 lamp bulb according to claim 1, which is characterized in that the COB lamps of multiple series connection
Pearl is arranged on support plate in the form of an array.
A kind of 5. encapsulating structure for improving G9 lamp bulb according to claim 1, which is characterized in that the COB lamps of multiple series connection
Pearl is arranged on support plate and is rectangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721389614.9U CN207458998U (en) | 2017-10-25 | 2017-10-25 | A kind of encapsulating structure for improving G9 lamp bulb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721389614.9U CN207458998U (en) | 2017-10-25 | 2017-10-25 | A kind of encapsulating structure for improving G9 lamp bulb |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207458998U true CN207458998U (en) | 2018-06-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721389614.9U Active CN207458998U (en) | 2017-10-25 | 2017-10-25 | A kind of encapsulating structure for improving G9 lamp bulb |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107808925A (en) * | 2017-10-25 | 2018-03-16 | 江苏稳润光电科技有限公司 | A kind of encapsulating structure for improving G9 lamp bulb |
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2017
- 2017-10-25 CN CN201721389614.9U patent/CN207458998U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107808925A (en) * | 2017-10-25 | 2018-03-16 | 江苏稳润光电科技有限公司 | A kind of encapsulating structure for improving G9 lamp bulb |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180801 Address after: 212009 88 Wei Yi Road, Ding Mao Development Area, Zhenjiang, Jiangsu Patentee after: Wenrui Photoelectric Co., Ltd., Jiangsu Address before: 212009 88 Wei Yi Road, Ding Mao Development Area, Zhenjiang, Jiangsu Patentee before: Jiangsu Wenrun Optoelectronic Technology Co., Ltd. |