CN203850333U - Full-angle luminous LED white light source - Google Patents
Full-angle luminous LED white light source Download PDFInfo
- Publication number
- CN203850333U CN203850333U CN201320848523.2U CN201320848523U CN203850333U CN 203850333 U CN203850333 U CN 203850333U CN 201320848523 U CN201320848523 U CN 201320848523U CN 203850333 U CN203850333 U CN 203850333U
- Authority
- CN
- China
- Prior art keywords
- light source
- led chip
- transparent
- led
- blue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 18
- 230000001070 adhesive effect Effects 0.000 claims abstract description 18
- 238000004806 packaging method and process Methods 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 23
- 239000004033 plastic Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 8
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 238000004643 material aging Methods 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000000843 powder Substances 0.000 abstract description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241001025261 Neoraja caerulea Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a full-angle luminous LED white light source, and the light source comprises a transparent support; blue-light LED chips, wherein the number of the blue-light LED chips is greater than one, and the blue-light LED chips are disposed on the transparent support through a die bonding adhesive containing fluorescent powder; a metal bonding wire which is used for enabling the LED chips to be connected in series or in parallel; and an electrode which is used for enabling all the LED chips to be connected with a power supply. The LED chips are packaged on the transparent support through a fluorescent adhesive. According to the utility model, the blue-light LED chips are bonded on the transparent support through the die bonding adhesive containing fluorescent powder, and the fluorescent adhesive is used for packaging, thereby solving a problem that the luminous angle of a common LED package light source is limited within 180 degrees, and achieving the omnibearing uniform light emission of the LED white light source.
Description
Technical field
The utility model relates to a kind of white LED light source, and for general illumination light fixture, commercial lighting, as bulb lamp etc., belongs to field of semiconductor illumination.
Background technology
LED is as a kind of novel solid lighting source, there is the features such as volume is little, life-span length, good reliability, energy-saving and environmental protection, illumination, backlight and large scale display aspect are widely used in, the topmost implementation of current LED white light source is that blue-light LED chip adds fluorescent material, as bloom, rouge and powder, green powder etc., part blue light is absorbed by fluorescent material, excites and sends corresponding gold-tinted, ruddiness and green glow.Blue light, gold-tinted, the mixing of ruddiness and green glow, has just produced the visual white light of people.
The white LED light source of encapsulation at present, no matter be that point-source of light is as Top-LED, or area source is as polycrystalline integrated optical source, be COB, all adopt material opaque, good heat conductivity to do stent substrate, as copper, aluminium, aluminium oxide ceramics etc., derive from stent substrate rapidly to the heat energy that LED blue chip is produced in the time lighting, thereby effectively reduce the working temperature of chip, the junction temperature of chip is operated in the operating temperature range of demarcation, improve the life-span of chip.Just because of the utilization of this stent substrate, cause LED bright dipping within the scope of 180 °, its light distribution becomes 120 ° of shapes of lambert's that.
The shortcoming that packaged LED white light source exists at present:
1) one side is luminous, and lighting angle is less than 180 °, as the application for bulb lamp, the Nei You dark space, space of 360 °.
2) if adopt secondary optical design to make divergence of beam, in the process at expansion lamp luminescence angle, can reduce the light extraction efficiency of light source, be unfavorable for energy-conservation.
Utility model content
The problem existing for prior art, the purpose of this utility model is to provide a kind of full angle emitting led white light source, and the Omnibearing even of having realized white LED light source is luminous.
The emitting led white light source of a kind of full angle of the present utility model comprises:
Transparent rack;
Blue-light LED chip, this LED chip is more than a slice, and is arranged on described transparent rack by being mixed with the crystal-bonding adhesive of fluorescent material;
Metal bonding wire, for connecting described LED chip or be connected in parallel;
Electrode, for being connected described LED chip with power supply;
Wherein, described LED chip is encapsulated on described transparent rack by fluorescent glue.
Preferably, described metal bonding wire or electrode are arranged on transparent rack by insulating barrier.
Preferably, described crystal-bonding adhesive is transparent resin material or silica gel, and crystal-bonding adhesive thickness is 4～20 μ m.
Preferably, described LED chip is the transparent LED chip of back side no-reflection rete.
Preferably, described fluorescent glue is mixed by fluorescent material and packaging plastic, and wherein the mixed proportion of fluorescent material and packaging plastic is 1:0.05～0.5, and the thickness of fluorescent glue is 0.1～2.0mm.
Preferably, described packaging plastic is silica gel or epoxy resin.
The LED white light source advantage that the utility model is made:
1, the white LED light source that adopts the utility model to make, by the crystal-bonding adhesive that is mixed with fluorescent material, blue-light LED chip is bonded on transparent rack, and encapsulate by fluorescent glue, like this, be confined to the problem within 180 ° with regard to having overcome common LED packaged light source lighting angle, the Omnibearing even of having realized white LED light source is luminous;
2,, without 360 ° of secondary optical designs, improved the utilance of light.
Brief description of the drawings
Fig. 1 is the structural representation of white LED light source of the present utility model;
Fig. 2 is fluorescent material crystal-bonding adhesive partial schematic diagram.
Embodiment
As shown in Figure 1, 2, implementation of the present utility model: the transparent crystal-bonding adhesive 3 that transparent chips 4 use has been mixed to fluorescent material coheres on transparent rack 1, between chip and between chip and electrode 2, connect by metal bonding wire 6, transparent chips 4 covers the packaging plastic 5 that is mixed with fluorescent material above.
The selected package support material of the utility model is transparent material, including, but not limited to transparent alumina ceramics, and aluminium nitride ceramics, silica, glass or resin, shape can be circle, square or other geometries.
The selected transparent chips 4 of the utility model is transparent blue-light LED chip, is one or many, adopts the mode of serial or parallel connection that transparent chips 4 is connected with metal bonding wire 6; And be connected with the electrode on transparent rack 1.
The selected crystal-bonding adhesive 3 of the utility model is transparent resin or silica gel material, and light transmission is good, mixed fluorescent powder therein, preferably the mixed proportion of crystal-bonding adhesive and fluorescent material is 1:(0.05～0.5), crystal-bonding adhesive thickness is 2～15 μ m.
The selected packaging plastic of the utility model is transparent silica gel or the epoxy resin of light transmission, good stability, and mixes with fluorescent material.
The selected fluorescent material of the utility model is one or more mixture in the rouge and powder that can be excited by blue-ray LED, orange powder, bloom and green powder, and preferred particulates is 3～8 μ m;
In addition, the manufacture method of white LED light source of the present utility model, step is as follows: 1, take transparent crystal-bonding adhesive and fluorescent material, the two is mixed, with it, transparent blue-light LED chip is fixed on transparent rack 1, put into baking oven baking-curing; 2, the transparent blue-light LED chip in step 1 resulting materials is welded by metal bonding wire 6, after serial or parallel connection, access the electrode 2 above support insulating barrier; 3, weigh phosphor powder and packaging plastic, mixes the two, is evenly coated on the support of intrinsic transparent chips, puts into baking oven heating it is solidified; 4,, by the module place in circuit of step 3 gained, obtain full angle LED white light source.
The white LED light source advantage that the utility model is made: the white LED light source that 1, adopts the utility model to make, by the crystal-bonding adhesive that is mixed with fluorescent material, blue-light LED chip is bonded on transparent rack, and encapsulate by fluorescent glue, like this, be confined to the problem within 180 ° with regard to having overcome common LED packaged light source lighting angle, the Omnibearing even of having realized white LED light source is luminous; 2,, without 360 ° of secondary optical designs, improved the utilance of light.
Claims (6)
1. the emitting led white light source of full angle, is characterized in that, comprising:
Transparent rack;
Blue-light LED chip, this LED chip is more than a slice, and is arranged on described transparent rack by being mixed with the crystal-bonding adhesive of fluorescent material;
Metal bonding wire, for connecting described LED chip or be connected in parallel;
Electrode, for being connected described LED chip with power supply;
Wherein, described LED chip is encapsulated on described transparent rack by fluorescent glue.
2. light source as claimed in claim 1, is characterized in that, described metal bonding wire or electrode are arranged on transparent rack by insulating barrier.
3. light source as claimed in claim 1, is characterized in that, described crystal-bonding adhesive is transparent resin material or silica gel, and crystal-bonding adhesive thickness is 4～20 μ m.
4. light source as claimed in claim 1, is characterized in that, described LED chip is the transparent LED chip of back side no-reflection rete.
5. light source as claimed in claim 1, is characterized in that, described fluorescent glue is mixed by fluorescent material and packaging plastic, and wherein the mixed proportion of fluorescent material and packaging plastic is 1:0.05～0.5, and the thickness of fluorescent glue is 0.1～2.0mm.
6. light source as claimed in claim 4, is characterized in that, described packaging plastic is silica gel or epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320848523.2U CN203850333U (en) | 2013-12-20 | 2013-12-20 | Full-angle luminous LED white light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320848523.2U CN203850333U (en) | 2013-12-20 | 2013-12-20 | Full-angle luminous LED white light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203850333U true CN203850333U (en) | 2014-09-24 |
Family
ID=51563313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320848523.2U Expired - Lifetime CN203850333U (en) | 2013-12-20 | 2013-12-20 | Full-angle luminous LED white light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203850333U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106373949A (en) * | 2015-07-22 | 2017-02-01 | 亿光电子工业股份有限公司 | Light emitting device |
-
2013
- 2013-12-20 CN CN201320848523.2U patent/CN203850333U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106373949A (en) * | 2015-07-22 | 2017-02-01 | 亿光电子工业股份有限公司 | Light emitting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: SHENZHEN BETOP ELECTRONICS Co.,Ltd. Assignor: SHINEON (BEIJING) TECHNOLOGY Co.,Ltd. Contract record no.: 2014440000471 Denomination of utility model: Full-angle light-emitting LED white light source and manufacturing method thereof Granted publication date: 20140924 License type: Exclusive License Record date: 20141201 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| EC01 | Cancellation of recordation of patent licensing contract | ||
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: SHENZHEN BETOP ELECTRONICS Co.,Ltd. Assignor: SHINEON (BEIJING) TECHNOLOGY Co.,Ltd. Contract record no.: 2014440000471 Date of cancellation: 20170925 |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140924 |