CN102447049B - LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator - Google Patents
LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator Download PDFInfo
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- CN102447049B CN102447049B CN 201110456524 CN201110456524A CN102447049B CN 102447049 B CN102447049 B CN 102447049B CN 201110456524 CN201110456524 CN 201110456524 CN 201110456524 A CN201110456524 A CN 201110456524A CN 102447049 B CN102447049 B CN 102447049B
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Abstract
The invention relates to an LED (light-emitting diode) package structure based on a COB (chip on board) package technology and an LED illuminator. The existing package structure has the problems of large volume, multiple particles, difficulty in heat dissipation, exceed standard glare, high cost and the like when being applied to an indoor illuminator. The LED package structure provided by the invention comprises a base plate and multiple groups of LED chip package structures, wherein the multiple groups of LED chip package structures are arranged on the base plate and surrounded by silica gels; and a mixture of fluorescent powder and glue is filled in the surrounded region and is of a plane shape on the top of the surrounded region. The LED illuminator comprises the LED package structure, wherein groups of LED chip package structures in the LED package structure are connected in parallel between an upper bus and a lower bus. According to the invention, The structure is simple and practicable, heat dissipation property is good and the reflection effect is good.
Description
Technical field
The invention belongs to LED encapsulation technology field, relate in particular to a kind of LED encapsulating structure based on the COB encapsulation technology and LED lighting device.
Background technology
Existing room lighting LED matrix is mainly used led chip is packaged into individual devices, as the SMD packagings of SMD such as 3020,3528,5050.There are problems such as volume is big, particle is many, heat radiation is difficult, dazzle exceeds standard, cost height in the SMD package application in interior illuminator.
Also there are some uses that the COB encapsulating structure of circular groove is arranged.There is the COB encapsulation of circular groove to solve some problems that many connection in series-parallel application of SMD bring, but groove needs machinery to carry out secondary process, and when carrying out the COB encapsulation, need put fluorescent glue one by one, cause the production cycle long, point glue inequality, because the method point fluorescent glue is outer gibbosity, causes LED to go out the relatively poor problem of light consistency.
Summary of the invention
The objective of the invention is at the deficiencies in the prior art, first technical problem of solution is: the COB encapsulating structure that shortcomings such as a kind of SMD of overcoming formula LED volume is big, heat radiation is difficult, cost is high, dazzle exceeds standard are provided.
Second technical problem that the present invention solves is: a kind of LED lighting device based on the COB encapsulation technology is provided, and this device encapsulation is simple, and fluorescent glue is evenly distributed, thereby eliminates hot spot, makes the bright dipping of LED lighting device even.
The present invention solves the technical scheme that first technical problem adopts:
A kind of LED encapsulating structure based on the COB encapsulation technology comprises substrate, organizes the led chip encapsulating structure more.Many group led chip encapsulating structures are arranged on the substrate, and are surrounded by silica gel; Be filled with the mixture of fluorescent material and glue in this surrounds the zone, described mixture is plane surrounding regional top.
Described led chip encapsulating structure comprises the led chip encapsulation unit of a plurality of serial connections, and each led chip encapsulation unit comprises led chip, elargol and the coating that sets gradually from top to bottom; Coating is arranged on the solid brilliant position of substrate, connects by gold thread between the adjacent LED chip packaging unit, and described gold thread one end and led chip upper surface electrode are fixed, and the pad between the other end and the led chip encapsulation unit is fixed.
Described led chip is the chip of bipolar electrode, and routing position pad is positioned at solid brilliant position dual-side.
Described substrate is rectangular-shaped high-thermal conductive metal base plate.
Described silica gel is heat conductive silica gel, and has the function that prevents that described encapsulating material from overflowing, and described encapsulating material is the mixture of fluorescent material and glue.
The present invention solves the technical scheme that second technical problem adopts:
A kind of LED lighting device comprises aforesaid LED encapsulating structure; Every group of led chip encapsulating structure in the LED encapsulating structure is connected in parallel between bus and the following bus.
Beneficial effect of the present invention: compared to existing technology, the present invention proposes a kind of encapsulating structure based on the COB encapsulation technology, but surround the silica gel of heat conduction at substrate, the encapsulating material that when packaging LED chips, uses fluorescent material and glue to be mixed and made into, described encapsulating material is filled in and surrounds the zone and be plane, avoided because fluorescent glue is outer gibbosity, cause LED to go out the relatively poor problem of light consistency, also can simplify packaging process, and provide a kind of simple and practical, thermal diffusivity is good, reflecting effect is good, colourity is even, temperature resistant capability is strong, the lighting device of the LED that packaging cost is low.
Description of drawings
Fig. 1 is prior art constructions figure;
Fig. 2 is the cross sectional representation of single-chip package structure in the embodiment of the invention;
Fig. 3 is the structural representation of LED lighting device in the embodiment of the invention.
Embodiment
The present invention is further described below in conjunction with accompanying drawing.
The present invention has avoided the SMD encapsulation to have problems such as volume is big, particle is many, heat radiation is difficult, dazzle exceeds standard, cost height.As shown in Figure 1, in Fig. 1, SMD paster LED light source 2 is welded in pcb board 1, and every spacing is bigger, and the point-like effect is obvious, and frame of broken lines is represented the dark space 3 that produces, and the hot spot that produces when using lighting device causes dazzle to exceed standard.
As shown in Figure 2, the cross sectional representation for single-chip package structure in the embodiments of the invention comprises: substrate 5 and a led chip encapsulation unit 7; Led chip encapsulation unit 7 is arranged on the substrate 5, and is surrounded by silica gel 15; The mixture of filling fluorescent material and glue in this surrounds the zone, described mixture are plane surrounding regional top;
Described led chip encapsulation unit 7 comprises led chip 8, elargol 18 and the coating 19 that sets gradually from top to bottom; Coating 19 is arranged on the solid brilliant position of substrate 5, and led chip 8 is fixed on the coating 19 of described substrate 5 by elargol 18; Led chip 8 upper surface electrodes are connected with substrate 5 upper surface routing positions by gold thread 16.
Described led chip 8 is the chip of bipolar electrode, and routing position pad is positioned at solid brilliant position dual-side.
Described substrate 5 is rectangular-shaped high-thermal conductive metal base plate.
Described silica gel 15 is heat conductive silica gel, and has the function that prevents that described encapsulating material from overflowing, and described encapsulating material is the mixture of fluorescent material and glue.
Described coating 19, the optional gold, silver of material or aluminium, thermal conductivity height, reflecting effect are good;
Described encapsulating material 14 light transmittance height, refractive index height, good fluidity, easy curing are blocked with cofferdam silica gel 15 and prevent its outflow.Led chip 8 is blue chip, and technology is ripe relatively, the conversion efficiency height; Described fluorescent material is blue-light excited ruddiness and gold-tinted fluorescent material; Described glue is epoxide-resin glue, and ratio is easily allocated, and cost is low.
As shown in Figure 3, be the structural representation of LED lighting device in the embodiment of the invention.A kind of LED encapsulating structure 4 based on the COB encapsulation technology comprises substrate 5, organizes led chip encapsulating structure 6 more, and described led chip encapsulating structure 6 is arranged on the substrate 5, and is surrounded by silica gel 15; Be filled with the mixture of fluorescent material and glue in this surrounds the zone, described mixture is plane surrounding regional top;
Described led chip encapsulating structure 6 comprises the led chip encapsulation unit 7 of a plurality of serial connections, and the structure of each led chip encapsulation unit 7 as above example is described.
Connect by gold thread 16 between the adjacent LED chip packaging unit 7, described gold thread 16 1 ends and led chip upper surface electrode are fixed, and the pad 11 between the other end and the led chip encapsulation unit 7 is fixing.
Described led chip 8 is the chip of bipolar electrode, and routing position pad is positioned at solid brilliant position dual-side, shortens the routing distance, has improved operability and reliability, and has saved the cost of gold thread 16.
Surround with silica gel 15 on the described substrate 5, rectangular being arranged on around the led chip 8 highly is no more than 1mm.After the cold curing, cover with point gum machine and to be coated with encapsulating material 14, need not to put one by one glue, only need the average mark glue of layouting, because encapsulating material 14 self good mobility makes it be plane, silica gel 15 surrounds it, and the upper surface of encapsulating material 14 is no more than silica gel 15, be area source with this illuminating source that forms, no point-like effect, free from glare.
Every group of led chip encapsulating structure 6 is connected in parallel between bus 12 and the following bus 13.Two its substrate 5 head and the tail that are provided with LED encapsulating structure 4 are together seamless spliced, are communicated with by lead-in wire between plate 17.
In sum, the embodiment of the invention adopts the LED encapsulating structure 4 based on the COB encapsulation technology, has avoided SMD paster class LED lighting device problem, the problem includes: problems such as volume is big, particle is many, heat radiation is difficult, dazzle exceeds standard, cost height.Also eliminated in the COB encapsulation that groove is set, owing to need the heat sink groove of processing, put fluorescent glue one by one, caused the production cycle long, some glue inequality, and because the method point fluorescent glue is outer gibbosity, cause LED to go out the relatively poor problem of light consistency.By selecting the silica gel 15 that cohesiveness is strong, heat conduction and heat radiation is good to surround; prevent that encapsulating material 14 from overflowing, make things convenient for control point glue amount, and protected encapsulating material 14 well; make it to have good adhesion strength and heat dispersion, further improved the useful life of LED lighting device.The present invention once can organize the LED lighting device by encapsulated moulding more, and is simple and practical, thermal diffusivity good, go out that light consistency is good, reflecting effect good, colourity is even, temperature resistant capability is strong, packaging cost is low.
Giving an example of the above near-sighted specific embodiment of the invention can not assert that concrete enforcement of the present invention is confined to these explanations, does not address part in detail and is those skilled in the art's common practise.Without departing from the inventive concept of the premise, any simple deduction, equivalent transformation of making is also within protection scope of the present invention.
Claims (5)
1. the LED encapsulating structure based on the COB encapsulation technology comprises substrate, organizes the led chip encapsulating structure more, it is characterized in that: organize the led chip encapsulating structure more and be arranged on the substrate, and surrounded by silica gel; Be filled with the mixture of fluorescent material and glue in this surrounds the zone, described mixture is plane surrounding regional top;
Described led chip encapsulating structure comprises the led chip encapsulation unit of a plurality of serial connections, and each led chip encapsulation unit comprises led chip, elargol and the coating that sets gradually from top to bottom; Coating is arranged on the solid brilliant position of substrate, connects by gold thread between the adjacent LED chip packaging unit, and described gold thread one end and led chip upper surface electrode are fixed, and the pad between the other end and the led chip encapsulation unit is fixed.
2. a kind of LED encapsulating structure based on the COB encapsulation technology as claimed in claim 1, it is characterized in that: described led chip is the chip of bipolar electrode, routing position pad is positioned at solid brilliant position dual-side.
3. a kind of LED encapsulating structure based on the COB encapsulation technology as claimed in claim 1, it is characterized in that: described substrate is rectangular-shaped heat-conducting metal substrate.
4. a kind of LED encapsulating structure based on the COB encapsulation technology as claimed in claim 1, it is characterized in that: described silica gel is heat conductive silica gel, and has the function that prevents that described encapsulating material from overflowing, described encapsulating material is the mixture of fluorescent material and glue.
5. a LED lighting device comprises a plurality of LED encapsulating structures as claimed in claim 1, it is characterized in that: every group of led chip encapsulating structure in the LED encapsulating structure is connected in parallel between bus and the following bus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110456524 CN102447049B (en) | 2011-12-31 | 2011-12-31 | LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110456524 CN102447049B (en) | 2011-12-31 | 2011-12-31 | LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator |
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| CN102447049A CN102447049A (en) | 2012-05-09 |
| CN102447049B true CN102447049B (en) | 2013-08-14 |
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| CN 201110456524 Expired - Fee Related CN102447049B (en) | 2011-12-31 | 2011-12-31 | LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102938402A (en) * | 2012-07-11 | 2013-02-20 | 周海兵 | Chip-on-board (COB) packaging high-power light-emitting diode (LED) lamp and manufacture method thereof |
| CN103047556A (en) * | 2012-09-14 | 2013-04-17 | 孙百贵 | Manufacture method of light-emitting diode (LED) lamp based on chip on board (COB) device |
| CN103258944A (en) * | 2013-05-31 | 2013-08-21 | 江苏索尔光电科技有限公司 | Method for manufacturing LED package |
| CN104347605A (en) * | 2013-08-06 | 2015-02-11 | 惠州市华阳光电技术有限公司 | Light-emitting diode packaging process |
| CN106067510A (en) * | 2016-07-28 | 2016-11-02 | 马建芳 | A kind of LED light source application module based on SMT paster technique die bond |
| CN108036204B (en) * | 2017-12-14 | 2020-03-17 | 广东雷腾智能光电有限公司 | COB light source capable of eliminating stray light |
| CN108807642B (en) * | 2018-06-15 | 2024-03-29 | 佛山宝芯智能科技有限公司 | Semiconductor modularized packaging system and packaging method |
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|---|---|---|---|---|
| CN101783384A (en) * | 2010-02-04 | 2010-07-21 | 九江联辉光电有限公司 | Method for sealing large-power LED |
| JP2010532929A (en) * | 2007-07-06 | 2010-10-14 | エルジー イノテック カンパニー リミテッド | Light emitting device package |
| CN202373627U (en) * | 2011-12-31 | 2012-08-08 | 杭州电子科技大学 | Light-emitting diode (LED) packaging structure and LED lightening device based on chip on board (COB) packaging technique |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010532929A (en) * | 2007-07-06 | 2010-10-14 | エルジー イノテック カンパニー リミテッド | Light emitting device package |
| CN101783384A (en) * | 2010-02-04 | 2010-07-21 | 九江联辉光电有限公司 | Method for sealing large-power LED |
| CN202373627U (en) * | 2011-12-31 | 2012-08-08 | 杭州电子科技大学 | Light-emitting diode (LED) packaging structure and LED lightening device based on chip on board (COB) packaging technique |
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