CN202120908U - Single-lead light-emitting diode (LED) module - Google Patents
Single-lead light-emitting diode (LED) module Download PDFInfo
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- CN202120908U CN202120908U CN2011202069304U CN201120206930U CN202120908U CN 202120908 U CN202120908 U CN 202120908U CN 2011202069304 U CN2011202069304 U CN 2011202069304U CN 201120206930 U CN201120206930 U CN 201120206930U CN 202120908 U CN202120908 U CN 202120908U
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- led
- led chip
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- lens module
- wiring board
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Abstract
The utility model relates to a single-lead light-emitting diode (LED) module, which comprises a radiator, a circuit board, an LED chip, fluorescent powder, packaging glue, sealing silica gel and a lens module. The lower surface of the LED chip is welded on the electrode welding disc of the circuit board, the upper surface of the LED chip is welded to the other electrode of the circuit board through a lead, the circuit board is attached to the radiator, and the lens module is arranged above the LED chip and is filled with the glue. The LED chip is directly welded on the circuit board, a traditional packaging process of the LED chip is abandoned, a support with heat sink is abandoned, and the heat of the LED chip is directly spread to the highly-conductive circuit board and the radiator so as to improve heat dissipation effect. Only the packaging glue is arranged between the lens module and the LED chip so that light passes through fewer media and the light-transmitting rate is high. Moreover, the refractive rates of the filling glue and the lens module are matched, reflective loss is less, and the light-transmitting rate of the LED module is increased.
Description
Technical field
The utility model relates to semiconductor application and encapsulation field, more particularly, relates to a kind of LED module of single lead-in wire.
Background technology
Along with led chip technology and Development of Packaging Technology, increasing LED product is applied to lighting field, especially large power white light LED.Because LED has high light efficiency, long-life, energy-conserving and environment-protective, suitable brightness adjustment control, polluter such as not mercurous, becomes the lighting source of new generation after conventional light source such as incandescent lamp, fluorescent lamp.
LED is a kind of electroluminescence semiconductor device, wherein has 30 percent electric energy to convert light into approximately, and dump energy then converts heat into, and the LED temperature that thermal accumlation causes rises, and is the main cause that causes the LED light decay.Thereby the led chip heat radiation is the key issue that the LED encapsulation is devoted to solve, and manufacturer has proposed various packaged types in succession both at home and abroad.
The theory of traditional encapsulation all is to be encapsulated into led chip on the support of LED device; And the relevant research work of a large amount of encapsulation all center on the support expansion, comprises that hot property, the reflective function of support, the stability of material all become the emphasis of research and drops into huge manpower and materials.
At present, led chip is fixed on support heat sink, forms the LED device, and the LED device places on the metal base circuit board, and metal substrate places on the radiator.Heat through heat dissipation channels such as heat sink, aluminium bases after radiator spread out.
That is to say, adopt structure as shown in Figure 1 to carry out LED encapsulation and assembling.It is: led chip and heat sink etc. is packaged into LED device 103, and LED device 103 is welded to wiring board 102, and like aluminium base, wiring board 102 is fixed on radiator 101 through modes such as screw or silicone grease.Its passage of heat is: heat is from led chip, and, wiring board 102 inner heat sink through encapsulating and radiator 101 finally are transmitted to air.There is following defective in above-mentioned LED module: because the led chip heat radiation needs the middle interlayer of passage of heat of process many; And LED is heat sink and wiring board 102, wiring board 102 and radiator 101 between medium be air or silicone grease; Middle interlayer thermal conductivity is lower, so heat dispersion is not good.
For general LED application luminaire, light generally will pass through after sending from chip: fluorescent material, package lens, air, light-distribution lens are again to diffuser, and the medium of light process is many, and each interface all reflection loss can take place, and therefore total optical transmittance is low.Thereby, there are shortcomings such as heat dispersion is not good, optical transmittance is low, production process is complicated, cost height.
The utility model content
The purpose of the utility model is to solve problem set forth above, provides that a kind of heat dissipation is good, light extraction efficiency is high, production process is simple, the LED module of single lead-in wire with low cost.
The technical scheme of the utility model is such:
A kind of LED module of single lead-in wire; Comprise radiator, wiring board, led chip, fluorescence part, packing colloid, sealing silica gel and lens module; Said led chip lower surface is welded on the wiring board electrode pad, and the led chip upper surface arrives another electricity level of wiring board through wire bonds; Said wiring board and radiator are fitted; Said lens module is installed on the led chip, the inner packing colloid of filling.
As preferably, the lens module is designed with back-off structure, radiator tip upside down on form on the lens module close fixing.
As preferably, described lens module is designed with plural at least lens.
As preferably, two electrodes of said led chip lay respectively at the chip upper and lower surfaces, and lower surface electrode is coated with solder coating, and upper surface has fluorescent material.。
As preferably, led chip is parallel with the LED open-circuit protector, and it act as open-circuit-protection and antistatic.
As preferably, described wiring board is a metal base circuit board, comprises metal level, insulating barrier and electrical layer; Electrical layer is provided with electrode pad electroplate or gold or nickel.
As preferably, described wiring board is the high heat-conducting ceramic substrate, comprises ceramic layer and electrical layer, and electrical layer is provided with electrode pad, is coated with silver or nickel or gold.
As preferably, described packing colloid refractive index is between 1.4 to 1.6.
As preferably, described sealing silica gel comprises the solid silicon cushion rubber that is installed on the lens module, and is coated in the gel silica gel circle that the liquid silica gel of solid silicon cushion rubber side forms.
As preferably, on the position on the lens module plane that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.
The beneficial effect of the utility model is following:
At first; The theory of traditional encapsulation all is to be encapsulated into led chip on the support of LED device, and the relevant research work of a large amount of encapsulation all center on the support expansion, and the stability that comprises hot property, reflective function, the material of support all becomes the emphasis of research and drops into huge manpower and materials and the present invention has jumped out the set of this thoughtcast; Casted off the support of LED device once and for all; Led chip directly encapsulates in the circuit board, has omitted to include heat sink support, and the heat that makes led chip is without heat sink this intermediate layer; Directly be diffused into the wiring board and the radiator of high thermal conductivity, good heat dissipation effect.
Secondly, between lens module and the led chip, the filling colloid is only arranged; And fill the colloid refractive index between 1.4 to 1.6, and light is few through medium, and transmitance is high; And fill the refractive index match of colloid and lens module, reflection loss is few, has improved the light extraction efficiency of LED module.
In addition, it is few that the LED module comprises parts, and production process is simple, and is with low cost.
Description of drawings
Fig. 1 is the encapsulation exemplary plot of existing LED device;
Fig. 2 is a LED module embodiment sketch map of the present invention;
Fig. 3 forms sketch map for wiring board of the present invention;
Fig. 4 is a lens module sketch map of the present invention;
Among the figure, the 101st, radiator, the 102nd, wiring board, the 103rd, LED device; The 201st, radiator, the 202nd, wiring board, the 203rd, led chip, the 204th, LED open-circuit protector; The 206th, sealing silica gel, the 207th, lens module, the 301st, metal level, the 302nd, insulating barrier; The 303rd, electrical layer, the 401st, lens pit, the 402nd, back-off structure.
Embodiment
Embodiment to the utility model is further elaborated below in conjunction with accompanying drawing:
A kind of LED module of single lead-in wire; Comprise radiator 201, wiring board 202, led chip 203, fluorescent material, packing colloid, sealing silica gel 206 and lens module 207; Said led chip 203 lower surface electrode are welded on wiring board 202 electrode pads through eutectic technology, and led chip 203 upper surface electrodes arrive wiring board 202 another electrode pads through wire bonds; Said wiring board 202 is fitted with radiator 201; Said lens module 207 is installed in led chip 203 tops, the inner packing colloid of filling.
Said wiring board 202 is fitted with the form that face contacts with radiator 201.
Described lens module 207 is designed with plural at least lens.
203 two electrodes of said led chip lay respectively at the chip upper and lower surfaces, and lower surface electrode is coated with solder coating, and upper surface has fluorescent material.。
Said fluorescent material can directly be put on led chip 203, perhaps sprays, perhaps is mounted on the led chip 203.
Led chip 203 is parallel with LED open-circuit protector 204, and it act as open-circuit-protection and antistatic.
Described wiring board 202 is a metal base circuit board 202, comprises metal level 301, insulating barrier 302 and electrical layer 303; Electrical layer 303 is provided with electrode pad, electrode pad electroplate or gold or nickel.
Described wiring board 202 is the high heat-conducting ceramic substrate, comprises ceramic layer and electrical layer 303, and electrical layer 303 is provided with electrode pad, is coated with silver or nickel or gold.
Described packing colloid refractive index is between 1.4 to 1.6.
Described sealing silica gel 206 comprises the solid silicon cushion rubber that is installed on the lens module 207, and the gel silica gel circle that is coated in the liquid silica gel formation of solid silicon cushion rubber side.On the position on lens module 207 planes that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.Described lens module 207 has an integral planar; Obviously seeing one by one protruding on the plane is lens (seeing if falling, is exactly the lens pits), and this position, edge, plane is enclosed a solid silicon cushion rubber earlier; The solid silicon cushion rubber outside or inner side; On corresponding lens module 207 planes, a circle groove is arranged, be used for coating liquid silica gel.Certainly, also groove can be set, directly coat liquid silica gel.
The application's core is: existing LED module, often led chip is fixed on support heat sink, and be packaged into the LED device; The LED device is welded on different wiring boards; Be installed to again on the radiator, form Different products, to adapt to more wider application scenarios; And become industry technology prejudice, and the frame mode of this LED module exists shortcomings such as heat dispersion is not good enough, optical transmittance is low, parts complicacy.
The application is directly carried led chip 203 and is overlayed on the wiring board 202, and adopts lens module 207 once light-distributions, has reached the light extraction efficiency of better radiating effect and Geng Gao, and has solved led chip and overlayed on the encapsulation problem on the wiring board 202 in 203 years.
Embodiment
As shown in Figure 2, a kind of LED module comprises: radiator 201, wiring board 202, led chip 203, LED open-circuit protector 204, fluorescent material, packing colloid, sealing silica gel 206, lens module 207.In the present embodiment, LED open-circuit protector 204 is selected Zener diode for use.Described sealing silica gel 206 comprises the solid silicon cushion rubber that is installed on the lens module 207, and the gel silica gel circle that is coated in the liquid silica gel formation of solid silicon cushion rubber side.On the position on lens module 207 planes that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.In the present embodiment, described lens module 207 has an integral planar, sees obviously on the plane that one by one protruding is that lens (are seen if falling; Be exactly the lens pits); This position, edge, plane is enclosed a solid silicon cushion rubber earlier, and the solid silicon cushion rubber outside or inner side are on corresponding lens module 207 planes; One circle groove is arranged, be used for coating liquid silica gel.Certainly, also groove can be set, directly coat liquid silica gel.
Led chip 203 positive and negative electrodes lay respectively at the chip upper and lower surfaces, and lower surface is coated with solder coating.LED open-circuit protector 204 is parallelly connected with led chip 203, and it act as open-circuit-protection and antistatic.In the present embodiment, described solder coating is an Au-Sn coating, according to the enforcement needs, also can select for use other to can be used as the alloy layer of scolder.
As shown in Figure 4, lens module 207 bottom surfaces are designed with plural at least lens pit 401, the inner packing colloid of filling.Be designed with back-off structure 402 all around, lens module 207 is fixing through back-off structure 402 with radiator 201, and forms hermetically-sealed construction through sealing silica gel 206 and pcb board 202 and radiator 201.
Said lens module 207 its another act as the optics luminous intensity distribution, its be shaped as circle, square, oval, or with the different shape of optics light distribution requirements design.
From the above; Led chip 203 directly is encapsulated on the wiring board 202, and the heat of led chip 203 is directly transferred to wiring board 202 and radiator 201, does not pass through the LED packaging heat sink; And LED is heat sink and the air dielectric of wiring board 202, has promoted radiating effect greatly.
In addition, the light that led chip 203 sends directly transmits through filling colloid and lens module 207, do not have secondary lens or diffuser, thereby light extraction efficiency is high.
Above-described only is the preferred implementation of the utility model; Should be understood that; For those of ordinary skill in the art; Under the prerequisite that does not break away from the utility model core technology characteristic, can also make some improvement and retouching, these improvement and retouching also should be regarded as the protection range of the utility model.
Claims (10)
1. the LED module of a single lead-in wire; Comprise radiator (201), wiring board (202), led chip (203), fluorescent material, packing colloid, sealing silica gel (206) and lens module (207); It is characterized in that; Said led chip (203) lower surface is welded on wiring board (202) electrode pad, and led chip (203) upper surface arrives another electricity level of wiring board (202) through wire bonds; Said wiring board (202) is fitted with radiator (201); Said lens module (207) is installed in led chip (203) top, the inner packing colloid of filling.
2. the singly LED module of lead-in wire according to claim 1 is characterized in that lens module (207) is designed with back-off structure (402), and radiator (201) tips upside down on the last formation of lens module (207) and closes fixing.
3. LED module according to claim 2 is characterized in that, described lens module (207) is designed with plural at least lens.
4. the LED module of single lead-in wire according to claim 1 is characterized in that (203) two electrodes of said led chip lay respectively at the chip upper and lower surfaces, and lower surface electrode is coated with solder coating, and upper surface has fluorescent material.
5. the LED module of single lead-in wire according to claim 1 is characterized in that led chip (203) is parallel with LED open-circuit protector (204).
6. the LED module of single lead-in wire according to claim 1 is characterized in that described wiring board (202) is metal base circuit board (202), comprises metal level (301), insulating barrier (302) and electrical layer (303); Electrical layer (303) is provided with electrode pad electroplate or gold or nickel.
7. the LED module of single lead-in wire according to claim 1 is characterized in that described wiring board (202) is the high heat-conducting ceramic substrate, comprises ceramic layer and electrical layer (303), and electrical layer (303) is provided with electrode pad, is coated with silver or nickel or gold.
8. the LED module of single lead-in wire according to claim 1 is characterized in that described packing colloid refractive index is between 1.4 to 1.6.
9. the LED module of single lead-in wire according to claim 1 is characterized in that described sealing silica gel (206) comprises the solid silicon cushion rubber that is installed on the lens module (207), and the gel silica gel circle that is coated in the liquid silica gel formation of solid silicon cushion rubber side.
10. the LED module of single lead-in wire according to claim 9 is characterized in that, on the position on lens module (207) plane that described solid silicon cushion rubber side is corresponding, has groove, is used for coating liquid silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202069304U CN202120908U (en) | 2011-06-17 | 2011-06-17 | Single-lead light-emitting diode (LED) module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202069304U CN202120908U (en) | 2011-06-17 | 2011-06-17 | Single-lead light-emitting diode (LED) module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202120908U true CN202120908U (en) | 2012-01-18 |
Family
ID=45461949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202069304U Expired - Lifetime CN202120908U (en) | 2011-06-17 | 2011-06-17 | Single-lead light-emitting diode (LED) module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202120908U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102983424A (en) * | 2012-11-20 | 2013-03-20 | 芜湖通和汽车管路系统有限公司 | Connection structure and connection method for circuit board and casing plug-in piece |
| CN112151518A (en) * | 2019-06-28 | 2020-12-29 | 王定锋 | LED circuit board module of glass diffusion cover and manufacturing method thereof |
| CN112151663A (en) * | 2019-06-28 | 2020-12-29 | 王定锋 | LED circuit board module with diffusion cover and manufacturing method thereof |
-
2011
- 2011-06-17 CN CN2011202069304U patent/CN202120908U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102983424A (en) * | 2012-11-20 | 2013-03-20 | 芜湖通和汽车管路系统有限公司 | Connection structure and connection method for circuit board and casing plug-in piece |
| CN112151518A (en) * | 2019-06-28 | 2020-12-29 | 王定锋 | LED circuit board module of glass diffusion cover and manufacturing method thereof |
| CN112151663A (en) * | 2019-06-28 | 2020-12-29 | 王定锋 | LED circuit board module with diffusion cover and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Lv Huali Inventor before: Chen Kai Inventor before: Huang Jianming Inventor before: Yang Fan |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: CHEN KAI HUANG JIANMING YANG FAN TO: LV HUALI |
|
| CB03 | Change of inventor or designer information |
Inventor after: Chen Kai Inventor after: Huang Jianming Inventor before: Lv Huali |
|
| COR | Change of bibliographic data | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120118 |