CN202120907U

CN202120907U - Leadless LED (Light-emitting Diode) module

Info

Publication number: CN202120907U
Application number: CN2011202069145U
Authority: CN
Inventors: 陈凯; 黄建明; 杨帆
Original assignee: Hangzhou Hpwinner Opto Corp
Current assignee: Hangzhou Hpwinner Opto Corp
Priority date: 2011-06-17
Filing date: 2011-06-17
Publication date: 2012-01-18
Anticipated expiration: 2021-06-17

Abstract

The utility model relates to a leadless LED (Light-emitting Diode) module which comprises a heat radiator, a PCB (Printed Circuit Board), an LED chip, a package colloid, sealing silica gel and a lens module. The LED chip is welded on the PCB; a positive electrode and a negative electrode are respectively welded on corresponding electrode bonding pads; the PCB is adhered to the heat radiator; and the lens module is arranged on the LED chip, and the package colloid is filled in the lens module. The LED chip is directly welded on the PCB, the traditional LED package process is saved, and a support comprising a heat sink is saved, so that the heat energy of the LED chip is directly diffused to the PCB with high thermal conductivity and the heat radiator, therefore, the heat radiation effect is improved. The package colloid is only arranged between the lens module and the LED chip, and a medium which is formed by the pass of the rays is few, so that the transmission ratio is high; moreover, the filling colloid is matched with the refractive index of the lens module, so that the reflection loss is less and light emission ratio of the LED module is improved.

Description

A kind of LED module that does not have lead-in wire

Technical field

The utility model relates to semiconductor application and encapsulation field, more particularly, relates to a kind of LED module that does not have lead-in wire.

Background technology

Along with led chip technology and Development of Packaging Technology, increasing LED product is applied to lighting field, especially large power white light LED.Because LED has high light efficiency, long-life, energy-conserving and environment-protective, suitable brightness adjustment control, polluter such as not mercurous, becomes the lighting source of new generation after conventional light source such as incandescent lamp, fluorescent lamp.

LED is a kind of electroluminescence semiconductor device, wherein has 30 percent electric energy to convert light into approximately, and dump energy then converts heat into, and the LED temperature that thermal accumlation causes rises, and is the main cause that causes the LED light decay.Thereby the led chip heat radiation is the key issue that the LED encapsulation is devoted to solve, and manufacturer has proposed various packaged types in succession both at home and abroad.

The theory of traditional encapsulation all is to be encapsulated into led chip on the support of device; And the relevant research work of a large amount of encapsulation all center on the support expansion, comprises that hot property, the reflective function of support, the stability of material all become the emphasis of research and drops into huge manpower and materials.

At present, led chip is fixed on support heat sink, forms the LED device, and the LED device places on the Metal Substrate pcb board, and metal substrate places on the radiator.Heat through heat dissipation channels such as heat sink, aluminium bases after radiator spread out.

That is to say, adopt structure as shown in Figure 1 to carry out LED encapsulation and assembling.It is: led chip and heat sink etc. is packaged into LED device 103, and LED device 103 is welded to pcb board 102, and like aluminium base, pcb board 102 is fixed on radiator 101 through modes such as screw or silicone grease.Its passage of heat is: heat is from led chip, and, pcb board 102 inner heat sink through encapsulating and radiator 101 finally are transmitted to air.There is following defective in above-mentioned LED module: because the led chip heat radiation needs the middle interlayer of passage of heat of process many; And LED is heat sink and pcb board 102, pcb board 102 and radiator 101 between medium be air or silicone grease; Middle interlayer thermal conductivity is lower, so heat dispersion is not good.

For general LED application luminaire, light generally will pass through after sending from chip: fluorescent material, package lens, air, light-distribution lens are again to diffuser, and the medium of light process is many, and each interface all reflection loss can take place, and therefore total optical transmittance is low.Thereby, there are shortcomings such as heat dispersion is not good, optical transmittance is low, production process is complicated, cost height.

The utility model content

The purpose of the utility model is to solve problem set forth above, provides that a kind of heat dissipation is good, light extraction efficiency is high, production process is simple, the LED module of nothing lead-in wire with low cost.

The technical scheme of the utility model is such:

A kind of LED module that does not have lead-in wire comprises radiator, pcb board, led chip, packing colloid, sealing silica gel and lens module, and described led chip is welded on the pcb board, and positive and negative electrode is welded in respectively on the corresponding electrode pad; Said pcb board and radiator are fitted; Said lens module is installed in the led chip top, the inner packing colloid of filling.

As preferably, the lens module is designed with back-off structure, radiator tip upside down on form on the lens module close fixing.

As preferably, two electrodes of said led chip are positioned at the same surface of chip, and the surface of distribution electrode is coated with solder coating, and there is fluorescent material on another surface.

As preferably, led chip is parallel with the LED open-circuit protector, and it act as open-circuit-protection and antistatic.

As preferably, described pcb board is the Metal Substrate pcb board, comprises metal level, insulating barrier and electrical layer; Electrical layer is provided with electrode pad, electroplate or gold or nickel.

As preferably, described pcb board is the high heat-conducting ceramic substrate, comprises ceramic layer and electrical layer, and electrical layer is provided with electrode pad, is coated with silver or nickel or gold.

As preferably, described sealing silica gel comprises the solid silicon cushion rubber that is installed on the lens module, and is coated in the gel silica gel circle that the liquid silica gel of solid silicon cushion rubber side forms.

As preferably, on the position on the lens module plane that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.

The beneficial effect of the utility model is following:

At first; The theory of traditional encapsulation all is to be encapsulated into led chip on the support of LED device, and the relevant research work of a large amount of encapsulation all center on the support expansion, and the stability that comprises hot property, reflective function, the material of support all becomes the emphasis of research and drops into huge manpower and materials and the utility model has been jumped out the set of this thoughtcast; Casted off the support of LED device once and for all; Led chip directly is encapsulated on the pcb board, has omitted to include heat sink support, and the heat that makes led chip is without heat sink this intermediate layer; Directly be diffused into the pcb board and the radiator of high thermal conductivity, good heat dissipation effect.

Secondly, between lens module and the led chip, the filling colloid is only arranged; And fill the colloid refractive index between 1.4 and 1.6, and light is few through medium, and transmitance is high; And fill the refractive index match of colloid and lens module, reflection loss is few, has improved the light extraction efficiency of LED module.

In addition, it is few that the LED module comprises parts, and production process is simple, and is with low cost.

Description of drawings

Fig. 1 is the encapsulation exemplary plot of existing LED device;

Fig. 2 is the utility model LED module embodiment sketch map;

Fig. 3 forms sketch map for the utility model pcb board;

Fig. 4 is the utility model lens module sketch map;

Among the figure, the 101st, radiator, the 102nd, pcb board, the 103rd, LED device; The 201st, radiator, the 202nd, pcb board, the 203rd, led chip, the 204th, LED open-circuit protector; The 206th, sealing silica gel, the 207th, lens module, the 301st, metal level, the 302nd, insulating barrier; The 303rd, electrical layer, the 401st, lens pit, the 402nd, back-off structure.

Embodiment

Embodiment to the utility model is further elaborated below in conjunction with accompanying drawing:

A kind of LED module that does not have lead-in wire; Comprise radiator 201, pcb board 202, led chip 203, packing colloid, sealing silica gel 206 and lens module 207; Said led chip 203 directly is welded on the pcb board 202 through covering brilliant technology, and positive and negative electrode is welded in respectively on the corresponding electrode pad; Said pcb board 202 is fitted with radiator 201; Said lens module 207 is installed in led chip 203 tops, the inner packing colloid of filling.

Said pcb board 202 is fitted with the form that face contacts with radiator 201.

Lens module 207 is designed with back-off structure 402, radiator 201 tip upside down on the lens module 207 form close fixing.

Described lens module 207 bottom surfaces are designed with plural at least lens pit 401.

203 two electrodes of said led chip are positioned at the same surface of chip, and the surface of distribution electrode is coated with solder coating, and there is fluorescent material on another surface.

Led chip 203 is parallel with LED open-circuit protector 204, and it act as open-circuit-protection and antistatic.

Described pcb board 202 is a Metal Substrate pcb board 202, comprises metal level 301, insulating barrier 302 and electrical layer 303; Electrical layer 303 is provided with electrode pad, electroplate or gold or nickel.

Described pcb board 202 is the high heat-conducting ceramic substrate, comprises ceramic layer and electrical layer 303, and electrical layer 303 is provided with electrode pad, is coated with silver or nickel or gold.

Described packing colloid refractive index is between 1.4 to 1.6.

Described sealing silica gel 206 comprises the solid silicon cushion rubber that is installed on the lens module 207, and the gel silica gel circle that is coated in the liquid silica gel formation of solid silicon cushion rubber side.On the position on lens module 207 planes that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.Described lens module 207 has an integral planar; Obviously seeing one by one protruding on the plane is lens (seeing if falling, is exactly pit), and this position, edge, plane is enclosed a solid silicon cushion rubber earlier; Solid silicon cushion rubber lateral location; On corresponding lens module 207 planes, a circle groove is arranged, be used for coating liquid silica gel.Certainly, also groove can be set, directly coat liquid silica gel.

The application's core is: existing LED module, often led chip is fixed on support heat sink, and be packaged into the LED device; The LED device is welded on different pcb boards; Be installed to again on the radiator, form Different products, to adapt to more wider application scenarios; And become industry technology prejudice, and the frame mode of this LED module exists shortcomings such as heat dispersion is not good enough, optical transmittance is low, parts complicacy.

The application is directly carried led chip 203 and is overlayed on the pcb board 202, and adopts lens module 207 once light-distributions, has reached the light extraction efficiency of better radiating effect and Geng Gao, and has solved led chip and overlayed on the encapsulation problem on the pcb board 202 in 203 years.

Embodiment

As shown in Figure 2, a kind of LED module comprises: radiator 201, pcb board 202, led chip 203, LED open-circuit protector 204, packing colloid, sealing silica gel 206, lens module 207.In the present embodiment, LED open-circuit protector 204 is selected Zener diode for use.Described sealing silica gel 206 comprises the solid silicon cushion rubber that is installed on the lens module 207, and the gel silica gel circle that is coated in the liquid silica gel formation of solid silicon cushion rubber side.On the position on lens module 207 planes that described solid silicon cushion rubber side is corresponding, have groove, be used for coating liquid silica gel.In the present embodiment, described lens module 207 has an integral planar, sees obviously on the plane that one by one protruding is that lens (are seen if falling; Be exactly pit); This position, edge, plane is enclosed a solid silicon cushion rubber earlier, and the solid silicon cushion rubber outside or inner side are on corresponding lens module 207 planes; One circle groove is arranged, be used for coating liquid silica gel.Certainly, also groove can be set, directly coat liquid silica gel.

The positive and negative electrode of led chip 203 is positioned at the chip lower surface, and is coated with solder coating, and upper surface applies or be pasted with fluorescent material.LED open-circuit protector 204 is parallelly connected with led chip 203, and it act as open-circuit-protection and antistatic.In the present embodiment, described solder coating is an Au-Sn coating, according to the enforcement needs, also can select for use other to can be used as the alloy layer of scolder.

Pcb board 202 adopts metal substrate or other high thermal conductivity substrate.In the present embodiment, described pcb board 202 is metal substrate, and is as shown in Figure 3, comprises metal level 301, insulating barrier 302, electrical layer 303; Electrical layer 303, especially electrical layer 303 electrode pad places are coated with silver, nickel or gold, and it act as the raising reflectivity, strengthens light effect.According to the utilization needs, described pcb board 202 can be the high heat-conducting ceramic substrate also, comprises ceramic layer and electrical layer 303, and electrical layer 303, especially electrical layer 303 electrode pad places are coated with silver, nickel or gold.

As shown in Figure 4, lens module 207 bottom surfaces are designed with plural at least lens pit 401, the inner packing colloid of filling.Be designed with back-off structure 402 all around, be buckled on the radiator 201, and form hermetically-sealed construction through sealing silica gel 206 and pcb board 202 and radiator 201.

Said lens module 207 its another act as the optics luminous intensity distribution, its be shaped as circle, square, oval, or with the different shape of optics light distribution requirements design.

Radiator 201 be generally the metal material that aluminium etc. has good heat-conductivity, structurally can be fin, perhaps column, perhaps other help heat is led the version of air.

Radiator 201 and pcb board 202 can be fixed together through screw etc.Lens module 207 is fixing through back-off structure 402 with radiator 201.Lens module 207 scribbles sealing silica gel 206 and is placed with moulding silica gel with radiator 201 joint places.

From the above; Led chip 203 can directly be encapsulated on the pcb board 202, and the heat of led chip 203 is directly transferred to pcb board 202 and radiator 201, does not pass through the LED packaging heat sink; And LED is heat sink and the air dielectric of pcb board 202, has promoted radiating effect greatly.

In addition, the light that led chip 203 sends directly transmits through filling colloid and lens module 207, do not have secondary lens or diffuser, thereby light extraction efficiency is high.

Above-described only is the preferred implementation of the utility model; Should be understood that; For those of ordinary skill in the art; Under the prerequisite that does not break away from the utility model core technology characteristic, can also make some improvement and retouching, these improvement and retouching also should be regarded as the protection range of the utility model.

Claims

1. LED module that does not have lead-in wire; Comprise radiator (201), pcb board (202), led chip (203), packing colloid, sealing silica gel (206) and lens module (207); It is characterized in that; Described led chip (203) is welded on the pcb board (202), and positive and negative electrode is welded in respectively on the corresponding electrode pad; Said pcb board (202) is fitted with radiator (201); Said lens module (207) is installed in led chip (203) top, the inner packing colloid of filling.

2. the LED module of nothing lead-in wire according to claim 1 is characterized in that lens module (207) is designed with back-off structure (402), and radiator (201) tips upside down on the last formation of lens module (207) and closes fixing.

3. the LED module of nothing lead-in wire according to claim 1 is characterized in that (203) two electrodes of said led chip are positioned at the same surface of chip, and the surface of distribution electrode is coated with solder coating, and there is fluorescent material on another surface.

4. the LED module of nothing lead-in wire according to claim 1 is characterized in that led chip (203) is parallel with LED open-circuit protector (204).

5. the LED module of nothing lead-in wire according to claim 1 is characterized in that described pcb board (202) is Metal Substrate pcb board (202), comprises metal level (301), insulating barrier (302) and electrical layer (303); Electrical layer (303) is provided with electrode pad, electroplate or gold or nickel.

6. the LED module of nothing lead-in wire according to claim 1 is characterized in that described pcb board (202) is the high heat-conducting ceramic substrate, comprises ceramic layer and electrical layer (303), and electrical layer (303) is provided with electrode pad, is coated with silver or nickel or gold.

7. the LED module of nothing lead-in wire according to claim 1 is characterized in that described sealing silica gel (206) comprises the solid silicon cushion rubber that is installed on the lens module (207), and the gel silica gel circle that is coated in the liquid silica gel formation of solid silicon cushion rubber side.

8. the LED module of nothing lead-in wire according to claim 7 is characterized in that, on the position on lens module (207) plane that described solid silicon cushion rubber side is corresponding, has groove, is used for coating liquid silica gel.