CN201796962U - LED (light-emitting diode) light source module with high heat conductivity and low junction temperature - Google Patents
LED (light-emitting diode) light source module with high heat conductivity and low junction temperature Download PDFInfo
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- CN201796962U CN201796962U CN2010205231796U CN201020523179U CN201796962U CN 201796962 U CN201796962 U CN 201796962U CN 2010205231796 U CN2010205231796 U CN 2010205231796U CN 201020523179 U CN201020523179 U CN 201020523179U CN 201796962 U CN201796962 U CN 201796962U
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Abstract
The utility model provides an LED (light-emitting diode) light source module with high heat conductivity and low junction temperature. The LED light source module comprises a heat conducting plate, liquid metal, a module bracket, a positive electrode, a negative electrode, LED chips, a gold thread, phosphor powder and pouring sealant, wherein the liquid metal is injected into pits of the heat conducting plate, which are arranged in an array manner; the module bracket fixedly connected with the heat conducting plate is arranged right opposite to the pits of the heat conducting plate; the LED chips arranged in an array manner are fixed in die-bonding via holes of a base plate of the module bracket, so that a substrate layer of the LED chips are embedded in the die-bonding via holes and directly contact with the liquid metal; gaps of the substrate layer of the LED chips are sealed by sealant; the LED chips arranged in an array manner are connected in series by the gold thread and then connected in parallel with the positive electrode and the negative electrode; the phosphor powder is coated above the series-parallel connection LED chips; and finally, the LED chips are packaged by the pouring sealant. In the packaging structure provided by the utility model, the liquid metal is additionally arranged between the substrate layer of the LED chips and the heat conducting plate, so as to achieve seamless butt joint of the LED chips and the heat conducting plate, so that heat emitted by the LEDs can be rapidly conducted, the LED junction temperature can be effectively controlled, the service lives of the LEDs can be prolonged and the light emitting efficiency can be improved.
Description
Technical field
The utility model relates to a kind of illuminating LED light source, says it is a kind of low junction temperature led light source module of high heat conduction of utilizing liquid metals heat transfer heat conduction definitely.
Background technology
Along with manifesting day by day of the energy and environmental problem, energy-conservation industry and products thereof more and more comes into one's own, the energy-saving effect of semiconductor diode (LED) illumination is generally acknowledged, but LED is such as heat radiation, application bottlenecks such as luminous intensity distribution are not also fully well solved, particularly heat dissipation problem is particularly outstanding, as everyone knows, led chip light efficiency and life-span and its junction temperature present must dependency relation, be that the low more light efficiency of junction temperature is high more, the corresponding life-span is also just long more, the key technology of control LED junction temperature is a heat radiation heat conduction technology, its technological core is that the heat that earlier LED is sent effectively conducts to external heat sink fast, heat is dispersed in the surrounding enviroment through external heat sink, the factor of restriction LED heat conduction has heat transfer path and heat gradient, our desired temperature gradient is the smaller the better setting under the certain situation of external heat sink temperature, and being about to the LED junction temperature, to be controlled at low as far as possible be level, so a certain amount of heat transferred to be gone out just must design more reasonable, more effective heat transfer path.The heat transfer path of tradition led chip packaging technology is: led chip-crystal-bonding adhesive-heat sink-heat-conducting glue-radiator, the drawback of this passage maximum is to fit between led chip and metal heat sink not tight, there is the gap between the two, usually add crystal-bonding adhesive to fill up gap and fixed chip, and the conductive coefficient of existing crystal-bonding adhesive can not be comparable with metal, and also have very big thermal resistance between crystal-bonding adhesive and led chip and metal heat sink.
Summary of the invention
In order to overcome above-mentioned defective, the utility model provides a kind of high heat conduction to hang down junction temperature led light source module, contacts the heat conduction of conducting heat by liquid metals and LED substrate layer are seamless.
The utility model for the technical scheme that solves its technical problem and adopt is:
Junction temperature led light source module is hanged down in a kind of high heat conduction, by heat-conducting plate, liquid metals, module carrier, positive electrode, negative electrode, led chip, gold thread, fluorescent material and casting glue constitute, in the pit that liquid metals filling heat-conductive plate is arranged in array, module carrier is fixed on heat-conducting plate and over against the setting of heat-conducting plate pit, the module carrier base plate directly contacts with liquid metals, the led chip array arrangement is fixed in the solid brilliant via hole of module carrier base plate, make the led chip substrate layer be embedded in solid brilliant via hole and direct contact liq metal, its place, slit fluid sealant encapsulation process, the led chip of array arrangement is connected in parallel in positive and negative electrode after being connected in series by gold thread again, led chip top coating fluorescent material after connection in series-parallel connects is encapsulated by casting glue at last again.
Described heat-conducting plate is made laminated structure by the metal or alloy material, the heat-conducting plate middle part is provided with pit, pit is array distribution, and its quantity is complementary with plan encapsulated LED chip-count, and the heat-conducting plate periphery is provided with the fixed installation that the screw via hole is used for the led light source module.
Described liquid metals is a kind of metal or alloy that at room temperature is in a liquid state, and it is generally the alloy material of tin, magnesium, gallium, indium etc., can select the liquid metals material of suitable fusing point according to actual operating position.
Described module carrier is made concave structure, solid brilliant via hole is set on the base plate of position, intermediate portion, Gu brilliant via hole is arranged in array, its quantity and spacing is corresponding one by one with the heat-conducting plate pit, positive electrode and negative electrode are embedded in the module carrier frame and corresponding the setting, module carrier both sides correspondence respectively are provided with positive electrode and negative electrode exposed parts, on the module carrier frame positive electrode and the external pad of negative electrode are set simultaneously.
Described positive electrode and negative electricity very low resistive metal or alloy are made laminated structure, are embedded in the module carrier, reserve the pad of welding gold thread and circumscripted power line.
Described led chip is a large-power light-emitting diodes.
The beneficial effects of the utility model are: the heat transfer path of traditional led chip packaging technology is: led chip-crystal-bonding adhesive-heat sink-heat-conducting glue-radiator, the drawback of this passage maximum is to fit between led chip and metal heat sink not tight, there is the gap between the two, usually add crystal-bonding adhesive to fill up gap and fixed chip, and the conductive coefficient of existing crystal-bonding adhesive can not be comparable with metal, and also there is very big thermal resistance between crystal-bonding adhesive and led chip and metal heat sink, add liquid metals in the new encapsulating structure of the utility model between led chip substrate layer and heat-conducting plate and can realize slitless connection between led chip and heat-conducting plate, thereby effectively improve fit between led chip and metal heat sink in the conventional package technology not tight, defectives such as the crystal-bonding adhesive heat conductivility is not good, the heat that allows LED send conducts rapidly, effectively control LED junction temperature increases LED useful life and luminous efficiency.
Description of drawings:
Fig. 1 is the heat-conducting plate structural representation;
Fig. 2 is the module carrier structural representation;
Fig. 3 is the module carrier plan view;
Fig. 4 is the A-A profile of Fig. 3;
Fig. 5 forms structural representation for the utility model;
Fig. 6 is the utility model overall structure schematic diagram;
Fig. 7 is the utility model plan view;
Fig. 8 is the B-B profile of Fig. 7;
Fig. 9 is the fixedly connected detail structure chart of led chip;
Indication legend in the accompanying drawing
1, heat-conducting plate 11, heat conduction version pit 12, screw via hole 2, liquid metals 3, module carrier 31, frame 32, base plate 33, via hole 4, positive electrode 5, negative electrode 6, led chip 7, gold thread 8, fluorescent material 9, casting glue 10 fluid sealants
Embodiment
As shown in Figure 1: heat-conducting plate 1 is made laminated structure by the metal or alloy material, the heat-conducting plate middle part is provided with pit 11, pit is array distribution, its quantity is complementary with plan encapsulated LED chip-count, pit is used for the loaded with liquid metal, and the heat-conducting plate periphery is provided with the fixed installation that screw via hole 12 is used for the led light source module.
Shown in Fig. 2,3,4: module carrier 3 is made concave structure, solid brilliant via hole 33 is set on position, the intermediate portion base plate 32, Gu brilliant via hole is arranged in array, its quantity and spacing is corresponding one by one with the heat-conducting plate pit, positive electrode and negative electrode are embedded in the module carrier frame 31 and corresponding the setting, module carrier both sides correspondence respectively are provided with positive electrode and negative electrode exposed parts, on the module carrier frame positive electrode and the external pad of negative electrode are set simultaneously.
Led chip 6 is a large-power light-emitting diodes.
As shown in Figure 5: junction temperature led light source module is hanged down in a kind of high heat conduction, is made of heat-conducting plate 1, liquid metals 2, module carrier 3, positive electrode 4, negative electrode 5, led chip 6, gold thread 7, fluorescent material 8 and casting glue 9.
As Fig. 6,7,8, shown in 9: in the pit 11 that liquid metals filling heat-conductive plate is arranged in array, module carrier is fixed on heat-conducting plate and over against the setting of heat-conducting plate pit, the module carrier base plate directly contacts with liquid metals, the led chip array arrangement is fixed in module carrier base plate 32 solid brilliant via holes 33, make the led chip substrate layer be embedded in solid brilliant via hole and direct contact liq metal, its place, slit fluid sealant 10 encapsulation process, the led chip of array arrangement is connected in parallel in positive and negative electrode after being connected in series by gold thread again, led chip top coating fluorescent material after connection in series-parallel connects is encapsulated by casting glue at last again.
Claims (6)
1. junction temperature led light source module is hanged down in a high heat conduction, by heat-conducting plate (1), liquid metals (2), module carrier (3), positive electrode (4), negative electrode (5), led chip (6), gold thread (7), fluorescent material (8) and casting glue (9) constitute, it is characterized in that: in the pit (11) that liquid metals filling heat-conductive plate is arranged in array, module carrier is fixed on heat-conducting plate and over against the setting of heat-conducting plate pit, the module carrier base plate directly contacts with liquid metals, the led chip array arrangement is fixed in the solid brilliant via hole (33) of module carrier base plate (32), make the led chip substrate layer be embedded in solid brilliant via hole and direct contact liq metal, its place, slit fluid sealant (10) encapsulation process, the led chip of array arrangement is connected in parallel in positive and negative electrode after being connected in series by gold thread again, led chip top coating fluorescent material after connection in series-parallel connects is encapsulated by casting glue at last again.
2. junction temperature led light source module is hanged down in a kind of high heat conduction according to claim 1, it is characterized in that: described heat-conducting plate (1) is made laminated structure by the metal or alloy material, the heat-conducting plate middle part is provided with pit (11), pit is array distribution, its quantity is complementary with plan encapsulated LED chip-count, and the heat-conducting plate periphery is provided with screw via hole (12).
3. junction temperature led light source module is hanged down in a kind of high heat conduction according to claim 1, it is characterized in that: described liquid metals (2) is a kind of metal or alloy that at room temperature is in a liquid state.
4. junction temperature led light source module is hanged down in a kind of high heat conduction according to claim 1, it is characterized in that: described module carrier (3) is made concave structure, solid brilliant via hole (33) is set on position, the intermediate portion base plate (32), Gu brilliant via hole is arranged in array, its quantity and spacing is corresponding one by one with the heat-conducting plate pit, positive electrode and negative electrode are embedded in the module carrier frame (31) and corresponding the setting, module carrier both sides correspondence respectively are provided with positive electrode and negative electrode exposed parts, on the module carrier frame positive electrode and the external pad of negative electrode are set simultaneously.
5. junction temperature led light source module is hanged down in a kind of high heat conduction according to claim 1, it is characterized in that: described positive electrode (4) and negative electrode (5) are made laminated structure for low resistive metal or alloy, be embedded in the module carrier, reserve the pad of welding gold thread and circumscripted power line.
6. junction temperature led light source module is hanged down in a kind of high heat conduction according to claim 1, it is characterized in that: described led chip (6) is a large-power light-emitting diodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205231796U CN201796962U (en) | 2010-09-03 | 2010-09-03 | LED (light-emitting diode) light source module with high heat conductivity and low junction temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205231796U CN201796962U (en) | 2010-09-03 | 2010-09-03 | LED (light-emitting diode) light source module with high heat conductivity and low junction temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201796962U true CN201796962U (en) | 2011-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205231796U Expired - Fee Related CN201796962U (en) | 2010-09-03 | 2010-09-03 | LED (light-emitting diode) light source module with high heat conductivity and low junction temperature |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201796962U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102856476A (en) * | 2012-09-12 | 2013-01-02 | 浙江中博光电科技有限公司 | LED chip packaging structure on basis of vapor chamber and chip support of LED chip packaging structure |
| CN104465549A (en) * | 2014-12-15 | 2015-03-25 | 株洲南车时代电气股份有限公司 | Power conductor module |
| CN104112737B (en) * | 2014-06-19 | 2016-09-28 | 华中科技大学 | A kind of LED module method for packing for car headlamp |
| CN106954368A (en) * | 2017-03-15 | 2017-07-14 | 东莞市明骏智能科技有限公司 | One step prepares preparation method, preparation facilities and the production line of the integral heat dissipation structure for sealing liquid metal |
-
2010
- 2010-09-03 CN CN2010205231796U patent/CN201796962U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102856476A (en) * | 2012-09-12 | 2013-01-02 | 浙江中博光电科技有限公司 | LED chip packaging structure on basis of vapor chamber and chip support of LED chip packaging structure |
| CN104112737B (en) * | 2014-06-19 | 2016-09-28 | 华中科技大学 | A kind of LED module method for packing for car headlamp |
| CN104465549A (en) * | 2014-12-15 | 2015-03-25 | 株洲南车时代电气股份有限公司 | Power conductor module |
| WO2016095701A1 (en) * | 2014-12-15 | 2016-06-23 | 株洲南车时代电气股份有限公司 | Power semiconductor module |
| CN104465549B (en) * | 2014-12-15 | 2017-11-03 | 株洲南车时代电气股份有限公司 | A kind of power semiconductor modular |
| CN106954368A (en) * | 2017-03-15 | 2017-07-14 | 东莞市明骏智能科技有限公司 | One step prepares preparation method, preparation facilities and the production line of the integral heat dissipation structure for sealing liquid metal |
| CN106954368B (en) * | 2017-03-15 | 2023-09-12 | 东莞市光钛科技有限公司 | Preparation method, preparation device and production line for one-step preparation of integrated heat dissipation structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110413 Termination date: 20170903 |