CN201764324U

CN201764324U - Led module

Info

Publication number: CN201764324U
Application number: CN2010205205842U
Authority: CN
Inventors: 陈凯; 黄建明; 章子奇
Original assignee: ZHEJIANG XIZI OPTOELECTRONICS TECHNOLOGY Co Ltd
Current assignee: Hangzhou Hpwinner Opto Corp
Priority date: 2010-09-07
Filing date: 2010-09-07
Publication date: 2011-03-16
Anticipated expiration: 2020-09-07

Abstract

The utility model provides a LED module, comprising a radiator, a circuit board, an LED chip, an internal lead, a filling rubber and a lens module. The LED chip is fixed on the circuit board covered with a rear adhesive. The internal lead bridges the LED chip with a bonding pad of the corresponding circuit board. The filling rubber encapsulates the LED chip and the internal lead. The circuit board is closely laminated with the radiator in a surface contact manner. The lens module is buttoned on the LED chip, the circuit board and the radiator. The LED chip is directly encapsulated on the circuit board, which omits a bracket containing a heat sink so that the heat of the LED chip directly diffuses to the circuit board with high thermal conductivity and the radiator without passing through the middle layer of the heat sink, thereby improving the radiating effect. Only the filling rubber is between the lens module and the LED chip, so that little ray passes through the medium and the transmissivity is high; and the refractive index of the filling rubber and the lens module is matched, so that the reflection loss is little and the light efficiency of the LED module is improved.

Description

The LED module

Technical field

The utility model relates to the semiconductor packages field, more particularly relates to a kind of LED (light emitting diode) module.

Background technology

Along with led chip technology and the increasing LED product of Development of Packaging Technology are applied to lighting field, large power white light LED especially.Because LED has high light efficiency, long-life, energy-conserving and environment-protective, suitable brightness adjustment control, polluter such as not mercurous, becomes the lighting source of new generation after conventional light source such as incandescent lamp, fluorescent lamp.

LED is a kind of electroluminescent semiconductor devices, wherein has 30 percent electric energy to be converted to light approximately, and dump energy then is converted to heat, and the LED temperature that thermal accumlation causes rises, and is the main cause that causes the LED light decay.Thereby the led chip heat radiation is the key issue that the LED encapsulation is devoted to solve, and manufacturer has proposed various packaged types in succession both at home and abroad.

The theory of traditional encapsulation all is that led chip is encapsulated on the support of particle, and the relevant research work of a large amount of encapsulation all center on the support expansion, comprises that hot property, the reflective function of support, the stability of material all become the emphasis of research and drops into huge manpower and materials.

At present, led chip is fixed on support heat sink, forms the LED particle, and the LED particle places on the metal base circuit board, and metal substrate places on the radiator.Heat by heat dissipation channels such as heat sink, aluminium bases after radiator spread out.

That is to say, adopt structure as shown in Figure 1 to carry out LED encapsulation and assembling.It is: led chip and heat sink etc. is packaged into LED particle 303, and LED particle 303 is welded to wiring board 302, and as aluminium base, wiring board 302 is fixed on radiator 301 by modes such as screw or silicone grease.Its passage of heat is: heat is from led chip, and, wiring board 302 inner heat sink by encapsulating and radiator 301 finally are transmitted to air.There is following defective in above-mentioned LED module:

Because led chip heat radiation needs the middle interlayer of passage of heat of process many, and LED is heat sink and wiring board 302, wiring board 302 and radiator 301 between medium be air or silicone grease, middle interlayer thermal conductivity is lower, so heat dispersion is not good.

For general LED application luminaire, light generally will pass through after sending from chip: fluorescent material → package lens → air → light-distribution lens → diffuser, and the medium of light process is many, and reflection loss all can take place in each interface, and therefore total optical transmittance is low.Thereby, there are shortcomings such as heat dispersion is not good, optical transmittance is low, production process is complicated, cost height.

The utility model content

The purpose of this utility model is to provide a kind of LED module, to solve in the prior art, has the technical problem that heat dispersion is low, optical transmittance is low or cost is high.

A kind of LED module, it is characterized in that, comprise radiator, wiring board, led chip, lead, filling colloid and lens module, described led chip carries and overlays on the wiring board that primer is a little arranged, described lead is with led chip and respective lines plate pad bridge joint, described filling colloid embedding led chip and lead, described wiring board fits tightly with the form that face contacts with radiator, and described lens module lid is buckled on led chip, wiring board and the radiator.

This example also comprises unidirectional Zener diode, and described each Zener diode is electrically connected with parallel way and led chip.

Preferably, this example can also comprise Zener diode, and described each Zener diode is a bi-directional zener diode, and described bi-directional zener diode is electrically connected with parallel way and led chip.

And complete, led chip or its lead-in wire are in the open fault state, and described Zener diode is positioned at the work shape, and its current value of keeping flowing through is constant.

Wiring board adopts metal substrate or other high thermal conductivity substrate.

The optical lens module is added a cover on the led chip, realizes the luminous intensity distribution effect.The optical lens module contains hole for injecting glue and steam vent.

The led chip both positive and negative polarity is connected with the wiring board pad respectively by lead, and perhaps the led chip electrode is connected by lead with the welding of wiring board weld layer, another electrode, and perhaps led chip both positive and negative polarity and wiring board pad directly weld.

Fill colloid compared with prior art, LED module of the present utility model has the following advantages:

At first, the theory of traditional encapsulation all is that led chip is encapsulated on the support of particle, and the relevant research work of a large amount of encapsulation all centers on the support expansion, the hot property that comprises support, reflective function, the stability of material all becomes the emphasis of research and drops into huge manpower and materials, and the utility model has been jumped out the set of this thoughtcast, casted off the support of LED particle once and for all, led chip directly encapsulates in the circuit board, omitted and included heat sink support, the heat that makes led chip is without heat sink this intermediate layer, directly be diffused into the wiring board and the radiator of high thermal conductivity, good heat dissipation effect.

Secondly, between lens module and the led chip, the filling colloid is only arranged, and fill the colloid refractive index between 1.4 and 1.6, light is few through medium, the transmitance height, and fill the refractive index coupling of colloid and lens module, reflection loss is few, has improved the light extraction efficiency of LED module.

Moreover the gum-injecting port of scioptics module pours into the filling colloid, and fills with whole lens module inner chamber, curing molding, and no knockout course does not damage lead.

In addition, it is few that the LED module comprises parts, and production process is simple, and is with low cost.

Description of drawings

Fig. 1 is the encapsulation exemplary plot of existing LED device;

Fig. 2 is the utility model LED module embodiment schematic diagram;

Fig. 3 is unidirectional Zener diode schematic diagram;

Fig. 4 is the bi-directional zener diode schematic diagram.

The specific embodiment

The application's core is: existing LED module, often led chip is fixed on support heat sink, be packaged into the LED particle, the LED particle is welded on different wiring boards, be installed to again on the radiator, form different products, to adapt to more wider application scenarios, and become industry technology prejudice, and the frame mode of this LED module exists shortcomings such as heat dispersion is not good enough, optical transmittance is low, parts complexity.The applicant is in LED throw light on proprietary field and application scenario, overcome existing technology prejudice, a kind of new LED modular structure has been proposed, direct the carrying of led chip overlayed on the wiring board, and adopt lens module once light-distribution, reached the light extraction efficiency of better radiating effect and Geng Gao, and solved led chip and carry the encapsulation problem that overlays on the wiring board.

As shown in Figure 2, a kind of LED module comprises: led chip 402, and Zener diode chip 403, lead 401 is filled colloid 406, wiring board 405, radiator 404, sealing ring 407, lens module 408.

Radiator 404 and wiring board 405 can be fixed together by screw etc.And for reasonable radiating effect, wiring board 405 can adopt the material of high thermal conductivity, as metal material or pottery etc.Wiring board 405 mounts the position with led chip 402 can also be plane, square groove, rectangular recess, circular groove etc.And for fixed L ED chip, wiring board 405 can have elargol by point, perhaps insulating cement, perhaps scolding tin connection led chip 402.And, can be processed into the radiation bowl shape in the position of wiring board 405 fixed L ED chips 402, can behind fixed chip, inject fluorescent material simultaneously.

Radiator 404 be generally the metal material that aluminium etc. has good heat-conductivity, structurally can be fin, perhaps column, perhaps other help heat is led the version of air.

In embodiment of the present utility model, can also comprise Zener diode, it is connected with the led chip parallel way.Perhaps adopt bi-directional zener diode, then as anti-static electrification (as Fig. 4); Perhaps adopt individual event Zener diode (as shown in Figure 3), then play the effect of LED open circuit protection, when LED opened circuit at that time, electric current flow through through Zener diode, and did not influence other led chip operate as normal.

Described lens module 408 by sealing ring 407, is added a cover on radiator 404, reaches sealing effectiveness, avoids led chip 402 contaminated.Described lens module 408 front and back sides or left and right sides contain hole for injecting glue and steam vent, and it act as after adding a cover lens module 408, form cavity around led chip 402, inject to cavity by hole for injecting glue and steam vent and fill colloid 406.

Described lens module 408 its another act as the optics luminous intensity distribution, and it is shaped as circle, square, oval or with the different shape of optics light distribution requirements design.

From the above, led chip can directly encapsulate in the circuit board, and the heat of led chip is directly transferred to wiring board and radiator, does not pass through the LED packaging heat sink, and LED is heat sink and the air dielectric of wiring board, has promoted radiating effect greatly.

In addition, the light that led chip sends directly transmits through filling colloid and lens module, does not have secondary lens or diffuser, thereby the light extraction efficiency height.

Be noted that described lens module, its effect is the optics luminous intensity distribution, and the light that led chip is sent is dispersed or converged in suitable angular range.

Described lens module, its another act as and the sealing ring acting in conjunction, between radiator and lens, form annular seal space, make led chip be in sealing shape body, water proof and dust proof improves the reliability of LED module.

Described filling colloid, it act as the cavity of filling the lens module, and another effect is the refractive index coupling, reduces the reflection of dielectric surface, improves light effect.The refraction of filling colloid is preferable, between 1.4 and 1.6.

Going up disclosed is specific embodiment of the utility model only, but the utility model is not limited thereto, any those skilled in the art can think variation, all should drop in the protection domain of the present utility model.

Claims

1. LED module, it is characterized in that, comprise radiator, wiring board, led chip, lead, filling colloid and lens module, described led chip is fixed on the wiring board that is covered with primer, described lead is with led chip and respective lines plate pad bridge joint, described filling colloid embedding led chip and lead, described wiring board fits tightly with the form that face contacts with radiator, and described lens module lid is buckled on led chip, wiring board and the radiator.

2. LED module as claimed in claim 1 is characterized in that, lens module both sides comprise hole for injecting glue and steam vent.

3. LED module as claimed in claim 1 is characterized in that, fills the colloid refractive index between 1.4 and 1.6.

4. LED module as claimed in claim 1 is characterized in that, also comprises unidirectional Zener diode, and described each Zener diode is electrically connected with parallel way and led chip.

5. LED module as claimed in claim 1 is characterized in that, also comprises bi-directional zener diode, and described bi-directional zener diode is electrically connected with parallel way and led chip.

6. LED module as claimed in claim 1 is characterized in that, led chip carrying place of wiring board is set to plane or groove or sagging bowl-shape.

7. as claim 4 or 5 described LED modules, it is characterized in that led chip or its lead-in wire are in the open fault state, described Zener diode is positioned at the work shape, and its current value of keeping flowing through is constant.

8. LED module as claimed in claim 1 is characterized in that, wiring board adopts metal substrate or has the substrate of high thermal conductivity power.