CN203277499U - LED module group - Google Patents
LED module group Download PDFInfo
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- CN203277499U CN203277499U CN 201320284482 CN201320284482U CN203277499U CN 203277499 U CN203277499 U CN 203277499U CN 201320284482 CN201320284482 CN 201320284482 CN 201320284482 U CN201320284482 U CN 201320284482U CN 203277499 U CN203277499 U CN 203277499U
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- led
- led module
- led chip
- radiator
- lenses
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Abstract
The utility model relates to the technical field of lighting lamp, especially to an LED module group which comprises a battery of lens, an LED illuminant, a circuit board and a radiator, wherein the LED illuminant comprises an LED chip and a heat radiation support where the LED chip is attached and which is arranged on the circuit board through surface-mounting technology, the battery of lens covers the radiator and is situated above the LED chip, and the battery of lens and the radiator form an enclosed space filled with packaging colloid which is injected in the enclosed space through colloid injection technology. When the LED module group is compared with the prior art, light emitted by the LED chip is transmitted in the packaging colloid instead of air medium. The refractive index of the packaging colloid matches with the lens on the battery of lens, thereby maximizes the light emitting rate. Compared with the prior art, the LED module group increases the lighting efficiency by 10 to 15%.
Description
Technical field
The utility model relates to the technical field of illuminating lamp, particularly a kind of LED module.
Background technology
Along with the development of LED chip technology and encapsulation technology, increasing LED product is applied to lighting field, especially large power white light LED.Because LED has high light efficiency, long-life, energy-conserving and environment-protective, suitable brightness adjustment control, the polluter such as not mercurous, become the lighting source of new generation after the conventional light source such as incandescent lamp, fluorescent lamp.
But there is following defective in present LED module:
1, the light that sends of the LED chip of existing LED module needs in communication process through air dielectric, can cause interface loss, causes the LED chip light extraction efficiency low;
2, in existing LED module, non-filler between set of lenses and radiator will damage the LED luminous element in case enter steam;
3, only the bottom surface by cooling stand is to the circuit board transferring heat for the LED luminous element of existing LED module, and radiating effect is relatively poor.
The utility model content
The utility model purpose is to provide a kind of LED module, and the light that sends with the LED chip that solves existing LED module in prior art needs in communication process through air dielectric, can cause interface loss, causes the low technical matters of LED chip light extraction efficiency.
The utility model purpose is achieved through the following technical solutions:
a kind of LED module, comprise set of lenses, sealing ring, the LED luminous element, circuit board and radiator, described LED luminous element comprises LED chip and cooling stand, described LED chip is fitted and is arranged on described cooling stand, described cooling stand is arranged on described circuit board by paster technique, described set of lenses lid is located on described radiator, described set of lenses is positioned at above described LED chip, be provided with cable-through hole on described radiator, described cable-through hole seals by sealed colloid, described set of lenses, described sealing ring, fill packing colloid in the confined space that described sealed colloid and described radiator form, described packing colloid is filled with described confined space by the technique of injecting glue.
Preferably, described packing colloid is transparence, and its refractive index is 1.3～1.7.
Preferably, the bottom of described radiator is provided with hole for injecting glue and steam vent; Described circuit board is provided with the through hole corresponding with described hole for injecting glue and steam vent.
Preferably, described LED chip is fixed on cooling stand by the die bond mode, and described LED chip is provided with fluorescent material.
Preferably, described cooling stand is made by the material of the high heat conduction of insulation.
Preferably, the material of the high heat conduction of described insulation comprises high heat-conducting ceramic materials A lN.
Preferably, described LED luminous element also comprises silicon rubber cup, and described silicon rubber cup is arranged on described cooling stand, and described silicon rubber cup is positioned at above described LED chip.
Preferably, described LED chip is fixed on cooling stand by the die bond mode, also is provided with the packing colloid of mixed fluorescent powder on described LED chip.
Preferably, described cooling stand is mixed by metal material and resin material, and metal material has heat sink and effect conductive welding disk of serving as; Resin material has the effect of serving as speculum, and plays the fixedly effect of packing colloid, can stop packing colloid to leak when packing colloid does not solidify.
Preferably, described set of lenses upper surface is provided with some reinforcements.
Preferably, be provided with some raceway grooves on described set of lenses inner surface, be used for making the injection of packing colloid more smooth and easy.
Compared with prior art, the utility model has following beneficial effect:
1, compared with prior art, in LED module of the present utility model, the light that LED chip sends packing colloid in communication process has substituted original air dielectric, and the refractive index of packing colloid and the coupling of the lens on set of lenses, improved so to the full extent light emission rate, compared with prior art, light efficiency has improved 10～15%;
2, be filled with packing colloid in the confined space of radiator and set of lenses in LED module of the present utility model, the packed colloid of circuit board and each LED luminous element coats, and therefore has good water resistance;
3, the heat that in the utility model, the LED luminous element produces not only can be by cooling stand the bottom surface to the circuit board transmission, and can outwards transmit by packing colloid, make radiating effect better.
Description of drawings
Fig. 1 is the structural representation of LED module of the present utility model;
Fig. 2 is the decomposing schematic representation of LED module of the present utility model;
Fig. 3 is the structural representation of circuit board of the present utility model;
Fig. 4 is the structural representation of radiator of the present utility model;
Fig. 5,6 is the structural representation of a kind of embodiment of LED luminous element of the present utility model;
Fig. 7 is the structural representation of the another kind of embodiment of LED luminous element of the present utility model;
Fig. 8 is the structural representation of another embodiment of LED luminous element of the present utility model;
Fig. 9 is the structural representation in the set of lenses of the present utility model outside;
Figure 10 is the structural representation of set of lenses of the present utility model inboard;
Figure 11 is the structural representation of the another kind of embodiment of LED module of the present utility model.
Embodiment
Below in conjunction with accompanying drawing, describe the utility model in detail.
see also Fig. 1-10, LED module of the present utility model, comprise set of lenses 1, sealing ring 4, LED luminous element 21, circuit board 2 and radiator 3, be provided with buckle structure 13 on set of lenses, sealing ring 4 comprises sealed solid circle and hydraulic seal circle, be provided with cable-through hole 24 on circuit board and radiator, 33, cable-through hole seals by sealed colloid, LED luminous element 21 comprises LED chip 211 and cooling stand 212, LED chip is fitted and is arranged on cooling stand, cooling stand is arranged on circuit board 2 by paster technique, set of lenses 1 is covered by buckle structure and is located on radiator 3, set of lenses 1 is positioned at above LED chip, set of lenses 1, sealing ring 4 and radiator 3, fill packing colloid in the confined space that cable-through hole place sealed colloid forms, the confined space that the technique of packing colloid by injecting glue is filled with.
In this example, packing colloid is transparence, and its refractive index is 1.3～1.7, and the refractive index of packing colloid and the refractive index of the lens on set of lenses approach.In LED module of the present utility model, the light that LED chip sends packing colloid in communication process has substituted original air dielectric, and the refractive index of packing colloid and the coupling of the lens on set of lenses, improved so to the full extent light emission rate, compared with prior art, light efficiency has improved 10～15%.
See also Fig. 2-4, in this example, the bottom of radiator 3 is provided with hole for injecting glue 31 and steam vent 32, cable-through hole 33; Circuit board 2 is provided with the through hole 22,23 corresponding with hole for injecting glue 31 and steam vent 32, cable-through hole 24.Hole for injecting glue can be one or more; Steam vent also can be one or more; The shape of hole for injecting glue and steam vent does not limit.In this example, hole for injecting glue 31 and steam vent 32 are respectively a bottom that is arranged on radiator 3, after radiator 3 and set of lenses 1 are fastened and connected, by the gap between hole for injecting glue injection radiator, sealing ring, set of lenses and the cable-through hole hermetically-sealed construction of radiator bottom, unnecessary air is discharged from steam vent with packing colloid.
See also Fig. 5,6, in this example, LED chip is fixed on cooling stand by the die bond mode, and LED chip is provided with fluorescent material.Wherein, cooling stand is made by the material of the high heat conduction of insulation, is preferably high heat-conducting ceramic materials A lN.
See also Fig. 7, in this example, the LED luminous element also comprises silicon rubber cup 213, and silicon rubber cup 213 is arranged on cooling stand 212, and silicon rubber cup 213 is positioned at LED chip 211 tops.
See also Fig. 8, in this example, LED chip 211 is fixed on cooling stand 212 by the die bond mode, also is provided with the packing colloid 214 of mixed fluorescent powder on LED chip.Wherein, cooling stand 212 is mixed by metal material and resin material, and metal material has heat sink and effect conductive welding disk of serving as; Resin material has the effect of serving as speculum, and plays the fixedly effect of packing colloid, can stop packing colloid to leak when packing colloid does not solidify.
See also Fig. 9,10, in this example, set of lenses 1 upper surface is provided with some reinforcements 11, and reinforcement 11 can strengthen the fastness of set of lenses.Be provided with some raceway grooves 12 on the set of lenses inner surface, be used for making the injection of packing colloid more smooth and easy.
The utility model also provides a kind of manufacturing process of LED module, comprises the following steps:
(1) the LED chip applying is arranged on cooling stand, cooling stand is fitted by paster technique to be arranged on circuit board;
(2) circuit board and radiator are fitted tightly, sealing ring is placed on edge, radiator surrounding, and the set of lenses lid is located on radiator, and set of lenses is positioned at above LED chip;
(3) the hole for injecting glue injection radiator bottom radiator and the gap between set of lenses with packing colloid, packing colloid fills up the gap between set of lenses and radiator, and unnecessary air is discharged from steam vent;
(4) mode that screws down and/or with mode seal pouring hole and the steam vent of glue sealing.
More smooth and easy for the injection that makes packing colloid, step (3) also comprises: the packing colloid first hole for injecting glue bottom radiator injects in the raceway groove of set of lenses inner surface, then enters the gap between radiator and set of lenses.Wherein, packing colloid is transparence, and its refractive index is 1.3～1.7.
See also Figure 11, the difference of the present embodiment and foregoing embodiment is, no longer adopts the mode snapping of buckle in the present embodiment between set of lenses and radiator, but adopts screw tightening.
In LED module of the present utility model, be filled with packing colloid in the confined space of radiator and set of lenses, the packed colloid of circuit board and each LED luminous element coats, and therefore has good water resistance.In LED module of the present utility model, the bottom surface that the heat that the LED luminous element produces not only can be by cooling stand is to the circuit board transmission, and can outwards transmit by packing colloid, makes radiating effect better.
Above disclosed be only several specific embodiments of the application, but the application is not limited thereto, the changes that any person skilled in the art can think of all should drop in the application's protection range.
Claims (11)
1. LED module, it is characterized in that, comprise set of lenses, sealing ring, the LED luminous element, circuit board and radiator, described LED luminous element comprises LED chip and cooling stand, described LED chip is fitted and is arranged on described cooling stand, described cooling stand is arranged on described circuit board by paster technique, described set of lenses lid is located on described radiator, described set of lenses is positioned at above described LED chip, be provided with cable-through hole on described radiator, described cable-through hole seals by sealed colloid, described set of lenses, described sealing ring, fill packing colloid in the confined space that described sealed colloid and described radiator form, described packing colloid is filled with described confined space by the technique of injecting glue.
2. LED module as claimed in claim 1, is characterized in that, described packing colloid is transparence, and its refractive index is 1.3～1.7.
3. LED module as claimed in claim 1, is characterized in that, the bottom of described radiator is provided with hole for injecting glue and steam vent; Described circuit board is provided with the through hole corresponding with described hole for injecting glue and steam vent.
4. LED module as claimed in claim 1, is characterized in that, described LED chip is fixed on cooling stand by the die bond mode, and described LED chip is provided with fluorescent material.
5. LED module as claimed in claim 4, is characterized in that, described cooling stand is made by the material of the high heat conduction of insulation.
6. LED module as claimed in claim 5, is characterized in that, the material of the high heat conduction of described insulation comprises high heat-conducting ceramic materials A lN.
7. LED module as claimed in claim 1, is characterized in that, described LED luminous element also comprises silicon rubber cup, and described silicon rubber cup is arranged on described cooling stand, and described silicon rubber cup is positioned at above described LED chip.
8. LED module as claimed in claim 1, is characterized in that, described LED chip is fixed on cooling stand by the die bond mode, also is provided with the packing colloid of mixed fluorescent powder on described LED chip.
9. LED module as claimed in claim 8, is characterized in that, described cooling stand is mixed by metal material and resin material.
10. LED module as claimed in claim 1, is characterized in that, described set of lenses upper surface is provided with some reinforcements.
11. LED module as claimed in claim 1 is characterized in that, is provided with some raceway grooves on described set of lenses inner surface, is used for making the injection of packing colloid more smooth and easy.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320284482 CN203277499U (en) | 2013-05-21 | 2013-05-21 | LED module group |
| DE112013006965.2T DE112013006965T5 (en) | 2013-05-21 | 2013-06-17 | LED module and its manufacturing process |
| US14/893,432 US9960323B2 (en) | 2013-05-21 | 2013-06-17 | LED module and its manufacturing process |
| JP2016513196A JP2016518724A (en) | 2013-05-21 | 2013-06-17 | LED module and manufacturing method thereof |
| PCT/CN2013/077333 WO2014186994A1 (en) | 2013-05-21 | 2013-06-17 | Led module and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320284482 CN203277499U (en) | 2013-05-21 | 2013-05-21 | LED module group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203277499U true CN203277499U (en) | 2013-11-06 |
Family
ID=49507843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320284482 Expired - Lifetime CN203277499U (en) | 2013-05-21 | 2013-05-21 | LED module group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203277499U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104183581A (en) * | 2013-05-21 | 2014-12-03 | 杭州华普永明光电股份有限公司 | LED module and manufacturing process thereof |
| CN110161686A (en) * | 2018-02-12 | 2019-08-23 | 杭州太若科技有限公司 | AR display device and wearable AR equipment |
| CN110537134A (en) * | 2018-02-12 | 2019-12-03 | 优奈柯恩(北京)科技有限公司 | Augmented reality equipment and its employed in optical system |
-
2013
- 2013-05-21 CN CN 201320284482 patent/CN203277499U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104183581A (en) * | 2013-05-21 | 2014-12-03 | 杭州华普永明光电股份有限公司 | LED module and manufacturing process thereof |
| CN110161686A (en) * | 2018-02-12 | 2019-08-23 | 杭州太若科技有限公司 | AR display device and wearable AR equipment |
| CN110537134A (en) * | 2018-02-12 | 2019-12-03 | 优奈柯恩(北京)科技有限公司 | Augmented reality equipment and its employed in optical system |
| US11042040B2 (en) | 2018-02-12 | 2021-06-22 | Matrixed Reality Technology Co., Ltd. | Augmented reality apparatus and optical system therefor |
| US11460704B2 (en) | 2018-02-12 | 2022-10-04 | Matrixed Reality Technology Co., Ltd. | Augmented reality apparatus and optical system therefor |
| US11500205B2 (en) | 2018-02-12 | 2022-11-15 | Matrixed Reality Technology Co., Ltd. | Wearable AR system, AR display device and its projection source module |
| US11693244B2 (en) | 2018-02-12 | 2023-07-04 | Matrixed Reality Technology Co., Ltd. | Augmented reality apparatus and optical system therefor |
| US11693245B2 (en) | 2018-02-12 | 2023-07-04 | Matrixed Reality Technology Co., Ltd. | Wearable AR system, AR display device and its projection source module |
| US11874466B2 (en) | 2018-02-12 | 2024-01-16 | Matrixed Reality Technology Co., Ltd. | Augmented reality apparatus, and optical system and semi-reflector therefor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131106 |