CN202308052U

CN202308052U - LED module group

Info

Publication number: CN202308052U
Application number: CN2011204333903U
Authority: CN
Inventors: 吕华丽; 蔡建奇
Original assignee: Hangzhou Hpwinner Opto Corp
Current assignee: Hangzhou Hpwinner Opto Corp
Priority date: 2011-11-04
Filing date: 2011-11-04
Publication date: 2012-07-04
Anticipated expiration: 2021-11-04

Abstract

Provided is an LED module group, comprising an LED device, a circuit board, and a lens module group packaged by an LED chip and a support, wherein the LED device is directly welded upon the circuit board; the bottom of the circuit board contacts with and is attached to the surface of a radiator; the lens module group covers upon the LED device; the space between the pits of the lens module group and the LED device is provided with a molding colloid having light refractive index matched to that of the lens module group; and the LED device is completely coated by the molding colloid, with no air left inside. As the ray passes through less medium with high transmissivity and the refractive index of the filling colloid is matched to that of the lens module group with less refractive loss, the bright dipping rate of the LED module group is improved. Moreover, the LED light source only comprises a chip and a packaging support, without a bright dipping lens, thereby cutting the cost.

Description

The LED module

Technical field

The utility model relates to semiconductor application and encapsulation field, more particularly relates to a kind of LED (light-emitting diode) module.

Background technology

Along with led chip technology and Development of Packaging Technology, increasing LED product is applied to lighting field, especially large power white light LED.Because LED has high light efficiency, long-life, energy-conserving and environment-protective, suitable brightness adjustment control, polluter such as not mercurous, becomes the lighting source of new generation after conventional light source such as incandescent lamp, fluorescent lamp.

Light efficiency is to weigh one of of paramount importance index of LED performance, and it has characterized the LED light extraction efficiency, directly influences the energy-saving effect of LED.In order to increase light emission rate, common LED method for packing is that led chip is encapsulated on the support, adds a cover sphere lens again, and perhaps directly one-shot forming makes the light that led chip sends, the scioptics outgoing of maximal efficiency ground.Product after the LED encapsulation is referred to as the LED device.Existing LED device has several kinds of forms: a kind of is that led chip is encapsulated on the support, adds a cover sphere lens; Second kind is that led chip is encapsulated in an one-body molded sphere lens on the support.

Based on traditional LED encapsulation, promptly as shown in Figure 1, the manufacturing process of LED module may further comprise the steps:

At first carry out step S110: LED device 103 is welded on the wiring board 102;

Carry out step S120 then: the wiring board behind the step S110 102 is fixed on the radiator 101,

Carry out step S130 subsequently: above LED device 103 particles, add a cover lens module 105, to be made into the appropriate light type.

But there are following two deficiencies in the manufacturing process of this LED module:

The first, add a cover light-distribution lens module 105 having on the LED device 103 of sphere lens, certainly exist air between the two; And the material of the sphere lens of LED device 103 and lens module 105 is respectively silica gel and PC; Refractive index causes refractive index not match much larger than air, the light that led chip sends; Material interface loss at different refractivity is serious, so that light extraction efficiency is low.

The second, during encapsulation, on led chip, add a cover lens, perhaps one-shot forming; Led chip is very little, precisely adds a cover lens or one-shot forming again on it again, and production process is complicated; Cause production cost high thus, its cost accounts for 10% of LED device 103 costs, even reaches 30%.

The utility model content

The purpose of the utility model is to provide a kind of LED module, to solve the technical problem that light emission rate is low, production cost is high in the prior art.

The utility model provides a kind of LED module, comprise by led chip and support encapsulated LED device,

Wiring board and lens module; Said LED device directly welds in the circuit board; The bottom of said wiring board contacts applying with the radiator face, and said lens module lid is located on the LED device, and each pit of lens module and the space between the LED device are provided with the molding colloid with lens module optical index coupling; The LED device all coat by the molding colloid and between the gas of not leaving a blank, form hermetically-sealed construction between lens module and wiring board and the radiator.

The inboard was coated with last layer sealed silicon glue around the LED module also comprised the lens module, and the silica gel sealing ring of moulding is placed in the outside; Perhaps the silica gel sealing ring of moulding is placed in the inboard around the lens module, and the outside is coated with last layer sealed silicon glue.

Compared with prior art, the LED module of the utility model has the following advantages:

At first, traditional LED uses normally having on the LED device of sphere lens and adds a cover the light-distribution lens module, certainly exists air between the two; And the material of the lens of LED device and lens module is respectively silica gel and PC; Refractive index causes refractive index not match much larger than air, the light that the LED device sends; Material interface loss at different refractivity is serious, so that light extraction efficiency is low.And the LED module of the utility model between lens module and the led chip, only has the molding colloid; Do not comprise air, light is few through medium, and transmitance is high; And fill the refractive index match of colloid and lens module, reflection loss is few, and the light extraction efficiency of LED module is high.

The second, traditional LED encapsulation in order to provide optical efficiency, is added a cover lens on the LED device, perhaps one-shot forming, and production process is complicated, and production cost is high.And the utility model need not the lens of led chip, produces simple, with low cost.

Description of drawings

Fig. 1 is that existing LED uses sketch map;

Fig. 2 is the utility model LED module embodiment sketch map;

Fig. 3 is the utility model lens module sketch map.

Embodiment

As shown in Figure 2, a kind of LED module comprises: radiator 201, wiring board 202, LED device 203, sealing silica gel 204, lens module 205.

Said LED device 203 comprises led chip and support, is welded on the wiring board 202.LED device 203 does not comprise luminous lens.LED device 203 directly is welded on the wiring board 202, and the bottom of wiring board 202 contacts applying with 201 in radiator

Lens module 205 covers on LED device 203, inner filling molding colloid (packing colloid), and through sealing silica gel 204 and wiring board 202 and radiator 201 formation hermetically-sealed constructions.Promptly; Each pit of lens module 205 and the space between the LED device 203 are provided with the molding colloid with lens module 205 optical indexs coupling; LED device 203 all coat by the molding colloid and between the gas of not leaving a blank, form hermetically-sealed construction between lens module 205 and wiring board 202 and the radiator 201.A kind of mode does, at lens module 205 hole for injecting glue is set, and gives the space injecting glue between pit and the LED device 203 through hole for injecting glue.Another kind of mode does, has been pre-charged with the molding colloid on each pit, wiring board 202 buckled again.The molding colloid of filling need meet the following conditions: the LED device is all coated by the molding colloid, between the gas of not leaving a blank.

Overflow the back for fear of glue and influence the whole sealing of LED module; The plastic hole that one glue when being used for lens module and radiator 201 and compressing overflows can be set respectively around each pit of lens module 205; Or the plastic emitting groove that a glue when being used for lens module 205 and compressing with radiator 201 overflows, the pit perforation on plastic emitting through hole and each lens module be set on lens module 205.

Said lens module 205 has a plurality of single lens (being above-mentioned said pit) to combine, and single the corresponding LED device 203 of lens.Every lens, inner surface can be spheres, perhaps hyperboloid, and other help the face type of LED bright dipping; It mainly act as the optics luminous intensity distribution outer surface.Light is assigned to suitable zone, reaches certain illuminating effect.

Fluorescent material be set to following at least a form:

Led chip on the LED device 203 adopts the led chip that contains fluorescent material;

Each pit inner surface at lens module 205 is coated with fluorescent material;

The molding colloid adopts the molding colloid that is mixed with fluorescent material.

In addition, the inboard was coated with one deck sealing silica gel around LED lens module also comprised the lens module, and the silica gel sealing ring of moulding is placed in the outside.Perhaps the silica gel sealing ring of moulding is placed in the inboard around the lens module, and the outside is coated with last layer sealed silicon glue.

From the above, LED device 203 does not contain air between the lens module 205, and the molding colloid is only arranged, and molding colloid refractive index and lens module 205 and LED device 203 couplings, and it is few to go out light loss, the light extraction efficiency height.

In addition, LED device 203 tops need not to add a cover or other luminous lens of moulding, produce simple, with low cost.

First kind of manufacture craft:

A kind of manufacturing process of LED module may further comprise the steps:

S110: the LED device that will not be provided with luminous lens welds in the circuit board.

S120: the wiring board of step S110 is fixed on the radiator, and the bottom of said wiring board contacts with the said radiator formation face that fits tightly.

S130: fill the molding colloid that matees with lens module optical index at each pit of inverted lens module inner surface.

Also comprise before this step: the plastic hole that a glue when being used for lens module and radiator and compressing overflows is being set respectively around each pit of lens module; Or the plastic emitting groove that a glue when being used for lens module and radiator and compressing overflows is set on the lens module, the pit on said plastic emitting through hole and each lens module connects.

S140: the radiator of step S120 is tipped upside down on the lens module, the pit of filling the molding colloid with compress after the LED device position is corresponding, the LED device is all coated by the molding colloid, between the gas of not leaving a blank.

S150: lens module and radiator are fixed, and form the LED module.

If can in the LED module, fluorescent material be set, have the better light effect that goes out:

Led chip on the said LED device adopts the led chip that contains fluorescent material.Perhaps, further comprising the steps of one of them before the step S130: inner surface is coated fluorescent material in advance in each pit at the lens module; Be pre-mixed fluorescent material at the molding colloid.

In addition, in order to reach better sealing, after lens module 205 passed through screw or snap fit with radiator 201, the inboard was coated with last layer sealed silicon glue around the lens module, and the silica gel sealing ring of moulding is placed in the outside.

Need to prove; Step S110 and step S120 have sequencing, and it is referred to as LED device, wiring board and radiator aggregate erection process, and step S130 is the filler process; LED device, wiring board and radiator aggregate erection process and filler process are two self-contained process; Can be a process formerly, another process after, also can be to accomplish simultaneously.

Second method

Such as, a kind of manufacturing process of LED module may further comprise the steps:

A kind of manufacturing process of LED module is characterized in that: may further comprise the steps:

S210: fill the molding colloid that matees with lens module optical index at each pit of inverted lens module inner surface;

S220: the LED device that will not be provided with luminous lens welds in the circuit board;

S230: the wiring board of step S220 is fixed on the radiator, and the bottom of said wiring board contacts with the said radiator formation face that fits tightly;

S240: the radiator of step S230 is tipped upside down on the lens module, the pit of filling the molding colloid with compress after the LED device position is corresponding, the LED device is all coated by the molding colloid, between the gas of not leaving a blank;

S250: lens module and radiator are fixed, and form the LED module.

The third method

Fig. 3 is disclosed to be the 3rd embodiment of the utility model, and a kind of LED module comprises: radiator 301, wiring board 302, LED device 303, molding colloid, lens module 304.

The said LED of comprising device 303 is welded on the wiring board 302.

Said wiring board 302 fits tightly with the form that face contacts with radiator 301.

Said lens module 304 covers on LED device 303, and the molding colloid is filled in inside, and 201 formation closely cooperate with radiator with wiring board 202.

Said lens module 305 has a plurality of single combination of lensess to form, and single the corresponding LED device 303 of lens.

Every lens of said lens module 305, inner surface can be spheres, perhaps hyperboloid, and other help the face type of LED bright dipping; It mainly act as the optics luminous intensity distribution outer surface.

That is, a kind of manufacturing process of LED module may further comprise the steps:

S310: the LED device that will not be provided with luminous lens welds in the circuit board;

S320: the wiring board of step S310 is fixed on the radiator, and the bottom of said wiring board contacts with the said radiator formation face that fits tightly;

S330: the pit of lens module covers the lens module on the LED device with after the LED device position is corresponding;

S340: the lens module is filled the molding colloid that matees with lens module optical index through the position of hole for injecting glue between each pit and LED device, and the gas of not leaving a blank between the LED device is all coated by the molding colloid is that injecting glue is accomplished;

S350: lens module and radiator are fixed, and form the LED module.

This embodiment can be used for room lighting, like Down lamp, and light fixtures such as shot-light.

More than the disclosed specific embodiment that is merely the utility model, but the utility model is not limited thereto, any those skilled in the art can think variation, all should drop in the protection range of the utility model.

Claims

1. a LED module is characterized in that, comprise by led chip and support encapsulated LED device,

2. LED module as claimed in claim 1 is characterized in that, the led chip on the LED device adopts the led chip that contains fluorescent material.

3. LED module as claimed in claim 1 is characterized in that, the plastic hole that a glue when being used for lens module and radiator and compressing overflows is set respectively around each pit of lens module.

4. LED module as claimed in claim 1 is characterized in that:

On the lens module, be provided with one be used for injecting glue hole for injecting glue and the plastic emitting through hole that glue overflows when being used for lens module and radiator and compressing, the pit on said plastic emitting through hole and each lens module connects.

5. LED module as claimed in claim 1 is characterized in that, also comprises:

The inboard is coated with last layer sealed silicon glue around the lens module, and the silica gel sealing ring of moulding is placed in the outside.

6. LED module as claimed in claim 1 is characterized in that, also comprises:

The inboard silica gel sealing ring of placing moulding around the lens module, the outside is coated with last layer sealed silicon glue.

7. LED module as claimed in claim 1 is characterized in that, is coated with or sprays at each pit inner surface of lens module and establish fluorescent material.

8. LED module as claimed in claim 1 is characterized in that, the molding colloid adopts the molding colloid that is mixed with fluorescent material.