CN103094425A - Manufacturing process of light emitting diode (LED) module group and LED module group - Google Patents
Manufacturing process of light emitting diode (LED) module group and LED module group Download PDFInfo
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- CN103094425A CN103094425A CN201110345452XA CN201110345452A CN103094425A CN 103094425 A CN103094425 A CN 103094425A CN 201110345452X A CN201110345452X A CN 201110345452XA CN 201110345452 A CN201110345452 A CN 201110345452A CN 103094425 A CN103094425 A CN 103094425A
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Abstract
A manufacturing process of a light emitting diode (LED) module group includes the following steps: (1), LED components without light-out lenses are welded on a circuit board; (2), the circuit board of the step one is fixed on a radiator, and the bottom of the circuit board is tightly attached to the radiator to form surface contact; (3), molding gel is filled in each concaved pit in the inner surface of an inverted lens module group and matched with the light refraction index of the lens module group; (4), the radiator of the step two is buckled on the lens module group in an inverted mode, the concaved pits filled with the gel correspond to the LED components and then is pressed tightly, and the LED components are completely coated with the molding gel and air is not residual between the LED components and the molding gel; (5), and the lens module group and the radiator are fixed to form the LED module group. Only the molding gel exists between the lens muddle group and an LED light source, the air is not included, light rays pass through a few media, transmittance is high, the filled gel is matched with the refraction index of the lens module group, reflection losses are few, and the light-out rate of the LED module group is improved. In addition, the LED light source only comprises a chip and an encapsulation support, the light-out lens is not included, and the cost is reduced.
Description
Technical field
The present invention relates to semiconductor application and encapsulation field, more particularly relate to a kind of LED(light-emitting diode) module and manufacturing process thereof.
Background technology
Along with the development of LED chip technology and encapsulation technology, increasing LED product is applied to lighting field, especially large power white light LED.Because LED has high light efficiency, long-life, energy-conserving and environment-protective, suitable brightness adjustment control, the polluter such as not mercurous, become the lighting source of new generation after the conventional light source such as incandescent lamp, fluorescent lamp.
Light efficiency is to weigh one of of paramount importance index of LED performance, and it has characterized the LED light extraction efficiency, directly affects the energy-saving effect of LED.In order to increase light emission rate, common LED method for packing is that LED chip is encapsulated on support, then adds a cover sphere lens, perhaps directly one-shot forming, the light that makes LED chip send, scioptics outgoing in maximum efficiency.Product after the LED encapsulation is referred to as the LED device.Existing LED device has several forms: a kind of is that LED chip is encapsulated on support, adds a cover sphere lens; The second is that LED chip is encapsulated in an one-body molded sphere lens on support.
Based on traditional LED encapsulation, namely as shown in Figure 1, the manufacturing process of LED module comprises the following steps:
At first carry out step S110: LED device 103 is welded on wiring board 102;
Then carry out step S120: the wiring board 102 after step S110 is fixed on radiator 101,
Carry out subsequently step S130: add a cover lens module 105 above LED device 103 particles, to be made into the appropriate light type.
But there are following two deficiencies in the manufacturing process of this LED module:
First, add a cover light-distribution lens module 105 on the LED device 103 with sphere lens, certainly exist air between the two, and the material of the sphere lens of LED device 103 and lens module 105 is respectively silica gel and PC, refractive index causes refractive index not mated much larger than air, the light that LED chip sends, material interface loss at different refractivity is serious, so that light extraction efficiency is low.
The second, during encapsulation, add a cover lens on LED chip, perhaps one-shot forming, LED chip is very little, more precisely adds a cover lens or one-shot forming on it again, and production process is complicated, cause thus production cost high, its cost accounts for 10% of LED device 103 costs, even reaches 30%.
Summary of the invention
The object of the present invention is to provide a kind of manufacture craft of LED module, to solve the technical problem that in prior art, light emission rate is low, production cost is high.
The second purpose of the present invention is to provide a kind of LED module, to solve the technical problem that in prior art, light emission rate is low, production cost is high.
The manufacturing process of the first LED module provided by the invention comprises the following steps:
(1) the LED device that will not be provided with luminous lens welds in the circuit board;
(2) wiring board with step (1) is fixed on radiator, and the bottom of described wiring board fits tightly formation face with described radiator and contacts;
(3) fill at each pit of inverted lens module inner surface the molding colloid (packing colloid) that mates with lens module optical index;
(4) radiator with step (2) tips upside down on the lens module, the pit of filling the molding colloid with compress after the LED device position is corresponding, the LED device is all coated by the molding colloid, between the gas of not leaving a blank;
(5) lens module and radiator are fixed, and form the LED module.
Preferably, also comprise before in step (3):
The plastic emitting groove that one glue when being used for lens module and radiator and compressing overflows is set on the lens module, the pit perforation on described plastic emitting groove and each lens module, or
The plastic hole that one glue when being used for lens module and radiator and compressing overflows is set respectively around each pit of lens module.
LED chip on described LED device adopts the LED chip that contains fluorescent material.Perhaps, in step (3) further comprising the steps of one of them before: each pit inner surface at the lens module is coated fluorescent material in advance; Be pre-mixed fluorescent material at the molding colloid.
This technique comprises that also lens module surrounding inboard is coated with last layer sealed silicon glue, and the silica gel sealing ring of moulding is placed in the outside.
The invention provides the manufacturing process of the second LED module, comprise the following steps:
(1) the LED device that will not be provided with luminous lens welds in the circuit board;
(2) wiring board with step (1) is fixed on radiator, and the bottom of described wiring board fits tightly formation face with described radiator and contacts;
(3) pit of lens module with after the LED device position is corresponding, covers the lens module on the LED device;
(4) the lens module is filled the molding colloid that mates with lens module optical index to the position between each pit and LED device by hole for injecting glue, and the gas of not leaving a blank between the LED device is all coated by the molding colloid is that injecting glue is completed;
(5) lens module and radiator are fixed, and form the LED module.
The invention provides the manufacturing process of the third LED module, comprise the following steps:
(1) fill at each pit of inverted lens module inner surface the molding colloid that mates with lens module optical index;
(2) the LED device that will not be provided with luminous lens welds in the circuit board;
(3) wiring board with step (1) is fixed on radiator, and the bottom of described wiring board fits tightly formation face with described radiator and contacts;
(4) radiator with step (2) tips upside down on the lens module, the pit of filling the molding colloid with compress after the LED device position is corresponding, the LED device is all coated by the molding colloid, between the gas of not leaving a blank;
(5) lens module and radiator are fixed, and form the LED module.
The invention provides a kind of LED module, comprise by the LED device of LED chip and support encapsulation,
Wiring board and lens module, described LED device directly welds in the circuit board, the bottom of described wiring board contacts applying with the radiator face, described lens module lid is located on the LED device, the molding colloid of each pit of lens module and the spatial placement between the LED device and lens module optical index coupling, the LED device all coated by the molding colloid and between the gas of not leaving a blank, form hermetically-sealed construction between lens module and wiring board and radiator.
Compared with prior art, LED module of the present invention has the following advantages:
At first, traditional LED uses and normally adds a cover the light-distribution lens module on the LED device with sphere lens, certainly exist air between the two, and the material of the lens of LED device and lens module is respectively silica gel and PC, refractive index causes refractive index not mated much larger than air, the light that the LED device sends, material interface loss at different refractivity is serious, so that light extraction efficiency is low.And LED module of the present invention between lens module and LED chip, only has the molding colloid, does not comprise air, and light is few through medium, and transmitance is high, and fills the index matching of colloid and lens module, and reflection loss is few, and the light extraction efficiency of LED module is high.
The second, traditional LED encapsulation in order to provide optical efficiency, is added a cover lens on the LED device, perhaps one-shot forming, and production process is complicated, and production cost is high.And the present invention need not the lens of LED chip, produces simple, with low cost.
Description of drawings
Fig. 1 is that existing LED uses schematic diagram;
Fig. 2 is LED module embodiment schematic diagram of the present invention;
Fig. 3 is lens module schematic diagram of the present invention.
Embodiment
As shown in Figure 2, a kind of LED module comprises: radiator 201, wiring board 202, LED device 203, sealing silica gel 204, lens module 205.
Described LED device 203 comprises LED chip and support, is welded on wiring board 202.LED device 203 does not comprise luminous lens.LED device 203 directly is welded on wiring board 202, and the bottom of wiring board 202 contacts applying with 201, radiator
Overflow the sealing of the rear LED of impact module integral body for fear of glue, the plastic hole that one glue when being used for lens module and radiator 201 and compressing overflows can be set respectively around each pit of lens module 205, or the plastic emitting groove that a glue when being used for lens module 205 and radiator 201 and compressing overflows, the pit perforation on plastic emitting through hole and each lens module be set on lens module 205.
Described lens module 205 has a plurality of single lens (being above-mentioned said pit) to combine, and single the corresponding LED device 203 of lens.Every lens, inner surface can be spheres, perhaps hyperboloid, and other are conducive to the face type of LED bright dipping; Its Main Function of outer surface is the optics luminous intensity distribution.Light is assigned to suitable zone, reaches certain illuminating effect.
Fluorescent material be set to following at least a form:
LED chip on LED device 203 adopts the LED chip that contains fluorescent material;
Each pit inner surface at lens module 205 is coated with fluorescent material;
The molding colloid adopts the molding colloid that is mixed with fluorescent material.
In addition, LED lens module comprises that also lens module surrounding inboard is coated with one deck sealing silica gel, and the silica gel sealing ring of moulding is placed in the outside.
From the above, LED device 203 does not contain air between lens module 205, and the molding colloid is only arranged, and molding colloid refractive index mates with lens module 205 and LED device 203, goes out light loss few, and light extraction efficiency is high.
In addition, LED device 203 tops need not to add a cover or other luminous lens of moulding, produce simple, with low cost.
The first manufacture craft:
A kind of manufacturing process of LED module comprises the following steps:
S110: will not be provided with the LED device welding of luminous lens in the circuit board.
S120: the wiring board of step S110 is fixed on radiator, and the bottom of described wiring board fits tightly formation face with described radiator and contacts.
S130: fill the molding colloid that mates with lens module optical index at each pit of inverted lens module inner surface.
Also comprising before this step: the plastic hole that a glue when being used for lens module and radiator and compressing overflows is set respectively around each pit of lens module, or the plastic emitting groove that a glue when being used for lens module and radiator and compressing overflows, the pit perforation on described plastic emitting through hole and each lens module be set on the lens module.
S140: the radiator of step S120 is tipped upside down on the lens module, the pit of filling the molding colloid with compress after the LED device position is corresponding, the LED device is all coated by the molding colloid, between the gas of not leaving a blank.
S150: lens module and radiator are fixed, and form the LED module.
If can in the LED module, fluorescent material be set, have the better light effect that goes out:
LED chip on described LED device adopts the LED chip that contains fluorescent material.Perhaps, further comprising the steps of one of them before step S130: each pit inner surface at the lens module is coated fluorescent material in advance; Be pre-mixed fluorescent material at the molding colloid.
In addition, in order to reach better sealing, lens module 205 and radiator 201 by screw or buckle fixing after, lens module surrounding inboard is coated with last layer sealed silicon glue, the silica gel sealing ring of moulding is placed in the outside.
Need to prove, step S110 and step S120 have sequencing, it is referred to as LED device, wiring board and radiator combination installation process, step S130 is the filler process, LED device, wiring board and radiator combination installation process and filler process are two self-contained process, can be a process formerly, another process rear, can be also to complete simultaneously.
Second method
Such as, a kind of manufacturing process of LED module comprises the following steps:
A kind of manufacturing process of LED module is characterized in that: comprise the following steps:
S210: fill the molding colloid that mates with lens module optical index at each pit of inverted lens module inner surface;
S220: will not be provided with the LED device welding of luminous lens in the circuit board;
S230: the wiring board of step S220 is fixed on radiator, and the bottom of described wiring board fits tightly formation face with described radiator and contacts;
S240: the radiator of step S230 is tipped upside down on the lens module, the pit of filling the molding colloid with compress after the LED device position is corresponding, the LED device is all coated by the molding colloid, between the gas of not leaving a blank;
S250: lens module and radiator are fixed, and form the LED module.
The third method
Fig. 3 is disclosed is the third embodiment of the present invention, and a kind of LED module comprises: radiator 301, wiring board 302, LED device 303, molding colloid, lens module 304.
The described LED of comprising device 303 is welded on wiring board 302.
Described wiring board 302 fits tightly with the form that face contacts with radiator 301.
Described lens module 304 covers on LED device 303, the inner molding colloid of filling, and closely cooperate with wiring board 202 and radiator 201 formation.
Described lens module 305 has a plurality of single lens combinations to form, and single the corresponding LED device 303 of lens.
Every lens of described lens module 305, inner surface can be spheres, perhaps hyperboloid, and other are conducive to the face type of LED bright dipping; Its Main Function of outer surface is the optics luminous intensity distribution.
That is, a kind of manufacturing process of LED module comprises the following steps:
S310: will not be provided with the LED device welding of luminous lens in the circuit board;
S320: the wiring board of step S310 is fixed on radiator, and the bottom of described wiring board fits tightly formation face with described radiator and contacts;
S330: the pit of lens module covers the lens module on the LED device with after the LED device position is corresponding;
S340: the lens module is filled the molding colloid with lens module optical index coupling to the position between each pit and LED device by hole for injecting glue, and the gas of not leaving a blank between the LED device is all coated by the molding colloid is that injecting glue is completed;
S350: lens module and radiator are fixed, and form the LED module.
This embodiment can be used for room lighting, as Down lamp, and the light fixtures such as shot-light.
Above disclosed be only specific embodiments of the invention, but the present invention is not limited thereto, the changes that any person skilled in the art can think of all should drop in protection scope of the present invention.
Claims (15)
1. the manufacturing process of a LED module is characterized in that: comprise the following steps:
(1) the LED device that will not be provided with luminous lens welds in the circuit board;
(2) wiring board with step (1) is fixed on radiator, and the bottom of described wiring board fits tightly formation face with described radiator and contacts;
(3) fill at each pit of inverted lens module inner surface the molding colloid that mates with lens module optical index;
(4) radiator with step (2) tips upside down on the lens module, the pit of filling the molding colloid with compress after the LED device position is corresponding, the LED device is all coated by the molding colloid, between the gas of not leaving a blank;
(5) lens module and radiator are fixed, and form the LED module.
2. the manufacturing process of LED module as claimed in claim 1 is characterized in that: also comprise before in step (3):
The plastic emitting groove that one glue when being used for lens module and radiator and compressing overflows is set on the lens module, the pit perforation on described plastic emitting groove and each lens module, or
The plastic hole that one glue when being used for lens module and radiator and compressing overflows is set respectively around each pit of lens module.
3. the manufacturing process of LED module as claimed in claim 1 is characterized in that: also comprise according to following wherein a kind of mode increasing fluorescent material:
Spray in advance or coat fluorescent material at each pit inner surface of lens module;
Be pre-mixed fluorescent material in the molding colloid, or
LED chip on described LED device adopts the LED chip that contains fluorescent material.
4. the manufacturing process of LED module as claimed in claim 1 is characterized in that: also comprise:
Lens module surrounding inboard is coated with last layer sealed silicon glue, and the silica gel sealing ring of moulding is placed in the outside; Perhaps
The inboard silica gel sealing ring of placing moulding of lens module surrounding, the outside is coated with last layer sealed silicon glue.
5.
A kind of manufacturing process of LED module is characterized in that: comprise the following steps:
(1) the LED device that will not be provided with luminous lens welds in the circuit board;
(2) wiring board with step (1) is fixed on radiator, and the bottom of described wiring board fits tightly formation face with described radiator and contacts;
(3) pit of lens module with after the LED device position is corresponding, covers the lens module on the LED device;
(4) the lens module is filled the molding colloid that mates with lens module optical index to the position between each pit and LED device by hole for injecting glue, and the gas of not leaving a blank between the LED device is all coated by the molding colloid is that injecting glue is completed;
(5) lens module and radiator are fixed, and form the LED module.
6. the manufacturing process of LED module as claimed in claim 5 is characterized in that: also comprise according to following wherein a kind of mode increasing fluorescent material:
Spray in advance or coat fluorescent material at each pit inner surface of lens module;
Be pre-mixed fluorescent material in the molding colloid, or
LED chip on described LED device adopts the LED chip that contains fluorescent material.
7. the manufacturing process of LED module as claimed in claim 5 is characterized in that:
Comprise that also lens module surrounding inboard is coated with last layer sealed silicon glue, the silica gel sealing ring of moulding is placed in the outside; Perhaps the silica gel sealing ring of moulding is placed in lens module surrounding inboard, and the outside is coated with last layer sealed silicon glue.
8. the manufacturing process of a LED module is characterized in that: comprise the following steps:
(1) fill at each pit of inverted lens module inner surface the molding colloid that mates with lens module optical index;
(2) the LED device that will not be provided with luminous lens welds in the circuit board;
(3) wiring board with step (2) is fixed on radiator, and the bottom of described wiring board fits tightly formation face with described radiator and contacts;
(4) radiator with step (3) tips upside down on the lens module, the pit of filling the molding colloid with compress after the LED device position is corresponding, the LED device is all coated by the molding colloid, between the gas of not leaving a blank;
(5) lens module and radiator are fixed, and form the LED module.
9. the manufacturing process of a kind of LED module as claimed in claim 8, is characterized in that, also comprises before in step (1):
The plastic emitting groove that one glue when being used for lens module and radiator and compressing overflows is set on the lens module, the pit perforation on described plastic emitting groove and each lens module, or
The plastic hole that one glue when being used for lens module and radiator and compressing overflows is set respectively around each pit of lens module.
10. the manufacturing process of LED module as claimed in claim 8 is characterized in that: also comprise according to following wherein a kind of mode increasing fluorescent material:
Spray in advance or coat fluorescent material at each pit inner surface of lens module;
Be pre-mixed fluorescent material in the molding colloid, or
LED chip on described LED device adopts the LED chip that contains fluorescent material.
11. a LED module is characterized in that, comprise by the LED device of LED chip and support encapsulation,
Wiring board and lens module, described LED device directly welds in the circuit board, the bottom of described wiring board contacts applying with the radiator face, described lens module lid is located on the LED device, the molding colloid of each pit of lens module and the spatial placement between the LED device and lens module optical index coupling, the LED device all coated by the molding colloid and between the gas of not leaving a blank, form hermetically-sealed construction between lens module and wiring board and radiator.
12. LED module as claimed in claim 11 is characterized in that, fluorescent material be set to following at least a form:
LED chip on the LED device adopts the LED chip that contains fluorescent material;
Be coated with or spray at each pit inner surface of lens module and establish fluorescent material;
The molding colloid adopts the molding colloid that is mixed with fluorescent material.
13. LED module as claimed in claim 11 is characterized in that, the plastic hole that a glue when being used for lens module and radiator and compressing overflows is set respectively around each pit of lens module.
14. LED module as claimed in claim 11 is characterized in that:
The plastic emitting through hole that when one hole for injecting glue and that is used for injecting glue being set on the lens module being used for lens module and radiator and compressing, glue overflows, the pit perforation on described plastic emitting through hole and each lens module.
15. LED module as claimed in claim 11 is characterized in that, also comprises:
Lens module surrounding inboard is coated with last layer sealed silicon glue, and the silica gel sealing ring of moulding is placed in the outside; Perhaps
The inboard silica gel sealing ring of placing moulding of lens module surrounding, the outside is coated with last layer sealed silicon glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110345452XA CN103094425A (en) | 2011-11-04 | 2011-11-04 | Manufacturing process of light emitting diode (LED) module group and LED module group |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110345452XA CN103094425A (en) | 2011-11-04 | 2011-11-04 | Manufacturing process of light emitting diode (LED) module group and LED module group |
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| CN103094425A true CN103094425A (en) | 2013-05-08 |
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| WO2014186994A1 (en) * | 2013-05-21 | 2014-11-27 | 杭州华普永明光电股份有限公司 | Led module and manufacturing process thereof |
| CN104390160A (en) * | 2014-11-05 | 2015-03-04 | 四川华体照明科技股份有限公司 | LED (light emitting diode) optical engine capable of preventing lens surface from being scratched and having excellent sealing effect |
| CN107178711A (en) * | 2016-03-11 | 2017-09-19 | 杭州华普永明光电股份有限公司 | Light emitting diode module and preparation method thereof and light fixture |
| CN112145986A (en) * | 2020-07-31 | 2020-12-29 | 中节能晶和科技有限公司 | Manufacturing method of high-luminous-efficiency lamp |
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| CN112145986B (en) * | 2020-07-31 | 2022-11-01 | 中节能晶和科技有限公司 | Manufacturing method of high-luminous-efficiency lamp |
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Address after: 310015, 3 north, 2 North, 18 Kang Road, Hangzhou, Zhejiang, Gongshu District Applicant after: Hangzhou Huapu Yongming Photoelectric Co., Ltd. Address before: 311305, Hangzhou, Zhejiang province Ling'an City Qingshan Lake Street Chuen mouth Village No. 15 Applicant before: Hangzhou Huapu Yongming Photoelectric Co., Ltd. |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130508 |