CN204407355U - A kind of encapsulating structure of chip size white light LEDs - Google Patents

A kind of encapsulating structure of chip size white light LEDs Download PDF

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Publication number
CN204407355U
CN204407355U CN201420538298.7U CN201420538298U CN204407355U CN 204407355 U CN204407355 U CN 204407355U CN 201420538298 U CN201420538298 U CN 201420538298U CN 204407355 U CN204407355 U CN 204407355U
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chip
encapsulating structure
led
area
white light
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CN201420538298.7U
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刘国旭
张俊福
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Shineon Beijing Technology Co Ltd
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Shineon Beijing Technology Co Ltd
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Abstract

A kind of encapsulating structure of chip size white light LEDs, described encapsulating structure comprises bare chip and fluorescent material coating layer, and wherein, the area of described encapsulating structure is slightly larger than the area of described bare chip, described bare chip adopts the form of upside-down mounting to be encapsulated on heat-radiating substrate, eliminates LED support and gold thread; Described encapsulating structure enhances heat dispersion by reducing heat-transfer interface, and makes white light reflective surface close to chip surface size thus, and then makes optical density large.

Description

A kind of encapsulating structure of chip size white light LEDs
Technical field
The utility model relates to the chip size packages technology of a kind of LED, is mainly used in, on illumination and backlight product, belonging to semiconductor lighting application.
Background technology
Traditional LED is placed on by chip on support or substrate, fluorescent material and silica gel mixture coated above support or by the optical lens of molding after sprayed with fluorescent powder and realize LED.The packaging body volume of these forms comparatively luminescence chip itself can go out greatly at least 7-8 doubly, and lighting angle and brightness are all subject to the restriction of substrate or support, cannot meet the demand of some application scenarios, have certain limitation.As shown in Figure 1 and Figure 2, the encapsulating structure with once optics and traditional SMD packing forms is respectively.
LED, as forth generation lighting source, has incomparable advantage, and its cost is relatively high, although the cost of LED industry chain links all declines to a certain extent to some extent in recent years, but LED replaces conventional illumination sources completely still needs a period of time.Long service life is one of advantage of LED, and theoretical value can reach more than 100,000 hours, but is limited to the impact of encapsulating material and encapsulating structure at present, and its useful life only reaches 30,000 hours.Although the material and function of LED support is in continuous lifting, its heat-sinking capability is limited, remains the key factor affecting the LED life-span.
In addition, also there is following technical problem in traditional packing forms:
Due to the restriction by support bowl cup structure, its lighting angle is only about 120 °.Beam angle is had to the application scenario of particular/special requirement, need encapsulation optical lens to adjust the lighting angle of LED.As illuminating LED flashlight, require that LED lighting angle is less, both can make full use of luminous energy, be also more conducive to the design of its secondary optics.The logical beam angle filling an optical lens or other means adjustment LED, increases the degree of freedom of LED light beam angle, but too increases encapsulation difficulty and complexity, too increase cost simultaneously;
Because the bowl cup structure of packaging body is larger relative to chip size, the area of phosphor powder layer is far longer than chip list area, the blue light that chip sends fully cannot mix with the gold-tinted that fluorescent material is excited, and causes the colorspace distribution of light uneven, affects optical property and the result of use of product;
The design of electrode uses gold thread more, and gold thread had both affected the spatial distribution of light, and also increase the packaging cost of LED, the size and shape of gold thread soldered ball often has influence on the performance of LED, adds technology difficulty simultaneously.Gold thread fracture is also failure mode common in LED, affects LED product reliability.
High-power LED encapsulation is subject to the restriction of support and bowl cup structure always, for high-power LED, can only adopt the packing forms of ceramic substrate encapsulation or COB at present or strengthen package dimension, both add packaging cost, and technically also faced a lot of bottleneck.Along with the update of product and improving constantly of consumer demand, some backlights and high-precision end product are proposed to volume is little, the requirement of slimming.Current LED volume is comparatively large, cannot realize slimming product.
Utility model content
The utility model provides a kind of novel encapsulated technology, i.e. chip size packages CSP (chip scalepackage) technology, and disclosed in the utility model, technical scheme is specially:
A kind of encapsulating structure of chip size white light LEDs, described encapsulating structure comprises bare chip and fluorescent material coating layer, and wherein, the area of described encapsulating structure is slightly larger than the area of described bare chip, described bare chip adopts the form of upside-down mounting to be encapsulated on heat-radiating substrate, eliminates LED support and gold thread; Described encapsulating structure enhances heat dispersion by reducing heat-transfer interface, and makes white light reflective surface close to chip surface size thus, and then makes optical density large.
Further, the area of described encapsulating structure is less than 1.5 times of described bare chip area.
Technical scheme disclosed in the utility model has following technique effect:
1. wafer-level package (CSP) is without the need to using support and gold thread, and compared with the packing forms of identical performance, cost savings more than 20%, make LED more extensive in the application of every field, especially commercial lighting and domestic lighting field.
2. no rack structure, heat dispersion is splendid, extends useful life.Due to without support to the absorption of light and scattering process, the efficiency of light energy utilization improve.
3. five surface-emitting type CSP beam angles can reach more than 150 °, are convenient to secondary optical design; One surface-emitting type CSP beam angle can reach within 120 °, is convenient to axially get light design.
4. the colorspace distribution of light is even, and evenly luminous, light extraction efficiency is high.Improve the optical property of LED, improve the taste of application end product.
5. save encapsulating material, simplify packaging technology and program.
6. the encapsulation of great power LED is no longer subject to the restriction of encapsulating material and supporting structure, can encapsulate the size and shape of applicable power and selection light-emitting area as required.
7. packaging body is chip-scale size, can meet the slimming demand of backlight product and other military, civilian high-end product very well to the requirement of light source small size.
8. light-emitting area shape and size can design according to demand, and flexibility ratio is high.
Accompanying drawing explanation
Fig. 1 is the encapsulating structure with once optics in prior art.
Fig. 2 is SMD packing forms of the prior art.
Fig. 3 is chip scale package structure of the present utility model.
Fig. 4 is the CSP process chart of chip scale package structure of the present utility model.
Embodiment
In order to understand the technical solution of the utility model better, be further elaborated below in conjunction with accompanying drawing.
The utility model provides a kind of novel encapsulated technology, i.e. chip size packages CSP (chip scalepackage) technology, as shown in Figure 3.CSP technology refers to the single-chip package technology of packaging body area slightly larger than bare chip area (being generally less than 1.5 times).Concrete, be chip direct package on heat-radiating substrate, eliminate original support, decrease a heat-transfer interface, there is splendid heat dispersion; Due to the lifting of heat dispersion, white light reflective surface is close to chip surface size, and therefore optical density is large, is applicable to the optical design of electric light source; Owing to adopting flip-chip, eliminate gold thread, reduce encapsulating material and cost of manufacture, improve product reliability simultaneously.Representing the development trend of high-capacity LED of future generation, is the present and following high performance-price ratio LED product.
The ratio of chip area and package area is close to 1:1, Total Product overall dimension is little, the demand of multiple TV backlight product slimming can be met, but also may be used for before this cannot the space of packaged light source, in ordinary luminaire, also there is advantage, contribute to the photochromic mixed effect of lifting LED and be convenient to secondary optical design.Keep higher luminous efficiency at higher current densities, than conventional package LED advantageously.The chip size packages that the utility model relates on flip LED chips, carries out fluorescent material directly cover, and have employed simple possible, the encapsulating material being applicable to batch production and technological process, can realize the white-light LED encapsulation product of high yield, low manufacturing cost.
Wafer-level package (CSP) is that array is arranged on temporary base chip, be made into the cope match-plate pattern of carrying fluorescent material and glue, fluorescent material and the silica gel mixture of the ratio for preparing is injected again in mould, matched moulds is carried out, from film, baking with the temporary base being loaded with chip, then according to chip size cutting, strippable substrate, complete and make single LEDs light source.
Particularly, the technological process of CSP structure is as shown in Figure 4:
1. substrate prepares: the diaphragm (as hot stripping film, UV film etc.) using automatic mulch applicator can change viscosity is attached on the functional areas of temporary base.Toughness is all with in film two sides, and adhesive substrates, one side are fitted chip;
2. chip is fixed: use general bonder, is arranged on temporary base by inverted structure chip array, and substrate indicates with CCD identifiable design.Because flip-chip P/N ties design, weld without the need to gold thread;
3. reflect glue to fill: use Universal dispenser, high reverse--bias silica gel on chip surrounding is filled, makes silica gel and chip surface level.Then baking-curing, final formation one surface-emitting type CSP.High reverse--bias silica gel reflectivity can reach more than 98%, and its prime cost is TiO2 or BaSO4 etc.If wish five surface-emitting type CSP, this step can be saved;
4. patrix: temporary base is put into mould;
5. injecting glue: the fluorescent material and silica gel mixture that prepare ratio are injected mould.
6. matched moulds: will be marked with the mould of fluorescent material and be loaded with the substrate matched moulds of flip-chip, make fluorescent material and silica gel be uniformly distributed in chip surrounding, thickness be adjustable;
7. from mould: after baking sizing, temporary base is taken out.
8. cut: the flip-chip arrangement according to array is cut.
9. peel off: adopt the mode of UV mode or heating the viscosity on diaphragm two sides to be reduced, usually can be reduced to about 0.03N/20mm, and then be divided into single;
10. color-division, testing package.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.

Claims (1)

1. the encapsulating structure of a chip size white light LEDs, described encapsulating structure comprises bare chip and fluorescent material coating layer, wherein, the area of described encapsulating structure is slightly larger than the area of described bare chip, described bare chip adopts the form of upside-down mounting to be encapsulated on heat-radiating substrate, and the area of described encapsulating structure is less than 1.5 times of described bare chip area.
CN201420538298.7U 2014-09-18 2014-09-18 A kind of encapsulating structure of chip size white light LEDs Active CN204407355U (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
CN201420538298.7U CN204407355U (en) 2014-09-18 2014-09-18 A kind of encapsulating structure of chip size white light LEDs

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CN204407355U true CN204407355U (en) 2015-06-17

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105374807A (en) * 2015-12-03 2016-03-02 易美芯光(北京)科技有限公司 Color temperature adjustable LED integrated light source

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105374807A (en) * 2015-12-03 2016-03-02 易美芯光(北京)科技有限公司 Color temperature adjustable LED integrated light source

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