CN101980388A - Radiator package-based LED device and manufacturing process for LED device - Google Patents
Radiator package-based LED device and manufacturing process for LED device Download PDFInfo
- Publication number
- CN101980388A CN101980388A CN2010102746634A CN201010274663A CN101980388A CN 101980388 A CN101980388 A CN 101980388A CN 2010102746634 A CN2010102746634 A CN 2010102746634A CN 201010274663 A CN201010274663 A CN 201010274663A CN 101980388 A CN101980388 A CN 101980388A
- Authority
- CN
- China
- Prior art keywords
- radiator
- led chip
- line layer
- led
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses a radiator package-based LED device, which comprises a plurality of LED chips, an internal lead, a package colloid, a line layer, and an insulating layer, wherein the LED chips are connected to the line layer through the internal lead; the line layer electrically connects one or more LED chips; the insulating layer forms electrical isolation between a radiator and the line layer; the LED chips are carried on the radiator dotted with a primer; and the package colloid is poured into the internal lead and the LED chips. The LED chips are directly packaged into the radiator, and a bracket comprising a heat sink and a metal substrate (such as an aluminium substrate) are at least saved, namely the heat of the LED chips does not need passing through the heat sink and the metal substrate when the LED chips dissipate heat; and the radiator, the line layer and the insulating layer are attached to one another through a laminating or bonding process, and the line layer and the insulating layer are provided with through holes on the bottoms of the LED chips, so that the LED chips are directly connected with the radiator and the heat dissipation effect is further improved greatly.
Description
Technical field
The present invention relates to the semiconductor packages field, more particularly relate to a kind of manufacture craft based on radiator encapsulated LED (light-emitting diode) device and LED device.
Background technology
Along with led chip technology and Development of Packaging Technology, increasing LED product is applied to lighting field, especially large power white light LED.Because LED has high light efficiency, long-life, energy-conserving and environment-protective, suitable brightness adjustment control, polluter such as not mercurous, becomes the lighting source of new generation after conventional light source such as incandescent lamp, fluorescent lamp.
LED is a kind of electroluminescence semiconductor device, wherein has 30 percent electric energy to be converted to light approximately, and dump energy then is converted to heat, and the LED temperature that thermal accumlation causes rises, and is the main cause that causes the LED light decay.Thereby the led chip heat radiation is the key issue that the LED encapsulation is devoted to solve, and manufacturer has proposed various packaged types in succession both at home and abroad.
At present, led chip is fixed on support heat sink, forms the LED particle, and the LED particle places on the metal substrate (as aluminium base), and metal substrate is installed on the radiator.Heat spreads out after by heat dissipation channels such as heat sink, aluminium base, radiators.
That is to say, adopt structure as shown in Figure 1 to carry out the LED encapsulation.It is: led chip and heat sink etc. is packaged into LED particle 303, and LED particle 303 is welded to PCB (Printed Circuit Board) 302, and as aluminium base, PCB 302 is fixed on radiator 301 by modes such as screw or silicone grease.Its passage of heat is: from led chip, by encapsulating inner heat sink, PCB 302 and radiator 301, finally be transmitted to air.
There is following problem in above-mentioned LED device:
At first, because dispelling the heat, led chip need the middle interlayer of the passage of heat of process many, medium as LED between heat sink and PCB 302, PCB 302 and the radiator 301 is air or silicone grease, and the thermal conductivity of interlayer is lower in the middle of gas or the silicone grease, so heat dispersion is not good.
In addition, owing to non-metal base plates such as metal substrate that has used high thermal conductivity or potteries, cost is higher.
Therefore, there are shortcomings such as heat dispersion is low, cost is high, production process is many in the product of LED packing forms at present.
Summary of the invention
It is a kind of based on radiator encapsulated LED device that first purpose of the present invention is to provide, and to solve in the prior art, has the technical problem that heat dispersion is low or cost is high.
Second purpose of the present invention is to provide a kind of manufacture craft of LED device, to solve in the prior art, has the technical problem that heat dispersion is low or cost is high.
A kind of based on radiator encapsulated LED device, comprise some led chips, lead, packing colloid, line layer, insulating barrier and radiator.
Described led chip is connected to described line layer by lead;
Described line layer is to form between one or more led chips to be electrically connected;
Described insulating barrier is for forming electrical isolation between described radiator and described line layer;
Described packing colloid perfusion lead and led chip;
Some through holes are set respectively on described insulating barrier and the line layer, each led chip overlays on the radiator by direct the carrying of the through hole of correspondence, on the perhaps described line layer some through holes are set, each led chip is sticked on described insulating barrier by the through hole of correspondence, and the opposite side of insulating barrier contacts with described radiator formation face.
Preferably, this example also comprises some Zener diodes, and described zener diode is in parallel with led chip, and described Zener diode is two-way zener diode or unidirectional Zener diode.
In addition, to mount the position be plane, groove shape, the bowl shape of sinking for described radiator and described led chip.
The led chip both positive and negative polarity is connected with line layer by lead respectively, and perhaps the led chip electrode is connected by lead with line layer welding, another electrode, and perhaps led chip both positive and negative polarity and line layer directly weld.
Described radiator, line layer and insulating barrier are sticked by pressing or technique for sticking and are in the same place.
The present invention also provides a kind of manufacture craft based on radiator encapsulated LED device, is made up of following steps:
(1) radiator, line layer and insulating barrier are sticked by pressing or technique for sticking and are in the same place, and some through holes are set respectively on described line layer and the insulating barrier or some through holes only are set on described line layer;
(2) through hole correspondence position on radiator, primer on the point as elargol, then with led chip, perhaps and Zener diode, carries by through hole and to cover on the radiator, and baking is fixing again;
(3) the led chip both positive and negative polarity is welded on the line layer by lead;
(4) fluorescent material and glue are mixed after, point is above led chip;
(5) adopt some lens to be located at directly over the led chip, and at lens internal cavity encapsulating.
The present invention also provides second kind based on radiator encapsulated LED device, also comprise: led chip, lead, packing colloid, wiring board and radiator, some through holes are set on the described wiring board, each led chip carries by corresponding through hole and overlays on the radiator that primer is a little arranged, described lead is connected to from led chip on the electrical layer of wiring board, described packing colloid perfusion lead and led chip.
This example also comprises some Zener diodes, and described zener diode is in parallel with led chip, and described Zener diode is two-way zener diode or unidirectional Zener diode.
Preferably, described wiring board adopts low heat conductivity circuit base plate cheaply.
It is sagging bowl-shape that the position that connects led chip on the described radiator is, and adds some optical lenses or described packing colloid is directly made optical lens outside packing colloid.
The invention also discloses second kind of manufacture craft, form by following steps based on radiator encapsulated LED device:
(1) radiator and wiring board are fixed by modes such as screws;
(2) through hole correspondence position on radiator, primer on the point as elargol, then with led chip, perhaps and Zener diode, carries by through hole and to cover on the radiator, and baking is fixing again;
(3) the led chip both positive and negative polarity is welded on the wiring board by lead;
(4) fluorescent material and glue are mixed after, point is above led chip;
(5) adopt some lens to be located at directly over the led chip, and at lens internal cavity encapsulating.
Compared with prior art, LED device of the present invention has the following advantages:
At first, led chip directly is encapsulated in to carry on the radiator or by insulating barrier and overlays on the radiator.The heat of led chip just directly spread from radiator and sends out, and does not have to pass through other heat eliminating mediums: such as heat sink, aluminium lamination, LED is heat sink and PCB, PCB and radiator between air dielectric, promoted radiating effect greatly.
Secondly, led chip directly is encapsulated on the radiator, do not comprise with heat sink support, and metal substrate, thereby parts introduction, and also production process is few, and with low cost.
Moreover led chip directly is encapsulated on the radiator, and PCB only plays electric interconnect function, is not conductive force, and then PCB is not restricted to the substrate of high thermal conductivities such as aluminium, pottery, and replaceable is the plank of low heat conduction such as FR4, CEM-1, with low cost.
Description of drawings
Fig. 1 is the encapsulation exemplary plot of existing LED device;
Fig. 2 is the first example principle schematic that the present invention is based on radiator encapsulated LED device;
Fig. 3 is the first example principle schematic that the present invention is based on radiator encapsulated LED device.
Embodiment
The application's core is: existing LED device, often led chip is fixed on support heat sink, be packaged into the LED particle, the LED particle is welded on different wiring boards, be installed to again on the radiator, form different products, to adapt to more wider application scenarios, and become industry technology prejudice, and the frame mode of this LED module exists shortcomings such as heat dispersion is not good enough, parts complexity.The applicant is in LED throw light on proprietary field and application scenario, overcome existing technology prejudice, a kind of new LED packaged type has been proposed, led chip carried overlay on the radiator that primer is a little arranged, reached better radiating effect and cheaper cost, and solved led chip and carry the encapsulation problem that overlays on the radiator.
Embodiment one
Fig. 2 is a kind of principle schematic based on radiator encapsulated LED device.It comprises some led chips 405, lead 402, packing colloid 401, line layer 406, insulating barrier 403 and radiator 404.
The acting as between one or more led chip of line layer 406 forms serial or parallel connection etc. and is electrically connected, and material is generally copper.Line layer 406 forms electric wiring, especially led chip 405 below hollow outs by technologies such as physics or chemical etchings, can directly reach radiator 404 with the heat that reaches led chip 405.And make each led chip 405 both positive and negative polarity be connected with line layer 406 respectively by lead 402, perhaps make that by lead 402 each led chip 405 certain electrode and line layer 406 weld or led chip 405 both positive and negative polarities are direct and line layer 406 directly welds.In order to strengthen the welding effect of lead 402, can be in line layer 406 surface gold-plating or silver-plated.And line layer 406 is arranged to through hole with led chip 405 junctions, overlays on radiator 404 so that led chip 405 can directly carry, and reaches good heat radiating.
Acting as between radiator 404 and line layer 406 of insulating barrier 403 forms electrical isolation.
On insulating barrier 403 and the line layer 406 some through holes are set respectively, each led chip 405 is set directly on the radiator 404 by the through hole of correspondence. promptly, corresponding through hole is set, the corresponding led chip 405. of the through hole of each on insulating barrier 403 and the line layer 406 respectively
Also can be: some through holes 407 are set on the line layer 406, and each led chip 405 be sticked on insulating barrier 403 by the through hole 405 of correspondence, and the opposite side of insulating barrier 403 contacts with radiator 404 formation faces.
In an embodiment of the present invention, can be processed into the radiation bowl shape, can behind fixed chip, inject the colloid that contains fluorescent material simultaneously in the position of radiator 404 fixed L ED chips 405.
The present invention can also comprise Zener diode, and it is connected with the led chip parallel way, perhaps adopts bi-directional zener diode, then plays anti-static electrification; Perhaps adopt the individual event Zener diode, then play the effect of LED open circuit protection, when LED opened circuit, electric current flow through through Zener diode, and did not influence other led chip operate as normal.
Described packing colloid 401 perfusion lead 402 and led chips 405.The effect of packing colloid 401 is fixing leads 402, also plays the effect of optics luminous intensity distribution simultaneously, by injection mo(u)lding, perhaps adds a cover lens, finishes from lens bottom injecting glue then.
From the above, led chip 405 can directly be encapsulated on the radiator 404.Like this, the heat radiation of led chip 405 has just directly distributed from radiator 404, does not pass through heat eliminating medium: such as heat sink, aluminium base, LED is heat sink and PCB, PCB and radiator between air dielectric, promoted radiating effect greatly.
Or led chip 405 is close on the insulating barrier 403 by the through hole 405 of correspondence, and the opposite side of insulating barrier 403 contacts with radiator 404 formation faces.Generally speaking, insulating barrier 403 is extremely thin, and carrying out face with radiator 404 contacts, equally, the heat of led chip also can be by spreading out in the radiator 404, do not pass through heat eliminating medium: such as heat sink, aluminium base, LED is heat sink and PCB, PCB and radiator between air dielectric, promoted radiating effect greatly.
A kind of manufacture craft based on radiator encapsulated LED device, form by following steps:
(1) radiator, line layer and insulating barrier are sticked by pressing or technique for sticking and are in the same place, and some through holes are set respectively on described line layer and the insulating barrier or some through holes only are set on described line layer;
(2) through hole correspondence position on radiator, primer on the point as elargol, then with led chip, perhaps and Zener diode, carries by through hole and to cover on the radiator, and baking is fixing again;
(3) the led chip both positive and negative polarity is welded on the line layer by lead;
(4) fluorescent material and glue are mixed after, point is above led chip;
(5) adopt some lens to be located at directly over the led chip, and at lens internal cavity encapsulating.
Need to prove, described lens, its effect is the optics luminous intensity distribution, the light that led chip is sent is dispersed or is converged in suitable angular range.Act as the protection led chip in addition, avoid polluting.
Embodiment two
Fig. 3 is the schematic diagram based on radiator encapsulated LED device of second embodiment.It comprises radiator 404, led chip 405, lead 402, packing colloid 401 and wiring board 501.Compare with embodiment one, identical technology point just no longer is described in detail at this.
The position that connects led chip 405 on the radiator 404 also can be for being sagging bowl-shape.And radiator 404 and wiring board 501 are fastening by a plurality of screws, and perhaps colloid cements.
The present invention can also comprise Zener diode, and it is connected with the led chip parallel way, perhaps adopts bi-directional zener diode, then as anti-static electrification; Perhaps adopt unidirectional Zener diode, then its LED open circuit protection effect, when LED opened circuit at that time, electric current flow through through Zener diode, and did not influence other led chip operate as normal.
A kind of manufacture craft based on radiator encapsulated LED device, form by following steps:
(1) radiator and wiring board are fixed by modes such as screws;
(2) through hole correspondence position on radiator, primer on the point as elargol, then with led chip, perhaps and Zener diode, carries by through hole and to cover on the radiator, and baking is fixing again;
(3) the led chip both positive and negative polarity is welded on the wiring board by lead;
(4) fluorescent material and glue are mixed after, point is above led chip;
(5) adopt some lens to be located at directly over the led chip, and at lens internal cavity encapsulating.
Need to prove, described lens, its effect is the optics luminous intensity distribution, the light that led chip is sent is dispersed or is converged in suitable angular range.Act as the protection led chip in addition, avoid polluting.
More than disclosed only be several specific embodiment of the present invention, but the present invention is not limited thereto, any those skilled in the art can think variation, all should drop in protection scope of the present invention.
Claims (10)
1. one kind based on radiator encapsulated LED device, it is characterized in that, comprises some led chips, lead, packing colloid, line layer and insulating barrier, radiator, wherein,
Described led chip is connected to described line layer by lead;
Described line layer is to form between one or more led chips to be electrically connected;
Described insulating barrier is for forming electrical isolation between described radiator and described line layer;
Described packing colloid perfusion lead and led chip;
Some through holes are set respectively on described insulating barrier and the line layer, each led chip overlays on the radiator by direct the carrying of the through hole of correspondence, on the perhaps described line layer some through holes are set, each led chip is sticked on described insulating barrier by the through hole of correspondence, and the opposite side of insulating barrier contacts with described radiator formation face.
2. as claimed in claim 1ly it is characterized in that based on radiator encapsulated LED device also comprise some Zener diodes, described zener diode is in parallel with led chip, described Zener diode is two-way zener diode or unidirectional Zener diode.
3. as claimed in claim 1ly it is characterized in that it is plane, groove shape that described radiator and described led chip mount the position, the bowl shape of sinking based on radiator encapsulated LED device.
4. as claimed in claim 1 based on radiator encapsulated LED device, it is characterized in that, the led chip both positive and negative polarity is connected with line layer by lead respectively, perhaps the led chip electrode is connected by lead with line layer welding, another electrode, perhaps led chip both positive and negative polarity and line layer directly weld, and described radiator, line layer and insulating barrier are sticked by pressing or technique for sticking and are in the same place.
5. the manufacture craft based on radiator encapsulated LED device is characterized in that, is made up of following steps:
(1) radiator, line layer and insulating barrier are sticked by pressing or technique for sticking and are in the same place, and some through holes are set respectively on described line layer and the insulating barrier or some through holes only are set on described line layer;
(2) through hole correspondence position on radiator, primer on the point, then with led chip, perhaps led chip and Zener diode carry to cover on the radiator or carry by insulating barrier by through hole and cover on the radiator, and baking is fixing again;
(3) the led chip both positive and negative polarity is welded on the line layer by lead;
(4) fluorescent material and glue are mixed after, point is above led chip;
(5) adopt some lens to be located at directly over the led chip, and at lens internal cavity encapsulating.
6. one kind based on radiator encapsulated LED device, it is characterized in that, also comprise radiator, led chip, lead, packing colloid and wiring board, some through holes are set on the described wiring board, led chip carries by corresponding through hole and overlays on the radiator that primer is a little arranged, described lead is connected to from led chip on the electrical layer of wiring board, described packing colloid perfusion lead and led chip.
7. as claimed in claim 6ly it is characterized in that based on radiator encapsulated LED device also comprise some Zener diodes, described zener diode is in parallel with led chip, described Zener diode is two-way zener diode or unidirectional Zener diode.
8. as claimed in claim 6ly it is characterized in that described wiring board adopts the low heat conductivity substrate based on radiator encapsulated LED device.
9. as claimed in claim 6ly it is characterized in that it is sagging bowl-shape that the position that connects led chip on the described radiator is, outside packing colloid, add some optical lenses or described packing colloid is directly made optical lens based on heat radiation encapsulated LED device.
10. the manufacture craft based on radiator encapsulated LED device is characterized in that, is made up of following steps:
(1) radiator and wiring board are fixed;
(2) through hole correspondence position on radiator, primer on the point, then with led chip, perhaps led chip and Zener diode carry by through hole and to cover on the radiator, and baking is fixing again;
(3) the led chip both positive and negative polarity is welded on the wiring board by lead;
(4) fluorescent material and glue are mixed after, point is above led chip;
(5) adopt some lens to be located at directly over the led chip, and at lens internal cavity encapsulating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102746634A CN101980388A (en) | 2010-09-07 | 2010-09-07 | Radiator package-based LED device and manufacturing process for LED device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102746634A CN101980388A (en) | 2010-09-07 | 2010-09-07 | Radiator package-based LED device and manufacturing process for LED device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101980388A true CN101980388A (en) | 2011-02-23 |
Family
ID=43600883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102746634A Pending CN101980388A (en) | 2010-09-07 | 2010-09-07 | Radiator package-based LED device and manufacturing process for LED device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101980388A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102956807A (en) * | 2012-11-26 | 2013-03-06 | 福建省能宝光电集团有限公司 | Efficiently integrated LED (Light Emitting Diode) light source |
| CN103066036A (en) * | 2012-12-30 | 2013-04-24 | 杨渊翔 | Active heat dissipation substrate |
| CN103094268A (en) * | 2011-11-04 | 2013-05-08 | 杭州华普永明光电股份有限公司 | Light-emitting diode (LED) module used for commercial lighting and manufacturing method thereof |
| CN103094425A (en) * | 2011-11-04 | 2013-05-08 | 杭州华普永明光电股份有限公司 | Manufacturing process of light emitting diode (LED) module group and LED module group |
| CN103094465A (en) * | 2011-11-04 | 2013-05-08 | 杭州华普永明光电股份有限公司 | Light-emitting diode (LED) module and manufacturing technology thereof |
| CN103187518A (en) * | 2011-12-31 | 2013-07-03 | 杨璠 | Novel light emitting diode (LED) heat dissipation system |
| CN103474551A (en) * | 2013-08-21 | 2013-12-25 | 奇瑞汽车股份有限公司 | High-power light-emitting diode (LED) substrate and packaging method thereof |
| CN105355622A (en) * | 2014-08-21 | 2016-02-24 | 上海威廉照明电气有限公司 | Integrated super-quantum LED light-emitting device |
| CN106098911A (en) * | 2016-06-22 | 2016-11-09 | 深圳市领德奥普电子有限公司 | Can the heat dissipation type lamp plate and preparation method thereof of once light-distribution molding |
| CN103094465B (en) * | 2011-11-04 | 2016-12-14 | 杭州华普永明光电股份有限公司 | LED module and processing technology thereof |
| CN106898680A (en) * | 2015-12-21 | 2017-06-27 | 上海威廉照明电气有限公司 | Light-emitting device and its manufacture method |
| WO2020147004A1 (en) * | 2019-01-15 | 2020-07-23 | 泉州三安半导体科技有限公司 | Light emitting diode packaging device and light emitting device |
| CN114039271A (en) * | 2021-10-27 | 2022-02-11 | 深圳市宏钢机械设备有限公司 | Integrated glass packaging tube seat and production process thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2798315Y (en) * | 2005-04-04 | 2006-07-19 | 江苏奥雷光电有限公司 | High power LED packing structure |
| CN101159300A (en) * | 2007-11-12 | 2008-04-09 | 西安立明电子科技有限责任公司 | Copper base high power LED packaging |
| US20080290363A1 (en) * | 2007-05-23 | 2008-11-27 | Advanced Connectek Inc. | Light emitting diode package |
| CN101692448A (en) * | 2009-09-30 | 2010-04-07 | 李峰 | Multi-chip LED centralized-encapsulated radiating structure and encapsulation technology thereof |
-
2010
- 2010-09-07 CN CN2010102746634A patent/CN101980388A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2798315Y (en) * | 2005-04-04 | 2006-07-19 | 江苏奥雷光电有限公司 | High power LED packing structure |
| US20080290363A1 (en) * | 2007-05-23 | 2008-11-27 | Advanced Connectek Inc. | Light emitting diode package |
| CN101159300A (en) * | 2007-11-12 | 2008-04-09 | 西安立明电子科技有限责任公司 | Copper base high power LED packaging |
| CN101692448A (en) * | 2009-09-30 | 2010-04-07 | 李峰 | Multi-chip LED centralized-encapsulated radiating structure and encapsulation technology thereof |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103094465B (en) * | 2011-11-04 | 2016-12-14 | 杭州华普永明光电股份有限公司 | LED module and processing technology thereof |
| CN103094268A (en) * | 2011-11-04 | 2013-05-08 | 杭州华普永明光电股份有限公司 | Light-emitting diode (LED) module used for commercial lighting and manufacturing method thereof |
| CN103094425A (en) * | 2011-11-04 | 2013-05-08 | 杭州华普永明光电股份有限公司 | Manufacturing process of light emitting diode (LED) module group and LED module group |
| CN103094465A (en) * | 2011-11-04 | 2013-05-08 | 杭州华普永明光电股份有限公司 | Light-emitting diode (LED) module and manufacturing technology thereof |
| CN103187518A (en) * | 2011-12-31 | 2013-07-03 | 杨璠 | Novel light emitting diode (LED) heat dissipation system |
| CN102956807A (en) * | 2012-11-26 | 2013-03-06 | 福建省能宝光电集团有限公司 | Efficiently integrated LED (Light Emitting Diode) light source |
| CN103066036A (en) * | 2012-12-30 | 2013-04-24 | 杨渊翔 | Active heat dissipation substrate |
| CN103474551A (en) * | 2013-08-21 | 2013-12-25 | 奇瑞汽车股份有限公司 | High-power light-emitting diode (LED) substrate and packaging method thereof |
| CN105355622A (en) * | 2014-08-21 | 2016-02-24 | 上海威廉照明电气有限公司 | Integrated super-quantum LED light-emitting device |
| CN106898680A (en) * | 2015-12-21 | 2017-06-27 | 上海威廉照明电气有限公司 | Light-emitting device and its manufacture method |
| CN106098911A (en) * | 2016-06-22 | 2016-11-09 | 深圳市领德奥普电子有限公司 | Can the heat dissipation type lamp plate and preparation method thereof of once light-distribution molding |
| WO2020147004A1 (en) * | 2019-01-15 | 2020-07-23 | 泉州三安半导体科技有限公司 | Light emitting diode packaging device and light emitting device |
| CN114039271A (en) * | 2021-10-27 | 2022-02-11 | 深圳市宏钢机械设备有限公司 | Integrated glass packaging tube seat and production process thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101980388A (en) | Radiator package-based LED device and manufacturing process for LED device | |
| CN102606904B (en) | Comprise the lighting apparatus of light-emitting device | |
| CN102280569B (en) | High heat conducting substrate, light-emitting diode (LED) device and LED component | |
| CN101980387A (en) | LED module and manufacturing process thereof | |
| KR20130048143A (en) | Led module and method of bonding thereof | |
| CN102388473A (en) | Light-emitting diode package | |
| CN202196815U (en) | High heat conducting substrate, light-emitting diode (LED) device and LED assembly | |
| CN103500787A (en) | Ceramic COB (Chip-on-Board) packaged LED (light-emitting diode) light source with bottom capable of being directly soldered on heat sink | |
| CN102610735A (en) | Light-emitting device with thermoelectric separated structure and manufacturing method of light-emitting device | |
| CN102412212A (en) | Heat dissipation device for electronic/optolectronic assembly | |
| CN202405323U (en) | Structure for directly packaging LED chips on vapor chamber and lamp employing same | |
| WO2014121878A1 (en) | Circuit board | |
| CN201149869Y (en) | LED encapsulation structure | |
| CN202195315U (en) | LED (light-emitting diode) surface light source device | |
| CN102593317B (en) | High-power high-brightness light-emitting diode (LED) light source packaging structure and packaging method thereof | |
| CN104009028A (en) | Integrated package method and structure of high-power LED with ceramic substrate and heat dissipation substratum | |
| CN201766098U (en) | Zero thermal resistance structure of high-power LED (light-emitting diode) and radiator and LED lamp | |
| CN101980386A (en) | Radiator encapsulation-based light-emitting diode (LED) device and manufacturing process of same | |
| CN102005530A (en) | High-power LED heat radiating unit | |
| CN103956356A (en) | Efficient heat conducting large-power LED integration package structure | |
| CN201242052Y (en) | Combined component of LED and heat conducting device | |
| WO2018018961A1 (en) | Pcb, method for manufacturing same, and mobile terminal | |
| CN108461616B (en) | Packaging method of thermoelectric separation heat dissipation structure for high-power L ED | |
| CN102364684A (en) | LED (Light-Emitting Diode) module and manufacturing process thereof | |
| CN103474565A (en) | Connection of light emitting diode unit and insulation heat conduction substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20110223 |