CN2798315Y - High power LED packing structure - Google Patents
High power LED packing structure Download PDFInfo
- Publication number
- CN2798315Y CN2798315Y CNU2005200704735U CN200520070473U CN2798315Y CN 2798315 Y CN2798315 Y CN 2798315Y CN U2005200704735 U CNU2005200704735 U CN U2005200704735U CN 200520070473 U CN200520070473 U CN 200520070473U CN 2798315 Y CN2798315 Y CN 2798315Y
- Authority
- CN
- China
- Prior art keywords
- emitting diode
- high power
- utility
- light emitting
- electrode slice
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model belongs to the technical field of a semiconductor device. The utility model relates to a high power light emitting diode packing structure which comprises a metal base plate, wherein the upper surface of which is covered with an insulation layer on which an electrode slice and a light emitting diode are stuck. A bottom surface where the light emitting diode and the insulation layer are combined is a smooth plane surface. A base pin of the light emitting diode extends out of the lateral surface and is welded with the electrode slice. The bottom surface of the metal base plate is provided with a plurality of heat radiation troughs. The structure of the utility model lowers the heat resistance of the whole product which is packed and improves the heat dispersion.
Description
Technical field
The utility model belongs to technical field of semiconductor device, relates to a kind of high power LED package structure.
Background technology
The encapsulating structure of traditional light-emitting diode (LED), generally be with conduction or non-conductive adhesive is contained in chip in the undersized reflector or on the slide holder, the inside and outside connection back of being finished device by spun gold forms with epoxy encapsulation, its thermal resistance is up to 250～300 ℃/W, thus its can only the little electric current of 20mA and＜work under the condition of 0.1W.And power-type (＞1W) LED is if adopt traditional packing forms, will cause junction temperature of chip to rise rapidly and epoxy carbonization flavescence because heat radiation is bad, cause the optical attenuation of device to quicken, even lost efficacy because the stress that thermal expansion rapidly produced causes open circuit until inefficacy.Therefore traditional package structure for LED is difficult to adapt to the heat radiation needs of high-capacity LED device, can't obtain stable light and export and keep higher device lifetime.
Summary of the invention
Technical problem to be solved in the utility model is that the high power LED package structure that a kind of thermal resistance is low, heat radiation is good is provided.
High power LED package structure of the present utility model includes a metal substrate, be coated with a layer insulating at the metal substrate upper surface, on insulating barrier, be pasted with electrode slice and light-emitting diode, the bottom surface that described light-emitting diode combines with insulating barrier is a smooth flat, the pin of light-emitting diode is stretched out by the side and is welded to connect with electrode slice, has many radiating grooves on the bottom surface of described metal substrate.For further reducing thermal resistance, described insulating barrier can adopt membrane structure, to be different from the known technology with the structure of pcb board as insulating barrier.
The utility model by radiating groove is set to increase area of dissipation in the metal substrate bottom surface, therefore greatly reduces the thermal resistance after entire product encapsulates simultaneously owing to improved the integrated structure of light-emitting diode, insulating barrier and metal substrate, has improved heat dispersion.
Description of drawings
Fig. 1 is the utility model hierarchy schematic diagram;
Fig. 2 is a planar structure schematic diagram of the present utility model.
Embodiment
As shown in the figure, include a metal substrate 1 in the structure of the present utility model, the metal substrate upper surface is coated with the insulating barrier 2 of film like, and electrode slice 3 and light-emitting diode 4 are set on insulating barrier.The bottom surface of light-emitting diode is a smooth flat, and the pin 5 that is positioned at the side is welded to connect with electrode slice.Have many radiating grooves 6 on the bottom surface of metal substrate.
Claims (2)
1, a kind of high power LED package structure, include a metal substrate (1), be coated with a layer insulating (2) at the metal substrate upper surface, on insulating barrier, be pasted with electrode slice (3) and light-emitting diode (4), it is characterized in that: the bottom surface that described light-emitting diode combines with insulating barrier is a smooth flat, the pin of light-emitting diode (5) is stretched out by the side and is welded to connect with electrode slice, has many radiating grooves (6) on the bottom surface of described metal substrate.
2, high power LED package structure according to claim 1 is characterized in that: described insulating barrier (2) is a membrane structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005200704735U CN2798315Y (en) | 2005-04-04 | 2005-04-04 | High power LED packing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005200704735U CN2798315Y (en) | 2005-04-04 | 2005-04-04 | High power LED packing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2798315Y true CN2798315Y (en) | 2006-07-19 |
Family
ID=36869562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2005200704735U Expired - Lifetime CN2798315Y (en) | 2005-04-04 | 2005-04-04 | High power LED packing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2798315Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101980388A (en) * | 2010-09-07 | 2011-02-23 | 浙江西子光电科技有限公司 | Radiator package-based LED device and manufacturing process for LED device |
| CN101988636A (en) * | 2009-07-31 | 2011-03-23 | 歌尔声学股份有限公司 | White light LED (light-emitting diode) and preparation method thereof |
-
2005
- 2005-04-04 CN CNU2005200704735U patent/CN2798315Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101988636A (en) * | 2009-07-31 | 2011-03-23 | 歌尔声学股份有限公司 | White light LED (light-emitting diode) and preparation method thereof |
| CN101980388A (en) * | 2010-09-07 | 2011-02-23 | 浙江西子光电科技有限公司 | Radiator package-based LED device and manufacturing process for LED device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20150404 Granted publication date: 20060719 |