CN201373367Y

CN201373367Y - High-power LED light source module adopting semiconductor for cooling

Info

Publication number: CN201373367Y
Application number: CN200920050679U
Authority: CN
Inventors: 李炳乾; 郑同场
Original assignee: Shenzhen Chengguangxing Industrial Development Co Ltd
Current assignee: Shenzhen Chengguangxing Industrial Development Co Ltd
Priority date: 2009-01-22
Filing date: 2009-01-22
Publication date: 2009-12-30
Anticipated expiration: 2019-01-22

Abstract

The utility model discloses a high-power LED light source module adopting a semiconductor for cooling. The high-power LED light source module comprises a base seat, a metal circuit board (MCPCB), an LED array and a reflecting cup. The high-power LED light source module is characterized in that the module also comprises a semiconductor cooler which comprises a cooling end and a heating end, wherein the cooling end is connected with the metal layer of the MCPCB, the heating end is connected with the base seat, the LED array is installed on the MCPCB, an LED heat sink is directly welded on the metal layer of the MCPCB by adopting highly heat conductive brazing metal, the bottom of the reflecting cup is fixed on the base seat and tightly presses the MCPCB, the semiconductor cooler and the base seat. The high-power LED light source module has the advantages of low heat resistance, quick heat conduction, adjustable conduction speed, low working temperature, high brightness, compact structure, good reliability, simple manufacturing technique, low manufacturing cost and convenient subsequent design and use.

Description

A kind of high-power LED light source module that utilizes semiconductor refrigerating

Technical field

The utility model relates to LED illumination application, more specifically says the light source module that relates to high-power (more than the 20W) and LED dense arrangement.

Background technology

LED (Light Emitting Diode, light emitting diode) a kind ofly changes electric energy the solid light source of luminous energy into, might become the novel solid light source of replace incandescent, fluorescent lamp, will create the 4th revolution of Lighting Industry.Compare with existing lighting, the luminous efficiency particularly low and heat-sinking capability difference of light extraction efficiency is the major technique bottleneck that illuminative high-power LED (power is greater than 1W) faces, the luminous efficiency of LED only can reach 10%～20% at present, 80%～90% power conversion has become heat in addition, in order to guarantee the life-span of device, generally require junction temperature below 110 ℃.More than 1mm * 1mm, heat flow density has surpassed 100W/cm to the chip size of making that satisfies illuminative high-power LED mostly at present ², if untimely with transfer of heat, the gathering of heat can cause the rising of LED junction temperature, and junction temperature directly has influence on the light extraction efficiency, peak wavelength, device lifetime of device etc.Therefore the heat radiation that solves LED has become great power LED to develop illuminating matter of utmost importance.The heat radiation main method that solves high-power LED module at present has: adjust the arrangement pitches of LED, strengthen the size of pcb board, increase its area of dissipation; Adopt the good MCPCB plate of heat conduction, reduce the thermal resistance of pcb board, again increased area radiator in addition; These schemes can satisfy under the less situation of led module power ratio, but when led module power during big slightly and LED dense arrangement, radiating effect is undesirable, has restricted its bigger direction of power density court and has developed.

The utility model content

The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of thermal resistance low, the high-power LED light source module of good heat dissipation effect.

The technical solution adopted in the utility model is as follows: the high-power LED light source module that utilizes semiconductor refrigerating, comprise pedestal, metal circuit board (MCPCB), led array, reflector, it is characterized in that: also comprise the semiconductor refrigerator, semiconductor cooler comprises refrigeration end and heating end, the refrigeration end is connected with the metal level of MCPCB, the heating end is connected with pedestal, led array is installed on the MCPCB, the reflector bottom is fixed on the pedestal, and MCPCB, semiconductor cooler, pedestal three are compressed.

Insulating barrier with the heat sink correspondence position of each LED on the MCPCB plate is removed, and the brazing metal of LED is heat sink employing high thermal conductivity directly is welded on the metal level of MCPCB.

Described pcb board can replace with common line plate and sheet metal combination, promptly on the common line plate, punch with the heat sink corresponding position of great power LED, again wiring board and sheet metal bonding, the common line plate only provides electric connection, and great power LED is heat sink directly to be connected with sheet metal by scolder.

Described reflector is that heat-insulating materials such as glass, plastics, resin constitute, and in order to improve the reliability of module, reflector also can use metal material to make, and when using the metal reflective cup, is provided with heat insulation loop between metal reflective cup and pedestal.

Led array and semiconductor cooler are when operating current mates, and can connect constitutes a loop, and the two is worked simultaneously to guarantee high-power LED array and semiconductor cooler, does not also follow hard on damage because of one of them components from being damaged makes another one.

Described led array can replace with and adopt COB technology packaging LED chips array on the MCPCB plate.

The beneficial effects of the utility model are:

(1) the utility model utilizes the high-power LED light source module of semiconductor refrigerating, in existing great power LED cooling structure is that MCPCB adds on the basis of outside radiator structure, add one deck in the centre and force the refrigeration layer, be semiconductor cooler, become MCPCB and add the structure that the conductor refrigeration layer adds radiator structure again.The conductor refrigeration cooling velocity is fast, can make the heat on the MCPCB lead outside radiator structure rapidly by semiconductor cooler, guarantee that MCPCB maintains lower temperature all the time, thereby the work that has guaranteed led array is good, also can control its cooling velocity and cooling power, itself and led array heating power are complementary by the operating current of regulating semiconductor cooler.Force refrigeration by semiconductor in addition, assurance also is provided for great power LED is densely arranged, can concentrate a large amount of luminescent devices in range of small, characteristics with brightness height, compact conformation, might produce the approximate light source of power, brightness and apparent size and conventional light source, make things convenient for promoting the use of of semiconductor illuminating light source, saved encapsulating material simultaneously.

(2) the utility model utilizes the high-power LED light source module of semiconductor refrigerating, adopt the MCPCB plate, its passage of heat unique design, promptly on the MCPCB plate, remove insulating barrier with the heat sink opposite position of its great power LED of installing, the heat sink of great power LED directly is connected with the metal level of MCPCB by scolder, with great power LED be directly installed on MCPCB compare, thermal resistance significantly reduces.Do the heat conduction through hole and compare in addition with on using FR4-PCB, simpler on the technology, thermal resistance is also lower.Use the MCPCB plate of this low thermal resistance, the great power LED of can closely arranging has in the above improved the unit are luminous flux, also makes the compact conformation of module.

(3) the utility model utilizes the high-power LED light source module of semiconductor refrigerating, it is simple in structure, moulded flexible, pass through modular technology, a plurality of these high-power LED light source modules can be made up according to random shape, also this module can be carried out follow-up design (as the secondary optics design etc.), satisfy the lighting requirement of different field, giving to produce and use provides bigger design space.

Description of drawings

Fig. 1 is the structural representation that the utility model utilizes the great power LED of semiconductor refrigerating to be connected with the MCPCB plate.

Fig. 2 is the structural representation that the utility model utilizes the high-power LED light source module of semiconductor refrigerating.

Fig. 3 is a specific embodiment of the utility model high-power LED light source module of utilizing semiconductor refrigerating.

Fig. 4 is another specific embodiment figure of the utility model high-power LED light source module of utilizing semiconductor refrigerating.

The specific embodiment

Utilize the high-power LED light source module of semiconductor refrigerating to be described further below in conjunction with the drawings and specific embodiments to the utility model.

Make the large power white light LED light source module that a 50W utilizes semiconductor refrigerating, adopt the XLamp series white light of Cree company.20 such great power LEDs are installed on the special MCPCB plate, and its mounting structure illustrates that as shown in Figure 11 is the metal level of MCPCB plate, and 2 is insulating barrier, and 3 is copper foil layer, and 4 is scolder, and 5 is the great power LED electrode, and 6 is that great power LED is heat sink.Promptly remove on the MCPCB substrate insulating barrier with the heat sink opposite position of its great power LED of installing, the heat sink of great power LED directly is connected with the metal base of PCB by scolder, like this in passage of heat owing to lacked the obstruction of insulating barrier, make that the thermal resistance on the pcb board significantly reduces.

As shown in Figure 2, the MCPCB plate 8 that high-power LED array 7 has been installed is placed in the modular substrate 10, at MCPCB plate 8 and modular substrate 10 sandwich layer of semiconductor refrigerators 9, its refrigeration end is connected with MCPCB plate 8, and its heating end is connected with modular substrate 10.After having added semiconductor cooler, the main heat dissipation channel of this module be led chip-LED heat sink-MCPCB-semiconductor cooler-modular substrate-secondary heat abstractor.The conductor refrigeration cooling velocity is fast, can make the heat on the MCPCB lead modular substrate rapidly by refrigerator, guarantees that MCPCB maintains lower temperature all the time, thereby has guaranteed that led array work is good.Can control its cooling velocity and cooling power by the operating current of regulating semiconductor cooler in addition, the heating power of itself and led array is complementary.The heat that stores on the modular substrate finally is dispersed in the environment by secondary heat abstractors such as shells.

As shown in Figure 2, modular substrate 10, the two has all done a tooth reflector 11; The bottom opening diameter of reflector 11 is littler than pcb board diameter, like this by screwing reflector, makes MCPCB plate 8, semiconductor cooler 9, modular substrate 10 threes closely fixing, fills heat-conducting silicone grease at three's contact-making surface; Reflector 11 is a heat-insulating material, prevents that heat from conducting on reflector, conducts to the external world fast and make it pass through modular substrate.

Fig. 3 is a specific embodiment of the utility model high-power LED light source module of utilizing semiconductor refrigerating.It comprises modular substrate 10, semiconductor cooler 9, Metal Substrate pcb board 8, high-power LED array 7, fills glue 12, metal reflective cup 11, heat insulation loop 13.Adopt the metal reflective cup as improving, and increase the adiabatic ring of one deck between metal reflective cup and modular substrate, modular substrate, heat insulation loop, reflector three fix by the silk tooth.

Fig. 4 is another specific embodiment of the utility model high-power LED light source module of utilizing semiconductor refrigerating.It comprises that modular substrate 10, semiconductor cooler 9, MCPCB plate 8, led chip array 7, filling glue 12, reflector 11, chip array packaging plastic 15, high printing opacity go out photosphere 16, phosphor layer 17.Adopt COB (chip on board) technology to encapsulate blue light or purple LED chip array on the described wiring board, in the surface coverage of led chip array one deck packaging plastic is arranged, the array interconnection mode is adopted in being electrically connected of its chip array; The lower surface that described high printing opacity goes out photosphere scribbles the layer of even fluorescent material; Its refrigeration end of described semiconductor cooler is connected with the MCPCB plate, and its heating end is connected with modular substrate.Present embodiment mainly is at the large power white light LED light source module, adopt conductor refrigeration to guarantee that the high power module heat radiation is reliable, adopt fluorescent powder coated technology in addition, can carry out the fluorescence conversion to blue light or the purple light that a plurality of led chips send, avoided that single led chip is carried out fluorescence and be converted to the photochromic non-uniform phenomenon that white light brings, simplified manufacture craft simultaneously; Adopt the COB technology, the volume of single luminescent device can be concentrated a large amount of luminescent devices in range of small much smaller than volume after being encapsulated, has the characteristics of brightness height, compact conformation, has also reduced packaging thermal resistance simultaneously; Adopt array chip syndeton, each led chip or packaged LED device all are that circuit connects a node in the array, wherein any LED breaks down, can not causing on every side, LED does not work, reduce traditional series connection and the chip of method that is connected in parallel damages influence to other chip operation states, improved the reliability of white light LEDs module.

Being the utility model preferred embodiment only in sum, is not to be used for limiting practical range of the present utility model.Be that all equivalences of doing according to the content of the utility model claim change and modification, all should belong to technology category of the present utility model.

Claims

1, a kind of high-power LED light source module that utilizes semiconductor refrigerating, comprise pedestal, MCPCB, led array, reflector, it is characterized in that: also comprise the semiconductor refrigerator, semiconductor cooler comprises refrigeration end and heating end, the refrigeration end is connected with the metal level of MCPCB, and the heating end is connected with pedestal, and led array is installed on the MCPCB, the reflector bottom is fixed on the pedestal, and MCPCB, semiconductor cooler, pedestal three are compressed.

2, the high-power LED light source module that utilizes semiconductor refrigerating as claimed in claim 1, it is characterized in that: the insulating barrier with the heat sink correspondence position of each LED on the MCPCB plate is removed, and the brazing metal of LED is heat sink employing high thermal conductivity directly is welded on the metal level of MCPCB.

3, the high-power LED light source module that utilizes semiconductor refrigerating as claimed in claim 1 or 2 is characterized in that: described MCPCB plate can replace with common line plate and sheet metal combination.

4, the high-power LED light source module that utilizes semiconductor refrigerating as claimed in claim 1 or 2, it is characterized in that: described reflector is made by heat-insulating material.

5, the high-power LED light source module that utilizes semiconductor refrigerating as claimed in claim 1 or 2, it is characterized in that: described reflector is made by metal material, is provided with heat insulation loop between metal reflective cup and pedestal.

6, the high-power LED light source module that utilizes semiconductor refrigerating as claimed in claim 1 or 2 is characterized in that: led array and semiconductor cooler are when operating current mates, and can connect constitutes a loop.

7, the high-power LED light source module that utilizes semiconductor refrigerating as claimed in claim 1 or 2 is characterized in that: described led array can replace with and adopt COB technology packaging LED chips array on the MCPCB plate.