CN201935013U - A kind of LED light bulb - Google Patents
A kind of LED light bulb Download PDFInfo
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- CN201935013U CN201935013U CN2011200305904U CN201120030590U CN201935013U CN 201935013 U CN201935013 U CN 201935013U CN 2011200305904 U CN2011200305904 U CN 2011200305904U CN 201120030590 U CN201120030590 U CN 201120030590U CN 201935013 U CN201935013 U CN 201935013U
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- 239000000758 substrate Substances 0.000 claims abstract description 87
- 230000017525 heat dissipation Effects 0.000 claims abstract description 61
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 239000002184 metal Substances 0.000 claims abstract description 41
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- 238000005034 decoration Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
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Abstract
本实用新型涉及LED灯具技术,尤其涉及一种LED灯泡,其包括有灯头、灯罩、位于灯头内的电源,灯头与灯罩之间卡接有散热金属外壳,散热金属外壳的顶部位于灯罩内,且散热金属外壳的顶部卡接固定有散热基板,散热基板插接固定有LED发光柱,LED发光柱包括两块PCB基板,两块PCB基板的正面均封装有LED芯片,LED芯片与PCB基板电连接,PCB基板与电源电连接,两块PCB基板的背面互相紧贴固定,且两块PCB基板的背面之间夹置有散热金属片。本实用新型可实现径向发光,且光线覆盖范围大、散热速度快。
The utility model relates to LED lamp technology, and in particular to an LED bulb, which includes a lamp holder, a lampshade, and a power source located in the lamp holder, a heat dissipation metal shell is clamped between the lamp holder and the lampshade, the top of the heat dissipation metal shell is located in the lampshade, and a heat dissipation substrate is clamped and fixed to the top of the heat dissipation metal shell, and an LED light-emitting column is plugged and fixed to the heat dissipation substrate, and the LED light-emitting column includes two PCB substrates, the fronts of the two PCB substrates are both packaged with LED chips, the LED chip is electrically connected to the PCB substrate, the PCB substrate is electrically connected to the power source, the backs of the two PCB substrates are closely fixed to each other, and a heat dissipation metal sheet is sandwiched between the backs of the two PCB substrates. The utility model can realize radial light emission, and has a large light coverage range and fast heat dissipation speed.
Description
技术领域technical field
本实用新型涉及LED灯具技术,尤其涉及一种LED灯泡。The utility model relates to the technology of LED lamps, in particular to an LED light bulb.
背景技术Background technique
由于LED (Light Emitting Diode,发光二极管)具有使用寿命长、能耗低、节约能源显著等特点,因此,LED作为光源已广泛地应用于日常生活中,如杯灯、射灯、汽车灯、LED灯泡等LED照明灯具。Because LED (Light Emitting Diode, light-emitting diode) has the characteristics of long service life, low energy consumption, and remarkable energy saving, LED has been widely used as a light source in daily life, such as cup lights, spotlights, car lights, LED Light bulbs and other LED lighting fixtures.
目前,LED灯泡一般包括灯头、安装在灯头顶部的灯罩、位于灯头内的电源,灯罩内设置有LED发光柱,LED发光柱与灯头内的电源电连接,当LED发光柱通电发光时,其发出的光线可透过灯罩照射出去,达到照明或装饰的目的。但是,现有技术中LED灯泡的LED发光柱大多是在PCB(印刷电路板)基板上直接焊接封装好的LED,且LED均位于PCB基板的一侧,导致LED发光柱只能单方向发光,光线覆盖范围较小(最大180度),而且,LED工作时产生的热量只是通过PCB基板导走及散发,散热速度较慢,散热效果不好。At present, LED light bulbs generally include a lamp cap, a lampshade installed on the top of the lamp cap, and a power supply located in the lamp cap. An LED light-emitting column is arranged in the lampshade, and the LED light-emitting column is electrically connected to the power supply in the lamp cap. The light can be irradiated through the lampshade to achieve the purpose of lighting or decoration. However, most of the LED light-emitting columns of LED bulbs in the prior art are directly welded and packaged LEDs on the PCB (printed circuit board) substrate, and the LEDs are all located on one side of the PCB substrate, resulting in the LED light-emitting columns only emitting light in one direction. The light coverage is small (maximum 180 degrees), and the heat generated by the LED is only guided and dissipated through the PCB substrate, the heat dissipation speed is slow, and the heat dissipation effect is not good.
发明内容Contents of the invention
本实用新型的目的在于针对现有技术的不足而提供一种可径向发光、散热速度快的LED灯泡。The purpose of the utility model is to provide an LED light bulb capable of emitting light in a radial direction and having a fast heat dissipation speed in view of the deficiencies of the prior art.
本实用新型的目的通过以下技术措施实现:一种LED灯泡,它包括有灯头、灯罩、位于灯头内的电源,灯头与灯罩之间卡接有散热金属外壳,散热金属外壳的顶部位于灯罩内,且散热金属外壳的顶部卡接固定有散热基板,散热基板插接固定有LED发光柱,所述LED发光柱包括两块PCB基板,两块PCB基板的正面均封装有LED芯片,LED芯片与PCB基板电连接,PCB基板与电源电连接,两块PCB基板的背面互相紧贴固定,且两块PCB基板的背面之间夹置有散热金属片。The purpose of this utility model is achieved through the following technical measures: an LED light bulb, which includes a lamp cap, a lampshade, and a power supply located in the lamp cap. And the top of the heat-dissipating metal shell is clamped and fixed with a heat-dissipating substrate, and the heat-dissipating substrate is plugged and fixed with an LED light-emitting column. The LED light-emitting column includes two PCB substrates, and LED chips are packaged on the fronts of the two PCB substrates. The substrates are electrically connected, the PCB substrates are electrically connected to the power supply, the backs of the two PCB substrates are closely attached to each other and fixed, and a heat dissipation metal sheet is interposed between the backs of the two PCB substrates.
所述散热金属片为铜片。The heat dissipation metal sheet is copper sheet.
所述散热金属片侧面的面积大于PCB基板背面的面积。The area of the side of the heat dissipation metal sheet is larger than the area of the back of the PCB substrate.
所述两块PCB基板的LED芯片的高度相等。The heights of the LED chips on the two PCB substrates are equal.
所述LED发光柱为两支或两支以上。There are two or more LED light columns.
所述散热金属外壳的底部内卡接固定有绝缘套。The bottom of the heat-dissipating metal shell is clamped and fixed with an insulating sleeve.
所述散热基板、PCB基板均为散热铝基板,PCB基板的底部设置有插接部,其中,LED发光柱的两块PCB基板与散热金属片是通过铆钉固定。Both the heat dissipation substrate and the PCB substrate are heat dissipation aluminum substrates, and the bottom of the PCB substrate is provided with a socket, wherein the two PCB substrates and the heat dissipation metal sheet of the LED luminous column are fixed by rivets.
所述PCB基板开设有用于封装LED芯片的盲孔,LED芯片通过树脂封装固定在盲孔内,且盲孔的内侧边缘为向外倾斜的斜坡。The PCB substrate is provided with a blind hole for packaging the LED chip, and the LED chip is fixed in the blind hole through resin encapsulation, and the inner edge of the blind hole is a slope inclined outward.
所述灯头为螺旋灯头。The lamp cap is a spiral lamp cap.
所述灯罩为烛形灯罩或球形灯罩。The lampshade is a candle-shaped lampshade or a spherical lampshade.
本实用新型有益效果在于:本实用新型包括有灯头、灯罩、位于灯头内的电源,灯头与灯罩之间卡接有散热金属外壳,散热金属外壳的顶部位于灯罩内,且散热金属外壳的顶部卡接固定有散热基板,散热基板插接固定有LED发光柱,LED发光柱包括两块PCB基板,两块PCB基板的正面均封装有LED芯片,LED芯片与PCB基板电连接,PCB基板与电源电连接,两块PCB基板的背面互相紧贴固定,且两块PCB基板的背面之间夹置有散热金属片。由于本实用新型的LED发光柱的两侧均具有LED芯片,当LED芯片发光时,可实现径向发光,且光线覆盖范围大(可达360度);而且,LED发光柱的散热金属片可以将PCB基板上聚集的热量快速地传递给散热基板,再由散热基板通过散热金属外壳快速地散发出去。因此,本实用新型具有光线覆盖范围大、散热速度快的特点。The beneficial effect of the utility model lies in that the utility model includes a lamp cap, a lampshade, and a power supply located in the lamp cap. A heat dissipation metal shell is clamped between the lamp cap and the lampshade. The heat dissipation substrate is connected and fixed, and the heat dissipation substrate is plugged and fixed with an LED light-emitting column. The LED light-emitting column includes two PCB substrates. The fronts of the two PCB substrates are packaged with LED chips. The LED chip is electrically connected to the PCB substrate. Connection, the backs of the two PCB substrates are closely attached to each other and fixed, and a heat dissipation metal sheet is sandwiched between the backs of the two PCB substrates. Since both sides of the LED light-emitting column of the utility model have LED chips, when the LED chip emits light, it can realize radial light emission, and the light coverage is large (up to 360 degrees); moreover, the heat-dissipating metal sheet of the LED light-emitting column can The heat accumulated on the PCB substrate is quickly transferred to the heat dissipation substrate, and then quickly dissipated by the heat dissipation substrate through the heat dissipation metal shell. Therefore, the utility model has the characteristics of large light coverage and fast heat dissipation.
附图说明Description of drawings
图1是本实用新型一种LED灯泡实施例1的结构示意图。Fig. 1 is a schematic structural view of Embodiment 1 of an LED light bulb of the present invention.
图2是本实用新型一种LED灯泡实施例1的分解示意图。Fig. 2 is an exploded schematic diagram of Embodiment 1 of an LED light bulb of the present invention.
图3是本实用新型一种LED灯泡实施例1的隐去灯罩的结构示意图。Fig. 3 is a schematic structural view of an LED bulb embodiment 1 of the present invention with the lampshade hidden.
图4是本实用新型一种LED灯泡实施例1的LED发光柱的结构示意图。Fig. 4 is a schematic structural view of an LED light-emitting column in Embodiment 1 of an LED light bulb of the present invention.
图5是本实用新型一种LED灯泡实施例1的LED发光柱的侧视图。Fig. 5 is a side view of the LED luminous column of Embodiment 1 of an LED light bulb of the present invention.
图6是本实用新型一种LED灯泡实施例1的LED发光柱的分解示意图。Fig. 6 is an exploded schematic view of the LED luminous column of Embodiment 1 of an LED light bulb of the present invention.
图7是本实用新型一种LED灯泡实施例1的封装的LED芯片的光线走向示意图。Fig. 7 is a schematic diagram of the light direction of the packaged LED chip of the LED bulb embodiment 1 of the present invention.
图8是传统封装的LED芯片的光线走向示意图。FIG. 8 is a schematic diagram of the light direction of a traditionally packaged LED chip.
在图1、图2、图3、图4、图5、图6和图7中包括有:In Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6 and Fig. 7 include:
1——灯头 2——灯罩1——
3——电源 4——散热金属外壳3——
5——散热基板 6——LED发光柱5——
61——PCB基板 611——插接部61——
612——铆钉 613——盲孔612——Rivet 613——Blind hole
614——内侧边缘 62——LED芯片614——inside
63——散热金属片 7——绝缘套。63——radiating
具体实施方式Detailed ways
下面结合附图对本实用新型作进一步的说明。Below in conjunction with accompanying drawing, the utility model is further described.
实施例1Example 1
本实用新型的一种LED灯泡,如图1~6所示,其包括有灯头1、灯罩2、位于灯头1内的电源3,电源3与灯头1电连接,使电源3可以通过灯头1外接交流电,灯头1与灯罩2之间卡接有散热金属外壳4,散热金属外壳4的顶部位于灯罩2内,且散热金属外壳4的顶部卡接固定有散热基板5,使散热基板5可以将热量传递给散热金属外壳4,散热基板5插接固定有LED发光柱6,LED发光柱6包括两块PCB基板61,两块PCB基板61的正面均封装有LED芯片62,即LED芯片62直接封装在PCB基板61上,以减小LED发光柱6的体积及重量,LED芯片62与PCB基板61电连接,PCB基板61与电源3电连接,使电源3可以将交流电转换为直流电,并通过PCB基板61为LED芯片62供电,两块PCB基板61的背面互相紧贴固定,使LED发光柱6的两侧均具有LED芯片62,当LED芯片62发光时,可实现径向发光,且光线覆盖范围大(可达360度)。A LED light bulb of the present utility model, as shown in Figures 1 to 6, includes a lamp base 1, a
LED发光柱6的两块PCB基板61的背面之间夹置有散热金属片63,由于LED芯片62工作发光时,会产生大量的热量并聚集在PCB基板61上,所以,散热金属片63可以将PCB基板61上聚集的热量传递给散热基板5,再由散热基板5通过散热金属外壳4快速地散发出去。在本实施例中,优选散热金属片63为铜片,因为铜片具有导热率高等优点,可以将PCB基板61上聚集的热量快速地导走,即散热速度较快。当然,所述散热金属片63也可以为其它散热材料制成,只要其具有导热率高等优点即可。A heat
散热金属片63侧面的面积大于PCB基板61背面的面积,即散热金属片63的四周稍凸出于PCB基板61,以增加散热及导热面积。The area of the side of the heat
LED发光柱6的两块PCB基板61的LED芯片62的高度相等,使LED发光柱6两侧的LED芯片62可以保持同一高度发光,形成点光源;其中,LED发光柱6为两支或两支以上,例如本实施例选用的3支,而且LED芯片62为1~10W的大功率LED芯片62,使LED发光柱6发光时具有足够的亮度,从而使LED发光柱6可以形成类似于传统的钨丝灯的“焰火”效果,即形成钨丝灯的发光效果从而使本实用新型可以替代传统的钨丝灯,达到照明或装饰的目的。当然,由于本实用新型采用了省电、使用寿命长的LED芯片62作为光源,相比于传统的钨丝灯,本实用新型具有省电、使用寿命长等优点。The heights of the
散热金属外壳4的底部内卡接固定有绝缘套7,使散热金属外壳4与电源3之间绝缘。The bottom of the heat
散热基板5、PCB基板61均为散热铝基板,散热铝基板具有良好的散热效果;LED发光柱6的PCB基板61的底部设置有插接部611,使LED发光柱6可以插接固定在散热基板5上。The
LED发光柱6的两块PCB基板61与散热金属片63是通过铆钉612固定,更具体地说,铆钉612穿过两块PCB基板61和散热金属片63,从而将两块PCB基板61和散热金属片63锁紧固定,使散热金属片63与两块PCB基板61的背面紧密地贴在一起,从而增加散热面积,使本实用新型可以增加8~10%的散热速度。当然,所述LED发光柱6的两块PCB基板61也可以采用其它的固定方式,如扣接固定、粘贴固定等,只要其固定效果较好即可。The two
如图7所示,将PCB基板61横向切开,其中,本实用新型LED发光柱6的PCB基板61开设有用于封装LED芯片62的盲孔613,LED芯片62通过树脂封装固定在盲孔613内,且盲孔613的内侧边缘614为向外倾斜的斜坡,而内侧边缘614可以将LED芯片62侧边发出的光线反射出去,从而提高了LED芯片62的亮度;但是,如图8所示,传统的PCB基板用于封装LED芯片的盲孔的内侧边缘为垂直设置,所以,导致LED芯片侧边发出的光线不能反射出去;因此,本实用新型上述的LED芯片62的封装结构可以将LED芯片62侧边发出的光线反射出去,据测试,可以将LED芯片62的亮度提高2~5%。As shown in Figure 7, the
灯头1为螺旋灯头1,使本实用新型可以与传统的灯具插座固定连接,当然,本实用新型灯头1可以为E12、E14、E17、E26、E27、B22等型号的灯头。The lamp holder 1 is a spiral lamp holder 1, so that the utility model can be fixedly connected with the traditional lamp socket. Certainly, the lamp holder 1 of the utility model can be lamp holders of models such as E12, E14, E17, E26, E27, B22.
灯罩2为烛形灯罩,使LED芯片62发出的光线可以透过灯罩2照射出去,达到照明或装饰的目的。当然,所述烛形灯罩可以根据实际应用环境而选用为玻璃烛形灯罩或塑料烛形灯罩,也可以为透明烛形灯罩或半透明烛形灯罩。The
实施例2Example 2
本实用新型的一种LED灯泡的实施例2,本实施例与实施例1的不同之处在于,灯罩2为球形灯罩,且球形灯罩可以根据实际应用环境而选用为玻璃球形灯罩或塑料球形灯罩,也可以为透明球形灯罩或半透明球形灯罩。当然,本实用新型的灯罩也可以为其它形状,不仅限于烛形或球形。本实施例的其它结构及工作原理与实施例1相同,在此不再赘述。
最后应当说明的是,以上实施例仅用以说明本实用新型的技术方案,而非对本实用新型保护范围的限制,尽管参照较佳实施例对本实用新型作了详细地说明,本领域的普通技术人员应当理解,可以对本实用新型的技术方案进行修改或者等同替换,而不脱离本实用新型技术方案的实质和范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model, rather than limiting the protection scope of the present utility model. Although the utility model has been described in detail with reference to the preferred embodiments, those skilled in the art Personnel should understand that the technical solution of the utility model can be modified or equivalently replaced without departing from the essence and scope of the technical solution of the utility model.
Claims (10)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200305904U CN201935013U (en) | 2011-01-28 | 2011-01-28 | A kind of LED light bulb |
| PCT/CN2011/072520 WO2012100460A1 (en) | 2011-01-28 | 2011-04-08 | Led lamp |
| HK11113713.6A HK1160581A2 (en) | 2011-01-28 | 2011-12-20 | Led bulb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200305904U CN201935013U (en) | 2011-01-28 | 2011-01-28 | A kind of LED light bulb |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201935013U true CN201935013U (en) | 2011-08-17 |
Family
ID=44446532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200305904U Ceased CN201935013U (en) | 2011-01-28 | 2011-01-28 | A kind of LED light bulb |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN201935013U (en) |
| HK (1) | HK1160581A2 (en) |
| WO (1) | WO2012100460A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102032493A (en) * | 2011-01-28 | 2011-04-27 | 东莞市美能电子有限公司 | LED bulb |
| CN102748611A (en) * | 2012-06-11 | 2012-10-24 | 蔡干强 | Light-emitting diode (LED) lamp |
| CN103016986A (en) * | 2012-12-17 | 2013-04-03 | 厦门立明光电有限公司 | LED (light-emitting diode) bulb |
| CN103672504A (en) * | 2013-11-09 | 2014-03-26 | 湖州巨群光电科技有限公司 | LED lamp with wide light emission range |
| WO2014101249A1 (en) * | 2012-12-24 | 2014-07-03 | 上海顿格电子贸易有限公司 | Bulb of inclined and rotary combined led lamp filament structure |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070119043A (en) * | 2005-04-14 | 2007-12-18 | 아로 덴시 고교 가부시키가이샤 | Turn lights |
| US20090122552A1 (en) * | 2007-11-09 | 2009-05-14 | Chuntlon Enterprise Co., Ltd. | Low power consumption high illumination LED lamp |
| US7815333B2 (en) * | 2008-09-26 | 2010-10-19 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Solar LED lamp |
| JP2010157459A (en) * | 2008-12-31 | 2010-07-15 | Keiji Iimura | Led lamp, and bulb-type led lamp |
| CN201373347Y (en) * | 2009-02-18 | 2009-12-30 | 杨春建 | LED light |
| CN101825236B (en) * | 2009-03-07 | 2013-04-24 | 富准精密工业(深圳)有限公司 | Light-emitting diode lamp |
| CN101782190B (en) * | 2010-03-15 | 2012-06-27 | 厦门聚萤光电科技有限公司 | High-power LED (light emitting diode) lighting equipment |
-
2011
- 2011-01-28 CN CN2011200305904U patent/CN201935013U/en not_active Ceased
- 2011-04-08 WO PCT/CN2011/072520 patent/WO2012100460A1/en not_active Ceased
- 2011-12-20 HK HK11113713.6A patent/HK1160581A2/en not_active IP Right Cessation
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102032493A (en) * | 2011-01-28 | 2011-04-27 | 东莞市美能电子有限公司 | LED bulb |
| CN102748611A (en) * | 2012-06-11 | 2012-10-24 | 蔡干强 | Light-emitting diode (LED) lamp |
| CN102748611B (en) * | 2012-06-11 | 2014-10-01 | 蔡干强 | Light-emitting diode (LED) lamp |
| CN103016986A (en) * | 2012-12-17 | 2013-04-03 | 厦门立明光电有限公司 | LED (light-emitting diode) bulb |
| CN103016986B (en) * | 2012-12-17 | 2016-03-23 | 厦门立达信照明有限公司 | LED bulb |
| WO2014101249A1 (en) * | 2012-12-24 | 2014-07-03 | 上海顿格电子贸易有限公司 | Bulb of inclined and rotary combined led lamp filament structure |
| CN103672504A (en) * | 2013-11-09 | 2014-03-26 | 湖州巨群光电科技有限公司 | LED lamp with wide light emission range |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1160581A2 (en) | 2012-07-20 |
| WO2012100460A1 (en) | 2012-08-02 |
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Decision date of declaring invalidation: 20121018 Decision number of declaring invalidation: 19402 Granted publication date: 20110817 |
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