CN201281306Y - Packaging structure for high power light-emitting diode chip - Google Patents
Packaging structure for high power light-emitting diode chip Download PDFInfo
- Publication number
- CN201281306Y CN201281306Y CNU2008203022341U CN200820302234U CN201281306Y CN 201281306 Y CN201281306 Y CN 201281306Y CN U2008203022341 U CNU2008203022341 U CN U2008203022341U CN 200820302234 U CN200820302234 U CN 200820302234U CN 201281306 Y CN201281306 Y CN 201281306Y
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Abstract
The utility model relates to the semiconductor lighting technology, in particular to a high-power light-emitting diode (LED) encapsulating structure. The utility model aims at the defect that the LED encapsulating structure of the prior art is not smooth in heat transportation and heat radiation, and discloses the light-emitting diode encapsulating structure which can enhance heat transportation efficiency and heat radiation efficiency. The utility model adopts the technical scheme that: the light-emitting diode encapsulating structure comprises a chip and a base plate and is characterized in that the chip is pasted and fixed on the base plate. The utility model is used for encapsulation of light-emitting diodes, eliminates a bracket and a heat sink, and enhances heat transportation efficiency and heat radiation efficiency in structure. Because the base plate adopts a metal plate having an overall structure, the structure has larger volume and heat capacity, is propitious to radiation of the chip, and is particularly suitable for an LED lighting device.
Description
Technical field
The utility model relates to the semiconductor lighting technology, particularly large-power light-emitting diodes (LED) encapsulating structure.
Background technology
LED is a kind of electroluminescent device.The basic structure of the LED of prior art encapsulation as shown in Figure 1, mainly comprises chip 1, substrate 2, heat sink 3, support 4 and pin 5 (other also have lens, fluorescent material etc., and are not shown).Heat sink 3 and substrate 2 be generally metal material, substrate 2 is provided with the conducting wire, the conducting wire is connected with pin 5, pin 5 passes support 4 and is connected with the lead-in wire 10 of chip 1.Chip 1 is as illuminator, pastes usually to be fixed on heat sink 3, and heat sink 3 paste by materials such as heat-conducting silicone grease and substrate 2 and to constitute a luminescence unit together.In the time of actual the use, can a plurality of luminescence units be together in series or parallel with lead, and substrate is installed on the radiator, form the lighting device of various power requirements.The LED of this encapsulating structure, heat sink 3 and substrate 2 between the thermal resistance that exists of contact-making surface, be influence the key factor that high-power LED chip dispels the heat.On the other hand, chip lead also has very important thermolysis, and its heat conduction also is not a factor that influences LED lighting device reliability freely.At present, the great power LED structure is varied, but in these areas some defectives is arranged all.Particularly in high-power LED street lamp and domestic light application, this encapsulating structure brings a lot of obstacles for fitting structure and manufacturing, particularly heat dissipation design.
The utility model content
Technical problem to be solved in the utility model is exactly the shortcoming that the LED encapsulating structure conducts heat, heat radiation is not smooth at prior art, provides a kind of package structure for LED, to improve its heat transfer, radiating efficiency.
The technical solution of the utility model is, package structure for LED comprises chip and substrate, it is characterized in that, described chip is pasted and is fixed on the described substrate.
The beneficial effects of the utility model are, have saved support, heat sink, have improved heat transfer, radiating efficiency from structure.Because substrate adopts an integrally-built metallic plate, has bigger volume and thermal capacity, helps chip cooling.
Description of drawings
Fig. 1 is a prior art chip-packaging structure schematic diagram;
Fig. 2 is embodiment 1 a chip-packaging structure schematic diagram;
Fig. 3 is the vertical view of Fig. 2;
Fig. 4 is embodiment 2 chip-packaging structure schematic diagrames.
The specific embodiment
Below in conjunction with drawings and Examples, describe technical scheme of the present invention in detail.
Package structure for LED of the present utility model has saved heat sink and support, directly chip encapsulation is fixed on the substrate, do not exist substrate and heat sink between thermal resistance.This structure also can be regarded as to be integrated with substrate heat sink, replaces original heat sink and substrate with a bulk metal plate.
The technical solution of the utility model is, package structure for LED comprises chip and substrate, it is characterized in that, described chip is pasted and is fixed on the described substrate.
Further, for the secure fixation chip, described substrate is provided with pit or the boss with described die size coupling.
Further, described substrate can be selected geometries such as polygon metallic plate, circular metal plate, oval metallic plate for use.
Especially, can also adopt the substrate of upper and lower surface angle ≠ 0, promptly the upper and lower surface of substrate is not parallel, and an angle is arranged.When this substrate is installed, can adjust the emission optic angle degree of chip on radiator, adapt to various lighting requirements.
Further, described substrate is aluminium sheet, aluminium alloy plate or copper coin.Adopting aluminium sheet or aluminium alloy plate is a kind of both economical selection as substrate.
Concrete, being coated with the conducting wire that one deck and described substrate insulate on the described substrate, described conducting wire is connected with chip lead.
More specifically, described conducting wire is made of Copper Foil, both can carry big electric current, chip can also be delivered to substrate sooner by the heat that lead-in wire conducts.
As Fig. 2, shown in Figure 3, this routine package structure for LED is made of chip 1 and substrate 2.The center of substrate 2 is provided with boss 22, and boss 22 and substrate 2 are made of a monoblock aluminium sheet.Chip 1 is pasted and is fixed on boss 22 central authorities, and 10 is welded on the solder joint 20 and is communicated with conducting wire 21 by going between.Conducting wire 21 adopts the Copper Foil that certain width is arranged to constitute, and both can carry bigger electric current, also has certain heat transfer, thermolysis.
This routine light emitting diode assembling structure has been processed a pit 23 in substrate 2 centers, is used to paste fixed chip 1.This spr substrate 2 upper and lower surfaces have an angle α, as shown in Figure 4.This substrate is installed on the radiator, and it is the angle of α that the emission light of chip 1 and vertical direction also have a size, changes the installation direction of this angle or substrate and radiator, can adjust the angle of chip 1 emission light.Other structures of this example see also embodiment 1.
The utility model the foregoing description only is that example is described with the rectangular substrate.Those skilled in the art select the substrate of embodiment other shapes in addition for use as can be seen, can realize the technical solution of the utility model equally as circle, ellipse, polygon etc.The selection of substrate shape should be considered easy to process, also should and use the light distribution requirements of high-power LED illumination to be complementary with heat spreader structures.
Claims (10)
1. package structure for LED comprises chip and substrate, it is characterized in that, described chip is pasted and is fixed on the described substrate.
2. package structure for LED according to claim 1 is characterized in that, described substrate is provided with the pit with described die size coupling.
3. package structure for LED according to claim 1 is characterized in that, described substrate is provided with the boss with described die size coupling.
4. package structure for LED according to claim 1 is characterized in that, described substrate is the polygon metallic plate.
5. package structure for LED according to claim 1 is characterized in that, described substrate is a circular metal plate.
6. package structure for LED according to claim 1 is characterized in that, described substrate is oval metallic plate
7. package structure for LED according to claim 1 is characterized in that, described substrate upper and lower surface angle ≠ 0.
8. according to above-mentioned any described package structure for LED of claim, it is characterized in that described substrate is aluminium sheet, aluminium alloy plate or copper coin.
9. package structure for LED according to claim 8 is characterized in that, is coated with the conducting wire of one deck and described substrate insulation on the described substrate, and described conducting wire is connected with chip lead.
10. package structure for LED according to claim 9 is characterized in that described conducting wire is made of Copper Foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008203022341U CN201281306Y (en) | 2008-09-25 | 2008-09-25 | Packaging structure for high power light-emitting diode chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008203022341U CN201281306Y (en) | 2008-09-25 | 2008-09-25 | Packaging structure for high power light-emitting diode chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201281306Y true CN201281306Y (en) | 2009-07-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008203022341U Expired - Fee Related CN201281306Y (en) | 2008-09-25 | 2008-09-25 | Packaging structure for high power light-emitting diode chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201281306Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894902A (en) * | 2010-06-24 | 2010-11-24 | 浙江华正电子集团有限公司 | LED substrate and manufacturing method thereof |
| CN102097573A (en) * | 2010-12-03 | 2011-06-15 | 东莞市胤腾光电科技有限公司 | High-power light emitting diode (LED) bracket and method for packaging LEDs by using same |
| CN102522399A (en) * | 2011-12-23 | 2012-06-27 | 彩虹集团公司 | LED encapsulation structure |
| CN102569627A (en) * | 2012-02-21 | 2012-07-11 | 东莞市万丰纳米材料有限公司 | Copper substrate used for LED light source, LED light source module and preparation method thereof, and LED street lamp |
-
2008
- 2008-09-25 CN CNU2008203022341U patent/CN201281306Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894902A (en) * | 2010-06-24 | 2010-11-24 | 浙江华正电子集团有限公司 | LED substrate and manufacturing method thereof |
| CN101894902B (en) * | 2010-06-24 | 2012-12-12 | 浙江华正新材料股份有限公司 | LED substrate and manufacturing method thereof |
| CN102097573A (en) * | 2010-12-03 | 2011-06-15 | 东莞市胤腾光电科技有限公司 | High-power light emitting diode (LED) bracket and method for packaging LEDs by using same |
| CN102522399A (en) * | 2011-12-23 | 2012-06-27 | 彩虹集团公司 | LED encapsulation structure |
| CN102569627A (en) * | 2012-02-21 | 2012-07-11 | 东莞市万丰纳米材料有限公司 | Copper substrate used for LED light source, LED light source module and preparation method thereof, and LED street lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090729 Termination date: 20140925 |
|
| EXPY | Termination of patent right or utility model |