CN201443693U - LED light source module - Google Patents
LED light source module Download PDFInfo
- Publication number
- CN201443693U CN201443693U CN2008200609378U CN200820060937U CN201443693U CN 201443693 U CN201443693 U CN 201443693U CN 2008200609378 U CN2008200609378 U CN 2008200609378U CN 200820060937 U CN200820060937 U CN 200820060937U CN 201443693 U CN201443693 U CN 201443693U
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- wire plate
- led
- light source
- bonding wire
- source module
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Abstract
The utility model relates to an LED light source module. High power LED chips are connected in series and in parallel through a conductor, and form an array row which is arranged in a module bracket and is encapsulated through insulation heat conducting silica gel, thereby forming a light emitting surface and a heat conducting surface. The module bracket comprises a metallic heat conducting base, an anode welding wire plate, a cathode welding wire plate and a periphery frame. The anode welding wire plate and the cathode welding wire plate are encapsulated in the periphery frame, and the anode and the cathode of a light source module and a connection terminal for connecting the LED chip are set aside. The periphery frame is fixed on the metallic heat conducting base through a screw or other methods. LED chip is fixed in the LED chip installation pit on the metallic heat conducting base. After the chips of each group are connected in series, the anode and the cathode are respectively welded with the connection terminals on the anode welding wire plate and the cathode welding wire plate. Chip array is encapsulated through the insulation heat conducting silica gel (wherein white light which is close to the natural light can be obtained by adding phosphor powder). The light emitting surface is a circular arc structure or comprises more than two planes which form a certain angle mutually. The light emitting effect can be improved by changing the radian or the angle of the light emitting surface; and the heat conduction can be improved by increasing the contact area between the heat conducting surface and a lamp radiator. The LED light source chip can be combined and regulated from 10 watt to 500 watt by changing the power and the number of the LED chips to realize the ideal lighting requirements of the user. The LED light source module can be widely used in lighting lamps, and has advantages of good heat radiation effect, simple light distribution and the like.
Description
Technical field
The utility model relates to a kind of light source that is used for road lighting, says it is a kind of LED street lamp high-power LED light source module definitely.
Background technology
Along with manifesting day by day of the energy and environmental problem, energy-conservation industry and products thereof more and more comes into one's own, and the energy-saving effect of semiconductor diode (LED) illumination is generally acknowledged.But at present the LED large-power lamp such as special street lamp that throws light on also exists some technical bottlenecks to be difficult to be accepted extensively by market, have on the market single LEDs wafer is directly used in lamp light source, such light fixture can reach good light distribution effect by the setting angle that changes the LED wafer, but it is quite complicated that its maximum shortcoming is a light fixture mechanism, manufacturing cost and maintenance cost height, and the light decay of led light source is fast, designed the LED wafer has been encapsulated in the very little volume by integrated encapsulation technology for addressing the above problem the relevant technologies personnel, so can simplify fitting structure greatly, reduce cost, but this structure has also been brought the problem that is unfavorable for dispelling the heat with luminous intensity distribution simultaneously.
Summary of the invention
In order to overcome above-mentioned defective, the utility model provides a kind of LED street lamp light source module, improves the bright dipping light distribution effect by the exiting surface radian that changes light source module, improves heat-transfer effect by the contact area that increases thermal conductive surface and lamp radiator.
The utility model for solve that its technical problem adopts technical scheme be:
A kind of led light source module, form by the lead connection in series-parallel that array arrangement places in the module carrier and by the encapsulation of insulating heat-conductive silica gel by the great power LED luminescent wafer, forms a circular arc type light-emitting area and boss type thermal conductive surface (help changing lighting angle forms good luminous intensity distribution and increase heat conduction contact-making surface reduces thermal resistance).Module carrier is by metal heat-conducting base (1), anodal bonding wire plate (2), negative pole bonding wire plate (3) and peripheral frame (4) are formed, both positive and negative polarity bonding wire plate is encapsulated in the peripheral frame, the terminals of reserving the light source module both positive and negative polarity and connecting LED wafer (5), peripheral frame is fixed in the metal heat-conducting base by screw or alternate manner, the LED wafer is fixed in metal heat-conducting base LED wafer to be installed in the pit, after every group of wafer tandem both positive and negative polarity respectively with both positive and negative polarity bonding wire plate on terminals welding, the wafer array is by heat conductive silica gel encapsulation (wherein add fluorescent material and can obtain white light near natural daylight).
Described metal heat-conducting base is made by the high metal material of thermal conductivities such as copper or aluminium, comprise the fixed installation of LED wafer face and the radiating surface that is connected with lamp radiator, installed surface can be arc structure or the plural plane composition that forms an angle mutually, establish the LED wafer of array format on it pit is installed, the pit quantity and spacing should be decided according to intending packaged LED wafer number, polishing is done on the radiating surface surface, be the contact area of increase with lamp radiator, a boss and the chimeric installation of lamp radiator can be established in the radiating surface centre.The metal heat-conducting base also should be established the installing hole that is connected usefulness with lamp radiator, the attaching parts that the position corresponding with the frame support has through wires hole and be connected the screw hole or the alternate manner of usefulness with peripheral frame.
Described peripheral frame (4) is a rectangular box formula structure, anti-agingly there is certain elastically-deformable insulating materials mold pressing to form by high temperature resistant, with the one side of metal heat-conducting base contact the imbedded and fastened attaching parts can be set or the screw hole screw is connected, so that correspondence is installed on the metal heat-conducting base.Peripheral frame (4) is embedded with anodal bonding wire plate (2) and negative pole bonding wire plate (3), and corresponding both positive and negative polarity bonding wire plate (2,3) is having the both positive and negative polarity through wires hole and keeping corresponding relation with positive and negative through wires hole on the metal heat-conducting base on the support.
Described LED wafer 5 is a semiconductor light-emitting diode chip.
Described anodal bonding wire plate (2) and negative pole bonding wire plate (3) are generally made the silver-plated processing in rear surface by copper coin and are made, and are embedded in the inside of peripheral frame, and are connected respectively to the positive pole and the negative pole of LED wafer parallel connected array.
Described led light source module by adjusting single LED luminescent wafer power and increase or reduce LED luminescent wafer number and change its power and luminous flux.
The beneficial effects of the utility model are:
By integrated encapsulation technology with the plurality of LEDs wafer package in a fritter, can realize that more than single the hectowatt, it is simple in structure, packaging cost is low, reach the luminous flux and the power requirement of lighting source.The design of its unique exiting surface can improve and light effect by changing light-emitting area radian or angle, makes light-illuminating arrive in the effective range, increases effective intensity of illumination; The contact area of the design can increasing of thermal conductive surface boss thermal conductive surface and lamp radiator is improved heat transfer, makes the led light source chip operation in the rational temperature scope.By changing LED wafer power and quantity, can make the led light source chip make up adjustment simultaneously, reach the desirable lighting requirement of user from 10 watts to 500 watts.This led light source module can be widely applied in the lighting, has good heat dissipation effect, is easy to advantages such as luminous intensity distribution.
Description of drawings:
Fig. 1 is the utility model structural representation;
Fig. 2 is the utility model schematic diagram;
Fig. 3 is the utility model vertical view;
Fig. 4 is the A-A profile of Fig. 3;
Fig. 5 is the B-B profile of Fig. 3;
Fig. 6 is LED wafer catenation principle figure;
Fig. 7 is a LED wafer connection diagram;
Fig. 8 is a both positive and negative polarity bonding wire plate schematic diagram;
Fig. 9 is that the C of Fig. 8 is to schematic diagram;
Figure 10 is a metal heat-conducting based structures schematic diagram;
Figure 11 is the peripheral frame structural representation;
Figure 12 is the peripheral frame vertical view;
The specific embodiment
Embodiment: a kind of led light source module, form by the lead connection in series-parallel that array arrangement places in the module carrier and by the encapsulation of insulating heat-conductive silica gel by the great power LED luminescent wafer, forms a circular arc type light-emitting area and boss type thermal conductive surface (help changing lighting angle forms good luminous intensity distribution and increase heat conduction contact-making surface reduces thermal resistance).Module carrier is by metal heat-conducting base (1), anodal bonding wire plate (2), negative pole bonding wire plate (3) and peripheral frame (4) are formed, both positive and negative polarity bonding wire plate is encapsulated in the peripheral frame, the terminals of reserving the light source module both positive and negative polarity and connecting LED wafer (5), peripheral frame is fixed in the metal heat-conducting base by screw or alternate manner, the LED wafer is fixed in metal heat-conducting base LED wafer to be installed in the pit, every group of wafer by lead (6) series connection back both positive and negative polarity respectively with both positive and negative polarity bonding wire plate on the terminals welding, the wafer array is by heat conductive silica gel (7) encapsulation (wherein add fluorescent material (8) and can obtain white light near natural daylight).
As Figure 10: the metal heat-conducting base is made by the high metal material of thermal conductivities such as copper or aluminium, comprise the fixed installation of LED wafer face and the radiating surface that is connected with lamp radiator, installed surface can be arc structure or the plural plane composition that forms an angle mutually, establish the LED wafer of array format on it pit (11) is installed, the pit quantity and spacing should be decided according to intending packaged LED wafer number, polishing is done on the radiating surface surface, can establish a boss (12) and the chimeric installation of lamp radiator for increasing with the contact area radiating surface centre of lamp radiator.The metal heat-conducting base also should be established the installing hole (13) that is connected usefulness with lamp radiator, and the position corresponding with the frame support has through wires hole (14) and be connected the screw hole (15) of usefulness or the attaching parts of alternate manner with peripheral frame.
Peripheral frame (4) is a rectangular box formula structure, anti-agingly there is certain elastically-deformable insulating materials mold pressing to form by high temperature resistant, with the one side of metal heat-conducting base contact the imbedded and fastened attaching parts can be set or the screw hole screw is connected, so that correspondence is installed on the metal heat-conducting base.Peripheral frame is embedded with anodal bonding wire plate (2) and negative pole bonding wire plate (3), and corresponding both positive and negative polarity bonding wire plate is having the both positive and negative polarity through wires hole and keeping corresponding relation with positive and negative through wires hole on the metal heat-conducting base on the support.
Anodal bonding wire plate (2) and negative pole bonding wire plate (3) are generally made the silver-plated processing in rear surface by copper coin and are made, and are embedded in the inside of peripheral frame, and are connected respectively to the positive pole and the negative pole of LED wafer parallel connected array.
The led light source module by adjusting single LED luminescent wafer power and increase or reduce LED luminescent wafer number and change its power and luminous flux.
Claims (5)
1. led light source module, it is characterized in that: form array arrangement by the great power LED luminescent wafer by the lead connection in series-parallel and place in the module carrier and and encapsulate by insulating heat-conductive silica gel, form a circular arc type light-emitting area and a boss type thermal conductive surface, module carrier is by metal heat-conducting base (1), anodal bonding wire plate (2), negative pole bonding wire plate (3) and peripheral frame (4) are formed, both positive and negative polarity bonding wire plate is encapsulated in the peripheral frame, the terminals of reserving the light source module both positive and negative polarity and connecting LED wafer (5), peripheral frame is fixed in the metal heat-conducting base by screw or buckle mode, the LED wafer is fixed in metal heat-conducting base LED wafer to be installed in the pit, after every group of wafer tandem both positive and negative polarity respectively with both positive and negative polarity bonding wire plate on terminals welding, the wafer array is encapsulated by heat conductive silica gel, wherein adds fluorescent material.
2. a kind of led light source module according to claim 1, it is characterized in that: described metal heat-conducting base is made by the high metal material of thermal conductivities such as copper or aluminium, comprise the fixed installation of LED wafer face and the radiating surface that is connected with lamp radiator, the wafer installed surface is set to arc structure, establish the LED wafer of array format on it pit is installed, pit quantity and plan packaged LED wafer number coupling, polishing is done on the radiating surface surface, and a boss and the chimeric installation of lamp radiator can be established in the radiating surface centre; The metal heat-conducting base is provided with the installing hole that is connected usefulness with lamp radiator, the attaching parts that the position corresponding with the frame support is provided with through wires hole and is connected the screw hole or the imbedded and fastened of usefulness with peripheral frame.
3. a kind of led light source module according to claim 1, it is characterized in that: described peripheral frame (4) is a rectangular box formula structure, anti-agingly there is certain elastically-deformable insulating materials mold pressing to form by high temperature resistant, with the one side of metal heat-conducting base contact the imbedded and fastened attaching parts can be set or the screw hole screw is connected; Peripheral frame (4) is embedded with anodal bonding wire plate (2) and negative pole bonding wire plate (3), and corresponding both positive and negative polarity bonding wire plate (2,3) is having the both positive and negative polarity through wires hole and keeping corresponding relation with positive and negative through wires hole on the metal heat-conducting base on the support.
4. a kind of led light source module according to claim 1 is characterized in that: described LED wafer (5) is a semiconductor light-emitting diode chip.
5. a kind of led light source module according to claim 1, it is characterized in that: described anodal bonding wire plate (2) and negative pole bonding wire plate (3) are generally made the silver-plated processing in rear surface by copper coin and are made, be embedded in the inside of peripheral frame, and be connected respectively to the positive pole and the negative pole of LED wafer parallel connected array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008200609378U CN201443693U (en) | 2008-11-25 | 2008-11-25 | LED light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008200609378U CN201443693U (en) | 2008-11-25 | 2008-11-25 | LED light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201443693U true CN201443693U (en) | 2010-04-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008200609378U Expired - Fee Related CN201443693U (en) | 2008-11-25 | 2008-11-25 | LED light source module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201443693U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102313157A (en) * | 2010-06-30 | 2012-01-11 | 可成科技股份有限公司 | Light-emitting diode lamp module with high heat dissipation efficiency and manufacturing method thereof |
| CN102748634A (en) * | 2012-07-11 | 2012-10-24 | 河南鑫特光电科技有限公司 | LED (Light-Emitting Diode) light source based on special module |
| CN103363382A (en) * | 2012-03-29 | 2013-10-23 | 海洋王照明科技股份有限公司 | Tunnel lamp |
| CN108332109A (en) * | 2018-03-15 | 2018-07-27 | 江西申安亚明光电科技有限公司 | A kind of ultra-thin direct-injection type panel light |
-
2008
- 2008-11-25 CN CN2008200609378U patent/CN201443693U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102313157A (en) * | 2010-06-30 | 2012-01-11 | 可成科技股份有限公司 | Light-emitting diode lamp module with high heat dissipation efficiency and manufacturing method thereof |
| CN103363382A (en) * | 2012-03-29 | 2013-10-23 | 海洋王照明科技股份有限公司 | Tunnel lamp |
| CN103363382B (en) * | 2012-03-29 | 2016-09-07 | 海洋王照明科技股份有限公司 | Tunnel lamp |
| CN102748634A (en) * | 2012-07-11 | 2012-10-24 | 河南鑫特光电科技有限公司 | LED (Light-Emitting Diode) light source based on special module |
| CN108332109A (en) * | 2018-03-15 | 2018-07-27 | 江西申安亚明光电科技有限公司 | A kind of ultra-thin direct-injection type panel light |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Jiangsu Yangtze Electromechanical Science & Technology Co.,Ltd. Assignor: Dong Lixia Contract record no.: 2012320000310 Denomination of utility model: LED light source module and LED bulb lamp, spot lamp and down lamp therewith Granted publication date: 20100428 License type: Exclusive License Record date: 20120327 |
|
| ASS | Succession or assignment of patent right |
Owner name: ZHENJIANG YANGZI ELECTROMECHANICAL EQUIPMENT CO., Effective date: 20120815 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 236302 FUYANG, ANHUI PROVINCE TO: 212200 ZHENJIANG, JIANGSU PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20120815 Address after: 212200 No. 108 Yang Yang North Road, Yangzhong Development Zone, Jiangsu, China Patentee after: Zhenjiang Yangzi Electromechanical Equipment Co., Ltd. Address before: Zhao village 236302 Anhui County of Funan province Duan Ying Xiang Shuang Zhuang 74 Patentee before: Dong Lixia |
|
| ASS | Succession or assignment of patent right |
Owner name: JIANGSU YANGTZE ELECTROMECHANICAL SCIENCE + TECHNO Free format text: FORMER OWNER: ZHENJIANG YANGZI ELECTROMECHANICAL EQUIPMENT CO., LTD. Effective date: 20120927 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 212200 ZHENJIANG, JIANGSU PROVINCE TO: 212132 ZHENJIANG, JIANGSU PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20120927 Address after: 212132 No. 76, Yinhe Road, Dagang District, Zhenjiang, Jiangsu Patentee after: Jiangsu Yangtze Electromechanical Science & Technology Co.,Ltd. Address before: 212200 No. 108 Yang Yang North Road, Yangzhong Development Zone, Jiangsu, China Patentee before: Zhenjiang Yangzi Electromechanical Equipment Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100428 Termination date: 20151125 |