CN201910445U - Light-emitting diode (LED) packaging structure - Google Patents
Light-emitting diode (LED) packaging structure Download PDFInfo
- Publication number
- CN201910445U CN201910445U CN2010206561825U CN201020656182U CN201910445U CN 201910445 U CN201910445 U CN 201910445U CN 2010206561825 U CN2010206561825 U CN 2010206561825U CN 201020656182 U CN201020656182 U CN 201020656182U CN 201910445 U CN201910445 U CN 201910445U
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- CN
- China
- Prior art keywords
- led
- heat
- encapsulating structure
- metal
- silica gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title abstract 7
- 239000002184 metal Substances 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000000741 silica gel Substances 0.000 claims abstract description 13
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 13
- 239000012212 insulator Substances 0.000 claims abstract description 12
- 239000011889 copper foil Substances 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 238000004020 luminiscence type Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 230000005611 electricity Effects 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 239000002002 slurry Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract 2
- 238000009434 installation Methods 0.000 abstract 1
- 239000005022 packaging material Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model discloses a light-emitting diode (LED) packaging structure, which comprises a substrate, a reflective cup, an LED chip, a fluorescent thin layer, a positive electrode, a negative electrode, electric conduction copper foil, a heat conduction silica gel packaging shield, a plastic support, a metal connector, a metal heat conduction electrode, an insulator and a heat dissipation piece, wherein the positive electrode, the negative electrode, the electric conduction copper foil, the heat conduction silica gel packaging shield and the plastic support are connected with the LED chip. The LED packaging structure is characterized in that through the installation of the reflective cup, the fluorescent thin layer and the metal connector, the heat dissipation efficiency of the LED packaging structure is improved, and simultaneously, the problem that the light use ratio is not high because light excited out from a fluorescent powder in the traditional LED packaging structure is absorbed by a packaging material after being reflected by many times is effectively solved, so that the brightness of lamplight is higher.
Description
Technical field
The utility model belongs to lighting technical field, relates to a kind of LED encapsulating structure.
Background technology
The brightness of LED, power all got lifting in recent years, and increasing occasion is applied, but the problem of effectively utilizing of the package cooling of LED and light is also quietly appeared in one's mind.When traditional LED is fixed on the pcb board, be provided with insulating barrier between its base and the heat sink, the heat conductivility that is subject to insulating barrier is relatively poor, the heat of LED can't be conducted fast, causes the integral heat sink weak effect; And that fluorescent material inspires in a lot of traditional LED encapsulating structures is wide many through repeatedly reflecting packed absorbed, and the effective rate of utilization of light is low.
Summary of the invention
The purpose of this utility model provides a kind of LED encapsulating structure, solve the heat of LED can't being conducted apace of existing in the prior art, caused wide many low problems of effective rate of utilization that cause light through repeatedly reflecting packed absorbed that fluorescent material inspires in integral heat sink weak effect and the encapsulating structure.
The technical scheme that the utility model adopted is, a kind of LED encapsulating structure, comprise substrate, reflector, led chip, fluorescence thin layer, positive electrode, negative electrode, copper-foil conducting electricity, heat conductive silica gel package, plastic stent, metal connector, metal heat-conducting electrode, insulator, binding has the led chip that places in the reflector on the described substrate surface, and the surface of reflector and periphery scribble reflecting material;
Wherein the top of reflector is suspended with a fluorescence thin layer;
Further, positive electrode, negative electrode that the LED luminescence chip is connected with the LED luminescence chip, and the copper-foil conducting electricity that is arranged on positive pole, negative electrode below; Be covered with the heat conductive silica gel package on the described LED luminescence chip;
Wherein plastic stent is positioned at the below of substrate;
Wherein the plastic stent below is provided with LED metal heat-conducting electrode;
Wherein be positioned at the insulator of LED metallic conduction Copper Foil below;
Further the below of insulator is provided with metal connector;
Wherein the heat conductive silica gel package coats led chip and fluorescence thin layer, and the LED luminescence chip is fixed by silver slurry glue;
The material of wherein said metal connector is a copper;
Wherein said metal connector is connected by pin with the heat sink that is arranged on the below.
Wherein heat sink is a metal material.
The beneficial effects of the utility model are: replace the insulator or the insulating cement of original heat conductivility difference by using the better metal connector of heat conductivility, make the heat of LED can better conduct to heat sink, improved the radiating effect of LED system, simultaneously effectively alleviated the light that fluorescent material inspires in traditional LED encapsulating structure and caused the not high problem of light utilization efficiency through repeatedly reflecting packed absorbed, the lamplight brightness that makes is higher.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Among the figure, 1. substrate, 2. reflector, 3.LED chip, 4. fluorescence thin layer, 5. positive electrode, 6. negative electrode, 7. copper-foil conducting electricity, 8. heat conductive silica gel package, 9. plastic stent, 10. metal connector, 11. metal heat-conducting electrodes, 12. insulators, 13. silver medals slurry glue, 14. heat sinks.
Embodiment
Below in conjunction with the drawings and specific embodiments the utility model is elaborated.
The utility model discloses a kind of LED encapsulating structure, as shown in Figure 1, comprise substrate 1, reflector 2, led chip 3, fluorescence thin layer 4, positive electrode 5, negative electrode 6, copper-foil conducting electricity 7, heat conductive silica gel package 8, plastic stent 9, metal connector 10, metal heat-conducting electrode 11, insulator 12, binding is gone up on substrate 1 surface wherein the led chip 3 that places in the reflector 2, and the surface and the periphery of reflector 2 scribble reflecting material;
Be covered with heat conductive silica gel package 8 on the LED luminescence chip 3 wherein;
Wherein plastic stent 9 as shown in Figure 1 is positioned at the below of substrate 2;
Further plastic stent 9 belows are provided with LED metal heat-conducting electrode 11;
Wherein be positioned at the insulator 12 of LED metallic conduction Copper Foil below;
The below of insulator 12 wherein is provided with metal connector 10.
Heat conductive silica gel package 8 as shown in Figure 1 coats led chip 3 and fluorescence thin layer 4 again.
In order to make radiating effect better, LED luminescence chip 3 is fixing by silver slurry glue 13.
The material of metal connector 10 wherein is a copper.
A kind of LED encapsulating structure operation principle of the present utility model is: the light that is sent by led chip 3 is through the effect of reflector 2, the fluorescence thin layer 4 of deexcitation top is luminous from different perspectives, the light part that fluorescence thin layer 4 sends is directly passed through 8 direct projections of heat conductive silica gel package in air, the light of another part imports in the air after reflecting through reflecting material again, improved the utilance of light like this, the heat of dispersing out by led chip 3 frequent time services meanwhile, its heat can pass through plastic stent 9 successively, LED metal heat-conducting electrode 11, conduct to heat sink 14 through metal connector 10, by metal connector 10 is set, make the radiating effect of LED system obtain significant raising like this.
Claims (6)
1. LED encapsulating structure, comprise base (1), reflector (2), led chip (3), fluorescence thin layer (4), positive electrode (5), negative electrode (6), copper-foil conducting electricity (7), heat conductive silica gel package (8), plastic stent (9), metal connector (10), metal heat-conducting electrode (11), insulator (12), it is characterized in that binding has the led chip (3) that places in the reflector (2) on described substrate (1) surface, the surface and the periphery of described reflector (2) scribble reflecting material;
The top of described reflector (2) is suspended with a fluorescence thin layer (4);
The positive electrode (5) that described LED luminescence chip (3) is connected with LED luminescence chip (3), negative electrode (6), and the copper-foil conducting electricity (7) that is arranged on positive pole (5), negative electrode (6) below; Be covered with heat conductive silica gel package (8) on the described LED luminescence chip (3);
Described plastic stent (9) is positioned at the below of substrate (1);
Described plastic stent (9) below is provided with LED metal heat-conducting electrode (11);
The described insulator (12) that is positioned at LED metallic conduction Copper Foil (7) below;
The below of described insulator (12) is provided with metal connector (10).
2. LED encapsulating structure according to claim 1 is characterized in that: described heat conductive silica gel package (8) coats LED luminescence chip (3) and fluorescence thin layer (4).
3. LED encapsulating structure according to claim 1 is characterized in that, described LED luminescence chip (3) is fixing by silver slurry glue (13).
4. LED encapsulating structure according to claim 1 is characterized in that, the material of described metal connector (10) is a copper.
5. LED encapsulating structure according to claim 1 is characterized in that, described metal connector (10) is connected by pin with the heat sink (14) that is arranged on the below.
6. LED encapsulating structure according to claim 1 is characterized in that, described heat sink (14) is a metal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206561825U CN201910445U (en) | 2010-12-09 | 2010-12-09 | Light-emitting diode (LED) packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206561825U CN201910445U (en) | 2010-12-09 | 2010-12-09 | Light-emitting diode (LED) packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201910445U true CN201910445U (en) | 2011-07-27 |
Family
ID=44302645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206561825U Expired - Fee Related CN201910445U (en) | 2010-12-09 | 2010-12-09 | Light-emitting diode (LED) packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201910445U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105006516A (en) * | 2015-08-04 | 2015-10-28 | 浙江福森电子科技有限公司 | LED heat dissipation device |
| CN109935556A (en) * | 2017-12-15 | 2019-06-25 | 光宝科技股份有限公司 | Light emitting diode package structure, heat dissipation substrate and manufacturing method of heat dissipation substrate |
| CN111223976A (en) * | 2020-01-14 | 2020-06-02 | 昆山琉明光电有限公司 | High-brightness LED packaging method and structure |
| CN112885940A (en) * | 2021-01-08 | 2021-06-01 | 深圳市科润光电股份有限公司 | COB technology-based heat dissipation structure for LED packaging unit |
-
2010
- 2010-12-09 CN CN2010206561825U patent/CN201910445U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105006516A (en) * | 2015-08-04 | 2015-10-28 | 浙江福森电子科技有限公司 | LED heat dissipation device |
| CN105006516B (en) * | 2015-08-04 | 2018-01-30 | 浙江福森电子科技有限公司 | A kind of LED heat abstractor |
| CN109935556A (en) * | 2017-12-15 | 2019-06-25 | 光宝科技股份有限公司 | Light emitting diode package structure, heat dissipation substrate and manufacturing method of heat dissipation substrate |
| CN109935556B (en) * | 2017-12-15 | 2020-11-24 | 光宝科技股份有限公司 | Light emitting diode package structure, heat dissipation substrate and manufacturing method of heat dissipation substrate |
| CN111223976A (en) * | 2020-01-14 | 2020-06-02 | 昆山琉明光电有限公司 | High-brightness LED packaging method and structure |
| CN112885940A (en) * | 2021-01-08 | 2021-06-01 | 深圳市科润光电股份有限公司 | COB technology-based heat dissipation structure for LED packaging unit |
| CN112885940B (en) * | 2021-01-08 | 2021-11-30 | 深圳市科润光电股份有限公司 | COB technology-based heat dissipation structure for LED packaging unit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110727 Termination date: 20111209 |