CN201103857Y - Integrated LED light source component - Google Patents

Integrated LED light source component Download PDF

Info

Publication number
CN201103857Y
CN201103857Y CNU2007203055374U CN200720305537U CN201103857Y CN 201103857 Y CN201103857 Y CN 201103857Y CN U2007203055374 U CNU2007203055374 U CN U2007203055374U CN 200720305537 U CN200720305537 U CN 200720305537U CN 201103857 Y CN201103857 Y CN 201103857Y
Authority
CN
China
Prior art keywords
light source
led light
heat dissipation
base plate
metal base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2007203055374U
Other languages
Chinese (zh)
Inventor
江珏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen North Korea Photoelectric Technology Co., Ltd.
Original Assignee
Jin Zhongjun
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jin Zhongjun filed Critical Jin Zhongjun
Priority to CNU2007203055374U priority Critical patent/CN201103857Y/en
Application granted granted Critical
Publication of CN201103857Y publication Critical patent/CN201103857Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The utility model discloses an integrated LED light source component, comprising an LED light source and a metal radiating soleplate covered with a radiating glue film which is provided with a light source layer which is formed by one or more LED chips in paralleled connection; the light source layer is encapsulated with a silicon gel layer; one or two sides of the metal radiating soleplate are provided with a positive and negative electrode bonding pad in connection with a wire of the LED chips. By adopting the structure, the integrated LED light source component has the advantages of the high brightness, the good radiating effect, the small size, the long service life, etc.

Description

A kind of integrated LED light source assembly
Technical field
The utility model relates to a kind of semiconductor illuminating light source, refers to a kind of good heat dissipation effect especially, the integrated LED light source assembly that luminosity is high.
Background technology
LED is as a kind of illuminating source, with its luminance height, energy-conservation, plurality of advantages such as long service life and extremely user's favor, be widely used in lighting of home, decorative lighting, the illumination of city lighting engineering, in the industrial production illumination, sell in the market with the lighting of LED as light source, generally all be to adopt common single LED lamp is welded on the circuit board as illuminating source, reach certain brightness plurality of LEDs just is installed, adopt the light source of design so just to make the volume of light fixture to increase, do not meet the small but excellent development trend of present light fixture, also be inconvenient to install or carry, and because increasing of single LEDs quantity makes radiating effect also undesirable, use also can cause the phenomenon of its brightness decay and dead lamp to take place for a long time, shortened the service life of LED shot-light greatly, if the LED that an is adopted number is few, though can reduce the volume of light fixture, be convenient to install or carry, but its brightness is affected again, adopts existing LED to be difficult to realize high brightness and the small and exquisite combination of volume as the lighting of light source.
Summary of the invention
At the technological deficiency of above-mentioned existence, the utility model provides the light source of a kind of integrated LED light source assembly as lighting, by contrast it not only volume is small and exquisite, and luminosity height, and good heat dissipation effect are conveniently installed and are carried.
To achieve these goals, the utility model has adopted following technical proposals: design a kind of integrated LED light source assembly, comprise led light source, heat dissipation metal base plate, be coated with a heat radiation glue-line on the described heat dissipation metal base plate face, the thermal paste aspect is provided with a light source layer of being made up of several led chips that are connected in parallel, be packaged with a layer of silica gel on the described light source aspect, one or both sides are provided with the positive and negative electrode pad that is electrically connected with the led chip lead on the described heat dissipation metal base plate face.
Optimal technical scheme of the present utility model is:
As preferably; Described heat dissipation metal base plate is an aluminium base.
As preferably; Offer screw mounting hole on the described heat dissipation metal base plate face, just be opened in the both sides of heat dissipation metal base plate.
As preferably; Described heat dissipation metal base plate is rectangular circular or oval.
As preferably; Described lead is gold thread or aluminum steel.
As preferably; Described light source layer is to stick on the thermal paste aspect.
As preferably; Described its thickness of heat dissipation metal base plate is the 1.0-5.0 millimeter.Owing to adopted technique scheme, be connected in parallel on the heat dissipation metal base plate that is coated with the radiating insulating glue-line the plurality of LEDs chip is integrated, one or both sides are provided with the positive and negative electrode pad that is electrically connected with the led chip lead on heat dissipation metal base plate face, dripping last layer silica gel again encapsulates it, just form one and had the led light source that the heat dissipation metal base plate is formed and had to the plurality of LEDs chip, got final product work welding power lead on the both positive and negative polarity pad.Compare with existing led light source and both to have reduced volume, improved the brightness of light source again, adopt that such light source just can be done small and exquisitely, attractive in appearance being convenient to installed or carried to light fixture, it is installed on the lamp body heat that can be timely LED be produced when luminous derives, guaranteed the temperature constant state of the operate as normal of LED fully, use for a long time and also can not cause the phenomenon of its brightness decay and dead lamp to take place, improved the service life of LED shot-light greatly, the use cost of just having saved product in the middle of invisible.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment.
The specific embodiment
Below in conjunction with accompanying drawing and concrete embodiment the utility model is described in further detail:
The utility model adopts an aluminium base with good heat radiating attribute, and (this radiating bottom plate also can be other metal material as radiating bottom plate; As copper, iron, steel etc.); Can be designed to rectangle or circle, ellipse etc. according to this radiating bottom plate of user's needs, the utility model embodiment just is described with the heat radiation aluminum soleplate of rectangle; As shown in Figure 1; Adopt a thickness greatly between the 1.0-5.0 millimeter, the heat radiation aluminum soleplate 1 of surface smoothing, on the surface of heat radiation aluminum soleplate 1, apply last layer and have the thermal paste of heat sinking function, the thermal paste aspect is provided with a light source layer of being made up of 20 led chips that are connected in parallel 3, and (number of led chip 3 can be set up or reduces according to the design needs of product, do not limit to and 20), for being provided with two respectively, wiring or both sides on 1 of aluminum soleplate of heat radiation easy for installation just are electrically connected with led chip 3 gold threads or aluminum steel, negative terminal pad 5, (also can be only a side setting on 1 of heat dissipation metal aluminum soleplate just be electrically connected with led chip 3 gold threads or aluminum steel, negative terminal pad 5) on light source layer is the face of described led chip 3, is coated with then and is covered with a layer of silica gel 2 its encapsulation, just form one and had the led light source that the aluminum soleplate 1 that dispels the heat is formed and had to 20 (or many) led chips 3, the utility model just has high brightness and good heat sinking function like this, specific volume is littler mutually with the LED that has equal number now, both sides offer a screw mounting hole 4 respectively on 1 of aluminum soleplate of heat radiation, be fixed on the lamp body by screw, power lead just is welded on, can use on the pad 5 of negative pole.The light fixture that adopts led light source of the present utility model to make just can small and exquisite, attractive in appearancely be convenient to install or carry, and good heat dissipation effect, guaranteed the temperature constant state of the operate as normal of LED fully, use for a long time and also can not cause the phenomenon of its brightness decay and dead lamp to take place, improved the service life of LED shot-light greatly, the use cost of just having saved product in the middle of invisible.
In sum only be preferred implementation of the present invention; should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise; can also make several distortion and improvement, these also should be considered as belonging within protection scope of the present invention.

Claims (8)

1. integrated LED light source assembly, comprise led light source, heat dissipation metal base plate, it is characterized in that: be coated with a heat radiation glue-line on the described heat dissipation metal base plate face, the thermal paste aspect is provided with a light source layer of being made up of several led chips that are connected in parallel, be packaged with a layer of silica gel on the described light source aspect, one or both sides are provided with the positive and negative electrode pad that is electrically connected with the led chip lead on the described heat dissipation metal base plate face.
2. a kind of integrated LED light source assembly according to claim 1 is characterized in that: described heat dissipation metal base plate is an aluminium base.
3. a kind of integrated LED light source assembly according to claim 1 is characterized in that: offer screw mounting hole on the described heat dissipation metal base plate face.
4. a kind of integrated LED light source assembly according to claim 3, it is characterized in that: described screw mounting hole is opened in the both sides of heat dissipation metal base plate.
5. a kind of integrated LED light source assembly according to claim 1 is characterized in that: described heat dissipation metal base plate is rectangular circular or oval.
6. a kind of integrated LED light source assembly according to claim 1 is characterized in that: described lead is gold thread or aluminum steel.
7. a kind of integrated LED light source assembly according to claim 1 is characterized in that: described light source layer is to stick on the thermal paste aspect.
8. a kind of integrated LED light source assembly according to claim 1 and 2 is characterized in that: described its thickness of heat dissipation metal base plate is the 1.0-5.0 millimeter.
CNU2007203055374U 2007-11-21 2007-11-21 Integrated LED light source component Expired - Fee Related CN201103857Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2007203055374U CN201103857Y (en) 2007-11-21 2007-11-21 Integrated LED light source component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007203055374U CN201103857Y (en) 2007-11-21 2007-11-21 Integrated LED light source component

Publications (1)

Publication Number Publication Date
CN201103857Y true CN201103857Y (en) 2008-08-20

Family

ID=39950884

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2007203055374U Expired - Fee Related CN201103857Y (en) 2007-11-21 2007-11-21 Integrated LED light source component

Country Status (1)

Country Link
CN (1) CN201103857Y (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101813267A (en) * 2009-12-23 2010-08-25 北京巨数数字技术开发有限公司 LED street lamp and LED street lamp display system
CN102176505A (en) * 2011-01-13 2011-09-07 天津科技大学 Integrated LED light source system
CN104064665A (en) * 2014-07-16 2014-09-24 广东威创视讯科技股份有限公司 Bonding pad design structure based on LEDs

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101813267A (en) * 2009-12-23 2010-08-25 北京巨数数字技术开发有限公司 LED street lamp and LED street lamp display system
CN101813267B (en) * 2009-12-23 2015-10-07 深圳市汇能环保科技有限公司 A kind of LED street lamp and LED street lamp display system
CN102176505A (en) * 2011-01-13 2011-09-07 天津科技大学 Integrated LED light source system
CN104064665A (en) * 2014-07-16 2014-09-24 广东威创视讯科技股份有限公司 Bonding pad design structure based on LEDs
CN104064665B (en) * 2014-07-16 2018-01-23 广东威创视讯科技股份有限公司 A kind of LED-based pad design structure

Similar Documents

Publication Publication Date Title
CN201363572Y (en) LED light source module
US20130033195A1 (en) Light source apparatus
CN202058732U (en) High-power LED (light-emitting diode) white light panel with separated chip and fluorescent powder
CN102734654A (en) High power LED (light-emitting diode) daylight lamp and heat rejection method
CN201103857Y (en) Integrated LED light source component
CN205752232U (en) A kind of COB light module
CN202708919U (en) Tower-shaped light-emitting diode (LED) automobile lamp
CN201910445U (en) Light-emitting diode (LED) packaging structure
CN201601146U (en) Light-emitting diode (LED)
CN101093828A (en) Structure for packaging compact type large power light emitting diode
CN201428943Y (en) Led lamp
CN203659925U (en) High brightness surface mount device light-emitting diode
CN201443693U (en) LED light source module
CN2723812Y (en) Heat radiating lighting decoration lamp
CN102544300A (en) LED packaging structure
CN202695440U (en) Light emitting diode (LED) integrated optical source
CN201884982U (en) Novel LED (light-emitting diode) light source module encapsulation structure
CN203596351U (en) LED-COB (chip on board) light source
CN204927337U (en) Luminous AC COB LED light source of full chip
CN2916931Y (en) Compact high-power LED encapsulation structure
CN203607403U (en) High-voltage LED integration packaging light source and high-voltage LED light fixture
CN202349760U (en) High-radiating and high-power light emitting diode (LED) spotlight
CN210040256U (en) High heat dissipation LED base plate
CN210535687U (en) LED packaging support
CN208637457U (en) A kind of high-power patch-type encapsulation LED crystal lamp

Legal Events

Date Code Title Description
GR01 Patent grant
C14 Grant of patent or utility model
TR01 Transfer of patent right

Effective date of registration: 20090109

Address after: Shenzhen City, Baoan District Xixiang nine Wai Kok days Fu'an a kind of bamboo industrial park three floor on the eastern side, zip code: 518100

Patentee after: Shenzhen North Korea Photoelectric Technology Co., Ltd.

Address before: Xiangxi village, Xiangxi County, Duchang, Jiangxi, zip code: 332600

Co-patentee before: Yang Jun

Patentee before: Jue Jue Jiang

Co-patentee before: Wang Wenhua

Co-patentee before: Jin Zhongjun

C41 Transfer of patent application or patent right or utility model
ASS Succession or assignment of patent right

Owner name: SHENZHEN CITY CHAOHANG OPTO-ELECTRICAL TECHNOLOGY

Free format text: FORMER OWNER: JIANG JUE

Effective date: 20090109

EE01 Entry into force of recordation of patent licensing contract

Assignee: Lianyuan Hai Hai miner's lamp Co., Ltd.

Assignor: Shenzhen North Korea Photoelectric Technology Co., Ltd.

Contract fulfillment period: 2008.9.10 to 2015.4.15

Contract record no.: 2009430000062

Denomination of utility model: Integrated LED light source component

Granted publication date: 20080820

License type: Exclusive license

Record date: 20090918

LIC Patent licence contract for exploitation submitted for record

Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.9.10 TO 2015.4.15; CHANGE OF CONTRACT

Name of requester: LIANYUAN HAIHU MINER LAMP CO., LTD.

Effective date: 20090918

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080820

Termination date: 20101121

C17 Cessation of patent right