CN2723812Y - Heat radiating lighting decoration lamp - Google Patents
Heat radiating lighting decoration lamp Download PDFInfo
- Publication number
- CN2723812Y CN2723812Y CN2004200836570U CN200420083657U CN2723812Y CN 2723812 Y CN2723812 Y CN 2723812Y CN 2004200836570 U CN2004200836570 U CN 2004200836570U CN 200420083657 U CN200420083657 U CN 200420083657U CN 2723812 Y CN2723812 Y CN 2723812Y
- Authority
- CN
- China
- Prior art keywords
- led
- aluminium base
- fixed body
- heat dissipation
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005034 decoration Methods 0.000 title claims abstract description 12
- 239000004411 aluminium Substances 0.000 claims abstract description 43
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 43
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 43
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 25
- 229920003023 plastic Polymers 0.000 claims abstract description 25
- 239000004033 plastic Substances 0.000 claims abstract description 25
- 230000017525 heat dissipation Effects 0.000 claims description 19
- 238000004806 packaging method and process Methods 0.000 claims description 18
- 239000000084 colloidal system Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 230000005855 radiation Effects 0.000 abstract 6
- 239000011347 resin Substances 0.000 abstract 6
- 229920005989 resin Polymers 0.000 abstract 6
- 238000010586 diagram Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 239000003973 paint Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
The utility model discloses a heat radiation lighting decoration lamp which comprises an aluminium base, an LED arranged on the aluminium base, a package resin fixed body arranged on the aluminium base and the periphery of the LED, a metal heat radiation block sealed on the reverse side of a luminous surface of the LED, wherein a nudity metal plate with the LED contacted with the metal heat radiation block on the LED is arranged on the center of the aluminium base, and the aluminium base, the LED and a connecting lead are fixed into a whole via the resin perfusing in the package resin fixed body; the package resin fixed body thereof is a plastic frame arranged on the face of the aluminium base or a concave metal casing, and then, the aluminium base and the LED thereof are arranged in the metal casing. Because the metal heat radiation block is sealed on the reverse side of the luminous surface of the LED, and the metal heat radiation block is fixed into a whole via the resin perfusing in the package resin fixed body; the utility model has the advantages of high brightness, good decoration effect and good heat radiation function.
Description
Affiliated technical field
The utility model relates to a kind of illumination and decoration device, but particularly heat dissipation type lighting decoration lamp.
Background technology
Because LED has the brightness height, safety, advantages such as caloric value is low, for this reason, LED is widely used in the conventional lighting, the three-primary color LED lamp that uses exportable different wave length is more and more particularly arranged in recent years so that the trend of more natural projection light to be provided, light emission luminance value at the normal lighting light fixture is higher, but the luminosity of existing single common LED can not satisfy as the normal lighting light fixture, there is the people that LED is made into than high-power LED for this reason, but because the power of LED has been increased encapsulation volume and the also increase greatly of caloric value of LED thereupon, thereby influenced the decorative effect of lighting, and the service life of having limited LED, so solve the difficult point that the caloric value of its LED has become the maximum of LED.
Summary of the invention
The purpose of this utility model is in order to overcome the defective of above-mentioned existence, but provides a kind of brightness height, good decorating effect, have the heat dissipation type lighting decoration lamp of heat sinking function.
But the technical solution adopted in the utility model is a kind of heat dissipation type lighting decoration lamp to achieve these goals, comprises aluminium base, be arranged on LED on the aluminium base, be arranged on the aluminium base and the packaging plastic fixed body of LED periphery, LED and LED between be connected lead; Described LED is an adopting surface mounted LED, and the reverse side of LED light-emitting area is packaged with a heat dissipation metal piece; Copper Foil on the described aluminium base is provided with element and connects pad, the central authorities of aluminium base be provided with one settle LED's and with LED on the contacted bare metal plate of heat dissipation metal piece; Described aluminium base, LED, connection lead are fixed as one by the colloid that is poured in the packaging plastic fixed body.
Described packaging plastic fixed body is one to be arranged on the plastic frame body on the aluminium base front;
Described packaging plastic fixed body is one to be the metal-back of concavity, and its aluminium base and LED are arranged in the metal-back.
But a kind of heat dissipation type lighting decoration lamp of the utility model compared with prior art its beneficial effect has:
Because the reverse side in the LED light-emitting area is packaged with a heat dissipation metal piece, and contacts with the central bare metal plate that is arranged on aluminium base; Be fixed as one by the colloid that is poured in the packaging plastic fixed body then, thus have brightness height, good decorating effect, heat sinking function good advantage.
Description of drawings
Fig. 1 is a combination schematic appearance of the present utility model;
Fig. 2 is a blast structural representation of the present utility model;
Fig. 3 is the utility model aluminium base and packaging plastic fixed body combining structure schematic diagram;
Fig. 4 is the utility model aluminium base and LED and packaging plastic fixed body combining structure schematic diagram;
Fig. 5 is the schematic appearance of the utility model LED;
Fig. 6 is the schematic appearance of the utility model LED heat dissipation metal piece;
Fig. 7 is the utility model aluminium base with LED, packaging plastic fixed body and is connected the combining structure schematic diagram of lead;
Fig. 8 is the blast structural representation of another embodiment of the utility model;
The specific embodiment
Below in conjunction with the drawings and the specific embodiments the utility model is described in further detail.
Referring to figs. 1 through Fig. 7, the utility model comprises aluminium base 1, be arranged on LED2 on the aluminium base 1, be arranged on the aluminium base 1 and the packaging plastic fixed body 3 of LED2 periphery, LED and LED between be connected lead 5; Be furnished with the Copper Foil 11 of one deck conduction on the described aluminium base, Copper Foil 11 is provided with element and connects pad 12, other positions are then covered by insulated paint, its LED is arranged on the central authorities of aluminium base, for the heat that LED produces being distributed better, so be provided with the bare metal plate of an arrangement LED in the central authorities of aluminium base, its bare metal plate is exactly to cover without insulated paint in the position that aluminium base is provided with LED, for the bare metal plate with aluminium base is complementary, so described LED is adopted adopting surface mounted LED, reverse side in the LED2 light-emitting area is packaged with a heat dissipation metal piece 23, metallic plate during combination that heat dissipation metal piece on the LED and aluminium base is exposed contacts, then the element that is provided with on the conductive feet 22 of LED and the Copper Foil 11 being connected pad 12 welds mutually, the element that is provided with on the described Copper Foil 11 connect pad 12 except with can also be electrically connected with being connected lead LED is electrically connected, thereby the LED of each unit is coupled together.Described aluminium base, LED, connection lead connect the back and are fixed as one by the colloid 6 that is poured in the packaging plastic fixed body, its packaging plastic fixed body is a plastic frame body, before being poured in packaging plastic its packaging plastic fixed body is placed on the aluminium base, this allocation method can be for inlaying or pasting.Adopting surface mounted LED employing power in the utility model is 1～3 watt luminescent wafer, during encapsulation luminescent wafer is encapsulated with transparent colloid 21, and with 24 encapsulation of heat dissipation metal piece 23 usefulness plastics, the heat that this packing forms can produce the adopting surface mounted LED wafer timely and effectively conducts, thereby has solved low shortcoming of common LED power little (about 6 milliwatts) luminosity and great power LED (1～3 watt) shortcoming that caloric value is big effectively.
With reference to Fig. 8, packaging plastic fixed body in the utility model is except can be for being set to a metal-back 31 that is concavity the plastic frame body, its aluminium base 1 and LED2 are arranged in the metal-back 31, thereby can the substituted for plastic framework, because aluminium base 1 directly contacts with metal-back 31, be poured on the aluminium base 1 and LED2 in the metal-back 31 with colloid then, colloid is fixed on aluminium base 1 and LED2 in the metal-back 31.
To sum up state the utility model and be packaged with a heat dissipation metal piece at the reverse side of LED light-emitting area, the heat that thereby great power LED (1～3 watt) can be sent is central authorities by being arranged on aluminium base and conduct with the contacted bare metal plate of heat dissipation metal piece directly, thus the utlity model has brightness height, good decorating effect, heat sinking function good advantage.
Claims (3)
- But 1, a kind of heat dissipation type lighting decoration lamp is characterized in that: comprise aluminium base, be arranged on LED on the aluminium base, be arranged on the aluminium base and the packaging plastic fixed body of LED periphery, LED and LED between be connected lead; Described LED is an adopting surface mounted LED, and the reverse side of LED light-emitting area is packaged with a heat dissipation metal piece; Copper Foil on the described aluminium base is provided with element and connects pad, aluminium base central authorities be provided with one settle LED and with LED on the contacted bare metal plate of heat dissipation metal piece; Described aluminium base, LED, connection lead are fixed as one by the colloid that is poured in the packaging plastic fixed body.
- But 2, a kind of heat dissipation type lighting decoration lamp according to claim 1 is characterized in that: described packaging plastic fixed body is one to be arranged on the plastic frame body on the aluminium base front.
- But 3, a kind of heat dissipation type lighting decoration lamp according to claim 1 is characterized in that: described packaging plastic fixed body is one to be the metal-back of concavity, and its aluminium base and LED are arranged in the metal-back.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2004200836570U CN2723812Y (en) | 2004-09-04 | 2004-09-04 | Heat radiating lighting decoration lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2004200836570U CN2723812Y (en) | 2004-09-04 | 2004-09-04 | Heat radiating lighting decoration lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2723812Y true CN2723812Y (en) | 2005-09-07 |
Family
ID=35037438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2004200836570U Expired - Fee Related CN2723812Y (en) | 2004-09-04 | 2004-09-04 | Heat radiating lighting decoration lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2723812Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102012005A (en) * | 2010-08-24 | 2011-04-13 | 厦门汇耕电子工业有限公司 | Completely-metal integrated illuminating and backlight LED heat radiating structural body |
| CN101802485B (en) * | 2007-09-14 | 2013-01-02 | 欧司朗股份有限公司 | Illumination module |
| CN106224845A (en) * | 2016-09-28 | 2016-12-14 | 郑小微 | Projecting Lamp |
-
2004
- 2004-09-04 CN CN2004200836570U patent/CN2723812Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101802485B (en) * | 2007-09-14 | 2013-01-02 | 欧司朗股份有限公司 | Illumination module |
| US8657462B2 (en) | 2007-09-14 | 2014-02-25 | Osram Gesellschaft Mit Beschraenkter Haftung | Illumination module |
| CN102012005A (en) * | 2010-08-24 | 2011-04-13 | 厦门汇耕电子工业有限公司 | Completely-metal integrated illuminating and backlight LED heat radiating structural body |
| CN102012005B (en) * | 2010-08-24 | 2013-05-22 | 厦门汇耕电子工业有限公司 | Completely-metal integrated illuminating and backlight LED heat radiating structural body |
| CN106224845A (en) * | 2016-09-28 | 2016-12-14 | 郑小微 | Projecting Lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: HESHAN LIDE ELECTRONICAL INDUSTRY CO.,LTD. Free format text: FORMER OWNER: FAN BANGHONG Effective date: 20061201 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20061201 Address after: 529728 Gonghe Industrial Development Zone, Guangdong, Heshan Patentee after: Heshan Lide Electronic Industry Co., Ltd. Address before: 529728 Heshan silver rain lamp Co., Ltd., 301 Xianghe Road, Gonghe Town, Guangdong, Heshan Patentee before: Fan Banghong |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050907 Termination date: 20090904 |