CN203596351U - LED-COB (chip on board) light source - Google Patents
LED-COB (chip on board) light source Download PDFInfo
- Publication number
- CN203596351U CN203596351U CN201320833806.XU CN201320833806U CN203596351U CN 203596351 U CN203596351 U CN 203596351U CN 201320833806 U CN201320833806 U CN 201320833806U CN 203596351 U CN203596351 U CN 203596351U
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- CN
- China
- Prior art keywords
- led
- chip
- light source
- electrode
- cooling stand
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses an LED-COB (chip on board) light source. The LED-COB light source comprises an LED chip and an electrode, wherein the LED chip is electrically connected with the electrode. The LED-COB light source is characterized by further comprising a sheet type heat radiation support, a reflective bowl or a reflective groove disposed on the sheet type heat radiation support; the reflective bowl or the reflective groove is in an integrated structure with the sheet type heat radiation support radiation support; at least on LED chip is provided and is encapsulated in the reflective bowl or the reflective groove; and the electrode is mounted on the sheet type heat radiation support. The LED-COB light source is simple in structure and good in heat radiation, can be applied to LED lamps without arrangement of extra heat radiation structures, and thus helps to effectively reduce production cost and save resources.
Description
Technical field
The utility model relates to a kind of light source, is specifically related to a kind of LED-COB light source.
Background technology
LED-COB is chip on board, exactly bare chip is sticked on interconnect substrates by conduction or non-conductive adhesive, then carries out Bonding and realizes its electrical connection.Along with the progress of LED encapsulation technology, COB lamp pearl becomes the main flow of LED light source, the stage that direct insertion LED lamp pearl has been faded out gradually LED illumination and shown because of shortcomings such as its thermal resistance are large, light decay is fast, the life-span is short, this makes the production equipment of direct insertion LED lamp pearl much all leave unused, and causes the wasting of resources.
In addition, the lamp pearl chip direct package of traditional LED-COB light source is on aluminium base, and the caloric value of chip is considerably beyond the heat-sinking capability of aluminium base, radiating effect is poor, must carry out outside heat dissipation design, this has just increased the design cost of LED light fixture again, the LED fitting structure complexity of making.
Utility model content
Task of the present utility model be to provide a kind of simple in structure, heat radiation is good, can effectively reduce production costs, economize on resources, well behaved LED-COB light source.
The utility model is realized by following technical proposals:
A kind of LED-COB light source, comprises LED chip and electrode, and LED chip is electrically connected with electrode, it is characterized in that: described LED-COB light source also comprises chip cooling stand, is arranged at reflector or reflective groove on chip cooling stand; Reflector or reflective groove and chip cooling stand are structure as a whole; Described LED chip comprises at least one, is packaged in reflector or reflective groove; Described electrode is arranged on chip cooling stand.
The further improvement project of the utility model comprises:
Described chip cooling stand is metallic support; Described reflector or reflective groove are reflector or the reflective groove being directly stamped to form on chip cooling stand one side.
Described reflective groove is bottom indent and the open slot of strip opened the both sides outside.
Described electrode comprises positive electrode and negative electrode, and electrode is the sheet metal that on chip cooling stand, directly stamping-out goes out; Electrode is connected with chip cooling stand electric insulation by plastic packaging glue.
Inner surface at described reflector or reflective groove is silver coated; Between described LED chip, be electrically connected and be connected into LED chip group with wire, positive pole, the negative pole of LED chip group are connected with described positive electrode, described negative electrode respectively.
On described LED chip, be coated with epoxy resin cap or silicon rubber cup.
On described LED chip, be coated with phosphor gel, in phosphor gel, be coated with epoxy resin cap or silicon rubber cup.
Described chip cooling stand is aluminium, copper, retort stand.
The utlity model has following advantage: simple in structure, heat radiation is good, serviceability is good, be applied to LED light fixture, do not need additionally to arrange again radiator structure, effectively reduce production costs, economize on resources, and can again the production equipment of direct insertion LED lamp pearl be used.
Accompanying drawing explanation
Fig. 1 is the cutaway view of a kind of LED-COB light source of the utility model;
Fig. 2 is the schematic diagram of chip cooling stand before the reflective groove of punching press in the utility model;
Fig. 3 is the schematic diagram of chip cooling stand after the reflective groove of punching press in the utility model;
Fig. 4 is the A place partial enlarged drawing of Fig. 1
Wherein: 1-electrode, 2-chip cooling stand, the reflective groove of 3-, 4-LED chip, 5-plastic packaging glue, 6-wire, 7-epoxy resin cap or silicon rubber cup, 8-phosphor gel.
Embodiment
Below in conjunction with accompanying drawing, a kind of LED-COB light source of the utility model is further described:
Embodiment 1:
A kind of LED-COB light source, comprises LED chip 4 and electrode 1, and LED chip 4 is electrically connected with electrode 1.This LED-COB light source also comprises chip cooling stand 2, is arranged at reflector or reflective groove 3 on chip cooling stand 2; Reflector or reflective groove 3 are structure as a whole with chip cooling stand 2; LED chip 4 comprises at least one, is packaged in reflector or reflective groove 3; Electrode 1 is arranged on chip cooling stand 2.
Wherein electrode 1 is arranged on chip cooling stand 2.Wherein chip cooling stand is preferably metallic support, and more preferably it is the good materials of heat conduction such as aluminium flake, copper sheet, iron plate.
Wherein reflector or reflective groove 3 are directly stamped to form on chip cooling stand 2 one sides, and preferably this rammed reflective groove 3 is the open slot of the strip of outside indent both sides, bottom.
Wherein electrode 1 comprises positive electrode and negative electrode, positive electrode and the negative electricity sheet metal that very directly stamping-out goes out on chip cooling stand 2; Electrode 1 is connected with chip cooling stand 2 electric insulations by plastic packaging glue 5.The making flow process of electrode is as follows: first determine sheet metal in chip cooling stand 2 upper punches, this sheet metal is as electrode (as shown in Figure 2), again positive electrode is connected with chip cooling stand 2 by plastic packaging glue 5 with negative electrode, with rushing pin machine, electrode 1 is fallen with the metal part stamping-out being connected of chip cooling stand 2 again, realize electric insulation between electrode 1 and chip cooling stand 2 and be connected.
Preferably silver coated at the inner surface of reflector or reflective groove 3, this kind of structure can strengthen heat-conducting effect.LED chip 4 comprises multiple, between them, is electrically connected and is connected into LED chip group with wire 6, and positive pole, the negative pole of LED chip group are connected with positive electrode 1, negative electrode 1 respectively, and wire is preferably gold thread, copper cash, aluminum steel or alloy wire.
Wherein the encapsulation of LED chip can with or without phosphor gel.As without phosphor gel, directly on LED chip 4, applying epoxy resin or silica gel, baking and curing, forms epoxy resin cap or silicon rubber cup 7.If by phosphor gel, first on LED chip 4, apply after phosphor gel 8, baking and curing, then in phosphor gel, apply epoxy resin or silica gel, after baking and curing, form epoxy resin cap or silicon rubber cup 7.
This LED-COB light source can be applied to various LED light fixtures, includes but not limited to bulb lamp, Down lamp, desk lamp, flood light, undercut lamp etc.
For making task of the present utility model, technical scheme and advantage clearer, concrete structure and assembly method below in conjunction with accompanying drawing to above-mentioned execution mode are described in further detail:
A, on chip cooling stand 2, directly stamping-out goes out sheet metal, and the sheet metal that this stamping-out goes out is electrode, and its structure as shown in Figure 2;
B, process the reflector of separate type or reflective its structure of groove 3(of strip as shown in Figure 3 in the side of chip cooling stand 2 by methods such as punching presses), and reflector or reflective groove 3 are carried out to silver-plated processing;
C, electrode 1 is connected and realizes electric insulation with chip cooling stand 2 with plastic packaging glue 5;
D, at reflector or the interior placement one LEDs chip 4 of reflective groove 3, its positive pole, negative pole are connected with positive electrode, negative electrode on chip cooling stand 2 respectively; Or at reflector or the interior placement plurality of LEDs of reflective groove 3 chip 4, and with wire 6, plurality of LEDs chip 4 is connected and/or in parallel, form LED chip group, then the positive pole of LED chip group, negative pole are connected on positive electrode on chip cooling stand 2, negative electrode;
E, on LED chip 4, apply an epoxy resin cap or silicon rubber cup 7, baking and curing; Or be first coated on LED chip 4 by phosphor gel 8, baking and curing, then on fluorescent powder colloid, apply an epoxy resin cap or silicon rubber cup 7, baking and curing;
F, electrode 1 is fallen with the metal part stamping-out being connected of chip cooling stand 2 with rushing pin machine, finally form a kind of sheet-shaped LED-COB light source with heat radiation.
The utility model describes a kind of execution mode and accompanying drawing thereof in detail; but the utility model is not limited to this embodiment and accompanying drawing thereof; those of ordinary skills are according to the utility model; do not pay creative work; it is modified, is equal to replacement, improvement etc. and other execution modes and the accompanying drawing thereof that obtain, all in protection range of the present utility model.
Claims (8)
1. a LED-COB light source, comprise LED chip (4) and electrode (1), LED chip (4) is electrically connected with electrode (1), it is characterized in that: described LED-COB light source also comprises chip cooling stand (2), is arranged at reflector or reflective groove (3) on chip cooling stand (2); Reflector or reflective groove (3) are structure as a whole with chip cooling stand (2); Described LED chip (4) comprises at least one, is packaged in reflector or reflective groove (3); Described electrode (1) is arranged on chip cooling stand (2).
2. a kind of LED-COB light source according to claim 1, is characterized in that: described chip cooling stand (2) is metallic support; Described reflector or reflective groove (3) reflector or the reflective groove (3) for being directly stamped to form on chip cooling stand (2) one sides.
3. a kind of LED-COB light source according to claim 2, is characterized in that: described reflective groove (3) is the open slot of the strip of outside indent both sides, bottom.
4. according to a kind of LED-COB light source described in arbitrary claim in claims 1 to 3, it is characterized in that: described electrode (1) comprises positive electrode and negative electrode the sheet metal that electrode (1) goes out for the upper direct stamping-out of chip cooling stand (2); Electrode (1) is connected with chip cooling stand (2) electric insulation by plastic packaging glue (5).
5. a kind of LED-COB light source according to claim 4, is characterized in that: the inner surface at described reflector or reflective groove (3) is silver coated; Between described LED chip (4), be electrically connected and be connected into LED chip group with wire (6), positive pole, the negative pole of LED chip group are connected with described positive electrode, described negative electrode respectively.
6. a kind of LED-COB light source according to claim 5, is characterized in that: on described LED chip (4), be coated with epoxy resin cap or silicon rubber cup (7).
7. a kind of LED-COB light source according to claim 5, is characterized in that: on described LED chip (4), be coated with phosphor gel (8), be coated with epoxy resin cap or silicon rubber cup (7) in phosphor gel.
8. a kind of LED-COB light source according to claim 1, is characterized in that: described chip cooling stand (2) is aluminium, copper, retort stand.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320833806.XU CN203596351U (en) | 2013-09-09 | 2013-12-18 | LED-COB (chip on board) light source |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320556748.0 | 2013-09-09 | ||
| CN201320556748 | 2013-09-09 | ||
| CN201320833806.XU CN203596351U (en) | 2013-09-09 | 2013-12-18 | LED-COB (chip on board) light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203596351U true CN203596351U (en) | 2014-05-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320833806.XU Withdrawn - After Issue CN203596351U (en) | 2013-09-09 | 2013-12-18 | LED-COB (chip on board) light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203596351U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103647006A (en) * | 2013-09-09 | 2014-03-19 | 吴懿平 | Light-emitting diode (LED)-COB (chip on board) light source and preparation method thereof |
-
2013
- 2013-12-18 CN CN201320833806.XU patent/CN203596351U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103647006A (en) * | 2013-09-09 | 2014-03-19 | 吴懿平 | Light-emitting diode (LED)-COB (chip on board) light source and preparation method thereof |
| WO2015032226A1 (en) * | 2013-09-09 | 2015-03-12 | Wu Yiping | Led-cob light source and preparation method therefor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C53 | Correction of patent of invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wu Yiping Inventor after: Zhu Chao Inventor after: Liu Ke Inventor before: Wu Yiping |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: WU YIPING TO: WU YIPING ZHU CHAO LIU KE |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20140514 Effective date of abandoning: 20160518 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20140514 Effective date of abandoning: 20160518 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |